Embedded Die Packaging Technology Market Expected to Reach $370.7 Million by 2031—Allied Market Research

According to a new report published by Allied Market Research, titled, “Embedded Die Packaging Technology Market By Platform, Industry Vertical: Global Opportunity Analysis And Industry Forecast, 2022-2031," the embedded die packaging technology market was valued at $69.18 million in 2021, and is estimated to reach $370.7 million by 2031, growing at a CAGR of 18.3% from 2022 to 2031.

Embedded die packaging technology is a native 3D-compatible packaging solution, offering nearly 70% size reduction in system in package (SiP) solution. The advantages of this technology include miniaturization, improved electrical & thermal performance, heterogeneous integration, prospect for reduction in cost, and efficient logistics for OEM. In addition, it offers flexible system integration, fast turnaround for custom design, high robustness, and enhanced reliability of the package.

The growth of global embedded die packaging technology is majorly driven by the surge in demand for smart and power-efficient electronics devices coupled with rise in disposable income in developing economies. Moreover, an integration with advanced technologies is expected to drive market growth. However, the high initial cost of design & development and maintenance acts as prime restraint of the global market. On the contrary, the rise in demand for compact and scalable ICs in global electronic industry is anticipated to provide lucrative opportunities for the embedded die packaging technology industry during the forecast period. Internet of Things (IoT) is one of the embedded die packaging technology market trends.

According to embedded die packaging technology market analysis, the embedded die in IC package substrate segment was the highest contributor to the market in 2021. The consumer electronics and IT & telecommunication segments collectively accounted for around 68.4% of the embedded die packaging technology market share in 2021. Surge in prime players initiatives to develop and deploy next generation portable devices solution globally has led the growth of the consumer electronics and IT & telecommunication segment; thereby, enhancing the embedded die packaging technology market growth.

The landscape of the semiconductor industry underwent a significant transformation due to the outbreak of COVID-19. The disruption in supply chains and manufacturing processes resulted in a notable downturn in the growth of semiconductor device production. One segment particularly impacted was the embedded die packaging technology solutions, which experienced a decline in demand as manufacturing solutions faced challenges during the pandemic. Government-imposed lockdowns, both partial and complete, aimed at curbing the virus's spread, had far-reaching consequences. One of the major setbacks was the hindrance in accessing a skilled workforce, further impeding the progress of the embedded die packaging technology market. Despite these setbacks, the surge in the need for portable electronic devices and the expansion of Internet of Things (IoT) applications have acted as catalysts. This surge not only bolstered the demand for semiconductor devices but also rekindled interest in embedded technology solutions. Consequently, experts anticipate that the post-pandemic era will witness a revitalized growth trajectory for the embedded die packaging technology market. In essence, while the COVID-19 pandemic initially hindered the growth of embedded die packaging technology due to manufacturing limitations and workforce disruptions, the subsequent rise in demand for interconnected devices is expected to drive the resurgence of this technology sector in the near future.

Region-wise, Asia-Pacific holds a significant share in the global embedded die packaging technology market, owing to the presence of prime players in this region. Further, China holds a dominating position in the Asia-Pacific embedded die packaging technology market owing to rise in investment by prime players and government agencies to develop next generation embedded die packaging technology-based semiconductor solution to improve electrical thermal performance and reliability & mechanical stability, which is expected to lead to the growth of the embedded die packaging technology in this region.

The key players profiled in the report include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer. Market players have adopted various strategies such as product launch, collaboration, partnership, joint venture, and acquisition to expand their foothold in the embedded die packaging technology market.

Key Findings of the Study

• In 2021, the embedded die in IC package substrate segment accounted for maximum revenue in the embedded die packaging technology market size, while the embedded die in flexible board segment is projected to grow at a notable CAGR during the forecast period.
• In 2021, the consumer electronics segment dominated the embedded die packaging technology market, while the others segment is estimated to expand at a faster rate during the forecast period.
• In 2021, Asia-Pacific contributed for the major share of the embedded die packaging technology market, and it is also expected to be the fastest expanding region during the forecast period.