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Fan-out panel-level packaging (FOPLP) Market by Market Type (Core Fan-Out, High-Density Fan-Out, Ultra High-density Fan Out), by Carrier Type (200 mm, 300 mm, Panel) and by Business Model (OSAT, Foundary, IDM): Global Opportunity Analysis and Industry Forecast, 2023-2032

A04598

Pages: NA

Charts: NA

Tables: NA

 Key Market Segments

  • By Market Type
    • Core Fan-Out
    • High-Density Fan-Out
    • Ultra High-density Fan Out
  • By Carrier Type
    • 200 mm
    • 300 mm
    • Panel
  • By Business Model
    • OSAT
    • Foundary
    • IDM
  • By Geography
    • North America
      • U.S.
      • Canada
    • Europe
      • UK
      • Germany
      • France
      • Italy
      • Spain
      • Rest of Europe
    • Asia-Pacific
      • China
      • Japan
      • India
      • South Korea
      • Rest of Asia Pacific
    • LAMEA
      • Latin America
      • Middle East
      • Africa

 
Key Market Players

  • SPTS Technologies Ltd.
  • Strategic Moves and Developments
  • Amkor Technology, Inc.
  • STATS ChipPAC
  • Deca Technologies
  • Qualcomm Technologies, Inc
  • Jiangsu Changjiang Electronics Tech Co.
  • Amkor Technology Inc.
  • Samsung Electro-Mechanics
  • Powertech Technology Inc.

  • CHAPTER 1: INTRODUCTION

    • 1.1. Report Description

    • 1.2. Key Market Segments

    • 1.3. Key Benefits

    • 1.4. Research Methodology

      • 1.4.1. Primary Research

      • 1.4.2. Secondary Research

      • 1.4.3. Analyst Tools and Models

  • CHAPTER 2: EXECUTIVE SUMMARY

    • 2.1. CXO Perspective

  • CHAPTER 3: MARKET LANDSCAPE

    • 3.1. Market Definition and Scope

    • 3.2. Key Findings

      • 3.2.1. Top Investment Pockets

      • 3.2.2. Top Winning Strategies

    • 3.3. Porter's Five Forces Analysis

      • 3.3.1. Bargaining Power of Suppliers

      • 3.3.2. Threat of New Entrants

      • 3.3.3. Threat of Substitutes

      • 3.3.4. Competitive Rivalry

      • 3.3.5. Bargaining Power among Buyers

    • 3.5. Market Dynamics

      • 3.5.1. Drivers

      • 3.5.2. Restraints

      • 3.5.3. Opportunities

  • CHAPTER 4: FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY MARKET TYPE

    • 4.1. Market Overview

      • 4.1.1 Market Size and Forecast, By Market Type

    • 4.2. Core Fan-Out

      • 4.2.1. Key Market Trends, Growth Factors and Opportunities

      • 4.2.2. Market Size and Forecast, By Region

      • 4.2.3. Market Share Analysis, By Country

    • 4.3. High-Density Fan-Out

      • 4.3.1. Key Market Trends, Growth Factors and Opportunities

      • 4.3.2. Market Size and Forecast, By Region

      • 4.3.3. Market Share Analysis, By Country

    • 4.4. Ultra High-density Fan Out

      • 4.4.1. Key Market Trends, Growth Factors and Opportunities

      • 4.4.2. Market Size and Forecast, By Region

      • 4.4.3. Market Share Analysis, By Country

  • CHAPTER 5: FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY CARRIER TYPE

    • 5.1. Market Overview

      • 5.1.1 Market Size and Forecast, By Carrier Type

    • 5.2. 200 Mm

      • 5.2.1. Key Market Trends, Growth Factors and Opportunities

      • 5.2.2. Market Size and Forecast, By Region

      • 5.2.3. Market Share Analysis, By Country

    • 5.3. 300 Mm

      • 5.3.1. Key Market Trends, Growth Factors and Opportunities

      • 5.3.2. Market Size and Forecast, By Region

      • 5.3.3. Market Share Analysis, By Country

    • 5.4. Panel

      • 5.4.1. Key Market Trends, Growth Factors and Opportunities

      • 5.4.2. Market Size and Forecast, By Region

      • 5.4.3. Market Share Analysis, By Country

  • CHAPTER 6: FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY BUSINESS MODEL

