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2021
3d Ic Market

3D IC Market by Type (Stacked 3D and Monolithic 3D), Component (Through-Silicon Via (TSV), Through Glass Via (TGV), and Silicon Interposer), Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, and Others), and End User (Consumer Electronics, Telecommunication, Automotive, Military & Aerospace, Medical Devices, Industrial, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2030

A12532
Pages: 370
Jul 2021 | 431 Views
   
Author(s) : Avinash Savekar , Vineet Kumar
Tables: 151
Charts: 103
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COVID-19

Pandemic disrupted the entire world and affected many industries.

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The global 3D IC market size is expected to reach $51.81 billion by 2030 from $9.18 billion in 2020, growing at a CAGR of 20% from 2021 to 2030. 

The Automotive sector impacted negatively, due to COVID-19 Pandemic.

3D ICs are the integrated circuits that incorporate two or more layers of circuitry in a single package. The layers are interconnected vertically as well as horizontally.  These multi-layer chips are usually created by manufacturing separate layers and then stacking and thinning them. 

3D-IC-Market-2021-2030

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In semiconductors, a trend to vertically stack integrated circuits (ICs) or circuitry has emerged as a viable solution for meeting electronic device requirements such as higher performance, increased functionality, lower power consumption, and a smaller footprint. The various methods and processes used to achieve this are called 3D integration technologies.   

Semiconductor technology is expected to increase the value of a semiconductor product by adding functionality in its operation, increasing and maintaining the performance while lowering the overall cost of packaging. The adoption of semiconductor packaging is also creating demand for high-performance chips for various consumer electronic products. This augments the demand for 3D IC chips used in smartphones and other mobile devices.

The prominent factors that drive the 3D IC market growth include high adoption of electronics devices, rise in demand for internet of things (IoT) technology, and technological advancement in 3D packaging technology. The high rise in 3D packaging technology has fueled the growth of the 3D IC market revenue. For instance, in 3D TSV technology, the vertical connections are made inside chips as compared to horizontal connections in 2D technology, which reduces the interconnect length and overall size of the chip. The technological advantages of 3D packaging drive its demand in high-end applications such as chips used in computers, DRAMS, NAND, Imaging & optoelectronics, memory, and others. High investment and collaboration by leading outsourced semiconductor assembly & test (OSAT) companies in R&D is anticipated to create growth opportunities for 3D IC market. However, high initial capital investment and high cost of materials is hampering the market growth. Moreover, high adoption of fan-out wafer level packaging technology is expected to provide lucrative opportunities to the market growth.

The global 3D IC market share is segmented on the basis of type, component, application, end user, and region. Based on type, the market is divided into stacked 3D and monolithic 3D. On the basis of component, it is analyzed across through-silicon via (TSV), through glass via (TGV), and silicon interposer. Based on application, the market is categorized into logic, imaging & optoelectronics, memory, MEMS/sensors, LED, and others. By end user, the market is studied across consumer electronics, telecommunication, automotive, military & aerospace, medical device, industrial, and others. By region, the 3D IC market trends are analyzed across the North America, Europe, Asia-Pacific, and LAMEA.   

3D IC Market
By Type

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Stacked 3D segment is projected as one of the most lucrative segments.

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Top Impacting Factors

The prominent factors that drive the growth of the 3D IC market include high adoption of electronics devices, rise in demand for internet of things (IoT) technology, and technological advancement in 3D packaging technology. However, high initial capital investment and high cost of materials hampers its adoption, which is expected to pose a major threat to the global market growth. However, high adoption of fan-out wafer level packaging technology are expected to provide lucrative opportunities to the 3D IC market growth.    

3D IC Market
By End User

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Consumer Electronics segment is expected to secure leading position during forecast period.

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Competition Analysis

The key players profiled in the 3D IC market report include Amkor Technology (U.S.), ASE Group (Taiwan), United Microelectronics Corp ((Taiwan)), Micron Technology, Inc. (U.S.), Intel Corporation (U.S.), STMicroelectronics (Switzerland), Toshiba Corporation (Japan), Samsung Electronics Co., Ltd. (South Korea), Xilinx Inc. (U.S.), and Taiwan Semiconductor Manufacturing Company (Taiwan). Market players have adopted various strategies, such as product launch, collaboration, agreement, partnership, and expansion, to expand their foothold in the 3D IC industry.    

