Embedded Die Packaging Technology Market Overview:
Global Embedded Die Packaging Technology was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. Embedded die packaging technology refers to embedding the die directly into printed circuit board (PCB) laminated substrate, which facilitates size reduction, power saving, and improves the overall efficiency of the system on a large scale. There are two types of packaging technologies, namely, Flip-Chip Chip Scale Packaging (FC CSP) and Wafer Level Chip Scale Packaging (WL CSP), which have shown interesting growth rates in the recent past. This technology is growing rapidly and is expected to maintain this trend in the near future due to additional features, such as considerable cost reduction of whole packaging process, more compact chips, and reduced power loss of the system.
The demand for embedded die packaging technology is expected to increase globally during the forecast period, owing to impending need for circuit miniaturization in microelectronic devices, increase in number of portable electronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies. However, requirement of high high cost of these chips restrains the market growth restrains the market growth. Moreover, growth in trend of Internet of Things (IoT) globally is expected to present new opportunities in the market.
The global embedded die packaging technology market is segmented based on platform, industry vertical, and geography. Based on platform, it is classified into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. Based on industry vertical, it is categorized into consumer electronics, IT & telecommunication, automotive, healthcare, and others. Geographically, it is analyzed across North America (U.S., Mexico, and Canada), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
Global Embedded Die Packaging Market Segmentation
Top Impacting Factors
Impending Need for Circuit Miniaturization in Microelectronic Devices
The adoption of embedded die packaging has increased in the recent years, owing to the rise in need for miniaturization of electronic circuits in microelectronic devices. Embedded die packaging is a promising technology for emerging telecommunication applications, owing to its excellent electrical performance at high frequencies. Moreover, the demand for compact electronic circuitry is on a rise due to reduction in size of electronic devices for ease of access for users. This demand is catered by the embedded die packaging technology, which offers advantages such as increased functionality & efficiency of the electronic circuit; reduced size, signal inductance, and power inductance; improved reliability; and higher signal density.
North America is Expected to be a Lucrative Region
The North American embedded die packaging technology market is expected to grow at a high CAGR during the forecast period, owing to the well-developed telecommunication industry, rise in adoption of IoT, and high growth in automotive industry.
The report provides a comprehensive analysis of key market players and the significant strategies adopted by them. The key players include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.
Key Benefits for Stakeholders
- The study provides an in-depth analysis of the global embedded die packaging technology market to elucidate the prominent investment pockets from 2017 to 2023.
- Current trends and future estimations are outlined to determine the overall market scenario.
- The report provides information about key drivers, restraints, and opportunities with a detailed impact analysis.
Embedded Die Packaging Technology Market Key Segments:
- Embedded Die in IC Package Substrate
- Embedded Die in Rigid Board
- Embedded Die in Flexible Board
By Industry Vertical
- Consumer Electronics
- IT & Telecommunication
- North America
- Rest of Europe
- South Korea
- Rest of Asia-Pacific
- Latin America
- Middle East
- Amkor Technology
- Taiwan Semiconductor Manufacturing Company
- ASE Group
- AT & S
- General Electric
The other players in the value chain include (profiles not included in the report):
- Toshiba Corporation
- Fujitsu Limited