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Die Attach Machine Market by Type (Flip Chip Bonder and Die Bonder), Technique (Epoxy, Soft Solder, Sintering, Eutectic, and Others), and Application (RF and MEMS, Optoelectronics, Logic, Memory, CMOS Image Sensors, LED, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2028

A11538
Pages: 225
Jun 2021 | 592 Views
   
Author(s) : Amar Chinchane , Onkar Sumant
Tables: 121
Charts: 49
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COVID-19

Pandemic disrupted the entire world and affected many industries.

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The global die attach machine market size was valued at $1,129.0 million in 2020, and is projected to reach $1,813.1 million by 2028, registering a CAGR of 6.1% from 2021 to 2028. Die attach machine also known as die bond machine or die mount is installed for the attachment of the silicon chip to the die pad or die cavity or in the semiconductor package process. By attachment technique, its common types include epoxy, soft solder, sintering, eutectic, and others. Die attach machines are employed in various sectors for applications such as RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others.

The COVID 19 outbreak has affected the growth of the die attach machine industry owing to the lockdown measure in the countries and delay in manufacturing and production of die attach machine which are utilized for manufacturing die bonding and others.

The growth in demand for consumer electronics is expected to fuel the die attach machine market for electric circuit boards, which will in turn drive the demand for die-attach machines. Increase in demand for hybrid circuits in medical equipment, owing to increase in number of patients is propelling the demand for semiconductor chips. Similarly, the increase can be attributed to the expanding need for user-friendly electronic items as well as the developing residential sector, which drives consumer electronics demand internationally. The mass production of electronic products, which includes smartphones, wearables, and white goods, in China and Taiwan, makes use of several devices, such as optoelectronics, MEMS, and MOEMS. Furthermore, Asia-Pacific is expected to witness higher growth rate, owing to increase in spending on the semiconductor industry development in countries such as India and China, which drives the market growth. Thus, surge in construction projects across different regions across the globe is expected to boost the global die attach machine market growth. However, the fluctuation in raw material prices hinders the growth of the market.

Die-Attach-Machine-Market-2021-2028

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The novel coronavirus has rapidly spread across various countries and regions, causing enormous impact on lives of people and overall community. Originating as a crisis to human health, it now poses significant threat to worldwide trade, economy, and finance. The impact of lockdown, owing to COVID-19 is vague and economic recovery of die attach machine manufacturers is completely based on their cash reserves.

Market players can afford a complete lockdown only for a limited period, after which they would have to alter their investment plans. The die attach machine manufacturers had to emphasize on protecting their staff, operations, and supply chain partners to effectively respond to immediate crisis and discover new ways of working after coronavirus cases began to decline. Furthermore, number of COVID-19 cases are expected to reduce in the near term as vaccine for COVID-19 has been introduced in the market. This is further expected to lead to re-initiation of die attach machine companies at their full-scale capacities, which would aid the market to recover by the start of 2022. Furthermore, growth in semiconductor equipment industries across the globe and rise in demand for LED chips are anticipated to drive the market growth during the forecast period. 

The global die attach machine market is segmented on the basis of type, technique, application, and region. By type, the market is categorized into flip chip bonder and die bonder. Depending on technique, it is fragmented into epoxy, soft solder, sintering, eutectic, and others. On the basis of technique, it is categorized into epoxy, soft solder, sintering, eutectic, and others. Depending on application, it is fragmented into RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

Die Attach Machine Market
By Type

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Flip chip bonder segment is projected to grow at a significant CAGR

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Asia-Pacific registered high market share in 2020, and is expected to grow significantly with high CAGR during the forecast period. The region's high concentration of IC makers is expected to drive the demand for die bonder equipment in the Asia-Pacific area. ICs are widely used in a variety of industries, including consumer electronics, industrial, telecommunications, data centers, and automotive. For example, ICs are utilized for sensing and processing applications in high-density storage devices such as solid-state drives (SSDs) and vehicles. As a result of the growing number of chip fabrication facilities around the world, the semiconductor industry in Asia is predicted to grow throughout the forecast period.

