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3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded),by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material),by Industry vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense)- Global Opportunity Analysis and Industry Forecast, 2014-2022

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Pages: 228
Dec 2016 | 2026 Views
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Author's : Gaurav Shukla and Komal Sharma
Tables: 59
Charts: 75
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 Global 3D Semiconductor Packaging Market Overview:

Global 3D semiconductor packaging market size is estimated to reach $8.9 billion by 2022, growing at a CAGR of 15.7 % from 2016 to 2022. 3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency which makes 3D semiconductor packaging industry the leading amongst all advanced packaging technologies.


Imminent requirement for size reduction in electronic devices, improved efficiency, and less power consumption drive the adoption of 3D semiconductor packaging in microelectronic devices and consequently navigates the growth in 3D semiconductor packaging industry. 3D semiconductor packaging technology provides improved performance of electrical devices operating at high frequencies, which increases its adoption in dynamic random access memory (DRAMS), NAND, and other high-end applications. It exhibits high speed and enhanced overall system efficiency while consuming smaller space as compared to its alternatives.

The 3D semiconductor packaging market trends which navigate unprecedented growth in 3D semiconductor packaging industry include, its advantages over other packaging technologies, lower cost, smaller size and enhanced efficiency. In 3D Through Silicon via (TSV) technology, the vertical connections are made through silicon die, and interconnect length is reduced drastically as compared to 2D technology where the connections are horizontal. The technological advantages of 3D packaging drive its demand in high-end applications such as chips used in super computers, DRAMS, NAND, microelectronic circuits, and others. Owing to these advantages, 3D semiconductor packaging market size has a lot of potential to rise with high growth rate. In 2015, US had the highest 3D semiconductor packaging market share in the overall North America 3D semiconductor packaging market, due to the high penetration of 3D TSV technology.
 
Factors impacting 3D semiconductor packaging market

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The demand for 3D packaged chips is expected to surge due to heavy investments on the R&D by many key players, including Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., and others, leading to the improvement in advanced packaging technique. Leading outsourced assembly and test (OSAT) companies collaborate to give a tough competition to foundries in packaging business, thus fostering the market growth. For instance, in 2015, Jiangsu Changjiang Electronics Technology Co., Ltd. acquired Statschippac to increase its R&D capacity, and another giant ASE group is considering to acquire SPIL.

SEGMENT REVIEW

The 3D semiconductor packaging market is segmented on the basis of technology, material, industry vertical, and geography.

SEGMENT REVIEW
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Based on technology, the market is segmented into 3D through silicon via, 3D package on package, 3D fan out based, 3D wire bonded, and others. By materials, the market is classified into organic substrate, bonding wire, leadframe, encapsulation resin, ceramic package, die attach material, and others. Furthermore, the market is categorized on the basis of industry vertical, which includes electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. Geographically, the market is divided into North America, Europe, Asia-Pacific, and LAMEA.

The key players profiled in the report include Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, and Taiwan Semiconductor Manufacturing Company.

Increase in demand for miniaturized circuits in microelectronic devices

The microelectronic devices include small surgical apparatus used in healthcare industry and miniature MEMS devices used in electronic products and others. These devices constitute various integrated chips, in which the manufacturers focus on their size reduction. Small size and low-power consumption are the major factors that drive the demand for chips with different advanced semiconductor packaging techniques one of which is 3D packaging design. The demand for compact electronic circuitry is accelerating, with the decreasing size of electronic devices for ease of access for users. All these factors collectively fuel the demand in 3D semiconductor packaging technology market.
Top winning strategies: nature and type
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The key players of the global 3D semiconductor packaging market are employing novel concepts & ideas, improving manufacturing techniques, and upgrading the current set of products, besides enhancing their profitability to gain a competitive edge over the other market players.

POTENTIAL BENEFITS FOR STAKEHOLDERS:

  • This report provides an in-depth analysis of the global 3D semiconductor packaging market along with current 3D semiconductor packaging market trends and future estimations to identify lucrative investment opportunities
  • This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis
  • Porter’s Five Forces analysis highlights the potency of buyers and suppliers that participate in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks
  • Market estimation of geographical regions is based on the current market scenario and future trends

KEY SEGMENTATION OF 3D SEMICONDUCTOR PACKAGING MARKET

The global 3D semiconductor packaging market is segmented on the basis of technology, materials, industry vertical, and geography.

