3D ICs Market, by Technology (Stacked 3D (3D SiC), Monolithic 3D), by Component (Through Silicon Via (TSV), Through Glass Via (TGV), Silicon Interposer), by Application (Logic, Imaging optoelectronics, Memory, MEMS/Sensors, LED, Others) and, by End User (Telecommunication, Automotive, Military Aerospace, Medical Device, Industrial, Others): Global Opportunity Analysis and Industry Forecast, 2023-2032

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