    • 6.1. Market Overview

      • 6.1.1 Market Size and Forecast, By Business Model

    • 6.2. OSAT

      • 6.2.1. Key Market Trends, Growth Factors and Opportunities

      • 6.2.2. Market Size and Forecast, By Region

      • 6.2.3. Market Share Analysis, By Country

    • 6.3. Foundary

      • 6.3.1. Key Market Trends, Growth Factors and Opportunities

      • 6.3.2. Market Size and Forecast, By Region

      • 6.3.3. Market Share Analysis, By Country

    • 6.4. IDM

      • 6.4.1. Key Market Trends, Growth Factors and Opportunities

      • 6.4.2. Market Size and Forecast, By Region

      • 6.4.3. Market Share Analysis, By Country

  • CHAPTER 7: FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY REGION

    • 7.1. Market Overview

      • 7.1.1 Market Size and Forecast, By Region

    • 7.2. North America

      • 7.2.1. Key Market Trends and Opportunities

      • 7.2.2. Market Size and Forecast, By Market Type

      • 7.2.3. Market Size and Forecast, By Carrier Type

      • 7.2.4. Market Size and Forecast, By Business Model

      • 7.2.5. Market Size and Forecast, By Country

      • 7.2.6. U.S. Fan-out Panel-level Packaging (foplp) Market

        • 7.2.6.1. Market Size and Forecast, By Market Type
        • 7.2.6.2. Market Size and Forecast, By Carrier Type
        • 7.2.6.3. Market Size and Forecast, By Business Model

      • 7.2.7. Canada Fan-out Panel-level Packaging (foplp) Market

        • 7.2.7.1. Market Size and Forecast, By Market Type
        • 7.2.7.2. Market Size and Forecast, By Carrier Type
        • 7.2.7.3. Market Size and Forecast, By Business Model

      • 7.2.8. Mexico Fan-out Panel-level Packaging (foplp) Market

        • 7.2.8.1. Market Size and Forecast, By Market Type
        • 7.2.8.2. Market Size and Forecast, By Carrier Type
        • 7.2.8.3. Market Size and Forecast, By Business Model

    • 7.3. Europe

      • 7.3.1. Key Market Trends and Opportunities

      • 7.3.2. Market Size and Forecast, By Market Type

      • 7.3.3. Market Size and Forecast, By Carrier Type

      • 7.3.4. Market Size and Forecast, By Business Model

      • 7.3.5. Market Size and Forecast, By Country

      • 7.3.6. France Fan-out Panel-level Packaging (foplp) Market

        • 7.3.6.1. Market Size and Forecast, By Market Type
        • 7.3.6.2. Market Size and Forecast, By Carrier Type
        • 7.3.6.3. Market Size and Forecast, By Business Model

      • 7.3.7. Germany Fan-out Panel-level Packaging (foplp) Market

        • 7.3.7.1. Market Size and Forecast, By Market Type
        • 7.3.7.2. Market Size and Forecast, By Carrier Type
        • 7.3.7.3. Market Size and Forecast, By Business Model

      • 7.3.8. Italy Fan-out Panel-level Packaging (foplp) Market

        • 7.3.8.1. Market Size and Forecast, By Market Type
        • 7.3.8.2. Market Size and Forecast, By Carrier Type
        • 7.3.8.3. Market Size and Forecast, By Business Model

      • 7.3.9. Spain Fan-out Panel-level Packaging (foplp) Market

        • 7.3.9.1. Market Size and Forecast, By Market Type
        • 7.3.9.2. Market Size and Forecast, By Carrier Type
        • 7.3.9.3. Market Size and Forecast, By Business Model

      • 7.3.10. UK Fan-out Panel-level Packaging (foplp) Market

        • 7.3.10.1. Market Size and Forecast, By Market Type
        • 7.3.10.2. Market Size and Forecast, By Carrier Type
        • 7.3.10.3. Market Size and Forecast, By Business Model

      • 7.3.11. Russia Fan-out Panel-level Packaging (foplp) Market

        • 7.3.11.1. Market Size and Forecast, By Market Type
        • 7.3.11.2. Market Size and Forecast, By Carrier Type
        • 7.3.11.3. Market Size and Forecast, By Business Model

