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Package on Package technically is an integrated circuit packaging technology that combines vertically discrete packages of the logic and memory ball grid array. Two or more than two packages are stacked over each other, following a standard interface that routes signal between them. This permits high part density at the expense of slightly higher height specifications in electronic devices such as personal digital assistants (PDA), cell phones, and digital cameras. Package-on-Package has recently been adopted as a 3-D product solution which provides solution to multiple problems associated with the integration of various types of devices.
PoP provides greater time-to-market, flexibility for product upgrades, reduced non-recurring engineering (NRE) and development costs, and the potential utilize current high-yielding silicone die which prevents the creation of a new chip, shortening the design cycle. Whereas a standard stacked-die package offers the technology required to combine multiple ICs into a single package – reducing the complexity of the motherboard, and significantly reducing size and cost of the small portable computer – the true power of PoP lies in the versatility it offers by minimizing liabilities and enhancing logistics. These are the key factors that drive PoP market.
The global package on package market is segmented on the basis of package technology, packaging type, interconnection technology, application, and region. Based on package technology, the market is further bifurcated into 2-D IC Packaging, 2.5-D IC Packaging, and 3-D IC Packaging. Based on packaging type, the market is divided into flat packages, pin grid arrays, surface mount, small outline packages, and others. Based on interconnection technology, the market is classified into wire bond, and flip chip. Based on end-user, the report segments the market into consumer electronics, automotive, telecommunication, industrial, aerospace & defense, healthcare. Geographically, the global market is analyzed across North America (Canada, Mexico, U.S.), Europe (France, Germany, UK, Rest of Europe), Asia-Pacific (China, India, Japan, South Korea, Rest of Asia-Pacific), LAMEA (Africa, Latin America, Middle East).
Key players of the global package on package market analyzed in the report include Amkor Technology Inc., Chipmos Tech. Inc., Chipbond Technology Corporation, Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co., Nanium SA, Qualcomm Incorporated, Powertech Technologies Inc., Stats Chippac Ltd, and Toshiba Corporation.
The global package on package market trends are as follows:
Rapid R&D and advancement in technology has catalyzed demand for reliable and miniaturized electronic devices. This has resulted in growth in demand for miniaturized electronic devices. Also, the advancements in semiconductor industry, has further latest electronic products have witnessed advancements that requires the use of IC packaging technology in memory, RF, logic, and sensors to be integrated into small form factors. The implementation of popular "convergence" features and functions is crucial to meeting the demands of mobile consumers for electronic equipment designs held in hand. In the marketplace, products that achieve high levels of integrated communications, computing and multimedia entertainment features in small, stylish, and robust new form factors are winning. Even in high-penetration markets for mobile phones, digital still cameras, PDAs, and MP3 players; consumers show a significant desire to update to relatively small and more functional hand held devices.
Wireless networks is expected to drive the market exponentially over the next five years with the availability of equipment that supports high bandwidth. This will promote the transition from current LTE technologies such as 3G & 4G to 5G. The data rates offered by 5G technology is much faster than the existing 3G and 4G data rates, respectively. This is expected to result in increased number of mobile subscribers, it promotes infrastructure requirement that can withstand user information requests.
The advantages many developed and implemented technologies in stacked-die package production, PoP system enables quick time-to-market, no-supply-chain-headache, flexible solutions which also meets the next-generation device performance, size, and cost requirements.
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