Dicing tape refers to the backing tape that is extensively used in manufacturing of electronic & electrical products. It is used during the wafer dicing process to hold the semiconductor material when they are cut into pieces. The wafer dicing process involves separation of dies and chips from the wafer of the semiconductors. Dicing tapes are made of materials such as polyolefin, PVC, and polyethylene backing with an adhesive to hold the dies. The dicing tapes are categorized into two types, such as, UV film curable tapes a non UV film or silicon free plastic films.

Market scope and structure

COVID-19 scenario analysis:

• The demand for the dicing tapes is expected to decrease in 2020 due to lockdown imposed by the government and low demand from the electrical & electronics industry.
• COVID-19 crisis is likely to affect the dicing tapes industry negatively, as a result of halted manufacturing and massive reduction in demand for luxury and non-essential services globally.
• COVID-19 crisis had a mixed impact on the packaging industry, mainly due to closure of physical retail stores globally. However, the availability of online retailing has absorbed the high impact of this shutdown.
• The requirement of eCommerce specific packaging is likely to remain strong, although the ecommerce companies would have to focus on protection of goods and sanitization of packages. 
• In addition, the food packaging industry is on the frontline within the global packaging market, owing to the demand for essential products such as groceries and fresh food mainly from local e-retail sites. 
• Industrial, transportation, and bulk packaging has faced a sharp decline, owing to decreased demand for non-essential goods during the first two quarters of 2020. 
• Owing to the lowered disposable income of maximum population and weak demand for packaging from industrial goods, the packaging industry might face significant pressure of reduction in both wholesale as well as retail costs. 
• Consumers are likely to stay hesitant for consumption of luxury products, travel, and hospitality services, which is expected to hinder the packaging industry growth in the future after the COVID-19 crisis. 

Top impacting factors: Market Scenario Analysis, Trends , Drivers and Impact Analysis

The increase in demand for the compact electronic components and semiconductors that reduce the sizes of electronic devices is expected to fuel the growth of the dicing tapes market. Increase in customer preferences for single sided dicing tapes for the use in semiconductors act as a growth driver for the dicing tapes market. Surge in demand for the polyolefin UV tapes owing to its high temperature & pressure bearing properties and high adhesiveness is expected to boost the growth of the dicing tapes market. Rise in demand for small electronic components such as IC and electronic microchips creates a positive impact in the growth of the dicing tapes market.

New product launches to flourish the market

The launch of new generation technologically advanced products can boost the growth of the market. In the past few years, many such products having unique features were launched in the market. In March 2018, one of the global leaders in dicing tapes Furukawa Electric has launched Plasma masked back grind tape and separation dicing film. The plasma masked BG tape is used in the plasma dicing process where it protects the surface of the wafer during semiconductor wafer back-grinding and when the wafer is exposed to the plasma. The plasma masked BG tape consists of three layers that is plasma mask, adhesive layer and backing layer film. The plasma masked BG tape is one of the new generation semiconductor tape.

High demand from applications :

Dicing tapes are used in various application such as dicing of wafers, packaging, dicing panels of glass and ceramics. The glass wafers are used in the bio ID devices, CCTV & IR camera windows, mobile cameras, and IR cut off filters. Dicing tapes are used in glass wafer dicing process to reduce the damage, provide high accuracy cutting and reduce the process time. The UV film dicing tapes are used in the electronics industry for fixing the work-pieces during the dicing process. These are used in the manufacturing of semiconductors by assembling the minute electronic components.

Key segments covered:

Key benefits of the report:

• This study presents the analytical depiction of the dicing tapes market along with the current trends and future estimations to determine the imminent investment pockets.
• The report presents information related to key drivers, restraints, and opportunities along with detailed analysis of the dicing tapes market share.
• The current market is quantitatively analyzed from 2020 to 2027 to highlight the dicing tapes market growth scenario.
• Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 
• The report provides a detailed market analysis based on competitive intensity and how the competition will take shape in coming years.