Allied Market Research

2024

Gan Power Semiconductor Devices Market

GaN Power Semiconductor Devices Market Size, Share, Competitive Landscape and Trend Analysis Report by Type, by Application, by Voltage and by End User : Opportunity Analysis and Industry Forecast, 2023-2032

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Author's: | Sonia Mutreja
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Every data presented in the reports published by Allied Market Research is captured through primary interviews with top officials from leading organizations of the concerned domain. Our secondary data procurement methodology involves deep online and offline research and discussion with expert professionals and analysts in the industry. Moreover, the global Gan power semiconductor devices market report takes in the facts & figures of market growth & development, detailed study of the value chain, prevalent case studies, and profiles of the major players along with other qualitative segments. The top market players are thoroughly examined based on their revenue size. The report outlines how these players have taken recourse to several strategies including expansion, partnership, joint undertakings, and others to highlight their flair in the industry.

Key players identified in this report are NXP Semiconductors, ROHM Semiconductor, Infineon Technologies, Intel Corporation, Toshiba Corporation, Cree Inc., Texas Instruments Inc., Taiwan Semiconductor Manufacturing Company Ltd., GaN Systems Inc., Qorvo Inc.

Key Takeaways

  • Qualitative and quantitative analysis of the global Gan power semiconductor devices market based on by type, by application, by voltage, by end user

  • Current growth trends and market opportunities

  • Regional and country level forecast

  • Company profiles of the top market players

  • Detailed study of the drivers, restraints, and opportunities

  • Financial assessment of the portfolios of the key market players

Scope of the Report

The global Gan power semiconductor devices market report by AMR provides analysis of the current niches in the sector. The extensive research study offers significant information along with focusing on the drivers, restraints, and opportunities of the market. It also aims to role out wide-ranging information on the latest market trends and approaches.

Target Audience

  • Suppliers

  • Governments Bodies

  • Distributors

  • C-level Executives

  • Venture Capitalists

  • Universities

In this study, the years considered to estimate the market size of Gan power semiconductor devices market are as follows:

  • Base Year: 2022

  • Forecast Year: 2024

  • Unit: Value (USD Million/Billion)

GaN Power Semiconductor Devices Market Report Highlights

Aspects Details
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By Type
  • GaN-on-Si
  • GaN-on-SiC
  • GaN-on-Diamond
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By Application
  • Power Electronics
  • Computer and Peripheral
  • Medical Electronics
  • Consumer Electronics
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By Voltage
  • High Voltage
  • Low Voltage
  • Medium Voltage
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By End User
  • Automotive
  • Consumer Goods
  • Telecom and IT
  • Industrial Electronics
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By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (France, Germany, Italy, Spain, UK, Russia, Rest of Europe)
  • Asia-Pacific  (China, Japan, India, South Korea, Australia, Thailand, Malaysia, Indonesia, Rest of Asia-Pacific)
  • LAMEA  (Brazil, South Africa, Saudi Arabia, UAE, Argentina, Rest of LAMEA)
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Key Market Players

Texas Instruments Inc., Toshiba Corporation, Infineon Technologies, Qorvo Inc., ROHM Semiconductor, Intel Corporation, Taiwan Semiconductor Manufacturing Company Ltd., NXP Semiconductors, GaN Systems Inc., Cree Inc.

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GaN Power Semiconductor Devices Market

Opportunity Analysis and Industry Forecast, 2023-2032