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Embedded Die Packaging Technology Market by Platform (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board) and Industry Vertical (Consumer Electronics, IT & Telecommunications, Automotive, Healthcare, and Others): Global Opportunity Analysis and Industry Forecast, 2017-2023

SE 172267
Pages: 168
Jun 2017 | 1480 Views
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Author's : Preeti Bisht & Gaurav Shukla
Tables: 43
Charts: 58
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Embedded Die Packaging Technology Market Overview:

Global Embedded Die Packaging Technology was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. Embedded die packaging technology refers to embedding the die directly into printed circuit board (PCB) laminated substrate, which facilitates size reduction, power saving, and improves the overall efficiency of the system on a large scale. There are two types of packaging technologies, namely, Flip-Chip Chip Scale Packaging (FC CSP) and Wafer Level Chip Scale Packaging (WL CSP), which have shown interesting growth rates in the recent past. This technology is growing rapidly and is expected to maintain this trend in the near future due to additional features, such as considerable cost reduction of whole packaging process, more compact chips, and reduced power loss of the system.

The demand for embedded die packaging technology is expected to increase globally during the forecast period, owing to impending need for circuit miniaturization in microelectronic devices, increase in number of portable electronic devices, rise in application in healthcare and automotive devices, and advantages over other advanced packaging technologies. However, requirement of high high cost of these chips restrains the market growth restrains the market growth. Moreover, growth in trend of Internet of Things (IoT) globally is expected to present new opportunities in the market.

Segment Overview

The global embedded die packaging technology market is segmented based on platform, industry vertical, and geography. Based on platform, it is classified into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. Based on industry vertical, it is categorized into consumer electronics, IT & telecommunication, automotive, healthcare, and others. Geographically, it is analyzed across North America (U.S., Mexico, and Canada), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).

Global Embedded Die Packaging Market Segmentation

Global Embedded Die Packaging Market Segmentation

Top Impacting Factors

Top Impacting Factors

Impending Need for Circuit Miniaturization in Microelectronic Devices

The adoption of embedded die packaging has increased in the recent years, owing to the rise in need for miniaturization of electronic circuits in microelectronic devices. Embedded die packaging is a promising technology for emerging telecommunication applications, owing to its excellent electrical performance at high frequencies. Moreover, the demand for compact electronic circuitry is on a rise due to reduction in size of electronic devices for ease of access for users. This demand is catered by the embedded die packaging technology, which offers advantages such as increased functionality & efficiency of the electronic circuit; reduced size, signal inductance, and power inductance; improved reliability; and higher signal density.

North America is Expected to be a Lucrative Region

The North American embedded die packaging technology market is expected to grow at a high CAGR during the forecast period, owing to the well-developed telecommunication industry, rise in adoption of IoT, and high growth in automotive industry.

Competitive Landscape

The report provides a comprehensive analysis of key market players and the significant strategies adopted by them. The key players include Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.

Key Benefits for Stakeholders

  • The study provides an in-depth analysis of the global embedded die packaging technology market to elucidate the prominent investment pockets from 2017 to 2023.
  • Current trends and future estimations are outlined to determine the overall market scenario.
  • The report provides information about key drivers, restraints, and opportunities with a detailed impact analysis.

Embedded Die Packaging Technology Market Key Segments:

By Platform

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board

By Industry Vertical

  • Consumer Electronics
  • IT & Telecommunication
  • Automotive
  • Healthcare
  • Others

By Geography

  • North America
    • U.S.
    • Mexico
    • Canada
  • Europe
    • UK
    • Germany
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Players

  • Amkor Technology
  • Taiwan Semiconductor Manufacturing Company
  • ASE Group
  • AT & S
  • General Electric
  • Infineon
  • Fujikura
  • MicroSemi
  • TDK-Epcos
  • Schweizer

The other players in the value chain include (profiles not included in the report):

  • STMICROELECTRONICS
  • Toshiba Corporation
  • Fujitsu Limited
 

Chapter: 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models

Chapter: 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter: 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Porters five forces analysis

3.4. MARKET DYNAMICS

3.4.1. Drivers
3.4.2. Restraint
3.4.3. Opportunity

Chapter: 4 EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM TYPE

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. EMBEDDED DIE IN IC PACKAGE SUBSTRATE

4.2.1. Introduction
4.2.2. Key market trends, growth factors, and opportunities
4.2.3. Market size and forecast

4.3. EMBEDDED DIE IN RIGID BOARD

4.3.1. Introduction
4.3.2. Key market trends, growth factors, and opportunities
4.3.3. Market size and forecast

4.4. EMBEDDED DIE IN FLEXIBLE BOARD

4.4.1. Introduction
4.4.2. Key market trends, growth factors, and opportunities
4.4.3. Market size and forecast

Chapter: 5 EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. CONSUMER ELECTRONICS

