Universal Serial Bus (USB) 3.0 is third major version of USB standard for interfacing electronic devices and computers. USB 3.0 offers new transfer rate which is referred as SuperSpeed USB (SS) and can transfer data at up to 5 Gbit/s (625 MB/s), which is around ten times faster than the USB 2.0 standard. User applications demands a high-performance connection between the PC and these increasingly sophisticated peripherals.
USB 3.0 addresses this need by adding higher transfer rate to match new usages and devices. USB 3.0 is bidirectional, low cost, fast, dynamically attached interface which is consistent with the requirements of the PC platforms. The adoption of these devices is increasing over the years due to many benefits offered by USB 3.0 such as ease with which they can be used, convenience, portability, higher read and write speed, and others.
Global USB 3.0 market is driven by increasing consumer demand for advanced and high-speed interfaces. In addition, proliferation of tablet PC's and smartphones and increasing application of USB 3.0 universal docking chipsets in 4K monitors as well as in camera based applications in medical imaging propels the growth of the market. However, Development of USB 3.1 and increasing competition from Thunderbolt & Thunderbolt 2 interface technologies limits the growth of this market. Furthermore, continuous introduction of high bandwidth storage devices, technological advancements and emerging markets in Asia is expected to provide numerous opportunities for this market to grow.
The USB 3.0 market is segmented on the basis of Manufacturing Process and Capacity. Manufacturing Process segment covered in this study include Conventional and Chip-on-Board (CoB). Based on Capacity, the market is segmented into Below 4 GB, 4 GB to 16 GB, 16 GB to 64 GB, 128 GB and above. Geographically, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The global USB 3.0 market is dominated by key players such as Microsoft Corporation, SanDisk, Intel Corporation, Samsung, Advanced Micro Devices, Inc., Kingston Technology Co LLP, LaCie S.A.S., Seagate Technology LLC, Transcend Information, Inc. and HP Development Company, L.P.
- The study provides an in-depth analysis of the global USB 3.0 market and current & future trends to elucidate the imminent investment pockets.
- Information about key drivers, restrains, and opportunities and their impact analysis on the market size is provided.
- Porters Five Forces analysis illustrates the potency of buyers and suppliers operating in the industry.
- The quantitative analysis of the global market from 2016 to 2023 is provided to determine the market potential.
USB 3.0 Market Key Segment:
By Manufacturing Process
- Chip-on-Board (CoB)
- Below 4 GB
- 4 GB to 16 GB
- 16 GB to 64 GB
- 128 GB and above
- North America
- Rest of Europe
- Rest of Asia-Pacific
- Latin America
- Middle East
Key Market Players Profiled In The Report
"Note : The list of companies mentioned in the description is tentative in nature and may change after detailed analysis."
- Microsoft Corporation
- Intel Corporation
- Advanced Micro Devices, Inc.
- Kingston Technology Co LLP
- LaCie S.A.S.
- Seagate Technology LLC
- Transcend Information, Inc.
- HP Development Company, L.P.