Die Attach Machine Market
By Application

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LED segment holds dominant position in 2020

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Competition Analysis

Key companies profiled in the die attach machine market report include Anza Technology, Inc,  ASM Pacific Technology Limited,  BE Semiconductor Industries N.V,  Dr. Tresky AG,  Fasford Technology Co. Limited,  Inseto UK Limited,  Kulicke and Soffa Industries, Inc., MicroAssembly Technologies Limited, Palomar Technologies, and Shinkawa Limited. 

Die Attach Machine Market
By Region

2028
Asia-pacific 
North America
Europe
Lamea

Asia-Pacific holds a dominant position in 2020 and is expected to grow at a significant rate during the forecast period.

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Key Benefits For Stakeholders

  • The report provides an extensive analysis of the current and emerging die attach machine market trends and dynamics.  
  • Extensive analysis of the die attach machine market is conducted by following key product positioning and monitoring of top competitors within the market framework.
  • In-depth die attach machine market analysis is conducted by constructing market estimations for key market segments between 2020 and 2028. 
  • A comprehensive analysis of all the regions is provided to determine the prevailing opportunities.
  • The global die attach machine market forecast analysis from 2021 to 2028 is included in the report.
  • The key players within die attach machine industry are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the die attach machine industry. 

Global Die Attach Machine Market Segments

Key Segments

By Type

  • Flip Chip Bonder
  • Die Bonder

By Technique

  • Epoxy
  • Soft Solder
  • Sintering
  • Eutectic
  • Others

By Application

  • RF & MEMS
  • Optoelectronics
  • Logic
  • Memory
  • CMOS Image Sensors
  • LED
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East 
    • Africa
 

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings of the study
2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings

3.2.1.Top investment pockets by application

3.3.Porter's five forces analysis

3.3.1.Low-to-moderate bargaining power of suppliers
3.3.2.Low-to-moderate bargaining power of buyers
3.3.3.Low-to-moderate threat of substitutes
3.3.4.Low-to-moderate intensity of rivalry
3.3.5.Moderate-to-high threat of substitution

3.4.Die attach machine market Share Analysis 2020
3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Rise in demand for electronics products
3.5.1.2.Growing demand for hybrid circuits from medical, military, photonics, and wireless electronics applications
3.5.1.3.Growth of semiconductor packaging industry

3.5.2.Restraints

3.5.2.1.Fluctuation in raw material prices

3.5.3.Opportunities

3.5.3.1.Growth in usage of LED circuits

3.6.COVID-19 impact analysis

CHAPTER 4:DIE ATTACH MACHINE MARKET, BY TYPE

4.1.Overview

4.1.1.Market size and forecast, by type

4.2.Flip Chip Bonder

4.2.1.Key market trends, growth factors and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country

4.3.Die bonder

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country

CHAPTER 5:DIE ATTACH MACHINE MARKET, BY TECHNIQUE

5.1.Overview

5.1.1.Market size and forecast, by technique

5.2.Epoxy

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country

5.3.Soft solder

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country

5.4.Sintering

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country

5.5.Eutectic

5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis, by country

5.6.Others

5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market analysis, by country

CHAPTER 6:GLOBAL DIE ATTACH MACHINE MARKET, BY APPLICATION

6.1.Overview

6.1.1.Market size and forecast, by application

6.2.RF and MEMS

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market analysis by country

6.3.Optoelectronics

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market analysis by country

6.4.Logic

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market analysis by country

6.5.Memory

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market analysis by country

6.6.CMOS image sensors

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market analysis by country

6.7.LED

6.7.1.Key market trends, growth factors, and opportunities
6.7.2.Market size and forecast, by region
6.7.3.Market analysis by country

6.8.Others

6.8.1.Key market trends, growth factors, and opportunities
6.8.2.Market size and forecast, by region
6.8.3.Market analysis by country

CHAPTER 7:DIE ATTACH MACHINE MARKET, BY REGION

7.1.Overview

7.1.1.Market size and forecast, by region

7.2.North America

7.2.1.Key market trends and opportunities
7.2.2.Market size and forecast, by type
7.2.3.North America Market size and forecast, by technique
7.2.4.North America Market size and forecast, by application
7.2.5.Market analysis by country

7.2.5.1.U.S.