3D IC Market
By Region

2030
Asia-pacific 
North America
Europe
Lamea

Asia-Pacific region would exhibit the highest CAGR of 21.15% during 2021-2030

  

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Covid 19 Impact Analysis

  • The impact of COVID-19 on the manufacturing industry has significantly affected the global economy. Electronic components, such as LED chips and wafers, ICs, and other semiconductor devices, are mostly imported from China. Attributed to the shutdown of manufacturing units, the prices of semiconductor components have increased, owing to shortage of supplies. 
  • COVID-19 has a large impact on both consumer and the economy. Electronics manufacturing hubs have been temporarily shut down to limit the COVID-19 spread among individuals. This has majorly affected the supply chain of the 3D IC market by creating shortages of materials, components, and finished goods. Lack of business continuity has ensured significant negative impacts on revenue and shareholder returns, which is expected to create financial disruptions in the 3D IC industry.
  • However, slowdown in productions by OEMs and reduction in demand for mobile phones and other consumer electronics has slightly pulled down the 3D IC market growth. In addition, reduction in various capital budgets and delay in planned projects in various end-use industries have hampered the global economy. 

Key Benefits For Stakeholders

  • This study comprises analytical depiction of the global 3D IC market outlook along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall 3D IC market analysis is determined to understand the profitable trends to gain a stronger foothold.  
  • The report presents information related to key drivers, restraints, and 3D IC market opportunities with a detailed impact analysis. 
  • The current 3D IC market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.   
  • Porter’s five forces analysis illustrates the potency of the buyers and the 3D IC market share of key vendors.  
  • The report includes the market trends and the revenue share of key vendors.

Key Market Segments

By Type

  • Stacked 3D 
  • Monolithic 3D

By Component

  • Through-Silicon Via (TSV)
  • Through Glass Via (TGV)
  • Silicon Interposer 

By Application

  • Logic
  • Imaging & optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others    

By End User

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • Industrial 
  • Others  

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany 
    • UK
    • France    
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China 
    • Japan
    • South Korea
    • Taiwan
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Players

  • ASE Group
  • Amkor Technology
  • Samsung Electronics Co., Ltd.
  • United Microelectronics Corp
  • STMicroelectronics
  • Toshiba Corporation
  • Intel Corporation
  • Micron Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Xilinx Inc. 
 

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings

2.1.1.Top impacting factors
2.1.2.Top investment pockets

2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key forces shaping the 3D IC technology
3.3.Patent analysis

3.3.1.By region, 2012–2020
3.3.2.By applicant, 2012–2020

3.4.COVID-19 impact analysis

3.4.1.COVID-19 outbreak
3.4.2.Impact on market size
3.4.3.End user trends, preferences, and budget impact
3.4.4.Opportunity window

3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Growing trend of miniaturization of electronics devices
3.5.1.2.Rising demand for Internet of Things (IoT) technology
3.5.1.3.Technological advancement in 3D packaging technology

3.5.2.Restraint

3.5.2.1.High initial capital investment and high cost of materials

3.5.3.Opportunity

3.5.3.1.High adoption of fan-out wafer level packaging technology

CHAPTER 4:3D IC MARKET , BY TECHNOLOGY

4.1.Overview
4.2.Stacked 3D (3D SiC)

4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country

4.3.Monolithic 3D

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country

CHAPTER 5:3D IC MARKET, BY COMPONENT

5.1.Overview
5.2.Through Silicon Via (TSV)

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country

5.3.Through Glass Via (TGV)

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country

5.4.Silicon Interposer

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country

CHAPTER 6:3D IC MARKET, BY APPLICATION

6.1.Overview
6.2.Logic

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market analysis, by country

6.3.Imaging & optoelectronics

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market analysis, by country

6.4.Memory

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market analysis, by country

6.5.MEMS/Sensors

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market analysis, by country

6.6.LED

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market analysis, by country

6.7.Others

6.7.1.Key market trends, growth factors, and opportunities
6.7.2.Market size and forecast, by region
6.7.3.Market analysis, by country

CHAPTER 7:3D IC MARKET, BY END-USER

7.1.Overview
7.2.Consumer electronics

7.2.1.Key market trends, growth factors, and opportunities
7.2.2.Market size and forecast, by region
7.2.3.Market analysis, by country

7.3.Telecommunication

7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Market size and forecast, by region
7.3.3.Market analysis, by country

