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2023
Ball Grid Array (bga) Packaging Market

Ball Grid Array (BGA) Packaging Market

by Type (Molded Array Process BGA, Thermally Enhanced BGA, Package on Package (PoP) BGA, Micro BGA), by Material (Ceramic, Plastic, Tape), by Application (OEM (Original Equipment Manufacturer), Aftermarket) and by Industry Vertical (IT Telecommunication, Consumer Electronics, Aerospace Defense, Industrial, Automotive, Healthcare, Others): Global Opportunity Analysis and Industry Forecast, 2023-2032

SE : Semiconductors
Report Code: A08890
Nov 2023 | Pages: NA
Tables: NA
Charts: NA

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COVID-19

Pandemic disrupted the entire world and affected many industries.

Get detailed COVID-19 impact analysis on the Ball Grid Array (bga) Packaging Market

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Ball Grid Array (BGA) Packaging Market Outlook – 2027 

Ball grid array (BGA) packaging is a type of surface-mount packaging used for integrated circuits (ICs) and can provide more interconnection pins that can be put on dual-in-line or flat package. The entire bottom surface of the device can be used and traces connecting the package leads to wires connecting the die to the package, which are shorter hence provide better performance at high speed. 

BGA packaging is mainly used in high-performance applications that require high density connections such as SMD ICs, where high electrical and thermal requirement is the top priority. BG packaging has enhanced ratio between PCB area and pin count and provides reduced footprint along with increase in speed yield of ICs. 

This low-cost, dense packaging with heat conductivity and low inductance allows wide spacing between connections as well as better level of soliderability in manufacturing yields. Improved re-workability from larger pad sizes and reduced package thickness leading to thinner, compact smartphones imply that the ball grid array (BGA) packaging market share would undergo a steady growth in coming years.

The global ball grid array (BGA) packaging market is segmented on the basis of type, material type, application, industry vertical, and region. Based on type, the ball grid array (BGA) packaging market is divided into molded array process BGA, thermally enhanced BGA, package on package (PoP) BGA, and micro BGA. In terms of material type, the market is categorized into ceramic, plastic, and tape. On the basis of application, the market is bifurcated into OEM (original equipment manufacturer) and aftermarket. 

Based on industry vertical, the ball grid array (BGA) packaging market is segregated into, IT & telecommunication, consumer electronics, aerospace & defense, industrial, automotive, healthcare, and others. Geographically, the market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).

Top Impacting Factors

Rise in demand for high-performance denser type compact packaging in increasing number of diverse semiconductor and electronic devices such as smartphones, smartwatches, and TVs is the primary factor that propels the ball grid array (BGA) packaging market growth. However, non-compliant connectivity and difficulty of inspection, owing to critical and complex design of ball grid array (BGA) packaging tends to restrain the ball grid array (BGA) packaging market growth.

On the other hand, rise in inclusion of IoT in packaged electronic equipment such as MEMS sensors, pressure sensors, and gyroscopes in autonomous, or hybrid vehicles to fulfil demand of smart automotive solutions further boosts the market revenue. Advancements in R&D activities related to electronic gadgets supported by wide range of functions of low cost multiple microchips connector in integrated circuits, electronic circuits tends to pave new avenues for the ball grid array (BGA) packaging industry.

New Product Launches to Flourish the Market

Leading ball grid array (BGA) packaging market players adopt necessary methods to improve precision and functionality of advanced interconnect foundry services in the semiconductor industry with a view to support strong growth of chips and heterogeneous integration.

Plastic ball grid array and thermally enhanced ball grid array comprise most advanced assembly processes and designs for cost or performance applications. This advanced IC technology enables design engineers to optimize innovations while maximizing performance characteristics of semiconductors. PBGA packages are designed for low inductance and improved thermal operation. 

These packages utilize industry proven, semiconductor grade materials for reliable, long-term operators, which provide user flexible design parameters. This is an ideal package for microprocessors, gate arrays, memory, graphics, and PC chip sets for applications such as cellular wireless telecommunications, global positioning systems, and video recording.

Surge in Use in Automotive and Industrial Applications

Ball Grid Array (BGA) package is an important part of complex systems, owing to wide substrate technology. It is widely used in the automotive sector for high-pin-count devices as well as in combination with Flip chip (FC) technology to enhance direct and short device-to-substrate connection. More than one thousand bumps and five hundred balls are boundary conditions of package connectivity. 

Array-substrate based packaging is used in computing platforms, networking, and hand-held consumer products as a solution to problems, owing to significant electrical shorting problems caused by increase in number of leads surrounding integrated circuits. 

This technology is used for semiconductor IC packaging used in automotive applications such as navigation control, infotainment system, anti-lock braking system, power doors, and windows. It helps to create strong link between link and modelling by overcoming potential issues and weaknesses, hence reducing overall cost and development cycle time. 

