Italy Outsourced Semiconductor Assembly and Testing Market, by Process (Sawing, Sorting, Testing, Assembly), by Packaging Type (Ball grid array, Chip scale package, Multi-package, Stacked die, Quad and dual), by Application (Automotive, Consumer electronics, Industrial, Telecommunication, Aerospace and defense, Medical and healthcare, Logistics and transportation): Opportunity Analysis and Industry Forecast, 2021-2031

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