IC Substrates in Mobile Devices Market, by Type (Liquid Crystal Polymer (LCP), High Temperature Co-fired Ceramic (HTCC), Low Temperature Co-fired Ceramic (LTCC), Tape Automated Bonding (TAB), Flexible Substrates, Thin Film Substrates) and, by Application (Power Amplifiers, Transceiver and PA Modules, Switches, Filters, and Duplexers, Memory Modules, Multilayer Substrates, Thin-film Substrates): Opportunity Analysis and Industry Forecast, 2023-2032

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