Key Benefits of the Stakeholders

  • The study gives an analytical overview of ball grid array (BGA) packaging market forecast with current trends and future estimations to determine imminent investment pockets.
  • The report provides information related to key drivers, restraints, and opportunities along with detailed ball grid array (BGA) packaging market analysis.
  • The current ball grid array (BGA) packaging market trends are quantitatively analysed.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 

COVID-19 Impact Analysis

  • Packaging manufacturers are forced to shut down production operations, owing to government-imposed lockdowns in the wake of the COVID-19 pandemic, which has led to supply chain disruption of the whole chip manufacturing & supply industry.
  • The COVID-19 pandemic has led to a shrink in demand for products powered by semiconductor devices. There is a halt in production of components, owing to the lockdown scenario. This has caused disruption in the overall supply chain of the global BGA packaging market.
  • Contrarily, the BGA packaging industry expects an opportunity in the unprecedented crisis as organizations begin to work-from-home and end users begin to consume more content on digital platforms. This influences importance of storage and memory solutions such as compact, cost-efficient, and high-powered packaged ICs for data centres, laptops, and other devices.
  • Companies manufacturing semiconductor device components are anticipated to revise production planning, sourcing strategy, and change industry dynamics to stimulate growth after lockdown restrictions are lifted.

Questions Answered in the Ball Grid Array (BGA) Packaging Market Research Report

  • Who are the leading market players active in the ball grid array (BGA) packaging market?
  • What would be the detailed impact of COVID-19 on the ball grid array (BGA) packaging market size?
  • What current trends would influence the market in the next few years?
  • What are the driving factors, restraints, and opportunities in the ball grid array (BGA) packaging market?
  • What are the projections for the future that would help in taking further strategic steps?

 Ball Grid Array (BGA) Packaging Market Report Highlights

Aspects Details
By Type
  • Molded Array Process BGA
  • Thermally Enhanced BGA
  • Package on Package (PoP) BGA
  • Micro BGA
By Material
  • Ceramic
  • Plastic
  • Tape
By Application
  • OEM (Original Equipment Manufacturer)
  • Aftermarket
By Industry Vertical
  • IT & Telecommunication
  • Consumer Electronics
  • Aerospace & Defense
  • Industrial
  • Automotive
  • Healthcare
  • Others
By Region
  • North America  (US, Canada, Mexico)
  • Europe  (Germany, UK, France, rest of Europe)
  • Asia Pacific  (India, Japan, China, rest of Asia Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players Corintech Ltd., Amkor Technology, Cypress Semiconductor Corp., Infineon Technologies AG, ASE Technology Holding, Integrated Circuit Engineering Corp., TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology, NXP Semiconductors NV, STATS ChipPAC
 

  • CHAPTER 1: INTRODUCTION

    • 1.1. Report Description

    • 1.2. Key Market Segments

    • 1.3. Key Benefits

    • 1.4. Research Methodology

      • 1.4.1. Primary Research

      • 1.4.2. Secondary Research

      • 1.4.3. Analyst Tools and Models

  • CHAPTER 2: EXECUTIVE SUMMARY

    • 2.1. CXO Perspective

  • CHAPTER 3: MARKET LANDSCAPE

    • 3.1. Market Definition and Scope

    • 3.2. Key Findings

      • 3.2.1. Top Investment Pockets

      • 3.2.2. Top Winning Strategies

    • 3.3. Porter's Five Forces Analysis

      • 3.3.1. Bargaining Power of Suppliers

      • 3.3.2. Threat of New Entrants

      • 3.3.3. Threat of Substitutes

      • 3.3.4. Competitive Rivalry

      • 3.3.5. Bargaining Power among Buyers

    • 3.5. Market Dynamics

      • 3.5.1. Drivers

      • 3.5.2. Restraints

      • 3.5.3. Opportunities

    • 3.6. COVID-19 Impact Analysis

  • CHAPTER 4: BALL GRID ARRAY (BGA) PACKAGING MARKET, BY TYPE

    • 4.1. Market Overview

      • 4.1.1 Market Size and Forecast, By Type

    • 4.2. Molded Array Process BGA

      • 4.2.1. Key Market Trends, Growth Factors and Opportunities

      • 4.2.2. Market Size and Forecast, By Region

      • 4.2.3. Market Share Analysis, By Country

    • 4.3. Thermally Enhanced BGA

      • 4.3.1. Key Market Trends, Growth Factors and Opportunities

      • 4.3.2. Market Size and Forecast, By Region

      • 4.3.3. Market Share Analysis, By Country

    • 4.4. Package On Package (PoP) BGA

      • 4.4.1. Key Market Trends, Growth Factors and Opportunities

      • 4.4.2. Market Size and Forecast, By Region

      • 4.4.3. Market Share Analysis, By Country

    • 4.5. Micro BGA

      • 4.5.1. Key Market Trends, Growth Factors and Opportunities

      • 4.5.2. Market Size and Forecast, By Region

      • 4.5.3. Market Share Analysis, By Country

  • CHAPTER 5: BALL GRID ARRAY (BGA) PACKAGING MARKET, BY MATERIAL

    • 5.1. Market Overview

      • 5.1.1 Market Size and Forecast, By Material

    • 5.2. Ceramic

      • 5.2.1. Key Market Trends, Growth Factors and Opportunities

      • 5.2.2. Market Size and Forecast, By Region

      • 5.2.3. Market Share Analysis, By Country

    • 5.3. Plastic

      • 5.3.1. Key Market Trends, Growth Factors and Opportunities

      • 5.3.2. Market Size and Forecast, By Region

      • 5.3.3. Market Share Analysis, By Country

    • 5.4. Tape

      • 5.4.1. Key Market Trends, Growth Factors and Opportunities

      • 5.4.2. Market Size and Forecast, By Region

      • 5.4.3. Market Share Analysis, By Country

  • CHAPTER 6: BALL GRID ARRAY (BGA) PACKAGING MARKET, BY APPLICATION

    • 6.1. Market Overview

      • 6.1.1 Market Size and Forecast, By Application

    • 6.2. OEM (Original Equipment Manufacturer)