BY TECHNOLOGY

  • 3D Wire Bonded
  • 3D Through Silicon Via
  • 3D Package on Package
  • 3D Fan Out Based

BY MATERIAL

  • Organic Substrate
  • Bonding Wire
  • Leadframe
  • Encapsulation Resins
  • Ceramic Packages
  • Die Attach Material

BY INDUSTRY VERTICAL

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense

BY GEOGRAPHY

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
 3D SEMICONDUCTOR  PACKAGING MARKET PLAYERS IN VALUE CHAIN
  • Amkor Technology
  • ASE Group
  • Siliconware Precision Industries Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • SÜSS MicroTec AG.
  • International Business Machines Corporation (IBM)
  • Intel Corporation
  • Qualcomm Technologies, Inc.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company
  • Sony Corp
  • SAMSUNG Electronics Co. Ltd.
  • Advanced Micro Devices, Inc.
  • Cisco
 

Chapter: 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models

Chapter: 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter: 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top Impacting Factors

3.2.1.1. Increase in number of portable electronic devices
3.2.1.2. Rise in demand for miniaturized circuits in microelectronic devices
3.2.1.3. Technological superiorities over 2D packaging technology
3.2.1.4. High initial capital investment required to set up a plant works as a restraining factor
3.2.1.5. Thermal issues with devices restrains the growth in the market

3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Bargaining power of suppliers
3.3.2. Bargaining power of buyers
3.3.3. Threat of substitutes
3.3.4. Threat of new entrants
3.3.5. Intensity of competitive rivalry

3.4. MARKET SHARE ANALYSIS, 2015
3.5. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS
3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Increase in number of portable electronic devices
3.6.1.2. Rise in demand of miniaturized circuits in microelectronic devices
3.6.1.3. Technological superiorities over 2D packaging technology

3.6.2. Restraint

3.6.2.1. High initial capital investment required to set up a plant
3.6.2.2. Thermal issues with devices

3.6.3. Opportunities

3.6.3.1. Growing trend of Internet of Things (IoT)

Chapter: 4 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. 3D THROUGH SILICON VIA (TSV)

4.2.1. Key market trends
4.2.2. Growth factors and opportunities
4.2.3. Market size and forecast

4.3. 3D PACKAGE ON PACKAGE (POP)

4.3.1. Key market trends
4.3.2. Growth factors and opportunities
4.3.3. Market size and forecast

4.4. 3D FAN OUT

4.4.1. Key market trends
4.4.2. Growth factors and opportunities
4.4.3. Market size and forecast

4.5. 3D WIRE BONDED

4.5.1. Key market trends
4.5.2. Growth factors and opportunities
4.5.3. Market size and forecast

4.6. OTHERS (FLIP CHIP AND HYBRID)

4.6.1. Key market trends
4.6.2. Growth factors and opportunities
4.6.3. Market size and forecast

Chapter: 5 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. ORGANIC SUBSTRATE

