Int'l : +1-503-894-6022 | Toll Free : +1-800-792-5285 | help@alliedmarketresearch.com
A08259 | Pages: NA | Charts: NA | Tables: NA |
Fan-out Wafer Level Packaging (FOWLP) is an integrated circuit (IC) packaging technology that allows simultaneous packaging of several components on the same substrate, hence lowering the overall cost of packaging. FOWLP finds large-scale applications in the consumer electronics sector to design ultra-thin portable devices such as smartphones, smartwatches, and laptops as they offer high-performing, energy-efficient, thin, and small form factor packages.
FOWLP features substrate-less package, lower thermal resistance, shorter interconnects instead of wire bonds leading to high performance and low inductance that facilitates use in multichip packages and heterogeneous integration. Fan-out panel level technology finds innumerable applications in IoT-related smart city projects, artificial intelligence, and biotechnology as it is a low-density technology along with advanced design flexibility and physical performance. Use of this technology in computing and 5G wireless communication implies that the fan-out wafer level packaging market share would undergo exponentially high growth in coming years.
The global fan-out wafer level packaging market is segmented on the basis of type, carrier type, business model, industry vertical, and region. Based on type, the fan-out wafer level packaging market is bifurcated into core fan-out and high density fan-out. In terms of carrier type, the market is categorized into 200mm, 300mm, and Panel. On the basis of business model, the market is divided into OSAT, Foundry, and IDM. In terms of industry vertical, the market is segmented into IT & telecommunication, consumer electronics, aerospace & defense, industrial, automotive, healthcare and others. Geographically, the fan-out wafer level packaging market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).
Top Impacting Factors
Surge in demand for high-power, miniaturized packaged ICs due to rise in popularity of IoT and technologically improved compact electronic devices such as smartphones, smartwatches, tablet, TVs among others primarily drives the packaging technology fan-out wafer level market growth. However, high manufacturing cost owing to war page causing differential shrinkage of material during FOWLP and reduced lifespan due to fluctuating co-efficient of thermal expansion of materials of wafer technology restrains the fan-out wafer level packaging market growth.
Contrarily, rise in integration of electronic equipment such as MEMS sensors, pressure sensors, and gyroscopes in autonomous or hybrid vehicles to fulfil demand for smart automotive solutions further boosts the market revenue for high-performance and cost-effective semiconductor packaging solutions. Technological advancements in efficient, reliable interconnect solutions, and overall advantages in performance over customary chip-scale packaging is anticipated to present new pathways to the fan-out wafer level packaging market.
Leading fan-out wafer level packaging market players adopt necessary methods to improve precision and functionality of advanced interconnect foundry services in the semiconductor industry with a view to support strong growth of chiplets and heterogeneous integration.
In August 2019, Deca Technologies, a supplier of wafer-level electronic interconnect solutions, announced that its M-Series Fan-out Wafer Level Packaging (FOWLP) Technology has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Xiaomi Mi 9, LG G8, and Samsung S10 handsets. M-Series processes are used to encapsulate active semiconductors where all solder balls are within silicon area and provide zero defects related to silicon cracking or chipping. Chipping or cracking defects can arise during shipping or board mounting process due to exposed silicon.
Protected fan-out technology offers reliable performance with extreme miniaturization as well as benefits light-sensitive devices blocking around 10 times the ambient light over conventional fan-in wafer level chip scale package. It offers improved electrical performance along with unique dielectric structure between active device and redistribution layers in radio frequency devices, hence showing noted success in the low density fan-out market.
FOWLP technology is used for semiconductor IC packaging used in automotive applications such as navigation control, infotainment system, anti-lock braking system, power doors, and windows.
In June 2020, Winbond Electronics Corp. introduced HyperRAM products with wafer-level chip scale packaging that helps to achieve very thin form factor in embedded applications. The new HyperRAM 2.0 products offer maximum data transfer rate of 400Mbps with 3V or 1.8V operating voltage and operates at the maximum frequency of 200MHz. The four product lines of this series of product for various end-user applications are 32Mb, 64Mb, 128Mb, and 256Mb.
HyperRAM series products provide 15-ball, 1.48mm*2mm wafer level chip scale package that is the best memory solution to meet requirements of mobile products such as smartphones, smartwatches, and other wearable electronics. The HyperBus interface has low pin count making wiring area smaller and providing simpler circuit board layout. This design helps to design compact memory controllers as the products support the interface.
Key Benefits of the Stakeholders
COVID-19 Impact Analysis
Questions Answered in the Fan-out Wafer Level Packaging Market Research Report
Key Market Segments
Key Market Players