      • 6.2.1. Key Market Trends, Growth Factors and Opportunities

      • 6.2.2. Market Size and Forecast, By Region

      • 6.2.3. Market Share Analysis, By Country

    • 6.3. Aftermarket

      • 6.3.1. Key Market Trends, Growth Factors and Opportunities

      • 6.3.2. Market Size and Forecast, By Region

      • 6.3.3. Market Share Analysis, By Country

  • CHAPTER 7: BALL GRID ARRAY (BGA) PACKAGING MARKET, BY INDUSTRY VERTICAL

    • 7.1. Market Overview

      • 7.1.1 Market Size and Forecast, By Industry Vertical

    • 7.2. IT Telecommunication

      • 7.2.1. Key Market Trends, Growth Factors and Opportunities

      • 7.2.2. Market Size and Forecast, By Region

      • 7.2.3. Market Share Analysis, By Country

    • 7.3. Consumer Electronics

      • 7.3.1. Key Market Trends, Growth Factors and Opportunities

      • 7.3.2. Market Size and Forecast, By Region

      • 7.3.3. Market Share Analysis, By Country

    • 7.4. Aerospace Defense

      • 7.4.1. Key Market Trends, Growth Factors and Opportunities

      • 7.4.2. Market Size and Forecast, By Region

      • 7.4.3. Market Share Analysis, By Country

    • 7.5. Industrial

      • 7.5.1. Key Market Trends, Growth Factors and Opportunities

      • 7.5.2. Market Size and Forecast, By Region

      • 7.5.3. Market Share Analysis, By Country

    • 7.6. Automotive

      • 7.6.1. Key Market Trends, Growth Factors and Opportunities

      • 7.6.2. Market Size and Forecast, By Region

      • 7.6.3. Market Share Analysis, By Country

    • 7.7. Healthcare

      • 7.7.1. Key Market Trends, Growth Factors and Opportunities

      • 7.7.2. Market Size and Forecast, By Region

      • 7.7.3. Market Share Analysis, By Country

    • 7.8. Others

      • 7.8.1. Key Market Trends, Growth Factors and Opportunities

      • 7.8.2. Market Size and Forecast, By Region

      • 7.8.3. Market Share Analysis, By Country

  • CHAPTER 8: BALL GRID ARRAY (BGA) PACKAGING MARKET, BY REGION

    • 8.1. Market Overview

      • 8.1.1 Market Size and Forecast, By Region

    • 8.2. North America

      • 8.2.1. Key Market Trends and Opportunities

      • 8.2.2. Market Size and Forecast, By Type

      • 8.2.3. Market Size and Forecast, By Material

      • 8.2.4. Market Size and Forecast, By Application

      • 8.2.5. Market Size and Forecast, By Industry Vertical

      • 8.2.6. Market Size and Forecast, By Country

      • 8.2.7. U.S. Ball Grid Array (bga) Packaging Market

        • 8.2.7.1. Market Size and Forecast, By Type
        • 8.2.7.2. Market Size and Forecast, By Material
        • 8.2.7.3. Market Size and Forecast, By Application
        • 8.2.7.4. Market Size and Forecast, By Industry Vertical

      • 8.2.8. Canada Ball Grid Array (bga) Packaging Market

        • 8.2.8.1. Market Size and Forecast, By Type
        • 8.2.8.2. Market Size and Forecast, By Material
        • 8.2.8.3. Market Size and Forecast, By Application
        • 8.2.8.4. Market Size and Forecast, By Industry Vertical

      • 8.2.9. Mexico Ball Grid Array (bga) Packaging Market

        • 8.2.9.1. Market Size and Forecast, By Type
        • 8.2.9.2. Market Size and Forecast, By Material
        • 8.2.9.3. Market Size and Forecast, By Application
        • 8.2.9.4. Market Size and Forecast, By Industry Vertical

    • 8.3. Europe

      • 8.3.1. Key Market Trends and Opportunities

      • 8.3.2. Market Size and Forecast, By Type

      • 8.3.3. Market Size and Forecast, By Material

      • 8.3.4. Market Size and Forecast, By Application

      • 8.3.5. Market Size and Forecast, By Industry Vertical

      • 8.3.6. Market Size and Forecast, By Country

      • 8.3.7. France Ball Grid Array (bga) Packaging Market

        • 8.3.7.1. Market Size and Forecast, By Type
        • 8.3.7.2. Market Size and Forecast, By Material
        • 8.3.7.3. Market Size and Forecast, By Application
        • 8.3.7.4. Market Size and Forecast, By Industry Vertical

      • 8.3.8. Germany Ball Grid Array (bga) Packaging Market

        • 8.3.8.1. Market Size and Forecast, By Type
        • 8.3.8.2. Market Size and Forecast, By Material
        • 8.3.8.3. Market Size and Forecast, By Application
        • 8.3.8.4. Market Size and Forecast, By Industry Vertical

      • 8.3.9. Italy Ball Grid Array (bga) Packaging Market

        • 8.3.9.1. Market Size and Forecast, By Type
        • 8.3.9.2. Market Size and Forecast, By Material
        • 8.3.9.3. Market Size and Forecast, By Application
        • 8.3.9.4. Market Size and Forecast, By Industry Vertical