      • 7.3.12. Rest Of Europe Fan-out Panel-level Packaging (foplp) Market

        • 7.3.12.1. Market Size and Forecast, By Market Type
        • 7.3.12.2. Market Size and Forecast, By Carrier Type
        • 7.3.12.3. Market Size and Forecast, By Business Model

    • 7.4. Asia-Pacific

      • 7.4.1. Key Market Trends and Opportunities

      • 7.4.2. Market Size and Forecast, By Market Type

      • 7.4.3. Market Size and Forecast, By Carrier Type

      • 7.4.4. Market Size and Forecast, By Business Model

      • 7.4.5. Market Size and Forecast, By Country

      • 7.4.6. China Fan-out Panel-level Packaging (foplp) Market

        • 7.4.6.1. Market Size and Forecast, By Market Type
        • 7.4.6.2. Market Size and Forecast, By Carrier Type
        • 7.4.6.3. Market Size and Forecast, By Business Model

      • 7.4.7. Japan Fan-out Panel-level Packaging (foplp) Market

        • 7.4.7.1. Market Size and Forecast, By Market Type
        • 7.4.7.2. Market Size and Forecast, By Carrier Type
        • 7.4.7.3. Market Size and Forecast, By Business Model

      • 7.4.8. India Fan-out Panel-level Packaging (foplp) Market

        • 7.4.8.1. Market Size and Forecast, By Market Type
        • 7.4.8.2. Market Size and Forecast, By Carrier Type
        • 7.4.8.3. Market Size and Forecast, By Business Model

      • 7.4.9. South Korea Fan-out Panel-level Packaging (foplp) Market

        • 7.4.9.1. Market Size and Forecast, By Market Type
        • 7.4.9.2. Market Size and Forecast, By Carrier Type
        • 7.4.9.3. Market Size and Forecast, By Business Model

      • 7.4.10. Australia Fan-out Panel-level Packaging (foplp) Market

        • 7.4.10.1. Market Size and Forecast, By Market Type
        • 7.4.10.2. Market Size and Forecast, By Carrier Type
        • 7.4.10.3. Market Size and Forecast, By Business Model

      • 7.4.11. Thailand Fan-out Panel-level Packaging (foplp) Market

        • 7.4.11.1. Market Size and Forecast, By Market Type
        • 7.4.11.2. Market Size and Forecast, By Carrier Type
        • 7.4.11.3. Market Size and Forecast, By Business Model

      • 7.4.12. Malaysia Fan-out Panel-level Packaging (foplp) Market

        • 7.4.12.1. Market Size and Forecast, By Market Type
        • 7.4.12.2. Market Size and Forecast, By Carrier Type
        • 7.4.12.3. Market Size and Forecast, By Business Model

      • 7.4.13. Indonesia Fan-out Panel-level Packaging (foplp) Market

        • 7.4.13.1. Market Size and Forecast, By Market Type
        • 7.4.13.2. Market Size and Forecast, By Carrier Type
        • 7.4.13.3. Market Size and Forecast, By Business Model

      • 7.4.14. Rest of Asia Pacific Fan-out Panel-level Packaging (foplp) Market

        • 7.4.14.1. Market Size and Forecast, By Market Type
        • 7.4.14.2. Market Size and Forecast, By Carrier Type
        • 7.4.14.3. Market Size and Forecast, By Business Model

    • 7.5. LAMEA

      • 7.5.1. Key Market Trends and Opportunities

      • 7.5.2. Market Size and Forecast, By Market Type

      • 7.5.3. Market Size and Forecast, By Carrier Type

      • 7.5.4. Market Size and Forecast, By Business Model

      • 7.5.5. Market Size and Forecast, By Country

      • 7.5.6. Brazil Fan-out Panel-level Packaging (foplp) Market

        • 7.5.6.1. Market Size and Forecast, By Market Type
        • 7.5.6.2. Market Size and Forecast, By Carrier Type
        • 7.5.6.3. Market Size and Forecast, By Business Model

      • 7.5.7. South Africa Fan-out Panel-level Packaging (foplp) Market

        • 7.5.7.1. Market Size and Forecast, By Market Type
        • 7.5.7.2. Market Size and Forecast, By Carrier Type
        • 7.5.7.3. Market Size and Forecast, By Business Model

