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LED Packaging Market by Type (Lamp-LED, TOP-LED, Side-LED, SMD-LED, High-power-LED, Flip Chip-LED), Packaging Material (Paper & Paperboard, Plastic, Nanoceramics, Ceramic Packages, Silicones Materials, and Epoxy Molding Compound (EMC)), and Application (Televisions, Cruise Ship Lights, Automotive, Portable Electronics, Advertisement, and Home Decor Lighting): Global Opportunity Analysis and Industry Forecast, 2019-2026
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SE_182323
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Pages: NA
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Sep 2019 |
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LED or light emitting diode is one of the most rapidly growing sectors of the semiconductor industry. LED has the added advantage of power saving, high efficiency, non-splintery, and others as compared to stereotype bulbs. Thus, manufacturers focus on LED design for appropriate packaging and for viability of the end product. In addition, the packaging type is dependent on distinct variety of LED. The most advanced technologies for LED packaging include plastic leaded chip carriers (PLCCs), ceramic holders, flip glass substrate, printed circuit boards (PCBs), and others.
LED packaging industries are gaining popularity in the market with high growth rate, owing to the fact that various LED products used in cruise ship lights, industrial, hospital, and residential lightning illuminate their facades. In addition, these provide immense revenue to the market leading to growth in end-use industry. Moreover, the market has witnessed high growth rate and is expected to continue this trend in the near future. However, highly competitive market and increase in number of manufacturers have led to complete permeation of the LED Packaging market.
The LED packaging market is segmented into type, packaging material, and application. Based on type, it is divided into Lamp-LED, TOP-LED, side-LED, SMD-LED, high-power-LED, and flip chip-LED. On the basis of packaging material, it is classified into paper & paperboard, plastic, nanoceramics, ceramic packages, silicones materials, and epoxy molding compound (EMC). Application includes televisions, cruise ship lights, automotive, portable electronics, advertisement, and home decor lighting. The prominent players operating in the LED packaging market include AlphaLED, Nichia Corporation, Samsung Corporation, OSRAM Light AG, Seoul Semiconductors Co. Ltd., Philips Corporation, Stanley Electric Co. Ltd., and Toyoda Gosei Co. Ltd.
Key Benefits
- The study provides an in-depth analysis of the LED packaging market with current and future trends to elucidate the imminent investment pockets in the market.
- Current and future trends are outlined to determine the overall attractiveness and to single out profitable trends to gain a stronger foothold in the market.
- The report provides information related to key drivers, restraints, and opportunities with impact analysis.
- Quantitative analysis of the current market and estimations from 2017 to 2023 is provided to showcase the financial potential of the market.
- Porters Five Forces model and SWOT analysis of the industry illustrate the potency of the buyers & suppliers participating in the market.
- Value chain analysis is provided to gain clear understanding of the roles of stakeholders.
LED Packaging Market Key Segments
By Type
- Lamp-LED
- TOP-LED
- Side-LED
- SMD-LED
- High-power-LED
- Flip Chip-LED
By Packaging Material
- Plastic
- Paper & Paperboard
- Ceramic Packages
- Nanoceramics
- Silicones Materials
- Epoxy Molding Compound (EMC)
By Application
- Televisions
- Cruise Ship Lights
- Automotive
- Portable Electronics
- Advertisement
- Home Decor Lighting
By Geography
- U.S.
- Germany
- Japan
- China
Key Players
- AlphaLED
- Nichia Corporation
- Samsung Corporation
- OSRAM Light AG
- Seoul Semiconductors Co. Ltd.
- Philips Corporation
- Stanley Electric Co. Ltd.
- Toyoda Gosei Co. Ltd.
- Cree Inc.