7.2.5.1.1.U.S. Market size and forecast, by type
7.2.5.1.2.U.S. Market size and forecast, by technique
7.2.5.1.3.U.S. Market size and forecast, by application

7.2.5.2.Canada

7.2.5.2.1.Canada Market size and forecast, by type
7.2.5.2.2.Canada Market size and forecast, by technique
7.2.5.2.3.Canada Market size and forecast, by application

7.2.5.3.Mexico

7.2.5.3.1.Mexico Market size and forecast, by type
7.2.5.3.2.Mexico Market size and forecast, by technique
7.2.5.3.3.Mexico Market size and forecast, by application

7.3.Europe

7.3.1.Key market trends, growth factors and opportunities
7.3.2.Market size and forecast, by type
7.3.3.Europe Market size and forecast, by technique
7.3.4.Europe Market size and forecast, by application
7.3.5.Europe market size and forecast, by country

7.3.5.1.Germany

7.3.5.1.1.Germany Market size and forecast, by type
7.3.5.1.2.Germany Market size and forecast, by technique
7.3.5.1.3.Germany Market size and forecast, by application

7.3.5.2.France

7.3.5.2.1.France Market size and forecast, by type
7.3.5.2.2.France Market size and forecast, by technique
7.3.5.2.3.France Market size and forecast, by application

7.3.5.3.UK

7.3.5.3.1.UK Market size and forecast, by type
7.3.5.3.2.UK Market size and forecast, by technique
7.3.5.3.3.UK Market size and forecast, by application

7.3.5.4.Italy

7.3.5.4.1.Italy Market size and forecast, by type
7.3.5.4.2.Italy Market size and forecast, by technique
7.3.5.4.3.Italy Market size and forecast, by application

7.3.5.5.Rest of Europe

7.3.5.5.1.Rest of Europe Market size and forecast, by type
7.3.5.5.2.Rest of Europe Market size and forecast, by technique
7.3.5.5.3.Rest of Europe Market size and forecast, by application

7.4.Asia-Pacific

7.4.1.Key market trends, growth factors and opportunities
7.4.2.Market size and forecast, by type
7.4.3.Asia-Pacific Market size and forecast, by technique
7.4.4.Asia-Pacific Market size and forecast, by application
7.4.5.Market size and forecast, by country

7.4.5.1.China

7.4.5.1.1.China Market size and forecast, by type
7.4.5.1.2.China Market size and forecast, by technique
7.4.5.1.3.China Market size and forecast, by application

7.4.5.2.India

7.4.5.2.1.India Market size and forecast, by type
7.4.5.2.2.India Market size and forecast, by technique
7.4.5.2.3.India Market size and forecast, by application

7.4.5.3.Japan

7.4.5.3.1.Japan Market size and forecast, by type
7.4.5.3.2.Japan Market size and forecast, by technique
7.4.5.3.3.Japan Market size and forecast, by application

7.4.5.4.South Korea

7.4.5.4.1.South Korea Market size and forecast, by type
7.4.5.4.2.South Korea Market size and forecast, by technique
7.4.5.4.3.South Korea Market size and forecast, by application

7.4.5.5.Rest of Asia-Pacific

7.4.5.5.1.Rest of Asia-Pacific Market size and forecast, by type
7.4.5.5.2.Rest of Asia-Pacific Market size and forecast, by technique
7.4.5.5.3.Rest of Asia-Pacific Market size and forecast, by application

7.5.LAMEA

7.5.1.Key market trends, growth factors and opportunities
7.5.2.Market size and forecast, by type
7.5.3.LAMEA Market size and forecast, by technique
7.5.4.LAMEA Market size and forecast, by application
7.5.5.Market size and forecast, by country

7.5.5.1.Latin America

7.5.5.1.1.Latin America Market size and forecast, by type
7.5.5.1.2.Latin America Market size and forecast, by technique
7.5.5.1.3.Latin America Market size and forecast, by application

7.5.5.2.Middle East

7.5.5.2.1.Middle East Market size and forecast, by type
7.5.5.2.2.Middle East Market size and forecast, by technique
7.5.5.2.3.Middle East Market size and forecast, by application

7.5.5.3.Africa

7.5.5.3.1.Africa Market size and forecast, by type
7.5.5.3.2.Africa Market size and forecast, by technique
7.5.5.3.3.Africa Market size and forecast, by application

CHAPTER 8:COMPANY PROFILES

8.1.Anza Technology, Inc.