5.2.1. Key market trends
5.2.2. Growth factors and opportunities
5.2.3. Market size and forecast

5.3. BONDING WIRE

5.3.1. Key market trends
5.3.2. Growth factors and opportunities
5.3.3. Market size and forecast

5.4. LEADFRAME

5.4.1. Key market trends
5.4.2. Growth factors and opportunities
5.4.3. Market size and forecast

5.5. ENCAPSULATION RESIN

5.5.1. Key market trends
5.5.2. Growth factors and opportunities
5.5.3. Market size and forecast

5.6. CERAMIC PACKAGE

5.6.1. Key market trends
5.6.2. Growth factors and opportunities
5.6.3. Market size and forecast

5.7. DIE ATTACH MATERIAL

5.7.1. Key market trends
5.7.2. Growth factors and opportunities
5.7.3. Market size and forecast

5.8. OTHERS

5.8.1. Key market trends
5.8.2. Growth factors and opportunities
5.8.3. Market size and forecast

Chapter: 6 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL

6.1. OVERVIEW

6.1.1. Market size and forecast

6.2. ELECTRONICS

6.2.1. Key market trends
6.2.2. Growth factors and opportunities
6.2.3. Market size and forecast

6.3. INDUSTRIAL

6.3.1. Key market trends
6.3.2. Growth factors and opportunities
6.3.3. Market size and forecast

6.4. IT & TELECOMMUNICATION

6.4.1. Key market trends
6.4.2. Growth factors and opportunities
6.4.3. Market size and forecast

6.5. HEALTHCARE

6.5.1. Key market trends
6.5.2. Growth factors and opportunities
6.5.3. Market size and forecast

6.6. AUTOMOTIVE & TRANSPORT

6.6.1. Key market trends
6.6.2. Growth factors and opportunities
6.6.3. Market size and forecast

6.7. AEROSPACE & DEFENSE

6.7.1. Key market trends
6.7.2. Growth factors and opportunities
6.7.3. Market size and forecast

6.8. OTHERS (RENEWABLE ENERGY AND MEDIA & ENTERTAINMENT)

6.8.1. Key market trends
6.8.2. Growth factors and opportunities
6.8.3. Market size and forecast

Chapter: 7 WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY

7.1. OVERVIEW

7.1.1. Market size and forecast

7.2. NORTH AMERICA

7.2.1. Key market trends
7.2.2. Growth factors and opportunities
7.2.3. Market size and forecast
7.2.4. US

7.2.4.1. Market size and forecast

7.2.5. Canada

7.2.5.1. Market size and forecast

7.2.6. Mexico

7.2.6.1. Market size and forecast

7.3. EUROPE

7.3.1. Key market trends
7.3.2. Growth factors and opportunities
7.3.3. Market size and forecast
7.3.4. UK

7.3.4.1. Market size and forecast

7.3.5. Germany

7.3.5.1. Market size and forecast

7.3.6. France

7.3.6.1. Market size and forecast

7.3.7. Italy

7.3.7.1. Market size and forecast

7.3.8. Rest of Europe

7.3.8.1. Market size and forecast

7.4. ASIA-PACIFIC

7.4.1. Key market trends
7.4.2. Growth factors and opportunities
7.4.3. Market size and forecast
7.4.4. China

7.4.4.1. Market size and forecast

7.4.5. Japan

7.4.5.1. Market size and forecast

7.4.6. South Korea

7.4.6.1. Market size and forecast

7.4.7. India

7.4.7.1. Market size and forecast

7.4.8. Rest of Asia-Pacific

7.4.8.1. Market size and forecast

7.5. LAMEA

7.5.1. Key market trends
7.5.2. Growth factors and opportunities
7.5.3. Market size and forecast
7.5.4. Latin America

7.5.4.1. Market size and forecast

7.5.5. Middle East

7.5.5.1. Market size and forecast

7.5.6. Africa

7.5.6.1. Market size and forecast

Chapter: 8 COMPANY PROFILES

8.1. AMKOR TECHNOLOGY, INC.

8.1.1. Company overview
8.1.2. Operating business segments
8.1.3. Business performance
8.1.4. Key strategic moves and developments

8.2. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.

8.2.1. Company overview
8.2.2. Operating business segments
8.2.3. Business performance
8.2.4. Key strategic moves and developments

8.3. INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM)

8.3.1. Company overview
8.3.2. Operating business segments
8.3.3. Business performance
8.3.4. Key strategic moves and developments

8.4. QUALCOMM TECHNOLOGIES, INC.

8.4.1. Company overview
8.4.2. Operating business segments
8.4.3. Business performance
8.4.4. Key strategic moves and developments

8.5. INTEL CORPORATION

8.5.1. Company overview
8.5.2. Operating business segments
8.5.3. Business performance
8.5.4. Key strategic moves and developments

8.6. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

8.6.1. Company overview
8.6.2. Operating business segments
8.6.3. Business performance
8.6.4. Key strategic moves and developments

8.7. STMICROELECTRONICS N.V.

8.7.1. Company overview
8.7.2. Operating business segments
8.7.3. Business performance
8.7.4. Key strategic moves and developments

8.8. SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)

8.8.1. Company overview
8.8.2. Operating business segments
8.8.3. Business performance
8.8.4. Key strategic moves and developments

8.9. SUSS MICROTEC AG.

8.9.1. Company overview
8.9.2. Operating business segments
8.9.3. Business performance
8.9.4. Key strategic moves and developments

8.10. ASE GROUP

8.10.1. Company overview
8.10.2. Operating business segments
8.10.3. Business performance
8.10.4. Key strategic moves and developments

*Other players in the value chain include:

  • Sony Corp
  • SAMSUNG Electronics Co. Ltd.
  • Advanced Micro Devices, Inc.
  • Cisco

*Profiles of these players are not included. The same will be included on request

LIST OF FIGURES

FIGURE 1. SEGMENTATIONS
FIGURE 2. SMARTPHONE USERS IN MILLION (2014-2019)
FIGURE 3. TOP IMPACTING FACTORS
FIGURE 4. TOP WINNING STRATEGIES: PERCENTAGE DISTRIBUTION (2013 2016)
FIGURE 5. TOP WINNING STRATEGIES: NATURE AND TYPE
FIGURE 6. TOP INVESTMENT POCKETS IN WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL
FIGURE 7. PORTERS FIVE FORCES ANALYSIS
FIGURE 8. MARKET SHARE ANALYSIS, 2015
FIGURE 9. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS
FIGURE 10. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS ($MILLION), 2010-2015
FIGURE 11. INCREASE IN NUMBER OF CONNECTED DEVICES ACROSS THE GLOBE (2010-2020)
FIGURE 12. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D TSV SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 13. MARKET REVENUE & FORECAST OF GLOBAL 3D TSV SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 14. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D POP SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 15. MARKET REVENUE & FORECAST OF GLOBAL 3D POP SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 16. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D FAN OUT SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 17. MARKET REVENUE & FORECAST OF GLOBAL 3D FAN OUT SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 18. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 19. MARKET REVENUE & FORECAST OF GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 20. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 21. MARKET REVENUE & FORECAST OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 22. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 23. MARKET REVENUE & FORECAST OF GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 24. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 25. MARKET REVENUE & FORECAST OF GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 26. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 27. MARKET REVENUE & FORECAST OF GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 28. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 29. MARKET REVENUE & FORECAST OF GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 30. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 31. MARKET REVENUE & FORECAST OF GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 32. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL DIE ATTACH MATERIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 33. MARKET REVENUE & FORECAST OF GLOBAL DIE ATTACH MATERIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 34. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 35. MARKET REVENUE & FORECAST OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 36. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL ELECTROCNICS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 37. MARKET REVENUE & FORECAST OF GLOBAL ELECTRONICS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 38. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL INDUSTRIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 39. MARKET REVENUE & FORECAST OF GLOBAL INDUSTRIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 40. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL IT & TELECOMMUNICATION 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 41. MARKET REVENUE & FORECAST OF GLOBAL IT & TELECOMMUNICATION 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 42. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL HEALTHCARE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 43. MARKET REVENUE & FORECAST OF GLOBAL HEALTHCARE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 44. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL AUTOMOTIVE & TRANSPORT 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 45. MARKET REVENUE & FORECAST OF GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 46. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL AEROSPACE & DEFENSE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 47. MARKET REVENUE & FORECAST OF GLOBAL AEROSPACE & DEFENSE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 48. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 49. MARKET REVENUE & FORECAST OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 50. U.S.: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 51. CANADA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 52. MEXICO: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 53. UK: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 54. GERMANY: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 55. FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 56. FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 57. REST OF EUROPE: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 58. CHINA: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 59. JAPAN: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 60. SOUTH KOREA: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 61. INDIA: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 62. REST OF ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 63. LATIN AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 64. MIDDLE EAST: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 65. AFRICA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 66. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
FIGURE 67. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: COMPANY SNAPSHOT
FIGURE 68. IBM CORPORTAION: COMPANY SNAPSHOT
FIGURE 69. QUALCOMM TECHNOLOGIES.: COMPANY SNAPSHOT
FIGURE 70. INTEL CORPORATION: COMPANY SNAPSHOT
FIGURE 71. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: COMPANY SNAPSHOT
FIGURE 72. STMICROELECTRONICS TECHNOLOGY, INC.: COMPANY SNAPSHOT
FIGURE 73. SPIL: COMPANY SNAPSHOT
FIGURE 74. SUSS MICROTEC AG: COMPANY SNAPSHOT
FIGURE 75. ASE GROUP: COMPANY SNAPSHOT