5.2.1. Introduction
5.2.2. Key market trends, growth factors, and opportunities
5.2.3. Market size and forecast

5.3. IT & TELECOMMUNICATION

5.3.1. Introduction
5.3.2. Key market trends, growth factors, and opportunities
5.3.3. Market size and forecast

5.4. AUTOMOTIVE

5.4.1. Introduction
5.4.2. Key market trends, growth factors, and opportunities
5.4.3. Market size and forecast

5.5. HEALTHCARE

5.5.1. Introduction
5.5.2. Key market trends, growth factors, and opportunities
5.5.3. Market size and forecast

5.6. OTHERS

5.6.1. Introduction
5.6.2. Key market trends, growth factors, and opportunities
5.6.3. Market size and forecast

Chapter: 6 EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY

6.1. OVERVIEW

6.1.1. Market size and forecast

6.2. NORTH AMERICA

6.2.1. Introduction
6.2.2. Key market trends, growth factors, and opportunities
6.2.3. Market size and forecast
6.2.4. U.S.

6.2.4.1. Market size and forecast

6.2.5. Canada

6.2.5.1. Market size and forecast

6.2.6. Mexico

6.2.6.1. Market size and forecast

6.3. EUROPE

6.3.1. Introduction
6.3.2. Key market trends, growth factors, and opportunities
6.3.3. Market size and forecast
6.3.4. UK

6.3.4.1. Market size and forecast

6.3.5. Germany

6.3.5.1. Market size and forecast

6.3.6. France

6.3.6.1. Market size and forecast

6.3.7. Rest of Europe

6.3.7.1. Market size and forecast

6.4. ASIA-PACIFIC

6.4.1. Introduction
6.4.2. Key market trends, growth factors and opportunities
6.4.3. Market size and forecast
6.4.4. China

6.4.4.1. Market size and forecast

6.4.5. Japan

6.4.5.1. Market size and forecast

6.4.6. Taiwan

6.4.6.1. Market size and forecast

6.4.7. South Korea

6.4.7.1. Market size and forecast

6.4.8. Rest of Asia-Pacific

6.4.8.1. Market size and forecast

6.5. LAMEA

6.5.1. Introduction
6.5.2. Key market trends, growth factors, and opportunities
6.5.3. Market size and forecast
6.5.4. Latin America

6.5.4.1. Market size and forecast

6.5.5. Middle East

6.5.5.1. Market size and forecast

6.5.6. Africa

6.5.6.1. Market size and forecast

Chapter: 7 RELATED INDUSTRY INSIGHTS

7.1. WORLD 3D SEMICONDUCTOR PACKAGING MARKET

7.1.1. Executive Summary

7.2. WORLD FLIP CHIP MARKET

7.2.1. Executive Summary

Chapter: 8 COMPANY PROFILES

8.1. AMKOR TECHNOLOGY

8.1.1. Company overview
8.1.2. Operating business segments
8.1.3. Business performance
8.1.4. Key strategic moves and developments

8.2. ASE GROUP

8.2.1. Company overview
8.2.2. Operating business segments
8.2.3. Business performance
8.2.4. Key strategic moves and developments

8.3. AT & S

8.3.1. Company overview
8.3.2. Operating business segments
8.3.3. Business performance
8.3.4. Key strategic moves and developments

8.4. FUJIKURA LTD.

8.4.1. Company overview
8.4.2. Operating business segments
8.4.3. Business performance
8.4.4. Key strategic moves and developments

8.5. GENERAL ELECTRIC

8.5.1. Company overview
8.5.2. Operating business segments
8.5.3. Business performance
8.5.4. Key strategic moves and developments

8.6. INFINEON TECHNOLOGIES AS

8.6.1. Company overview
8.6.2. Operating business segments
8.6.3. Business performance
8.6.4. Key strategic moves and developments

8.7. MICROSEMI CORPORATION

8.7.1. Company overview
8.7.2. Operating business segments
8.7.3. Business performance
8.7.4. Key strategic moves and developments

8.8. SCHWEIZER ELECTRONICS AG

8.8.1. Company overview
8.8.2. Operating business segments
8.8.3. Business performance
8.8.4. Key strategic moves and developments

8.9. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

8.9.1. Company overview
8.9.2. Operating business segments
8.9.3. Business performance
8.9.4. Key strategic moves and developments