      • 7.5.8. Saudi Arabia Fan-out Panel-level Packaging (foplp) Market

        • 7.5.8.1. Market Size and Forecast, By Market Type
        • 7.5.8.2. Market Size and Forecast, By Carrier Type
        • 7.5.8.3. Market Size and Forecast, By Business Model

      • 7.5.9. UAE Fan-out Panel-level Packaging (foplp) Market

        • 7.5.9.1. Market Size and Forecast, By Market Type
        • 7.5.9.2. Market Size and Forecast, By Carrier Type
        • 7.5.9.3. Market Size and Forecast, By Business Model

      • 7.5.10. Argentina Fan-out Panel-level Packaging (foplp) Market

        • 7.5.10.1. Market Size and Forecast, By Market Type
        • 7.5.10.2. Market Size and Forecast, By Carrier Type
        • 7.5.10.3. Market Size and Forecast, By Business Model

      • 7.5.11. Rest of LAMEA Fan-out Panel-level Packaging (foplp) Market

        • 7.5.11.1. Market Size and Forecast, By Market Type
        • 7.5.11.2. Market Size and Forecast, By Carrier Type
        • 7.5.11.3. Market Size and Forecast, By Business Model

  • CHAPTER 8: COMPETITIVE LANDSCAPE

    • 8.1. Introduction

    • 8.2. Top Winning Strategies

    • 8.3. Product Mapping Of Top 10 Player

    • 8.4. Competitive Dashboard

    • 8.5. Competitive Heatmap

    • 8.6. Top Player Positioning, 2024

  • CHAPTER 9: COMPANY PROFILES

    • 9.1. Amkor Technology, Inc.

      • 9.1.1. Company Overview

      • 9.1.2. Key Executives

      • 9.1.3. Company Snapshot

      • 9.1.4. Operating Business Segments

      • 9.1.5. Product Portfolio

      • 9.1.6. Business Performance

      • 9.1.7. Key Strategic Moves and Developments

    • 9.2. Deca Technologies

      • 9.2.1. Company Overview

      • 9.2.2. Key Executives

      • 9.2.3. Company Snapshot

      • 9.2.4. Operating Business Segments

      • 9.2.5. Product Portfolio

      • 9.2.6. Business Performance

      • 9.2.7. Key Strategic Moves and Developments

    • 9.3. Strategic Moves And Developments

      • 9.3.1. Company Overview

      • 9.3.2. Key Executives

      • 9.3.3. Company Snapshot

      • 9.3.4. Operating Business Segments

      • 9.3.5. Product Portfolio

      • 9.3.6. Business Performance

      • 9.3.7. Key Strategic Moves and Developments

    • 9.4. SPTS Technologies Ltd.

      • 9.4.1. Company Overview

      • 9.4.2. Key Executives

      • 9.4.3. Company Snapshot

      • 9.4.4. Operating Business Segments

      • 9.4.5. Product Portfolio

      • 9.4.6. Business Performance

      • 9.4.7. Key Strategic Moves and Developments

    • 9.5. STATS ChipPAC

      • 9.5.1. Company Overview

      • 9.5.2. Key Executives

      • 9.5.3. Company Snapshot

      • 9.5.4. Operating Business Segments

      • 9.5.5. Product Portfolio

      • 9.5.6. Business Performance

      • 9.5.7. Key Strategic Moves and Developments

    • 9.6. Jiangsu Changjiang Electronics Tech Co.

      • 9.6.1. Company Overview

      • 9.6.2. Key Executives

      • 9.6.3. Company Snapshot

      • 9.6.4. Operating Business Segments

      • 9.6.5. Product Portfolio

      • 9.6.6. Business Performance

      • 9.6.7. Key Strategic Moves and Developments

    • 9.7. Amkor Technology Inc.

      • 9.7.1. Company Overview

      • 9.7.2. Key Executives

      • 9.7.3. Company Snapshot

      • 9.7.4. Operating Business Segments

      • 9.7.5. Product Portfolio

      • 9.7.6. Business Performance

      • 9.7.7. Key Strategic Moves and Developments

    • 9.8. Samsung Electro-Mechanics

      • 9.8.1. Company Overview

      • 9.8.2. Key Executives

      • 9.8.3. Company Snapshot

      • 9.8.4. Operating Business Segments

      • 9.8.5. Product Portfolio

      • 9.8.6. Business Performance

      • 9.8.7. Key Strategic Moves and Developments

    • 9.9. Powertech Technology Inc.

