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Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line or flat package. The entire bottom surface of the device can be used and traces connecting the package leads to wires connecting the die to the package, which are shorter hence provide better performance at high speed.
BGA packaging is mainly used in high-performance applications that require high density connections such as SMD ICs, where high electrical and thermal requirement is the top priority. BG packaging has enhanced ratio between PCB area and pin count and provides reduced footprint along with increase in speed yield of ICs.
This low-cost, dense packaging with heat conductivity and low inductance allows wide spacing between connections as well as better level of soliderability in manufacturing yields. Improved re-workability from larger pad sizes and reduced package thickness leading to thinner, compact smartphones imply that the ball grid array (BGA) packaging market share would undergo a steady growth in coming years.
The global ball grid array (BGA) packaging market is segmented on the basis of type, material type, application, industry vertical, and region. Based on type, the ball grid array (BGA) packaging market is divided into molded array process BGA, thermally enhanced BGA, package on package (PoP) BGA, and micro BGA. In terms of material type, the market is categorized into ceramic, plastic, and tape. On the basis of application, the market is bifurcated into OEM (original equipment manufacturer) and aftermarket.
Based on industry vertical, the ball grid array (BGA) packaging market is segregated into, IT & telecommunication, consumer electronics, aerospace & defense, industrial, automotive, healthcare, and others. Geographically, the market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).
Top Impacting Factors
Rise in demand for high-performance denser type compact packaging in increasing number of diverse semiconductor and electronic devices such as smartphones, smartwatches, and TVs is the primary factor that propels the ball grid array (BGA) packaging market growth. However, non-compliant connectivity and difficulty of inspection, owing to critical and complex design of ball grid array (BGA) packaging tends to restrain the ball grid array (BGA) packaging market growth.
On the other hand, rise in inclusion of IoT in packaged electronic equipment such as MEMS sensors, pressure sensors, and gyroscopes in autonomous, or hybrid vehicles to fulfil demand of smart automotive solutions further boosts the market revenue. Advancements in R&D activities related to electronic gadgets supported by wide range of functions of low cost multiple microchips connector in integrated circuits, electronic circuits tends to pave new avenues for the ball grid array (BGA) packaging industry.
Leading ball grid array (BGA) packaging market players adopt necessary methods to improve precision and functionality of advanced interconnect foundry services in the semiconductor industry with a view to support strong growth of chips and heterogeneous integration.
Plastic ball grid array and thermally enhanced ball grid array comprise most advanced assembly processes and designs for cost or performance applications. This advanced IC technology enables design engineers to optimize innovations while maximizing performance characteristics of semiconductors. PBGA packages are designed for low inductance and improved thermal operation.
These packages utilize industry proven, semiconductor grade materials for reliable, long-term operators, which provide user flexible design parameters. This is an ideal package for microprocessors, gate arrays, memory, graphics, and PC chip sets for applications such as cellular wireless telecommunications, global positioning systems, and video recording.
Ball Grid Array (BGA) package is an important part of complex systems, owing to wide substrate technology. It is widely used in the automotive sector for high-pin-count devices as well as in combination with Flip chip (FC) technology to enhance direct and short device-to-substrate connection. More than one thousand bumps and five hundred balls are boundary conditions of package connectivity.
Array-substrate based packaging is used in computing platforms, networking, and hand-held consumer products as a solution to problems, owing to significant electrical shorting problems caused by increase in number of leads surrounding integrated circuits.
This technology is used for semiconductor IC packaging used in automotive applications such as navigation control, infotainment system, anti-lock braking system, power doors, and windows. It helps to create strong link between link and modelling by overcoming potential issues and weaknesses, hence reducing overall cost and development cycle time.
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