8.10. TDK CORPORATION

8.10.1. Company overview
8.10.2. Operating business segments
8.10.3. Business performance
8.10.4. Key strategic moves and developments

LIST OF TABLES

TABLE 1. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM TYPE, 2016-2023 ($MILLION)
TABLE 2. EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 3. EMBEDDED DIE IN RIGID BOARD MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 4. EMBEDDED DIE IN FLEXIBLE BOARD MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 5. GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2016-2023 ($MILLION)
TABLE 6. CONSUMER ELECTRONICS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 7. IT & TELECOMMUNICATION EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 8. AUTOMOTIVE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 9. HEALTHCARE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 10. OTHERS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 11. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY, 2016-2023 ($MILLION)
TABLE 12. NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY TECHNOLOGY, 2016-2023 ($MILLION)
TABLE 13. NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2016-2023 ($MILLION)
TABLE 14. NORTH AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2016-2023 ($MILLION)
TABLE 15. EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY TYPE, 2016-2023 ($MILLION)
TABLE 16. EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2016-2023 ($MILLION)
TABLE 17. EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2016-2023 ($MILLION)
TABLE 18. ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY TECHNOLOGY, 2016-2023 ($MILLION)
TABLE 19. ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2016-2023 ($MILLION)
TABLE 20. ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2016-2023 ($MILLION)
TABLE 21. LAMEA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY TECHNOLOGY, 2016-2023 ($MILLION)
TABLE 22. LAMEA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL, 2016-2023 ($MILLION)
TABLE 23. LAMEA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY COUNTRY, 2016-2023 ($MILLION)
TABLE 24. AMKOR TECHNOLOGY: COMPANY SNAPSHOT
TABLE 25. AMKOR TECHNOLOGY: OPERATING SEGMENTS
TABLE 26. ASE GROUP: COMPANY SNAPSHOT
TABLE 27. ASE GROUP: OPERATING SEGMENTS
TABLE 28. AT & S: COMPANY SNAPSHOT
TABLE 29. AT & S: OPERATING SEGMENTS
TABLE 30. FUJIKURA LTD.: COMPANY SNAPSHOT
TABLE 31. FUJIKURA LTD.: OPERATING SEGMENTS
TABLE 32. GENERAL ELECTRIC: COMPANY SNAPSHOT
TABLE 33. GENERAL ELECTRIC: OPERATING SEGMENTS
TABLE 34. INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT
TABLE 35. INFINEON TECHNOLOGIES AG: OPERATING SEGMENTS
TABLE 36. MICROSEMI CORPORATION: COMPANY SNAPSHOT
TABLE 37. MICROSEMI CORPORATION: OPERATING SEGMENTS
TABLE 38. SCHWEIZER ELECTRONICS AG: COMPANY SNAPSHOT
TABLE 39. SCHWEIZER ELECTRONICS AG: OPERATING SEGMENTS
TABLE 40. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 41. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: OPERATING SEGMENTS
TABLE 42. TDK CORPORATION: COMPANY SNAPSHOT
TABLE 43. TDK CORPORATION: OPERATING SEGMENTS