      • 8.3.10. Spain Ball Grid Array (bga) Packaging Market

        • 8.3.10.1. Market Size and Forecast, By Type
        • 8.3.10.2. Market Size and Forecast, By Material
        • 8.3.10.3. Market Size and Forecast, By Application
        • 8.3.10.4. Market Size and Forecast, By Industry Vertical

      • 8.3.11. UK Ball Grid Array (bga) Packaging Market

        • 8.3.11.1. Market Size and Forecast, By Type
        • 8.3.11.2. Market Size and Forecast, By Material
        • 8.3.11.3. Market Size and Forecast, By Application
        • 8.3.11.4. Market Size and Forecast, By Industry Vertical

      • 8.3.12. Russia Ball Grid Array (bga) Packaging Market

        • 8.3.12.1. Market Size and Forecast, By Type
        • 8.3.12.2. Market Size and Forecast, By Material
        • 8.3.12.3. Market Size and Forecast, By Application
        • 8.3.12.4. Market Size and Forecast, By Industry Vertical

      • 8.3.13. Rest Of Europe Ball Grid Array (bga) Packaging Market

        • 8.3.13.1. Market Size and Forecast, By Type
        • 8.3.13.2. Market Size and Forecast, By Material
        • 8.3.13.3. Market Size and Forecast, By Application
        • 8.3.13.4. Market Size and Forecast, By Industry Vertical

    • 8.4. Asia-Pacific

      • 8.4.1. Key Market Trends and Opportunities

      • 8.4.2. Market Size and Forecast, By Type

      • 8.4.3. Market Size and Forecast, By Material

      • 8.4.4. Market Size and Forecast, By Application

      • 8.4.5. Market Size and Forecast, By Industry Vertical

      • 8.4.6. Market Size and Forecast, By Country

      • 8.4.7. China Ball Grid Array (bga) Packaging Market

        • 8.4.7.1. Market Size and Forecast, By Type
        • 8.4.7.2. Market Size and Forecast, By Material
        • 8.4.7.3. Market Size and Forecast, By Application
        • 8.4.7.4. Market Size and Forecast, By Industry Vertical

      • 8.4.8. Japan Ball Grid Array (bga) Packaging Market

        • 8.4.8.1. Market Size and Forecast, By Type
        • 8.4.8.2. Market Size and Forecast, By Material
        • 8.4.8.3. Market Size and Forecast, By Application
        • 8.4.8.4. Market Size and Forecast, By Industry Vertical

      • 8.4.9. India Ball Grid Array (bga) Packaging Market

        • 8.4.9.1. Market Size and Forecast, By Type
        • 8.4.9.2. Market Size and Forecast, By Material
        • 8.4.9.3. Market Size and Forecast, By Application
        • 8.4.9.4. Market Size and Forecast, By Industry Vertical

      • 8.4.10. South Korea Ball Grid Array (bga) Packaging Market

        • 8.4.10.1. Market Size and Forecast, By Type
        • 8.4.10.2. Market Size and Forecast, By Material
        • 8.4.10.3. Market Size and Forecast, By Application
        • 8.4.10.4. Market Size and Forecast, By Industry Vertical

      • 8.4.11. Australia Ball Grid Array (bga) Packaging Market

        • 8.4.11.1. Market Size and Forecast, By Type
        • 8.4.11.2. Market Size and Forecast, By Material
        • 8.4.11.3. Market Size and Forecast, By Application
        • 8.4.11.4. Market Size and Forecast, By Industry Vertical

      • 8.4.12. Thailand Ball Grid Array (bga) Packaging Market

        • 8.4.12.1. Market Size and Forecast, By Type
        • 8.4.12.2. Market Size and Forecast, By Material
        • 8.4.12.3. Market Size and Forecast, By Application
        • 8.4.12.4. Market Size and Forecast, By Industry Vertical

      • 8.4.13. Malaysia Ball Grid Array (bga) Packaging Market

        • 8.4.13.1. Market Size and Forecast, By Type
        • 8.4.13.2. Market Size and Forecast, By Material
        • 8.4.13.3. Market Size and Forecast, By Application
        • 8.4.13.4. Market Size and Forecast, By Industry Vertical

      • 8.4.14. Indonesia Ball Grid Array (bga) Packaging Market

        • 8.4.14.1. Market Size and Forecast, By Type
        • 8.4.14.2. Market Size and Forecast, By Material
        • 8.4.14.3. Market Size and Forecast, By Application
        • 8.4.14.4. Market Size and Forecast, By Industry Vertical

      • 8.4.15. Rest of Asia Pacific Ball Grid Array (bga) Packaging Market

        • 8.4.15.1. Market Size and Forecast, By Type
        • 8.4.15.2. Market Size and Forecast, By Material
        • 8.4.15.3. Market Size and Forecast, By Application
        • 8.4.15.4. Market Size and Forecast, By Industry Vertical

    • 8.5. LAMEA

      • 8.5.1. Key Market Trends and Opportunities

      • 8.5.2. Market Size and Forecast, By Type

      • 8.5.3. Market Size and Forecast, By Material

      • 8.5.4. Market Size and Forecast, By Application

      • 8.5.5. Market Size and Forecast, By Industry Vertical

      • 8.5.6. Market Size and Forecast, By Country

      • 8.5.7. Brazil Ball Grid Array (bga) Packaging Market

        • 8.5.7.1. Market Size and Forecast, By Type
        • 8.5.7.2. Market Size and Forecast, By Material
        • 8.5.7.3. Market Size and Forecast, By Application
        • 8.5.7.4. Market Size and Forecast, By Industry Vertical