7.4.Automotive

7.4.1.Key market trends, growth factors, and opportunities
7.4.2.Market size and forecast, by region
7.4.3.Market analysis, by country

7.5.Military & Aerospace

7.5.1.Key market trends, growth factors, and opportunities
7.5.2.Market size and forecast, by region
7.5.3.Market analysis, by country

7.6.Medical Device

7.6.1.Key market trends, growth factors, and opportunities
7.6.2.Market size and forecast, by region
7.6.3.Market analysis, by country

7.7.Industrial

7.7.1.Key market trends, growth factors, and opportunities
7.7.2.Market size and forecast, by region
7.7.3.Market analysis, by country

7.8.Others

7.8.1.Key market trends, growth factors, and opportunities
7.8.2.Market size and forecast, by region
7.8.3.Market analysis, by country

CHAPTER 8:3D IC MARKET, BY REGION

8.1.Overview
8.2.North America

8.2.1.Key market trends, growth factors, and opportunities
8.2.2.Market size and forecast, by type
8.2.3.Market size and forecast, by component
8.2.4.Market size and forecast, by application
8.2.5.Market size and forecast, by end user
8.2.6.Market analysis, by country

8.2.6.1.U.S.

8.2.6.1.1.Market size and forecast, by type
8.2.6.1.2.Market size and forecast, by component
8.2.6.1.3.Market size and forecast, by application
8.2.6.1.4.Market size and forecast, by end user

8.2.6.2.Canada

8.2.6.2.1.Market size and forecast, by type
8.2.6.2.2.Market size and forecast, by component
8.2.6.2.3.Market size and forecast, by application
8.2.6.2.4.Market size and forecast, by end user

8.2.6.3.Mexico

8.2.6.3.1.Market size and forecast, by type
8.2.6.3.2.Market size and forecast, by component
8.2.6.3.3.Market size and forecast, by application
8.2.6.3.4.Market size and forecast, by end user

8.3.Europe

8.3.1.Key market trends, growth factors, and opportunities
8.3.2.Market size and forecast, by type
8.3.3.Market size and forecast, by component
8.3.4.Market size and forecast, by application
8.3.5.Market size and forecast, by end user
8.3.6.Market analysis, by country

8.3.6.1.Germany

8.3.6.1.1.Market size and forecast, by type
8.3.6.1.2.Market size and forecast, by component
8.3.6.1.3.Market size and forecast, by application
8.3.6.1.4.Market size and forecast, by end user

8.3.6.2.UK

8.3.6.2.1.Market size and forecast, by type
8.3.6.2.2.Market size and forecast, by component
8.3.6.2.3.Market size and forecast, by application
8.3.6.2.4.Market size and forecast, by end user

8.3.6.3.France

8.3.6.3.1.Market size and forecast, by type
8.3.6.3.2.Market size and forecast, by component
8.3.6.3.3.Market size and forecast, by application
8.3.6.3.4.Market size and forecast, by end user

8.3.6.4.Italy

8.3.6.4.1.Market size and forecast, by type
8.3.6.4.2.Market size and forecast, by component
8.3.6.4.3.Market size and forecast, by application
8.3.6.4.4.Market size and forecast, by end user

8.3.6.5.Rest of Europe

8.3.6.5.1.Market size and forecast, by type
8.3.6.5.2.Market size and forecast, by component
8.3.6.5.3.Market size and forecast, by application
8.3.6.5.4.Market size and forecast, by end user

8.4.Asia-Pacific

8.4.1.Key market trends, growth factors, and opportunities
8.4.2.Market size and forecast, by type
8.4.3.Market size and forecast, by component
8.4.4.Market size and forecast, by application
8.4.5.Market size and forecast, by end user
8.4.6.Market analysis, by country

8.4.6.1.China

8.4.6.1.1.Market size and forecast, by type
8.4.6.1.2.Market size and forecast, by component
8.4.6.1.3.Market size and forecast, by application
8.4.6.1.4.Market size and forecast, by end user

8.4.6.2.Japan

8.4.6.2.1.Market size and forecast, by type
8.4.6.2.2.Market size and forecast, by component
8.4.6.2.3.Market size and forecast, by application
8.4.6.2.4.Market size and forecast, by end user

8.4.6.3.South Korea

8.4.6.3.1.Market size and forecast, by type
8.4.6.3.2.Market size and forecast, by component
8.4.6.3.3.Market size and forecast, by application
8.4.6.3.4.Market size and forecast, by end user