LIST OF TABLES

TABLE 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 2. GLOBAL 3D TSV, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 3. GLOBAL 3D POP, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 4. GLOBAL 3D FAN OUT, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 5. GLOBAL 3D WIRE BONDED, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 6. GLOBAL OTHERS, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 7. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 8. GLOBAL ORGANIC SUBSTRATE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 9. GLOBAL BONDING WIRE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 10. GLOBAL LEADFRAME, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 11. GLOBAL ENCAPSULATION RESIN, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 12. GLOBAL CERAMIC PACKAGE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 13. GLOBAL DIE ATTACH MATERIAL, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 14. GLOBAL OTHERS, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 15. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VETRICAL, 2014-2022 ($MILLION)
TABLE 16. GLOBAL ELECTRONICS 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 17. GLOBAL INDUSTRIAL, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 18. GLOBAL IT & TELECOMMUNICATION, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 19. GLOBAL HEALTHCARE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 20. GLOBAL AUTOMOTIVE & TRANSPORT, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 21. GLOBAL AEROSPACE & DEFENSE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 22. GLOBAL OTHERS, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 23. 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 24. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 25. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 26. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2014-2022 ($MILLION)
TABLE 27. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 28. EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 29. EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 30. EUROPE: MICRODISPLAY MARKET, BY INDUSTRY VETRICAL, 2014-2022 ($MILLION)
TABLE 31. EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 32. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 33. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 34. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY INDUSTRY VETRICAL, 2014-2022 ($MILLION)
TABLE 35. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 36. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 37. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 38. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2014-2022 ($MILLION)
TABLE 39. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 40. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 41. AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 42. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: COMPANY SNAPSHOT
TABLE 43. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: OPERATING SEGMENTS
TABLE 44. IBM CORPORATION: COMPANY SNAPSHOT
TABLE 45. IBM CORPORATION: OPERATING SEGMENTS
TABLE 46. QUALCOMM TECHNOLOGIES.: COMPANY SNAPSHOT
TABLE 47. QUALCOMM TECHNOLOGIES: OPERATING SEGMENTS
TABLE 48. INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 49. INTEL CORPORATION. OPERATING SEGMENTS
TABLE 50. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: COMPANY SNAPSHOT
TABLE 51. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: OPERATING SEGMENTS
TABLE 52. STMICROELECTRONICS TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 53. STMICROELECTRONICS TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 54. SPIL: COMPANY SNAPSHOT
TABLE 55. SPIL: OPERATING SEGMENTS
TABLE 56. SUSS MICROTEC AG: COMPANY SNAPSHOT
TABLE 57. SUSS MICROTEC AG: OPERATING SEGMENTS
TABLE 58. ASE GROUP: COMPANY SNAPSHOT
TABLE 59. ASE GROUP: OPERATING SEGMENTS

 

The global 3D semiconductor packaging industry is witnessing a high-paced growth due to the need to control chip designing cost, which plays a major role in overall price of electronic devices, increase in demand for miniaturized circuits, and short replacement period of electronics products, which are primarily constituted of integrated circuits manufactured with 3D packaging technology.

The compact size and enhanced efficiency of 3D semiconductor packaged chips are key factors that drives the 3D semiconductor packaging market. The 3D semiconductor packaging industry in China is witnessing a fast-paced growth as the companies and the government of the country are investing heavily in advanced packaging technology (i.e. 3D semiconductor packaging) lead in the semiconductor industry.

Impending need of circuit miniaturization to fulfil the increased demand for portable electronics products across the globe and enhanced efficiency demand are some of the key factors that are expected to fuel the growth of the global 3D semiconductor packaging industry in coming years. 3D semiconductor packaging technologies such as 3D wire bonded and 3D TSVs are widely used in advanced 3D packaging design. In the year 2015, wire bonded segment held a significant share of about 44% in the overall 3D semiconductor packaging market revenue. Owing to low cost, easy availability and decent efficiency, the wire bonded technology is anticipated to hold the largest share of overall 3D semiconductor packaging market size.

Asia-Pacific is the most potential region for the manufacturers to increase their revenue and market share in the global 3D semiconductor packaging industry. Increased demand for miniaturize portable devices globally and reduction in power consumption of high-performance devices such as computers, smartphones, and others is observed to be a rising trend in this industry which will supplement the growth and increase the overall 3D semiconductor packaging market size.

Key players such as ASE group, Siliconware Precision Industries Co., Ltd., and Jiangsu Changjiang Electronics Technology Co. Ltd. are largely engaged in the process of product innovation, collaboration, and acquisition to further expand their services across various geographies.

 

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