      • 8.5.8. South Africa Ball Grid Array (bga) Packaging Market

        • 8.5.8.1. Market Size and Forecast, By Type
        • 8.5.8.2. Market Size and Forecast, By Material
        • 8.5.8.3. Market Size and Forecast, By Application
        • 8.5.8.4. Market Size and Forecast, By Industry Vertical

      • 8.5.9. Saudi Arabia Ball Grid Array (bga) Packaging Market

        • 8.5.9.1. Market Size and Forecast, By Type
        • 8.5.9.2. Market Size and Forecast, By Material
        • 8.5.9.3. Market Size and Forecast, By Application
        • 8.5.9.4. Market Size and Forecast, By Industry Vertical

      • 8.5.10. UAE Ball Grid Array (bga) Packaging Market

        • 8.5.10.1. Market Size and Forecast, By Type
        • 8.5.10.2. Market Size and Forecast, By Material
        • 8.5.10.3. Market Size and Forecast, By Application
        • 8.5.10.4. Market Size and Forecast, By Industry Vertical

      • 8.5.11. Argentina Ball Grid Array (bga) Packaging Market

        • 8.5.11.1. Market Size and Forecast, By Type
        • 8.5.11.2. Market Size and Forecast, By Material
        • 8.5.11.3. Market Size and Forecast, By Application
        • 8.5.11.4. Market Size and Forecast, By Industry Vertical

      • 8.5.12. Rest of LAMEA Ball Grid Array (bga) Packaging Market

        • 8.5.12.1. Market Size and Forecast, By Type
        • 8.5.12.2. Market Size and Forecast, By Material
        • 8.5.12.3. Market Size and Forecast, By Application
        • 8.5.12.4. Market Size and Forecast, By Industry Vertical

  • CHAPTER 9: COMPETITIVE LANDSCAPE

    • 9.1. Introduction

    • 9.2. Top Winning Strategies

    • 9.3. Product Mapping Of Top 10 Player

    • 9.4. Competitive Dashboard

    • 9.5. Competitive Heatmap

    • 9.6. Top Player Positioning,2022

  • CHAPTER 10: COMPANY PROFILES

    • 10.1. Amkor Technology

      • 10.1.1. Company Overview

      • 10.1.2. Key Executives

      • 10.1.3. Company Snapshot

      • 10.1.4. Operating Business Segments

      • 10.1.5. Product Portfolio

      • 10.1.6. Business Performance

      • 10.1.7. Key Strategic Moves and Developments

    • 10.2. TriQuint Semiconductor Inc.

      • 10.2.1. Company Overview

      • 10.2.2. Key Executives

      • 10.2.3. Company Snapshot

      • 10.2.4. Operating Business Segments

      • 10.2.5. Product Portfolio

      • 10.2.6. Business Performance

      • 10.2.7. Key Strategic Moves and Developments

    • 10.3. Jiangsu Changjiang Electronics Technology

      • 10.3.1. Company Overview

      • 10.3.2. Key Executives

      • 10.3.3. Company Snapshot

      • 10.3.4. Operating Business Segments

      • 10.3.5. Product Portfolio

      • 10.3.6. Business Performance

      • 10.3.7. Key Strategic Moves and Developments

    • 10.4. Corintech Ltd.

      • 10.4.1. Company Overview

      • 10.4.2. Key Executives

      • 10.4.3. Company Snapshot

      • 10.4.4. Operating Business Segments

      • 10.4.5. Product Portfolio

      • 10.4.6. Business Performance

      • 10.4.7. Key Strategic Moves and Developments

    • 10.5. STATS ChipPAC

      • 10.5.1. Company Overview

      • 10.5.2. Key Executives

      • 10.5.3. Company Snapshot

      • 10.5.4. Operating Business Segments

      • 10.5.5. Product Portfolio

      • 10.5.6. Business Performance

      • 10.5.7. Key Strategic Moves and Developments

    • 10.6. ASE Technology Holding

      • 10.6.1. Company Overview

      • 10.6.2. Key Executives

      • 10.6.3. Company Snapshot

      • 10.6.4. Operating Business Segments

      • 10.6.5. Product Portfolio

      • 10.6.6. Business Performance

      • 10.6.7. Key Strategic Moves and Developments

    • 10.7. Integrated Circuit Engineering Corp.

      • 10.7.1. Company Overview

      • 10.7.2. Key Executives

      • 10.7.3. Company Snapshot

      • 10.7.4. Operating Business Segments

      • 10.7.5. Product Portfolio

      • 10.7.6. Business Performance

      • 10.7.7. Key Strategic Moves and Developments

    • 10.8. Cypress Semiconductor Corp.