8.1.1.Company overview
8.1.2.Key executive
8.1.3.Company snapshot
8.1.4.Operating business segments
8.1.5.Product portfolio

8.2.ASM Pacific Technology Limited

8.2.1.Company overview
8.2.2.Key executive
8.2.3.Company snapshot
8.2.4.Operating business segments
8.2.5.Product portfolio
8.2.6.Research and development expenses
8.2.7.Business performance

8.3.BE Semiconductor Industries N.V.

8.3.1.Company overview
8.3.2.Key executive
8.3.3.Company snapshot
8.3.4.Operating business segments
8.3.5.Product portfolio
8.3.6.Business performance
8.3.7.Key strategic moves and developments

8.4.Dr. Tresky AG

8.4.1.Company overview
8.4.2.Key executive
8.4.3.Company snapshot
8.4.4.Operating business segments
8.4.5.Product portfolio

8.5.Fasford Technology Co. Limited

8.5.1.Company overview
8.5.2.Key executive
8.5.3.Company snapshot
8.5.4.Operating business segments
8.5.5.Product portfolio

8.6.Inseto UK Limited

8.6.1.Company overview
8.6.2.Key executive
8.6.3.Company snapshot
8.6.4.Operating business segments
8.6.5.Product portfolio

8.7.Kulicke and Soffa Industries, Inc.

8.7.1.Company overview
8.7.2.Key executive
8.7.3.Company snapshot
8.7.4.Operating business segments
8.7.5.Product portfolio
8.7.6.Research and development expenses
8.7.7.Business performance

8.8.MicroAssembly Technologies Limited

8.8.1.Company overview
8.8.2.Key executive
8.8.3.Company snapshot
8.8.4.Product portfolio

8.9.Palomar Technologies

8.9.1.Company overview
8.9.2.Key executive
8.9.3.Company snapshot
8.9.4.Operating business segments
8.9.5.Product portfolio

8.10.Shinkawa Limited

8.10.1.Company overview
8.10.2.Key executive
8.10.3.Company snapshot
8.10.4.Operating business segments
8.10.5.Product portfolio