8.4.6.4.Taiwan

8.4.6.4.1.Market size and forecast, by type
8.4.6.4.2.Market size and forecast, by component
8.4.6.4.3.Market size and forecast, by application
8.4.6.4.4.Market size and forecast, by end user

8.4.6.5.India

8.4.6.5.1.Market size and forecast, by type
8.4.6.5.2.Market size and forecast, by component
8.4.6.5.3.Market size and forecast, by application
8.4.6.5.4.Market size and forecast, by end user

8.4.6.6.Rest of Asia-Pacific

8.4.6.6.1.Market size and forecast, by type
8.4.6.6.2.Market size and forecast, by component
8.4.6.6.3.Market size and forecast, by application
8.4.6.6.4.Market size and forecast, by end user

8.5.LAMEA

8.5.1.Key market trends, growth factors, and opportunities
8.5.2.Market size and forecast, by type
8.5.3.Market size and forecast, by component
8.5.4.Market size and forecast, by application
8.5.5.Market size and forecast, by end user
8.5.6.Market analysis, by country

8.5.6.1.Latin America

8.5.6.1.1.Market size and forecast, by type
8.5.6.1.2.Market size and forecast, by component
8.5.6.1.3.Market size and forecast, by application
8.5.6.1.4.Market size and forecast, by end user

8.5.6.2.Middle East

8.5.6.2.1.Market size and forecast, by type
8.5.6.2.2.Market size and forecast, by component
8.5.6.2.3.Market size and forecast, by application
8.5.6.2.4.Market size and forecast, by end user

8.5.6.3.Africa

8.5.6.3.1.Market size and forecast, by type
8.5.6.3.2.Market size and forecast, by component
8.5.6.3.3.Market size and forecast, by application
8.5.6.3.4.Market size and forecast, by end user

CHAPTER 9:COMPETITIVE LANDSCAPE

9.1.Introduction

9.1.1.Market player positioning, 2020

9.2.Top winning strategies
9.3.Product mapping of top 10 players
9.4.Competitive dashboard
9.5.Competitive heatmap

CHAPTER 10:COMPANY PROFILES

10.1.AMKOR TECHNOLOGY

10.1.1.Company overview
10.1.2.Key executive
10.1.3.Company snapshot
10.1.4.Product portfolio
10.1.5.R&D expenditure
10.1.6.Business performance

10.2.ASE GROUP

10.2.1.Company overview
10.2.2.Key executives
10.2.3.Company snapshot
10.2.4.Operating business segments
10.2.5.Product portfolio
10.2.6.R&D expenditure
10.2.7.Business performance
10.2.8.Key strategic moves and developments

10.3.Micron Technology, Inc.

10.3.1.Company overview
10.3.2.Key executives
10.3.3.Company snapshot
10.3.4.Operating business segments
10.3.5.Product portfolio
10.3.6.R&D expenditure
10.3.7.Business performance
10.3.8.Key strategic moves and developments

10.4.INTEL CORPORATION

10.4.1.Company overview
10.4.2.Key executives
10.4.3.Company snapshot
10.4.4.Operating business segments
10.4.5.Product portfolio
10.4.6.R&D expenditure
10.4.7.Business performance
10.4.8.Key strategic moves and developments

10.5.Samsung Electronics Co. Ltd.

10.5.1.Company overview
10.5.2.Key executives
10.5.3.Company snapshot.
10.5.4.Operating business segments
10.5.5.Product portfolio
10.5.6.R&D expenditure
10.5.7.Business performance
10.5.8.Key strategic moves and developments

10.6.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

10.6.1.Company overview
10.6.2.Key executives
10.6.3.Company snapshot.
10.6.4.Product portfolio
10.6.5.R&D expenditure
10.6.6.Business performance
10.6.7.Key strategic moves and developments

10.7.Toshiba Corporation

10.7.1.Company overview
10.7.2.Key executives
10.7.3.Company snapshot
10.7.4.Operating business segments
10.7.5.Product portfolio
10.7.6.R&D expenditure
10.7.7.Business performance
10.7.8.Key strategic moves and developments

10.8.STMicroelectronics N.V.

10.8.1.Company overview
10.8.2.Key executives
10.8.3.Company snapshot
10.8.4.Operating business segments
10.8.5.Product portfolio
10.8.6.R&D expenditure
10.8.7.Business performance
10.8.8.Key strategic moves and developments

10.9.Xilinx Inc.