      • 10.8.1. Company Overview

      • 10.8.2. Key Executives

      • 10.8.3. Company Snapshot

      • 10.8.4. Operating Business Segments

      • 10.8.5. Product Portfolio

      • 10.8.6. Business Performance

      • 10.8.7. Key Strategic Moves and Developments

    • 10.9. Infineon Technologies AG

      • 10.9.1. Company Overview

      • 10.9.2. Key Executives

      • 10.9.3. Company Snapshot

      • 10.9.4. Operating Business Segments

      • 10.9.5. Product Portfolio

      • 10.9.6. Business Performance

      • 10.9.7. Key Strategic Moves and Developments

    • 10.10. NXP Semiconductors NV

      • 10.10.1. Company Overview

      • 10.10.2. Key Executives

      • 10.10.3. Company Snapshot

      • 10.10.4. Operating Business Segments

      • 10.10.5. Product Portfolio

      • 10.10.6. Business Performance

      • 10.10.7. Key Strategic Moves and Developments

  • LIST OF TABLES

  • TABLE 1. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 2. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR MOLDED ARRAY PROCESS BGA, BY REGION, 2022-2032 ($MILLION)
  • TABLE 3. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR THERMALLY ENHANCED BGA, BY REGION, 2022-2032 ($MILLION)
  • TABLE 4. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR PACKAGE ON PACKAGE (POP) BGA, BY REGION, 2022-2032 ($MILLION)
  • TABLE 5. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR MICRO BGA, BY REGION, 2022-2032 ($MILLION)
  • TABLE 6. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 7. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR CERAMIC, BY REGION, 2022-2032 ($MILLION)
  • TABLE 8. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR PLASTIC, BY REGION, 2022-2032 ($MILLION)
  • TABLE 9. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR TAPE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 10. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 11. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR OEM (ORIGINAL EQUIPMENT MANUFACTURER), BY REGION, 2022-2032 ($MILLION)
  • TABLE 12. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR AFTERMARKET, BY REGION, 2022-2032 ($MILLION)
  • TABLE 13. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 14. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR IT TELECOMMUNICATION, BY REGION, 2022-2032 ($MILLION)
  • TABLE 15. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2022-2032 ($MILLION)
  • TABLE 16. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR AEROSPACE DEFENSE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 17. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR INDUSTRIAL, BY REGION, 2022-2032 ($MILLION)
  • TABLE 18. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR AUTOMOTIVE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 19. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR HEALTHCARE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 20. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET FOR OTHERS, BY REGION, 2022-2032 ($MILLION)
  • TABLE 21. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET, BY REGION, 2022-2032 ($MILLION)
  • TABLE 22. NORTH AMERICA BALL GRID ARRAY (BGA) PACKAGING, BY REGION, 2022-2032 ($MILLION)
  • TABLE 23. NORTH AMERICA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 24. NORTH AMERICA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 25. NORTH AMERICA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 26. NORTH AMERICA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 27. U.S. BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 28. U.S. BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 29. U.S. BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 30. U.S. BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 31. CANADA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 32. CANADA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 33. CANADA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 34. CANADA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 35. MEXICO BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 36. MEXICO BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 37. MEXICO BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 38. MEXICO BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 39. EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY REGION, 2022-2032 ($MILLION)
  • TABLE 40. EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 41. EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 42. EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 43. EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 44. FRANCE BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 45. FRANCE BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 46. FRANCE BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 47. FRANCE BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 48. GERMANY BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 49. GERMANY BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 50. GERMANY BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 51. GERMANY BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 52. ITALY BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 53. ITALY BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 54. ITALY BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 55. ITALY BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 56. SPAIN BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 57. SPAIN BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 58. SPAIN BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 59. SPAIN BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 60. UK BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 61. UK BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 62. UK BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 63. UK BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 64. RUSSIA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 65. RUSSIA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 66. RUSSIA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 67. RUSSIA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 68. REST OF EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 69. REST OF EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 70. REST OF EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 71. REST OF EUROPE BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 72. ASIA-PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY REGION, 2022-2032 ($MILLION)
