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Photonic Integrated Circuit (PIC) is a complex, integrated device which incorporates a lot of optical devices and at least two photonic functions embedded onto it. This combination of photonic sensors processes information signals by superimposing them on visible and infrared wavelengths in range of 800nm to 1700nm. This ground-breaking technology is used on a large-scale in the consumer electronics and telecommunication sector as these optical devices are discrete, compact in size, low weight and offer high-level, power-efficient performance.
Use of these miniature devices in data centers, cloud services, and automation services facilitate high data transmission rate with minimum heat dissipation than copper-based transmission. The chip is of low cost and can be integrated in various components such as amplifier and modulator thus shrinking the size of the component and simplifying equipment design, which helps in increasing manufacturing capabilities. Photonic components enable efficient electrical to optical conversion and allow devices to work at high temperature enhancing product quality standards in the market. Optics being the most significant method for long-haul data transmission, the photonic integrated circuit market share is anticipated to grow at considerably higher rate in the coming years.
Covid Impact Analysis:
Extensive use of advanced fiber communication network, growth of 3D sensing application using InP (Indium Phosphide) in PIC, increase in use of miniaturized compact integrated devices simplifying complex fabrication processes, and growth in use of bandwidth intensive applications such as provision of high-speed internet are primary factors that drive the photonic integrated circuit market growth. Organizations are shifting to fiber-optic enabled enterprise networks to handle benefits of IoT, artificial intelligence, and use optical splitters to separate light signals of various wavelength as they are transmitted through the network.
However, lack of skilled workforce to handle complex, advanced packaging techniques, need for high initial investments and thermal effect issues act as obstacles to hinder the photonic integrated circuit market growth. Contrarily, innovation in fabrication technologies of PIC, improvements in photonic integration with conventional technology processes, and extensive use of advanced data solution using silicon-based PIC are anticipated to pave new avenues in the photonic integrated circuit industry.
Key photonic integrated circuit market players have adopted necessary steps to bring about optimized solutions to fulfill critical demand for limitless bandwidth in cloud-service data centers.
In March 2020, Intel Corporation, American multinational corporation and technology company, declared that it integrated its 1.6Tbps silicon photonics engine with its 12.8Tbps programmable Ethernet switch. The silicon interconnect platform features 1.6Tbps photonic engines realized at 4ports of 400GBase-DR4 interfaces. The engines are modular arrays of transceivers with on-chip lasers and high-speed modulator and detector. The ethernet switch is programmed to meet the needs of hyperscale data centers and cloud service provider networks.
The laser PIC market is used at large-scale in automotive and industrial sectors for marking, engraving, cutting, welding, and drilling purposes as they provide wide operating range and enhanced optical power.
In May 2019, European scientists developed a pulse laser system to cut and shape ultra-high strength industrial materials at very high speed producing very less waste. The hardest boron steel used in vehicles can be cut by this new laser at 1cc/min operating at 1.5km per second. This technology have the control etch molds for vehicle parts at micron-scale accuracy and micro-weld dissimilar metals for solar thermal absorbers.
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Questions answered in the photonic integrated circuit Market research report:
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