      • 9.9.1. Company Overview

      • 9.9.2. Key Executives

      • 9.9.3. Company Snapshot

      • 9.9.4. Operating Business Segments

      • 9.9.5. Product Portfolio

      • 9.9.6. Business Performance

      • 9.9.7. Key Strategic Moves and Developments

    • 9.10. Qualcomm Technologies, Inc

      • 9.10.1. Company Overview

      • 9.10.2. Key Executives

      • 9.10.3. Company Snapshot

      • 9.10.4. Operating Business Segments

      • 9.10.5. Product Portfolio

      • 9.10.6. Business Performance

      • 9.10.7. Key Strategic Moves and Developments

  • LIST OF TABLES

  • TABLE 1. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 2. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR CORE FAN-OUT, BY REGION, 2025-2033 ($MILLION)
  • TABLE 3. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR HIGH-DENSITY FAN-OUT, BY REGION, 2025-2033 ($MILLION)
  • TABLE 4. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR ULTRA HIGH-DENSITY FAN OUT, BY REGION, 2025-2033 ($MILLION)
  • TABLE 5. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 6. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR 200 MM, BY REGION, 2025-2033 ($MILLION)
  • TABLE 7. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR 300 MM, BY REGION, 2025-2033 ($MILLION)
  • TABLE 8. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR PANEL, BY REGION, 2025-2033 ($MILLION)
  • TABLE 9. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 10. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR OSAT, BY REGION, 2025-2033 ($MILLION)
  • TABLE 11. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR FOUNDARY, BY REGION, 2025-2033 ($MILLION)
  • TABLE 12. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR IDM, BY REGION, 2025-2033 ($MILLION)
  • TABLE 13. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET, BY REGION, 2025-2033 ($MILLION)
  • TABLE 14. NORTH AMERICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY REGION, 2025-2033 ($MILLION)
  • TABLE 15. NORTH AMERICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 16. NORTH AMERICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 17. NORTH AMERICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 18. U.S. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 19. U.S. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 20. U.S. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 21. CANADA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 22. CANADA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 23. CANADA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 24. MEXICO FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 25. MEXICO FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 26. MEXICO FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 27. EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY REGION, 2025-2033 ($MILLION)
  • TABLE 28. EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 29. EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 30. EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 31. FRANCE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 32. FRANCE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 33. FRANCE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 34. GERMANY FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 35. GERMANY FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 36. GERMANY FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 37. ITALY FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 38. ITALY FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 39. ITALY FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 40. SPAIN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 41. SPAIN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 42. SPAIN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 43. UK FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 44. UK FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 45. UK FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 46. RUSSIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 47. RUSSIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 48. RUSSIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 49. REST OF EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 50. REST OF EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 51. REST OF EUROPE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 52. ASIA-PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY REGION, 2025-2033 ($MILLION)
  • TABLE 53. ASIA-PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 54. ASIA-PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 55. ASIA-PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 56. CHINA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 57. CHINA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 58. CHINA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 59. JAPAN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 60. JAPAN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 61. JAPAN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 62. INDIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 63. INDIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 64. INDIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 65. SOUTH KOREA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 66. SOUTH KOREA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 67. SOUTH KOREA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 68. AUSTRALIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 69. AUSTRALIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 70. AUSTRALIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 71. THAILAND FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 72. THAILAND FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 73. THAILAND FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 74. MALAYSIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 75. MALAYSIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 76. MALAYSIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 77. INDONESIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 78. INDONESIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 79. INDONESIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 80. REST OF ASIA PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 81. REST OF ASIA PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 82. REST OF ASIA PACIFIC FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 83. LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY REGION, 2025-2033 ($MILLION)
  • TABLE 84. LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 85. LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 86. LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 87. BRAZIL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 88. BRAZIL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 89. BRAZIL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 90. SOUTH AFRICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 91. SOUTH AFRICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 92. SOUTH AFRICA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 93. SAUDI ARABIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 94. SAUDI ARABIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 95. SAUDI ARABIA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 96. UAE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 97. UAE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 98. UAE FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 99. ARGENTINA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 100. ARGENTINA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 101. ARGENTINA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 102. REST OF LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY MARKET TYPE, 2025-2033 ($MILLION)
  • TABLE 103. REST OF LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY CARRIER TYPE, 2025-2033 ($MILLION)
  • TABLE 104. REST OF LAMEA FAN-OUT PANEL-LEVEL PACKAGING (FOPLP), BY BUSINESS MODEL, 2025-2033 ($MILLION)
  • TABLE 105. AMKOR TECHNOLOGY, INC.: KEY EXECUTIVES
  • TABLE 106. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
  • TABLE 107. AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
  • TABLE 108. AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO
  • TABLE 109. AMKOR TECHNOLOGY, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 110. DECA TECHNOLOGIES: KEY EXECUTIVES
  • TABLE 111. DECA TECHNOLOGIES: COMPANY SNAPSHOT
  • TABLE 112. DECA TECHNOLOGIES: OPERATING SEGMENTS
  • TABLE 113. DECA TECHNOLOGIES: PRODUCT PORTFOLIO
  • TABLE 114. DECA TECHNOLOGIES: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 115. STRATEGIC MOVES AND DEVELOPMENTS: KEY EXECUTIVES
  • TABLE 116. STRATEGIC MOVES AND DEVELOPMENTS: COMPANY SNAPSHOT
  • TABLE 117. STRATEGIC MOVES AND DEVELOPMENTS: OPERATING SEGMENTS
  • TABLE 118. STRATEGIC MOVES AND DEVELOPMENTS: PRODUCT PORTFOLIO
  • TABLE 119. STRATEGIC MOVES AND DEVELOPMENTS: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 120. SPTS TECHNOLOGIES LTD.: KEY EXECUTIVES
  • TABLE 121. SPTS TECHNOLOGIES LTD.: COMPANY SNAPSHOT
  • TABLE 122. SPTS TECHNOLOGIES LTD.: OPERATING SEGMENTS
  • TABLE 123. SPTS TECHNOLOGIES LTD.: PRODUCT PORTFOLIO
  • TABLE 124. SPTS TECHNOLOGIES LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 125. STATS CHIPPAC: KEY EXECUTIVES
  • TABLE 126. STATS CHIPPAC: COMPANY SNAPSHOT
  • TABLE 127. STATS CHIPPAC: OPERATING SEGMENTS
  • TABLE 128. STATS CHIPPAC: PRODUCT PORTFOLIO
  • TABLE 129. STATS CHIPPAC: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 130. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: KEY EXECUTIVES
  • TABLE 131. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: COMPANY SNAPSHOT
  • TABLE 132. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: OPERATING SEGMENTS
  • TABLE 133. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: PRODUCT PORTFOLIO
  • TABLE 134. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 135. AMKOR TECHNOLOGY INC.: KEY EXECUTIVES
  • TABLE 136. AMKOR TECHNOLOGY INC.: COMPANY SNAPSHOT
  • TABLE 137. AMKOR TECHNOLOGY INC.: OPERATING SEGMENTS
  • TABLE 138. AMKOR TECHNOLOGY INC.: PRODUCT PORTFOLIO
  • TABLE 139. AMKOR TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 140. SAMSUNG ELECTRO-MECHANICS: KEY EXECUTIVES
  • TABLE 141. SAMSUNG ELECTRO-MECHANICS: COMPANY SNAPSHOT
  • TABLE 142. SAMSUNG ELECTRO-MECHANICS: OPERATING SEGMENTS
  • TABLE 143. SAMSUNG ELECTRO-MECHANICS: PRODUCT PORTFOLIO
  • TABLE 144. SAMSUNG ELECTRO-MECHANICS: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 145. POWERTECH TECHNOLOGY INC.: KEY EXECUTIVES
  • TABLE 146. POWERTECH TECHNOLOGY INC.: COMPANY SNAPSHOT
  • TABLE 147. POWERTECH TECHNOLOGY INC.: OPERATING SEGMENTS
  • TABLE 148. POWERTECH TECHNOLOGY INC.: PRODUCT PORTFOLIO
  • TABLE 149. POWERTECH TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 150. QUALCOMM TECHNOLOGIES, INC: KEY EXECUTIVES
  • TABLE 151. QUALCOMM TECHNOLOGIES, INC: COMPANY SNAPSHOT
  • TABLE 152. QUALCOMM TECHNOLOGIES, INC: OPERATING SEGMENTS
  • TABLE 153. QUALCOMM TECHNOLOGIES, INC: PRODUCT PORTFOLIO
  • TABLE 154. QUALCOMM TECHNOLOGIES, INC: KEY STRATEGIC MOVES AND DEVELOPMENTS

