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2020
Advanced Packaging Market

Advanced Packaging Market by Type (Flip Chip CSP, Flip-Chip Ball Grid Array, Wafer Level CSP, 2.5D/3D, Fan-Out WLP, and Others), and End Use (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027
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A02024
Pages: 224
May 2020 | 12426 Views
Author(s) : Divyanshi Tewari, & Vineet Kumar
Tables: 106
Charts: 87
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Advanced Packaging Market Outlook - 2027

The global advanced packaging market size was valued at $29.42 billion in 2019 and projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027. 

Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. Advanced packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

Advanced-Packaging-Market-2020-2027

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With rapid growth in the advanced packaging market, specifically fan out wafer level packaging, along with increase in demand for smartphone and devices and Internet of Things (IoT), advanced packaging suppliers are developing process and ways to reduce the overall cost of advanced packaging and provide maximum operational efficiency. During the recent times, advanced packaging is mainly used for high-end products and for applications related to niche-market such as wafer and die production due to high cost in its operation. Different integrated circuits (ICs) have different packaging requirements, which provide growth opportunities for advanced packaging over traditional packaging process. In addition, advanced packaging is expected to offer higher abilities than conventional packaging solutions, which is expected to offer lucrative opportunities for advanced packaging market trends in the coming years.

The global advanced packaging market is analyzed by type, end use, and region. By type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. On the basis of end use, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

Top Impacting Factors

The significant factors impacting the advanced packaging market growth of the global advanced packaging sensor market include increase in demand for miniaturization of devices, and improved system performances and optimization of advanced packaging. However, high cost of advanced packaging is hampering its adoption. This hampers the growth of the market. On the contrary, emerging trends of fan-out wafer level packaging are anticipated to provide lucrative opportunities for the advanced packaging market during the forecast period. 

Some major factors impacting the advanced packaging market growth are given below:

Increase in demand for miniaturization of devices

With increase in advancement in technologies, manufacturers are laying emphasis in providing compact electronic devices in various industry verticals such as consumer electronics, healthcare, automotive, and semiconductor IC manufacturing. These manufacturers are reducing the size of the integrated circuits to ensure fine patterning on the wafers and chips. In addition, medical devices industry is observing an increase in demand for nano-sized robotic surgery equipment with sophistication and advances into wearable and personalized healthcare gadgets. Therefore, the trends toward compact electronic devices has created the need for designers to outgrow the conventional packaging solutions and to adopt advanced packaging. 

Improved system performances and optimization of advanced packaging

Semiconductor packaging industry is providing advanced IC packages to develop next-generation chip designs. Traditionally, the integrated circuit industry was using traditional chip scaling and innovative architectures for new devices. In addition, there exist multi-chip packages in every phone, data center, consumer electronics, and network which drive the growth of advanced packaging as it promotes system optimization. Advance packaging promotes usage of AI, machine learning, and deep learning as it allows variety of different processing elements and memories to be coupled together using very high-speed interconnects. Therefore, enhanced operation capabilities and precise processing is lucrative for various industry verticals, such as automotive, healthcare, aerospace & defense, and industrial sector, which are now adopting advanced packaging. 

Advanced Packaging Market
By Type

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Fan-Out WLP segment is projected as one of the most lucrative segments.

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High cost of advanced packaging is hampering its adoption 

Advanced packaging is a very costly process as against conventional packaging solutions used in semiconductor industry. The cost of designing and manufacturing chips at each new node is costly at certain levels. In addition, the cost of wafer fabrication is much higher due to the complexities of the ICs. Packaging of different chips and ICs with complex pattering increases the overall cost of advanced packaging and hampers its adoption. 

Advanced Packaging Market
By End Use

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Consumer Electronics segment generated the highest revenue in 2019.

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Competition Analysis

Key players operating with major advanced packaging market share include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices, which are profiled in this report. The advanced packaging industry key market players adopt various strategies such as product launch, product development, collaboration, partnership, agreements, among others to influence the market growth.

Advanced Packaging Market
By Geography

2027
Asia-pacific 
North America
Europe
Lamea

Asia-Pacific region is expected to dominate the market during 2020-2027

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Key Benefits For Stakeholders

  • This study comprises analytical depiction of the global advanced packaging market size along with the current advanced packaging market trends and future estimations to depict the imminent investment pockets.

  • The overall advanced packaging market analysis is determined to understand the profitable trends to gain a stronger foothold.

  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.

  • The current advanced packaging market forecast is quantitatively analyzed from 2019 to 2027 to benchmark the financial competency.

  • Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the advanced packaging market.

Key Market Segments & Key Market Players

Segments Sub-segments
By Type
  • Flip Chip CSP
  • Flip-Chip Ball Grid Array
  • Wafer Level CSP
  • 5D/3D
  • Fan Out WLP
  • Others

By End Use
  • Consumer Electronics
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace & Defense
  • Others

By Region
  • North America
    • U>S>
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Corea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players
  • RENESAS ELECTRONICS
  • TEXAS INSTRUMENTS
  • TOSHIBA CORPORATION
  • INTEL CORPORATION
  • QUALCOMM TECHNOLOGIES, INC.
  • INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM)
  • ANALOG DEVICES, INC.
  • MICROCHIP TECHNOLOGY INC.
  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
  • AMKOR TECHNOLOGY
 

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Advanced packaging market is expected to leverage high potential for the consumer electronics and automotive vertical in 2026. The current business scenario is witnessing an increase in the demand for smart consumer electronics, particularly in the developing regions such as China, India, and others, due to an increase in demand for technological advancements in this sector such as adoption of AI and IoT. Companies in this industry are adopting various innovative techniques such as mergers and acquisition activities, to strengthen their business position in the competitive matrix.

The advanced packaging market is steadily gaining traction, owing to rise in demand for enhanced technologies in various industry verticals such as integration of IoT, AI, and surge in demand for smart consumer electronics. Technological development by the emerging economies in Asia-Pacific boosts the advanced packaging market growth. The ambitious project of 100 smart cities in India is projected to surge the adoption of smarter solutions for storage, since the project is based on the concept of using sensors and wireless technology to establish a wide connectivity network. 

The global advanced packaging market is highly competitive, owing to the strong presence of the existing vendors. Advanced Packaging vendors who have access to extensive technical and financial resources are anticipated to gain a competitive edge over their rivals, as they have the capacity to cater to the global market requirements. The competitive environment in this market is expected to further intensify with increase in technological innovations, product extensions, and different strategies adopted by the key vendors.
 

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