LIST OF FIGURES

FIGURE 1. MARKET SEGMENTATION
FIGURE 2. TOP IMPACTING FACTORS
FIGURE 3. TOP WINNING STRATEGIES: PERCENTAGE DISTRIBUTION (2013-2016)
FIGURE 4. TOP INVESTMENT POCKETS IN GLOBAL EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL
FIGURE 5. BARGAINING POWER OF SUPPLIERS
FIGURE 6. BARGAINING POWER OF BUYERS
FIGURE 7. THREAT OF SUBSTITUTES
FIGURE 8. THREAT OF NEW ENTRANTS
FIGURE 9. INTENSITY OF COMPETITIVE RIVALRY
FIGURE 10. COMPARATIVE REGIONAL SHARE ANALYSIS OF EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET, 2016 & 2023 (%)
FIGURE 11. GLOBAL EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET, 2016-2023 ($MILLION)
FIGURE 12. GLOBAL EMBEDDED DIE IN IC PACKAGE SUBSTRATE MARKET ANALYSIS, 2016 & 2023
FIGURE 13. COMPARATIVE REGIONAL SHARE ANALYSIS OF EMBEDDED DIE IN RIGID BOARD MARKET, 2016 & 2023 (%)
FIGURE 14. GLOBAL EMBEDDED DIE IN RIGID BOARD MARKET, 2016-2023 ($MILLION)
FIGURE 15. GLOBAL EMBEDDED DIE IN RIGID BOARD MARKET ANALYSIS, 2016 & 2023
FIGURE 16. COMPARATIVE REGIONAL SHARE ANALYSIS OF EMBEDDED DIE IN FLEXIBLE BOARD MARKET, 2016 & 2023 (%)
FIGURE 17. GLOBAL EMBEDDED DIE IN FLEXIBLE BOARD MARKET, 2016-2023 ($MILLION)
FIGURE 18. GLOBAL EMBEDDED DIE IN FLEXIBLE BOARD MARKET ANALYSIS, 2016 & 2023
FIGURE 19. COMPARATIVE REGIONAL SHARE ANALYSIS OF CONSUMER ELECTRONICS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016 & 2023 (%)
FIGURE 20. GLOBAL CONSUMER ELECTRONICS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 21. GLOBAL CONSUMER ELECTRONICS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET ANALYSIS, 2016 & 2023
FIGURE 22. COMPARATIVE REGIONAL SHARE ANALYSIS OF IT & TELECOMMUNICATION EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016 & 2023 (%)
FIGURE 23. GLOBAL IT & TELECOMMUNICATION EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 24. GLOBAL IT & TELECOMMUNICATION EMBEDDED DIE PACKAGING TECHNOLOGY MARKET ANALYSIS, 2016 & 2023
FIGURE 25. COMPARATIVE REGIONAL SHARE ANALYSIS OF AUTOMOTIVE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016 & 2023 (%)
FIGURE 26. GLOBAL AUTOMOTIVE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 27. GLOBAL AUTOMOTIVE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET ANALYSIS, 2016 & 2023
FIGURE 28. COMPARATIVE REGIONAL SHARE ANALYSIS OF HEALTHCARE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016 & 2023 (%)
FIGURE 29. GLOBAL HEALTHCARE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 30. GLOBAL HEALTHCARE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET ANALYSIS, 2016 & 2023
FIGURE 31. COMPARATIVE REGIONAL SHARE ANALYSIS OF OTHERS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016 & 2023 (%)
FIGURE 32. GLOBAL OTHERS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 33. GLOBAL OTHERS EMBEDDED DIE PACKAGING TECHNOLOGY MARKET ANALYSIS, 2016 & 2023
FIGURE 34. U.S. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 35. CANADA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 36. MEXICO EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 37. UK EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 38. GERMANY EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 39. FRANCE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 40. REST OF EUROPE EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 41. CHINA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 42. JAPAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 43. TAIWAN EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 44. SOUTH KOREA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 45. REST OF ASIA-PACIFIC EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 46. LATIN AMERICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 47. MIDDLE EAST EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 48. AFRICA EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, 2016-2023 ($MILLION)
FIGURE 49. AMKOR TECHNOLOGY: COMPANY SNAPSHOT
FIGURE 50. ASE GROUP: COMPANY SNAPSHOT
FIGURE 51. AT & S: COMPANY SNAPSHOT
FIGURE 52. FUJIKURA LTD.: COMPANY SNAPSHOT
FIGURE 53. GENERAL ELECTRIC: COMPANY SNAPSHOT
FIGURE 54. INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT
FIGURE 55. MICROSEMI CORPORATION: COMPANY SNAPSHOT
FIGURE 56. SCHWEIZER ELECTRONICS AG: COMPANY SNAPSHOT
FIGURE 57. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
FIGURE 58. TDK CORPORATION: COMPANY SNAPSHOT

 

Embedded die packaging technology can be explained as the process of positioning or molding the components or ICs that are on an internal layer of an organic circuit board, unit, or chip package, such that it is hidden inside the complete structure, in spite of being connected on the top or bottom.

The embedded die packaging technology provides a reduced form-factor, improved thermal performance, enhanced integration capacity, and less inductance through advanced manufacturing chain with reduced cost. However, the large-scale production of these chips is still awaited, although the increased adoption in automotive and healthcare industries is anticipated to fuel the mass production of these chips in near future.  

The embedded die packaging technology is expected to present high growth rate as companies are heavily expending on R&D activities and the industries, such as automotive & transport, healthcare, and aerospace & defense, have a high adoption rate for this technology. This technology is expected to grow over twofolds in next 5-6 years, owing to its increasing applications across industries such as electronics, industrial, IT & telecom, and healthcare.

North America is the second highest revenue contributor to the global market, after Asia-Pacific. The market growth is attributed to factors such as rise in R&D investment in automotive industry, well-established IT & telecommunication industry, and rise in number of smart homes.

The key players in the embedded die packaging technology market are Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.

 

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