10.9.1.Company overview
10.9.2.Key executives
10.9.3.Company snapshot
10.9.4.Operating business segments
10.9.5.Product portfolio
10.9.6.R&D expenditure
10.9.7.Business performance
10.9.8.Key strategic moves and developments

10.10.United Microelectronics Corporation.

10.10.1.Company overview
10.10.2.Key executives
10.10.3.Company snapshot
10.10.4.Operating business segments
10.10.5.Product portfolio
10.10.6.R&D expenditure
10.10.7.Business performance

LIST OF TABLES

TABLE 01.GLOBAL 3D IC MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 02.3D IC MARKET FOR STACKED 3D (3D SIC), BY REGION, 2020–2030 ($MILLION)
TABLE 03.3D IC MARKET FOR 3D TSV, BY REGION, 2020–2030 ($MILLION)
TABLE 04.3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 05.3D IC MARKET FOR THROUGH SILICON VIA (TSV), BY REGION, 2020–2030 ($MILLION)
TABLE 06.3D IC MARKET FOR THROUGH GLASS VIA (TGV), BY REGION, 2020–2030($MILLION)
TABLE 07.3D IC MARKET FOR SILICON INTERPOSER, BY REGION, 2020–2030($MILLION)
TABLE 08.GLOBAL 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 09.3D IC MARKET FOR LOGIC, BY REGION, 2020–2030 ($MILLION)
TABLE 10.3D IC MARKET FOR IMAGING & OPTOELECTRONICS, BY REGION, 2020–2030 ($MILLION)
TABLE 11.3D IC MARKET FOR MEMORY, BY REGION, 2020–2030 ($MILLION)
TABLE 12.3D IC MARKET FOR MEMS/SENSORS, BY REGION, 2020–20230($MILLION)
TABLE 13.3D IC MARKET FOR LED, BY REGION, 2020–20230($MILLION)
TABLE 14.3D IC MARKET FOR OTHERS, BY REGION, 2020–2030($MILLION)
TABLE 15.3D IC MARKET, BY END-USER, 2020–2030 ($MILLION)
TABLE 16.3D IC MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2020–2030 ($MILLION)
TABLE 17.3D IC MARKET FOR TELECOMMUNICATION, BY REGION, 2020–2030 ($MILLION)
TABLE 18.3D IC MARKET FOR AUTOMOTIVE, BY REGION, 2020–2030 ($MILLION)
TABLE 19.3D IC MARKET FOR MILITARY & AEROSPACE, BY REGION, 2020–2030 ($MILLION)
TABLE 20.3D IC MARKET FOR MEDICAL DEVICE, BY REGION, 2020–2030 ($MILLION)
TABLE 21.3D IC MARKET FOR INDUSTRIAL, BY REGION, 2020–2030 ($MILLION)
TABLE 22.3D IC MARKET FOR OTHERS, BY REGION, 2020–2030 ($MILLION)
TABLE 23.3D IC MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 24.NORTH AMERICA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 25.NORTH AMERICA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 26.NORTH AMERICA 3D IC MARKET, BY APPLICATION 2020–2030 ($MILLION)
TABLE 27.NORTH AMERICA 3D IC MARKET, BY END USER, 2020–2030 ($MILLION)
TABLE 28.U.S. 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 29.U.S. 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 30.U.S. 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 31.U.S. 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 32.CANADA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 33.CANADA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 34.CANADA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 35.CANADA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 36.MEXICO 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 37.MEXICO 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 38.MEXICO 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 39.MEXICO 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 40.EUROPE 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 41.EUROPE 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 42.EUROPE 3D IC MARKET, BY APPLICATION 2020–2030 ($MILLION)
TABLE 43.EUROPE 3D IC MARKET, BY END USER, 2020–2030 ($MILLION)
TABLE 44.GERMANY 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 45.GERMANY 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 46.GERMANY 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 47.GERMANY 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 48.UK 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 49.UK 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 50.UK 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 51.UK 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 52.FRANCE 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 53.FRANCE 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 54.FRANCE 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 55.FRANCE 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 56.ITALY 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 57.ITALY 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 58.ITALY 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 59.ITALY 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 60.REST OF EUROPE 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 61.REST OF EUROPE 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 62.REST OF EUROPE 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 63.REST OF EUROPE 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 64.ASIA-PACIFIC 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 65.ASIA-PACIFIC 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 66.ASIA-PACIFIC 3D IC MARKET, BY APPLICATION 2020–2030 ($MILLION)
TABLE 67.ASIA-PACIFIC 3D IC MARKET, BY END USER, 2020–2030 ($MILLION)