  • TABLE 73. ASIA-PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 74. ASIA-PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 75. ASIA-PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 76. ASIA-PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 77. CHINA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 78. CHINA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 79. CHINA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 80. CHINA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 81. JAPAN BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 82. JAPAN BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 83. JAPAN BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 84. JAPAN BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 85. INDIA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 86. INDIA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 87. INDIA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 88. INDIA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 89. SOUTH KOREA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 90. SOUTH KOREA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 91. SOUTH KOREA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 92. SOUTH KOREA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 93. AUSTRALIA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 94. AUSTRALIA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 95. AUSTRALIA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 96. AUSTRALIA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 97. THAILAND BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 98. THAILAND BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 99. THAILAND BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 100. THAILAND BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 101. MALAYSIA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 102. MALAYSIA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 103. MALAYSIA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 104. MALAYSIA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 105. INDONESIA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 106. INDONESIA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 107. INDONESIA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 108. INDONESIA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 109. REST OF ASIA PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 110. REST OF ASIA PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 111. REST OF ASIA PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 112. REST OF ASIA PACIFIC BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 113. LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY REGION, 2022-2032 ($MILLION)
  • TABLE 114. LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 115. LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 116. LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 117. LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 118. BRAZIL BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 119. BRAZIL BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 120. BRAZIL BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 121. BRAZIL BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 122. SOUTH AFRICA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 123. SOUTH AFRICA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 124. SOUTH AFRICA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 125. SOUTH AFRICA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 126. SAUDI ARABIA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 127. SAUDI ARABIA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 128. SAUDI ARABIA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 129. SAUDI ARABIA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 130. UAE BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 131. UAE BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 132. UAE BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 133. UAE BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 134. ARGENTINA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 135. ARGENTINA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 136. ARGENTINA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 137. ARGENTINA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 138. REST OF LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 139. REST OF LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY MATERIAL, 2022-2032 ($MILLION)
  • TABLE 140. REST OF LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY APPLICATION, 2022-2032 ($MILLION)
  • TABLE 141. REST OF LAMEA BALL GRID ARRAY (BGA) PACKAGING, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 142. AMKOR TECHNOLOGY: KEY EXECUTIVES
  • TABLE 143. AMKOR TECHNOLOGY: COMPANY SNAPSHOT
  • TABLE 144. AMKOR TECHNOLOGY: OPERATING SEGMENTS
  • TABLE 145. AMKOR TECHNOLOGY: PRODUCT PORTFOLIO
  • TABLE 146. AMKOR TECHNOLOGY: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 147. TRIQUINT SEMICONDUCTOR INC.: KEY EXECUTIVES
  • TABLE 148. TRIQUINT SEMICONDUCTOR INC.: COMPANY SNAPSHOT
  • TABLE 149. TRIQUINT SEMICONDUCTOR INC.: OPERATING SEGMENTS
  • TABLE 150. TRIQUINT SEMICONDUCTOR INC.: PRODUCT PORTFOLIO
  • TABLE 151. TRIQUINT SEMICONDUCTOR INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 152. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: KEY EXECUTIVES
  • TABLE 153. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: COMPANY SNAPSHOT
  • TABLE 154. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: OPERATING SEGMENTS
  • TABLE 155. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: PRODUCT PORTFOLIO
  • TABLE 156. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 157. CORINTECH LTD.: KEY EXECUTIVES
  • TABLE 158. CORINTECH LTD.: COMPANY SNAPSHOT
  • TABLE 159. CORINTECH LTD.: OPERATING SEGMENTS
  • TABLE 160. CORINTECH LTD.: PRODUCT PORTFOLIO
  • TABLE 161. CORINTECH LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 162. STATS CHIPPAC: KEY EXECUTIVES
  • TABLE 163. STATS CHIPPAC: COMPANY SNAPSHOT
  • TABLE 164. STATS CHIPPAC: OPERATING SEGMENTS
  • TABLE 165. STATS CHIPPAC: PRODUCT PORTFOLIO
  • TABLE 166. STATS CHIPPAC: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 167. ASE TECHNOLOGY HOLDING: KEY EXECUTIVES
  • TABLE 168. ASE TECHNOLOGY HOLDING: COMPANY SNAPSHOT
  • TABLE 169. ASE TECHNOLOGY HOLDING: OPERATING SEGMENTS
  • TABLE 170. ASE TECHNOLOGY HOLDING: PRODUCT PORTFOLIO
  • TABLE 171. ASE TECHNOLOGY HOLDING: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 172. INTEGRATED CIRCUIT ENGINEERING CORP.: KEY EXECUTIVES
  • TABLE 173. INTEGRATED CIRCUIT ENGINEERING CORP.: COMPANY SNAPSHOT
  • TABLE 174. INTEGRATED CIRCUIT ENGINEERING CORP.: OPERATING SEGMENTS
  • TABLE 175. INTEGRATED CIRCUIT ENGINEERING CORP.: PRODUCT PORTFOLIO
  • TABLE 176. INTEGRATED CIRCUIT ENGINEERING CORP.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 177. CYPRESS SEMICONDUCTOR CORP.: KEY EXECUTIVES
  • TABLE 178. CYPRESS SEMICONDUCTOR CORP.: COMPANY SNAPSHOT
  • TABLE 179. CYPRESS SEMICONDUCTOR CORP.: OPERATING SEGMENTS
  • TABLE 180. CYPRESS SEMICONDUCTOR CORP.: PRODUCT PORTFOLIO
  • TABLE 181. CYPRESS SEMICONDUCTOR CORP.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 182. INFINEON TECHNOLOGIES AG: KEY EXECUTIVES
  • TABLE 183. INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT
  • TABLE 184. INFINEON TECHNOLOGIES AG: OPERATING SEGMENTS
  • TABLE 185. INFINEON TECHNOLOGIES AG: PRODUCT PORTFOLIO
  • TABLE 186. INFINEON TECHNOLOGIES AG: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 187. NXP SEMICONDUCTORS NV: KEY EXECUTIVES
  • TABLE 188. NXP SEMICONDUCTORS NV: COMPANY SNAPSHOT
  • TABLE 189. NXP SEMICONDUCTORS NV: OPERATING SEGMENTS
  • TABLE 190. NXP SEMICONDUCTORS NV: PRODUCT PORTFOLIO
  • TABLE 191. NXP SEMICONDUCTORS NV: KEY STRATEGIC MOVES AND DEVELOPMENTS

