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3D ICs Market By Type (3D Stacked ICs and 3D Monolithic ICs), Component Type (TSVs, TGVs, Silicon Interposer, and Others), Substrate (Silicon on insulator [SOI] and Bulk Silicon), 3D Technology (3D Wafer Level Packaging, 3D System-in-package, and 3D Heterogeneous Integration), Industry Vertical (Consumer Electronics, IT & Telecommunication, Aerospace & Defense, Automotive, Healthcare, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2027

 
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