TABLE 68.CHINA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 69.CHINA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 70.CHINA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 71.CHINA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 72.JAPAN 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 73.JAPAN 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 74.JAPAN 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 75.JAPAN 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 76.SOUTH KOREA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 77.SOUTH KOREA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 78.SOUTH KOREA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 79.SOUTH KOREA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 80.TAIWAN 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 81.TAIWAN 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 82.TAIWAN 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 83.TAIWAN 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 84.INDIA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 85.INDIA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 86.INDIA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 87.INDIA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 88.CANADA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 89.CANADA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 90.CANADA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 91.CANADA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 92.LAMEA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 93.LAMEA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 94.LAMEA 3D IC MARKET, BY APPLICATION 2020–2030 ($MILLION)
TABLE 95.LAMEA 3D IC MARKET, BY END USER, 2020–2030 ($MILLION)
TABLE 96.LATIN AMERICA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 97.LATIN AMERICA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 98.LATIN AMERICA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 99.LATIN AMERICA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 100.MIDDLE EAST 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 101.MIDDLE EAST 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 102.MIDDLE EAST 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 103.MIDDLE EAST 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 104.AFRICA 3D IC MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 105.AFRICA 3D IC MARKET, BY COMPONENT, 2020–2030 ($MILLION)
TABLE 106.AFRICA 3D IC MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 107.AFRICA 3D IC MARKET, BY END USER, 2020-2030 ($MILLION)
TABLE 108.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT
TABLE 109.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO
TABLE 110.KEY EXECUTIVES
TABLE 111.ASE GROUP: COMPANY SNAPSHOT
TABLE 112.ASE GROUP: OPERATING SEGMENTS
TABLE 113.ASE GROUP: PRODUCT PORTFOLIO
TABLE 114.ASE GROUP.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 115.MICRON TECHNOLOGY, INC.:KEY EXECUTIVES
TABLE 116.MICRON TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 117.MICRON TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 118.MICRON TECHNOLOGY, INC.: PRODUCT PORTFOLIO
TABLE 119.MICRON TECHNOLOGY, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 120.INTEL CORPORATION: KEY EXECUTIVES
TABLE 121.INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 122.INTEL CORPORATION: OPERATING SEGMENTS
TABLE 123.INTEL CORPORATION: PRODUCT PORTFOLIO
TABLE 124.INTEL CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 125.SAMSUNG:KEY EXECUTIVES
TABLE 126.SAMSUNG: COMPANY SNAPSHOT
TABLE 127.SAMSUNG: OPERATING SEGMENTS
TABLE 128.SAMSUNG: PRODUCT PORTFOLIO
TABLE 129.SAMSUNG: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 130.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY EXECUTIVES
TABLE 131.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 132.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT PORTFOLIO
TABLE 133.TOSHIBA CORPORATION:KEY EXECUTIVES
TABLE 134.TOSHIBA CORPORATION: COMPANY SNAPSHOT
TABLE 135.TOSHIBA CORPORATION: OPERATING SEGMENTS
TABLE 136.TOSHIBA CORPORATION: PRODUCT PORTFOLIO
TABLE 137.TOSHIBA CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 138.STMICROELECTRONICS N.V.:KEY EXECUTIVES
TABLE 139.STMICROELECTRONICS N.V.: COMPANY SNAPSHOT
TABLE 140.STMICROELECTRONICS N.V.: OPERATING SEGMENTS
TABLE 141.STMICROELECTRONICS N.V.: PRODUCT PORTFOLIO
TABLE 142.STMICROELECTRONICS N.V.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 143.XILINX INC:KEY EXECUTIVES
TABLE 144.XILINX INC: COMPANY SNAPSHOT
TABLE 145.XILINX INC: OPERATING SEGMENTS
TABLE 146.XILINX INC: PRODUCT PORTFOLIO
TABLE 147.XILINX INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 148.UNITED MICROELECTRONICS CORP:KEY EXECUTIVES
TABLE 149.UNITED MICROELECTRONICS CORP: COMPANY SNAPSHOT
TABLE 150.UNITED MICROELECTRONICS CORP: OPERATING SEGMENTS
TABLE 151.UNITED MICROELECTRONICS CORP: PRODUCT PORTFOLIO