  • LIST OF FIGURES

  • FIGURE 1. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET SEGMENTATION
  • FIGURE 2. GLOBAL FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET
  • FIGURE 3. SEGMENTATION FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET
  • FIGURE 4. TOP INVESTMENT POCKET IN FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET
  • FIGURE 5. MODERATE BARGAINING POWER OF BUYERS
  • FIGURE 6. MODERATE BARGAINING POWER OF SUPPLIERS
  • FIGURE 7. MODERATE THREAT OF NEW ENTRANTS
  • FIGURE 8. LOW THREAT OF SUBSTITUTION
  • FIGURE 9. HIGH COMPETITIVE RIVALRY
  • FIGURE 10. OPPORTUNITIES, RESTRAINTS AND DRIVERS: GLOBALFAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET
  • FIGURE 11. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET SEGMENTATION, BY BY MARKET TYPE
  • FIGURE 12. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR CORE FAN-OUT, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 13. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR HIGH-DENSITY FAN-OUT, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 14. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR ULTRA HIGH-DENSITY FAN OUT, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 15. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET SEGMENTATION, BY BY CARRIER TYPE
  • FIGURE 16. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR 200 MM, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 17. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR 300 MM, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 18. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR PANEL, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 19. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET SEGMENTATION, BY BY BUSINESS MODEL
  • FIGURE 20. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR OSAT, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 21. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR FOUNDARY, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 22. FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET FOR IDM, BY COUNTRY, 2025-2033 ($MILLION)
  • FIGURE 23. TOP WINNING STRATEGIES, BY YEAR, 2022-2024*
  • FIGURE 24. TOP WINNING STRATEGIES, BY DEVELOPMENT, 2022-2024*
  • FIGURE 25. TOP WINNING STRATEGIES, BY COMPANY, 2022-2024*
  • FIGURE 26. PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 27. COMPETITIVE DASHBOARD
  • FIGURE 28. COMPETITIVE HEATMAP: FAN-OUT PANEL-LEVEL PACKAGING (FOPLP) MARKET
  • FIGURE 29. TOP PLAYER POSITIONING, 2024
  • FIGURE 30. AMKOR TECHNOLOGY, INC.: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 31. AMKOR TECHNOLOGY, INC.: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 32. AMKOR TECHNOLOGY, INC.: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 33. DECA TECHNOLOGIES: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 34. DECA TECHNOLOGIES: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 35. DECA TECHNOLOGIES: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 36. STRATEGIC MOVES AND DEVELOPMENTS: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 37. STRATEGIC MOVES AND DEVELOPMENTS: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 38. STRATEGIC MOVES AND DEVELOPMENTS: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 39. SPTS TECHNOLOGIES LTD.: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 40. SPTS TECHNOLOGIES LTD.: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 41. SPTS TECHNOLOGIES LTD.: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 42. STATS CHIPPAC: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 43. STATS CHIPPAC: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 44. STATS CHIPPAC: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 45. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 46. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 47. JIANGSU CHANGJIANG ELECTRONICS TECH CO.: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 48. AMKOR TECHNOLOGY INC.: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 49. AMKOR TECHNOLOGY INC.: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 50. AMKOR TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 51. SAMSUNG ELECTRO-MECHANICS: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 52. SAMSUNG ELECTRO-MECHANICS: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 53. SAMSUNG ELECTRO-MECHANICS: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 54. POWERTECH TECHNOLOGY INC.: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 55. POWERTECH TECHNOLOGY INC.: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 56. POWERTECH TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2024 (%)
  • FIGURE 57. QUALCOMM TECHNOLOGIES, INC: NET SALES, 2022-2024 ($MILLION)
  • FIGURE 58. QUALCOMM TECHNOLOGIES, INC: REVENUE SHARE, BY SEGMENT, 2024 (%)
  • FIGURE 59. QUALCOMM TECHNOLOGIES, INC: REVENUE SHARE, BY REGION, 2024 (%)

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