- Samsung Corporation
1. INTRODUCTION
1.1. Report description
1.2. Key benefits
1.3. Key market segments
1.4. Research methodology
1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tool & model
2.EXECUTIVE SUMMARY
2.1. CXO perspective
3. MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top factors impacting the market
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. Porter’s five force analysis
3.4. Market share analysis, 2016
3.5. Market dynamics
3.5.1. Drivers
3.5.2. Restraints
3.5.3. Opportunities
4. GLOBAL LED PACKAGING MARKET, BY PACKAGE TYPE, 2017-2023 ($MILLION)
4.1. Market overview
4.2. Chip on board package (COB)
4.2.1. Key market trends
4.2.2. Key growth factors and opportunities
4.2.3. Market size and forecast, by region
4.2.4. Market analysis, by country
4.3. Surface mount device package (SMD)
4.3.1. Key market trends
4.3.2. Key growth factors and opportunities
4.3.3. Market size and forecast, by region
4.3.4. Market analysis, by country
4.4. Chip scale package (CSP)
4.4.1. Key market trends
4.4.2. Key growth factors and opportunities
4.4.3. Market size and forecast, by region
4.4.4. Market analysis, by country
4.5. Others
4.5.1. Key market trends
4.5.2. Key growth factors and opportunities
4.5.3. Market size and forecast, by region
4.5.4. Market analysis, by country
5. GLOBAL LED PACKAGING MARKET, BY PACKAGING MATERIAL, 2017-2023 ($MILLION)
5.1. Market overview
5.2. Ceramic packages
5.2.1. Key market trends
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Lead frames
5.3.1. Key market trends
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Nanoceramics
5.4.1. Key market trends
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Epoxy molding compound (EMC)
5.5.1. Key market trends
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
5.6. Others
5.6.1. Key market trends
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country
6. GLOBAL LED PACKAGING MARKET, BY APPLICATION, 2017-2023 ($MILLION)
6.1. Market overview
6.2. Automotive
6.2.1. Key market trends
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. Residential
6.3.1. Key market trends
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Television
6.4.1. Key market trends
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
6.5. Industrial
6.5.1. Key market trends
6.5.2. Market size and forecast, by region
6.5.3. Market analysis, by country
6.6. Others
6.6.1. Key market trends
6.6.2. Market size and forecast, by region
6.6.3. Market analysis, by country
7. GLOBAL LED PACKAGING MARKET, BY REGION, 2017-2023 ($MILLION)
7.1. Market overview
7.2. North America
7.2.1. Key market trends
7.2.2. Key growth factors and opportunities
7.2.3. Market size and forecast by
7.2.3.1. Package type
7.2.3.2. Packaging material
7.2.3.3. Application
7.2.3.4. Country
7.2.3.4.1. U.S.
7.2.3.4.1.1. Market size and forecast, by package type
7.2.3.4.1.2. Market size and forecast, by packaging material
7.2.3.4.1.3. Market size and forecast, by application
7.2.3.4.2. Canada
7.2.3.4.2.1. Market size and forecast, by package type
7.2.3.4.2.2. Market size and forecast, by packaging material
7.2.3.4.2.3. Market size and forecast, by application
7.2.3.4.3. Mexico
7.2.3.4.3.1. Market size and forecast, by package type
7.2.3.4.3.2. Market size and forecast, by packaging material
7.2.3.4.3.3. Market size and forecast, by application
7.3. Europe
7.3.1. Key market trends
7.3.2. Key growth factors and opportunities
7.3.3. Market size and forecast by
7.3.3.1. Package type
7.3.3.2. Packaging material
7.3.3.3. Application
7.3.3.4. Country
7.3.3.4.1. UK
7.3.3.4.1.1. Market size and forecast, by package type
7.3.3.4.1.2. Market size and forecast, by packaging material
7.3.3.4.1.3. Market size and forecast, by application
7.3.3.4.2. Germany
7.3.3.4.2.1. Market size and forecast, by package type
7.3.3.4.2.2. Market size and forecast, by packaging material
7.3.3.4.2.3. Market size and forecast, by application
7.3.3.4.3. France
7.3.3.4.3.1. Market size and forecast, by package type
7.3.3.4.3.2. Market size and forecast, by packaging material
7.3.3.4.3.3. Market size and forecast, by application
7.3.3.4.4. Russia
7.3.3.4.4.1. Market size and forecast, by package type
7.3.3.4.4.2.
7.3.3.4.4.3.