LIST OF FIGURES

FIGURE 01.SEGMENT INFORMATION
FIGURE 02.EXECUTIVE SUMMARY
FIGURE 03.EXECUTIVE SUMMARY
FIGURE 04.TOP IMPACTING FACTORS
FIGURE 05.TOP INVESTMENT POCKETS
FIGURE 06.MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07.MODERATE TO HIGH THREAT OF NEW ENTRANTS
FIGURE 08.MODERATE THREAT OF SUBSTITUTES
FIGURE 09.MODERATE INTENSITY OF RIVALRY
FIGURE 10.MODERATE TO HIGH BARGAINING POWER OF BUYERS
FIGURE 11.PATENT ANALYSIS, BY COUNTRY
FIGURE 12.PATENT ANALYSIS, BY APPLICANT
FIGURE 13.GLOBAL 3D IC MARKET, BY TECHNOLOGY, 2020–2030
FIGURE 14.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR STACKED 3D (3D SIC), BY COUNTRY, 2020 & 2030 (%)
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR 3D TSV, BY COUNTRY, 2020 & 2030 (%)
FIGURE 16.3D IC MARKET, BY COMPONENT, 2020–2030
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR THROUGH SILICON VIA (TSV), BY COUNTRY, 2020 & 2030 (%)
FIGURE 18.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR THROUGH GLASS VIA (TGV), BY COUNTRY, 2020 & 2030 (%)
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR SILICON INTERPOSER, BY COUNTRY, 2020 & 2030 (%)
FIGURE 20.GLOBAL 3D IC MARKET, BY APPLICATION, 2020–2030
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR LOGIC, BY COUNTRY, 2020 & 2030 (%)
FIGURE 22.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR IMAGING & OPTOELECTRONICS,  BY COUNTRY, 2020 & 2030 (%)
FIGURE 23.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR MEMORY, BY COUNTRY, 2020 & 2030 (%)
FIGURE 24.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR MEMS/SENSORS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 25.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR LED, BY COUNTRY, 2020 & 2030 (%)
FIGURE 26.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 27.3D IC MARKET, BY END-USER, 2020–2030
FIGURE 28.COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 29.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2020 & 2030 (%)
FIGURE 30.COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR AUTOMOTIVE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 31.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MAREKT FOR MILITARY & AEROSPACE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 32.COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR MEDICAL DEVICE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 33.COMPARATIVE SHARE ANALYSIS OF SHARE 3D IC MARKET FOR INDUSTRIAL, BY COUNTRY, 2020 & 2030 (%)
FIGURE 34.COMPARATIVE SHARE ANALYSIS OF 3D IC MARKET FOR OTHERS, BY COUNTRY,  2020 & 2030 (%)
FIGURE 35.3D IC MARKET, BY REGION, 2020-2030 (%)
FIGURE 36.COMPARATIVE SHARE ANALYSIS OF NORTH AMERICA 3D IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 37.U.S. 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 38.CANADA 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 39.MEXICO 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 40.COMPARATIVE SHARE ANALYSIS OF EUROPE 3D IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 41.GERMANY 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 42.UK 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 43.FRANCE 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 44.ITALY 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 45.REST OF EUROPE 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 46.COMPARATIVE SHARE ANALYSIS OF ASIA-PACIFIC 3D IC MARKET, BY COUNTRY,  2020–2030 (%)
FIGURE 47.CHINA 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 48.JAPAN 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 49.SOUTH KOREA 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 50.TAIWAN 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 51.INDIA 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 52.REST OF ASIA-PACIFIC 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 53.COMPARATIVE SHARE ANALYSIS OF LAMEA 3D IC MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 54.LATIN AMERICA 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 55.MIDDLE EAST 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 56.AFRICA 3D IC MARKET, 2020–2030 ($MILLION)
FIGURE 57.MARKET PLAYER POSITIONING, 2020
FIGURE 58.TOP WINNING STRATEGIES, BY YEAR, 2018–2021
FIGURE 59.TOP WINNING STRATEGIES, BY YEAR, 2018–2021
FIGURE 60.TOP WINNING STRATEGIES, BY COMPANY, 2018–2021
FIGURE 61.PRODUCT MAPPING OF TOP 10 PLAYERS
FIGURE 62.COMPETITIVE DASHBOARD
FIGURE 63.COMPETITIVE HEATMAP OF KEY PLAYERS
FIGURE 64.AMKOR TECHNOLOGY: KEY EXECUTIVE
FIGURE 65.AMKOR TECHNOLOGY: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 66.AMKOR TECHNOLOGY: REVENUE, 2018–2020 ($BILLION)
FIGURE 67.AMKOR TECHNOLOGY: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 68.R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 69.ASE GROUP: REVENUE, 2018–2020 ($MILLION)
FIGURE 70.ASE GROUP: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 71.ASE GROUP: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 72.MICRON TECHNOLOGY, INC.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 73.MICRON TECHNOLOGY, INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 74.MICRON TECHNOLOGY, INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 75.MICRON TECHNOLOGY, INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 76.INTEL CORPORATION: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 77.INTEL CORPORATION: REVENUE, 2018–2020 ($MILLION)
FIGURE 78.INTEL CORPORATION: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 79.INTEL CORPORATION: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 80.SAMSUNG: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 81.SAMSUNG: NET SALES, 2018–2020 ($MILLION)
FIGURE 82.SAMSUNG: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 83.SAMSUNG: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 84.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 85.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE, 2018–2020 ($MILLION)
FIGURE 86.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 87.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 88.TOSHIBA CORPORATION: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 89.TOSHIBA CORPORATION: NET SALES, 2018–2020 ($MILLION)
FIGURE 90.TOSHIBA CORPORATION: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 91.TOSHIBA CORPORATION: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 92.STMICROELECTRONICS N.V.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 93.STMICROELECTRONICS N.V.: REVENUE, 2018–2020 ($MILLION)
FIGURE 94.STMICROELECTRONICS N.V.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 95.STMICROELECTRONICS N.V.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 96.XILINX INC: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 97.XILINX INC: REVENUE, 2018–2020 ($MILLION)
FIGURE 98.XILINX INC: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 99.XILINX INC: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 100.  UNITED MICROELECTRONICS CORP: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 101.UNITED MICROELECTRONICS CORP: REVENUE, 2018–2020 ($MILLION)
FIGURE 102. UNITED MICROELECTRONICS CORP: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 103.UNITED MICROELECTRONICS CORP: REVENUE SHARE, BY REGION, 2020 (%)

