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IC CMP slurries and pads are the consumables used in chemical-mechanical planarization and are selected on the basis of needs, in terms of technical performance, process optimization, and cost of ownership. The process of chemical-mechanical planarization is a critical step which is performed multiple times to remove excess materials in a semiconductor manufacturing process, at each layer of the wafer to create a smooth surface. The advancement of CMP pads, which offers combinations of higher removal rate, improved planarization, and defectivity performance makes its advantageous for CMP process. In addition, improvisation in slurries, which finds application for oxides, polysilicon, and front end of line (FEOL) makes the CMP process proficient. Therefore, influencing the need of CMP pads and slurries.
Though the chemical-mechanical planarization market is at a mature stage, the advancements in manufacturing technology is still to evolve for end users. As, industry has shifted toward advanced process technologies and applications such as microelectromechanical system, advanced substrates, and advanced packaging, which promotes the CMP market, in turn, promoting the IC CMP slurries and pads market. The advancements of polishing pads reduce wafer defects, improves removal rate, topography, and cost of ownership, which reduces the operation cost and increases the proficiency of CMP, which is expected to fuel the global IC CMP slurries and pads market size.
The surge in consumption of electronics, followed by advancements in smart technologies such as Internet of Things and others in the global market has increased the production of semiconductors, which is increasing the demand for slurries and pads used in CMPs. The highest number of semiconductor production units are based in Asia-pacific and North America; thus, these regions hold the largest share of the global IC CMP slurries and pads market.
The development in the semiconductor industry with better tools such as 3D processing and new material drive scaling is impacting the global IC CMP slurries and pads market. Furthermore, involvement of optical systems for advanced inspection and defect detection has led to the demand for slurries and pads that provide better results in the wafer manufacturing process. This, in turn, is expected to fuel the growth of IC CMP slurries and pads market. Moreover, advancements in buffing technique applied to control defectivity acts as driving factors for the global market of chemical-mechanical planarization which is expected to increase the CMP slurries and pads demand during the forecast period.
The agglomeration of fine particles in slurry, which causes micro scratches and pits on the wafer surface due to non-uniformity in pressure of polishing, impacts the proficiency of slurries in the CMP process. The process of wafer surface conditioning degrades the surface of pad due to the impact from non-uniform wafer surfaces, which damages the pads. These factors cause adverse effects to the global IC CMP slurries and pads market. Further, advancement of IoT in various verticals have lured consumers toward adoption of electronic devices, which is expected to provide growth opportunities to the market for CMP consumables i.e. slurries and pads.
The market is segmented on the basis of material, product type, application, and region. On the basis of material, the market is categorized into copper, barrier, and aluminum. On the basis of product type, it is bifurcated into IC CMP slurries and IC CMP pads. On the basis of application, it is further classified into data storage, dielectrics, silicon carbide wafer, silicon wafer, TSV, and tungsten. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The key players in the IC CMP slurries and pads industry are Applied Materials, BASF, Dow Chemicals, FujiFilm, Fujimi Corporation, Evonik, 3M, Hitachi Chemical, Cabot Corporation, and Samsung Electronics.
Key Market Segments
Key Market Players