  • LIST OF FIGURES

  • FIGURE 1. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET SEGMENTATION
  • FIGURE 2. GLOBAL BALL GRID ARRAY (BGA) PACKAGING MARKET
  • FIGURE 3. SEGMENTATION BALL GRID ARRAY (BGA) PACKAGING MARKET
  • FIGURE 4. TOP INVESTMENT POCKET IN BALL GRID ARRAY (BGA) PACKAGING MARKET
  • FIGURE 5. MODERATE BARGAINING POWER OF BUYERS
  • FIGURE 6. MODERATE BARGAINING POWER OF SUPPLIERS
  • FIGURE 7. MODERATE THREAT OF NEW ENTRANTS
  • FIGURE 8. LOW THREAT OF SUBSTITUTION
  • FIGURE 9. HIGH COMPETITIVE RIVALRY
  • FIGURE 10. OPPORTUNITIES, RESTRAINTS AND DRIVERS: GLOBALBALL GRID ARRAY (BGA) PACKAGING MARKET
  • FIGURE 11. BALL GRID ARRAY (BGA) PACKAGING MARKET SEGMENTATION, BY BY TYPE
  • FIGURE 12. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR MOLDED ARRAY PROCESS BGA, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 13. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR THERMALLY ENHANCED BGA, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 14. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR PACKAGE ON PACKAGE (POP) BGA, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 15. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR MICRO BGA, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 16. BALL GRID ARRAY (BGA) PACKAGING MARKET SEGMENTATION, BY BY MATERIAL
  • FIGURE 17. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR CERAMIC, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 18. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR PLASTIC, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 19. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR TAPE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 20. BALL GRID ARRAY (BGA) PACKAGING MARKET SEGMENTATION, BY BY APPLICATION
  • FIGURE 21. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR OEM (ORIGINAL EQUIPMENT MANUFACTURER), BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 22. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR AFTERMARKET, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 23. BALL GRID ARRAY (BGA) PACKAGING MARKET SEGMENTATION, BY BY INDUSTRY VERTICAL
  • FIGURE 24. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR IT TELECOMMUNICATION, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 25. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 26. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR AEROSPACE DEFENSE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 27. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR INDUSTRIAL, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 28. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR AUTOMOTIVE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 29. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR HEALTHCARE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 30. BALL GRID ARRAY (BGA) PACKAGING MARKET FOR OTHERS, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 31. TOP WINNING STRATEGIES, BY YEAR, 2020-2022*
  • FIGURE 32. TOP WINNING STRATEGIES, BY DEVELOPMENT, 2020-2022*
  • FIGURE 33. TOP WINNING STRATEGIES, BY COMPANY, 2020-2022*
  • FIGURE 34. PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 35. COMPETITIVE DASHBOARD
  • FIGURE 36. COMPETITIVE HEATMAP: BALL GRID ARRAY (BGA) PACKAGING MARKET
  • FIGURE 37. Top player positioning, 2022
  • FIGURE 38. AMKOR TECHNOLOGY: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 39. AMKOR TECHNOLOGY: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 40. AMKOR TECHNOLOGY: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 41. TRIQUINT SEMICONDUCTOR INC.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 42. TRIQUINT SEMICONDUCTOR INC.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 43. TRIQUINT SEMICONDUCTOR INC.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 44. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 45. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 46. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 47. CORINTECH LTD.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 48. CORINTECH LTD.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 49. CORINTECH LTD.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 50. STATS CHIPPAC: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 51. STATS CHIPPAC: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 52. STATS CHIPPAC: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 53. ASE TECHNOLOGY HOLDING: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 54. ASE TECHNOLOGY HOLDING: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 55. ASE TECHNOLOGY HOLDING: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 56. INTEGRATED CIRCUIT ENGINEERING CORP.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 57. INTEGRATED CIRCUIT ENGINEERING CORP.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 58. INTEGRATED CIRCUIT ENGINEERING CORP.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 59. CYPRESS SEMICONDUCTOR CORP.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 60. CYPRESS SEMICONDUCTOR CORP.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 61. CYPRESS SEMICONDUCTOR CORP.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 62. INFINEON TECHNOLOGIES AG: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 63. INFINEON TECHNOLOGIES AG: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 64. INFINEON TECHNOLOGIES AG: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 65. NXP SEMICONDUCTORS NV: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 66. NXP SEMICONDUCTORS NV: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 67. NXP SEMICONDUCTORS NV: REVENUE SHARE, BY REGION, 2032 (%)

 
 
With collective industry experience of about 200 years of its analysts and experts, Allied Market Research (AMR) encompasses most infallible research methodology for its market intelligence and industry analysis. We do not only engrave the deepest levels of markets but also sneak through its slimmest details for the purpose of our market estimates and forecasts. Our approach helps in building greater market consensus view for size, shape and industry trends within each industry segment. We carefully factor in industry trends and real developments for identifying key growth factors and future course of the market. Our research proceeds are the resultant of high quality data, expert views and analysis and high value independent opinions. Our research process is designed to deliver balanced view of the global markets and allow stakeholders to make informed decisions.

We offer our clients exhaustive research and analysis based on wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics and regional intelligence. Our in-house industry experts play instrumental role in designing analytic tools and models, tailored to the requirements of particular industry segment. These analytical tools and models sanitize the data & statistics and enhance the accuracy of our recommendations and advice. With AMR’s calibrated research process and 360` degree data-evaluation methodology, our clients are assured of receiving:

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With a strong methodology we are, therefore, confident that our research and analysis are most reliable and guarantees sound business planning.

Secondary research
We refer a broad array of industry sources for our secondary, which typically include; however, not limited to: Company SEC filings, annual reports, company websites, broker & financial reports and investor presentations for competitive scenario and shape of the industry

  • Patent and regulatory databases for understanding of technical & legal developments
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Our primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks and face-to-face interactions. We are also in professional corporate relations with various companies that allow us greater flexibility for reaching out industry participants and commentators for interviews and discussions, fulfilling following functions:

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Our primary research interview and discussion panels are typically composed of most experienced industry members. These participants include; however, not limited to:

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Analyst tools and models
AMR has developed set of analyst tools and data models to supplement and expedite the analysis process. Corresponding to markets, where there is significant lack of information and estimates, AMR’s team of experts and analyst develop specific analyst tools and industry models to translate qualitative and quantitative industry indicators into exact industry estimates. These models also allow analysts to examine the prospects and opportunities prevailing in the market to accurately forecast the course of the market.

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