Dicing Tapes Market Size, Share, Competitive Landscape and Trend Analysis Report by Thickness, by Product, by Material : Global Opportunity Analysis and Industry Forecast, 2021-2031

Dicing Tapes Market Research, 2031

The global dicing tapes market size was valued at $1,311.6 million in 2021, and is projected to reach $2,366.0 million by 2031, registering a CAGR of 6.0% from 2022 to 2031. Dicing tape has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Once a wafer has been diced, the pieces left on the dicing tape are referred to as die, dice or dies.

The adoption of dicing tapes is growing for semiconductor industry owing to its dicing applications for different electronic components. In addition, the low cost of manufacturing the dicing tapes results in lower prices of such tapes which in turn is growing its adoption in the dicing tapes market.

However, North America is the major manufacturer and exporter of electronic components. China is known to be the major exporter of electronic components from the U.S. but due to trade war between the U.S. and China, the manufacturing and sales of these components got affected that impacted the dicing tapes market growth.

Construction, manufacturing, hotel, and tourism industries were majorly affected during the outbreak of the COVID-19 pandemic. Manufacturing activities were halted or restricted. This led to decline in manufacturing of various equipment used for dicing tapes as well as their demand in the market, thereby restraining the growth of the dicing tapes industry. Conversely, industries are gradually resuming their regular manufacturing and services. This is expected to lead to re-initiation of dicing tapes companies at their full-scale capacities, that helped the dicing tapes market share to recover by end of 2021.

On the contrary, the growing demand for light weighted electronic components for designing the thin electronic devices is expected to offer new opportunities for the dicing tapes market.

The dicing tapes market is segmented into thickness, product and material. Based on thickness, the market is fragmented below 85 micron, between 86 and 125 micron, between 126 and 150 micron and above 150 micron. Based on product, the global market is categorized into UV curable and non UV curable.  Based on material, the market is divided into polyvinyl chloride, polyethylene terephthalate and polyolefin. Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

On the basis of thickness, in 2021 the between 86 and 125 micron segment dominated the market, in terms of revenue, and above 150 micron segment is expected to witness growth at the highest CAGR during the forecast period. As per product, in 2021, the UV curable segment led the dicing tapes market, and is expected to exhibit highest CAGR in the near future. By material, the polyvinyl chloride segment led the market in 2021, in terms of revenue and the polyolefin segment is anticipated to register highest CAGR during the forecast period. Region wise, Asia-Pacific garnered the highest revenue in 2021; however, LAMEA is anticipated to register highest CAGR during the forecast period.

COMPETITION ANALYSIS

The major players profiled in the dicing tapes market report are 3M Company, AI Technology, Inc., Daest Coating India Pvt. Ltd., Denka Company Limited, Furukawa Electric Co. Ltd., Hitachi Chemical Company, Ltd., LINTEC Corporation, Loadpoint, Mitsui Chemicals, Inc, Nippon Pulse Motor Taiwan, Nitto Denko Corp, Pantech Tape Co. Ltd., QES GROUP BERHAD, Shenzhen Xinst Technology Co., Ltd, Solar Plus Company, Sumitomo Bakelite Co. Ltd. and Ultron Systems, Inc. Major companies in the market have adopted product launch, partnership, business expansion, and acquisition as their key developmental strategies to offer better products and services to customers in the market.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the dicing tapes market analysis from 2021 to 2031 to identify the prevailing dicing tapes market opportunities.
• The market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
• In-depth analysis of the dicing tapes market forecast.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global dicing tapes market trends, key players, market segments, application areas, and market growth strategies.

  Dicing Tapes Market Report Highlights

Aspects	Details
By Thickness	Below 85 Micron 86-125 Micron 126-150 Micron Above 150 Micron
By Product	UV Curable Non UV Curable
By Material	Polyethylene Terephthalate Polyolefin Polyvinyl Chloride
By Region	North America  (U.S., Canada, Mexico) Europe  (Germany, UK, France, Italy, Rest of Europe) Asia-Pacific  (China, Japan, South Korea, India, Rest of Asia-Pacific) LAMEA  (Latin America, Middle East, Africa)
Key Market Players	Pantech Tape Co. Ltd., Ultron Systems, Inc., Shenzhen Xinst Technology Co., Ltd., Hitachi Chemical Company, Ltd., Daest Coating India Pvt. Ltd., Mitsui Chemicals, Inc., Loadpoint, Nitto Denko Corp., Furukawa Electric Co. Ltd., 3M Company, Denka Company Limited, Nippon Pulse Motor Taiwan, Solar Plus Company, LINTEC Corporation, QES GROUP BERHAD, Sumitomo Bakelite Co. Ltd., ai technology, inc.

Analyst Review

Dicing tapes is used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module micro fabrication.

Adoption of light weighted materials for manufacturing different electronic products is increasing owing to the adoption of dicing tapes. In addition, low cost of raw materials for manufacturing the dicing tapes is increasing its adoption. Major players are adopting agreements and product launches as key developmental strategies to improve their product portfolio, and thereby drive the growth of the market. Moreover, rise in adoption of internet of things (IOT), cloud-based system, and internet systems fuels the growth of the dicing tapes market.

Conversely, technological innovation in dicing tapes is expected to provide lucrative opportunities for the dicing tapes manufacturers.

Author Name(s) : Digvijay Subhash Pawar | Sonia Mutreja

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