 
 

The 3D IC market is expected to leverage high potential for consumer electronics and automotive verticals. The current business scenario is witnessing an increasing demand for consumer electronics devices, particularly in developing countries such as China, Japan, South Korea, India, and others. Companies in this industry are adopting various innovative techniques, such as merger & acquisition activities, to strengthen their business position in the competitive matrix. 

3D IC is steadily gaining traction, owing to rise in demand for enhanced technologies in various industry verticals, such as integration of IoT & AI, and surge in demand for consumer electronics products. Furthermore, technological development by emerging economies in Asia-Pacific boosts the 3D IC market growth. The 3D IC market is competitive, owing to the strong presence of existing vendors.

The key players operating in the global market include Amkor Technology, ASE Group, Intel Corporation, Samsung Electronics Co., Ltd., and Taiwan Semiconductor Manufacturing Company. These players have adopted various revenue and business growth strategies to enhance and develop their product portfolio, strengthen their market share, and help them increase their market penetration.

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A. The 3D IC Market is estimated to grow at a CAGR of 20% from 2021 to 2030.

A. The 3D IC Market is projected to reach $51.81 Billion by 2030.

A. To get the latest version of sample report

A. High adoption of electronics devices, rise in demand for internet of things (IoT) technology, and technological advancement in 3D packaging technology are the prime factors that drive growth of the 3D IC Market.

A. The key players profiled in the report include Amkor Technology (U.S.), ASE Group (Taiwan), United Microelectronics Corp ((Taiwan)), Micron Technology, Inc. (U.S.), Intel Corporation (U.S.), STMicroelectronics (Switzerland), Toshiba Corporation (Japan), Samsung Electronics Co., Ltd. (South Korea), Xilinx Inc. (U.S.), and Taiwan Semiconductor Manufacturing Company (Taiwan)

A. On the basis of top growing big corporations, we select top 10 players.

A. The 3D IC Market is segmented on the basis of type, component, application, end-user, and region

A. The key growth strategies of 3D IC Market players include product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations.

A. The stacked 3D segment accounted for maximum revenue and is projected to grow at a notable CAGR over 2021-2030.

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