Die Attach Machine Market by Type (Flip Chip Bonder and Die Bonder), Technique (Epoxy, Soft Solder, Sintering, Eutectic, and Others), and Application (RF and MEMS, Optoelectronics, Logic, Memory, CMOS Image Sensors, LED, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2028

Update Available On-Demand

The global die attach machine market size was valued at $1,129.0 million in 2020, and is projected to reach $1,813.1 million by 2028, registering a CAGR of 6.1% from 2021 to 2028. Die attach machine also known as die bond machine or die mount is installed for the attachment of the silicon chip to the die pad or die cavity or in the semiconductor package process. By attachment technique, its common types include epoxy, soft solder, sintering, eutectic, and others. Die attach machines are employed in various sectors for applications such as RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others.

The COVID 19 outbreak has affected the growth of the die attach machine industry owing to the lockdown measure in the countries and delay in manufacturing and production of die attach machine which are utilized for manufacturing die bonding and others.

The growth in demand for consumer electronics is expected to fuel the die attach machine market for electric circuit boards, which will in turn drive the demand for die-attach machines. Increase in demand for hybrid circuits in medical equipment, owing to increase in number of patients is propelling the demand for semiconductor chips. Similarly, the increase can be attributed to the expanding need for user-friendly electronic items as well as the developing residential sector, which drives consumer electronics demand internationally. The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. Furthermore, Asia-Pacific is expected to witness higher growth rate, owing to increase in spending on the semiconductor industry development in countries such as India and China, which drives the market growth. Thus, surge in construction projects across different regions across the globe is expected to boost the global die attach machine market growth. However, the fluctuation in raw material prices hinders the growth of the market.

Get more information on this report : Request Sample Pages

The novel coronavirus has rapidly spread across various countries and regions, causing enormous impact on lives of people and overall community. Originating as a crisis to human health, it now poses significant threat to worldwide trade, economy, and finance. The impact of lockdown, owing to COVID-19 is vague and economic recovery of die attach machine manufacturers is completely based on their cash reserves.

Market players can afford a complete lockdown only for a limited period, after which they would have to alter their investment plans. The die attach machine manufacturers had to emphasize on protecting their staff, operations, and supply chain partners to effectively respond to immediate crisis and discover new ways of working after coronavirus cases began to decline. Furthermore, number of COVID-19 cases are expected to reduce in the near term as vaccine for COVID-19 has been introduced in the market. This is further expected to lead to re-initiation of die attach machine companies at their full-scale capacities, which would aid the market to recover by the start of 2022. Furthermore, growth in semiconductor equipment industries across the globe and rise in demand for LED chips are anticipated to drive the market growth during the forecast period. 

The global die attach machine market is segmented on the basis of type, technique, application, and region. By type, the market is categorized into flip chip bonder and die bonder. Depending on technique, it is fragmented into epoxy, soft solder, sintering, eutectic, and others. On the basis of technique, it is categorized into epoxy, soft solder, sintering, eutectic, and others. Depending on application, it is fragmented into RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

Get more information on this report : Request Sample Pages

Asia-Pacific registered high market share in 2020, and is expected to grow significantly with high CAGR during the forecast period. The region's high concentration of IC makers is expected to drive the demand for die bonder equipment in the Asia-Pacific area. ICs are widely used in a variety of industries, including consumer electronics, industrial, telecommunications, data centers, and automotive. For example, ICs are utilized for sensing and processing applications in high-density storage devices such as solid-state drives (SSDs) and vehicles. As a result of the growing number of chip fabrication facilities around the world, the semiconductor industry in Asia is predicted to grow throughout the forecast period.

Get more information on this report : Request Sample Pages

Competition Analysis

Key companies profiled in the die attach machine market report include Anza Technology, Inc,  ASM Pacific Technology Limited,  BE Semiconductor Industries N.V,  Dr. Tresky AG,  Fasford Technology Co. Limited,  Inseto UK Limited,  Kulicke and Soffa Industries, Inc., MicroAssembly Technologies Limited, Palomar Technologies, and Shinkawa Limited. 

Get more information on this report : Request Sample Pages

Key Benefits For Stakeholders

• The report provides an extensive analysis of the current and emerging die attach machine market trends and dynamics.  
• Extensive analysis of the die attach machine market is conducted by following key product positioning and monitoring of top competitors within the market framework.
• In-depth die attach machine market analysis is conducted by constructing market estimations for key market segments between 2020 and 2028. 
• A comprehensive analysis of all the regions is provided to determine the prevailing opportunities.
• The global die attach machine market forecast analysis from 2021 to 2028 is included in the report.
• The key players within die attach machine industry are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the die attach machine industry. 

Global Die Attach Machine Market Segments

Key Segments

By Type

• Flip Chip Bonder
• Die Bonder

By Technique

• Epoxy
• Soft Solder
• Sintering
• Eutectic
• Others

By Application

• RF & MEMS
• Optoelectronics
• Logic
• Memory
• CMOS Image Sensors
• LED
• Others

By Region

• North America
  • U.S.
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • France
  • Italy
  • Rest of Europe
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• LAMEA
  • Latin America
  • Middle East 
  • Africa