7.3.3.4.5. Rest of Europe
7.3.3.4.5.1. Market size and forecast, by package type
7.3.3.4.5.2. Market size and forecast, by packaging material
7.3.3.4.5.3. Market size and forecast, by application
7.4. Asia-Pacific
7.4.1. Key market trends
7.4.2. Key growth factors and opportunities
7.4.3. Market size and forecast by
7.4.3.1. Package type
7.4.3.2. Packaging material
7.4.3.3. Application
7.4.3.4. Country
7.4.3.4.1. China
7.4.3.4.1.1. Market size and forecast, by package type
7.4.3.4.1.2. Market size and forecast, by packaging material
7.4.3.4.1.3. Market size and forecast, by application
7.4.3.4.2. India
7.4.3.4.2.1. Market size and forecast, by package type
7.4.3.4.2.2. Market size and forecast, by packaging material
7.4.3.4.2.3. Market size and forecast, by application
7.4.3.4.3. Japan
7.4.3.4.3.1. Market size and forecast, by package type
7.4.3.4.3.2.
7.4.3.4.3.3.
7.4.3.4.4. South Korea
7.4.3.4.4.1. Market size and forecast, by package type
7.4.3.4.4.2. Market size and forecast, by packaging material
7.4.3.4.4.3. Market size and forecast, by application
7.4.3.4.5. Rest of Asia-Pacific
7.4.3.4.5.1. Market size and forecast, by package type
7.4.3.4.5.2. Market size and forecast, by packaging material
7.4.3.4.5.3. Market size and forecast, by application
7.5. LAMEA
7.5.1. Key market trends
7.5.2. Key growth factors and opportunities
7.5.3. Market size and forecast by
7.5.3.1. Package type
7.5.3.2. Packaging material
7.5.3.3. Application
7.5.3.4. Country
7.5.3.4.1. Latin America
7.5.3.4.1.1. Market size and forecast, by package type
7.5.3.4.1.2. Market size and forecast, by packaging material
7.5.3.4.1.3. Market size and forecast, by application
7.5.3.4.2. Middle East
7.5.3.4.2.1. Market size and forecast, by package type
7.5.3.4.2.2.
7.5.3.4.2.3.
7.5.3.4.3. Africa
7.5.3.4.3.1. Market size and forecast, by package type
7.5.3.4.3.2. Market size and forecast, by packaging material
7.5.3.4.3.3. Market size and forecast, by application
8. COMPANY PROFILES
8.1. Cree Inc.
8.1.1. Company overview
8.1.2. Company snapshot
8.1.3. Business performance
8.1.4. Operating business segments
8.1.5. Key strategies and developments
8.2. AlphaLED
8.2.1. Company overview
8.2.2. Company snapshot
8.2.3. Business performance
8.2.4. Operating business segments
8.2.5. Key strategies and developments
8.3. Samsung Corporation
8.3.1. Company overview
8.3.2. Company snapshot
8.3.3. Business performance
8.3.4. Operating business segments
8.3.5. Key strategies and developments
8.4. Osram Licht AG
8.4.1. Company overview
8.4.2. Company snapshot
8.4.3. Business performance
8.4.4. Operating business segments
8.4.5. Key strategies and developments
8.5. Nichia Corporation
8.5.1. Company overview
8.5.2. Company snapshot
8.5.3. Business performance
8.5.4. Operating business segments 8.5.5. Key strategies and developments
8.6. Toyoda Gosei Co. Ltd.
8.6.1. Company overview
8.6.2. Company snapshot
8.6.3. Business performance
8.6.4. Operating business segments 8.6.5. Key strategies and developments
8.7. Seoul Semiconductors Co. Ltd.
8.7.1. Company overview
8.7.2. Company snapshot
8.7.3. Business performance
8.7.4. Operating business segments
8.7.5. Key strategies and developments
8.8. Stanley Electric Co. Ltd.
8.8.1. Company overview
8.8.2. Company snapshot
8.8.3. Business performance
8.8.4. Operating business segments
8.8.5. Key strategies and developments
8.9. Philips Corporation
8.9.1. Company overview
8.9.2. Company snapshot
8.9.3. Business performance
8.9.4. Operating business segments
8.9.5. Key strategies and developments
8.10. Everlight Electronics
8.10.1. Company overview
8.10.2. Company snapshot
8.10.3. Business performance
8.10.4. Operating business segments
8.10.5. Key strategies and developments
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