LIST OF TABLES

TABLE 01.DIE ATTACH MACHINE MARKET, BY TYPE, 2020–2028 ($MILLION)
TABLE 02.DIE ATTACH MACHINE MARKET REVENUE FOR FLIP CHIP BONDER, BY REGION, 2020–2028($MILLION)
TABLE 03.DIE ATTACH MACHINE MARKET REVENUE FOR DIE BONDER, BY REGION, 2020–2028($MILLION)
TABLE 04.DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 05.DIE ATTACH MACHINE MARKET REVENUE FOR EPOXY, BY REGION, 2020–2028 ($MILLION)
TABLE 06.DIE ATTACH MACHINE MARKET REVENUE FOR SOFT SOLDER, BY REGION, 2020–2028 ($MILLION)
TABLE 07.DIE ATTACH MACHINE MARKET REVENUE FOR SINTERING, BY REGION, 2020–2028($MILLION)
TABLE 08.DIE ATTACH MACHINE MARKET REVENUE FOR EUTECTIC, BY REGION, 2020–2028($MILLION)
TABLE 09.DIE ATTACH MACHINE MARKET REVENUE FOR OTHERS, BY REGION, 2020–2028($MILLION)
TABLE 10.DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020-2028 ($MILLION)
TABLE 11.DIE ATTACH MACHINE MARKET REVENUE FOR RF AND MEMS, BY REGION, 2020–2028 ($MILLION)
TABLE 12.DIE ATTACH MACHINE MARKET REVENUE FOR OPTOELECTRONICS, BY REGION, 2020–2028 ($MILLION)
TABLE 13.DIE ATTACH MACHINE MARKET REVENUE FOR LOGIC, BY REGION, 2020–2028 ($MILLION)
TABLE 14.DIE ATTACH MACHINE MARKET REVENUE FOR MEMORY, BY REGION, 2020–2028 ($MILLION)
TABLE 15.DIE ATTACH MACHINE MARKET REVENUE FOR CMOS IMAGE SENSORS, BY REGION, 2020–2028 ($MILLION)
TABLE 16.DIE ATTACH MACHINE MARKET REVENUE FOR LED, BY REGION, 2020–2028 ($MILLION)
TABLE 17.DIE ATTACH MACHINE MARKET REVENUE FOR OTHERS, BY REGION, 2020–2028 ($MILLION)
TABLE 18.DIE ATTACH MACHINE MARKET REVENUE, BY REGION, 2020–2028 ($MILLION)
TABLE 19.NORTH AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 20.NORTH AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 21.NORTH AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 22.NORTH AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY COUNTRY, 2020–2028 ($MILLION)
TABLE 23.U.S. DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 24.U.S. DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 25.U.S. DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 26.CANADA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 27.CANADA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE 2020–2028 ($MILLION)
TABLE 28.CANADA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 29.MEXICO DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 30.MEXICO DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 31.MEXICO DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 32.EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 33.EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 34.EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 35.EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY COUNTRY, 2020–2028 ($MILLION)
TABLE 36.GERMANY DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 37.GERMANY DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 38.GERMANY DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 39.FRANCE DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 40.FRANCE DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 41.FRANCE DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 42.UK DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 43.UK DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 44.UK DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 45.ITALY DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 46.ITALY DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 47.ITALY DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 48.REST OF EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 49.REST OF EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 50.REST OF EUROPE DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 51.ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 52.ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 53.ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 54.ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY COUNTRY, 2020–2028 ($MILLION)
TABLE 55.CHINA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 56.CHINA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 57.CHINA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 58.INDIA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 59.INDIA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 60.INDIA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 61.JAPAN DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 62.JAPAN DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 63.JAPAN DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 64.SOUTH KOREA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 65.SOUTH KOREA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 66.SOUTH KOREA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 67.REST OF ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 68.REST OF ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 69.REST OF ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 70.LAMEA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 71.LAMEA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 72.LAMEA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 73.LAMEA DIE ATTACH MACHINE MARKET REVENUE, BY COUNTRY, 2020–2028 ($MILLION)
TABLE 74.LATIN AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 75.LATIN AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 76.LATIN AMERICA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 77.MIDDLE EAST DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 78.MIDDLE EAST DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 79.MIDDLE EAST DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 80.AFRICA DIE ATTACH MACHINE MARKET REVENUE, BY TYPE, 2020–2028 ($MILLION)
TABLE 81.AFRICA DIE ATTACH MACHINE MARKET REVENUE, BY TECHNIQUE, 2020–2028 ($MILLION)
TABLE 82.AFRICA DIE ATTACH MACHINE MARKET REVENUE, BY APPLICATION, 2020–2028 ($MILLION)
TABLE 83.ANZA TECHNOLOGY, INC. : KEY EXECUTIVE
TABLE 84.ANZA TECHNOLOGY, INC.  : COMPANY SNAPSHOT
TABLE 85.ANZA TECHNOLOGY, INC : OPERATING SEGMENTS
TABLE 86.ANZA TECHNOLOGY, INC : PRODUCT PORTFOLIO
TABLE 87.ASM PACIFIC TECHNOLOGY LIMITED : KEY EXECUTIVE
TABLE 88.ASM PACIFIC TECHNOLOGY LIMITED : COMPANY SNAPSHOT
TABLE 89.ASM PACIFIC TECHNOLOGY LIMITED : OPERATING SEGMENTS
TABLE 90.ASM PACIFIC TECHNOLOGY LIMITED : PRODUCT PORTFOLIO
TABLE 91.BE SEMICONDUCTOR INDUSTRIES N.V.  : KEY EXECUTIVE
TABLE 92.BE SEMICONDUCTOR INDUSTRIES N.V.  : COMPANY SNAPSHOT
TABLE 93.BE SEMICONDUCTOR INDUSTRIES N.V. : OPERATING SEGMENTS
TABLE 94.BE SEMICONDUCTOR INDUSTRIES N.V. : PRODUCT PORTFOLIO
TABLE 95.DR. TRESKY AG : KEY EXECUTIVE
TABLE 96.DR. TRESKY AG : COMPANY SNAPSHOT
TABLE 97.DR. TRESKY AG : OPERATING SEGMENTS
TABLE 98.DR. TRESKY AG : PRODUCT PORTFOLIO
TABLE 99.FASFORD TECHNOLOGY CO. LIMITED : KEY EXECUTIVE
TABLE 100.FASFORD TECHNOLOGY CO. LIMITED : COMPANY SNAPSHOT
TABLE 101.FASFORD TECHNOLOGY CO. LIMITED : OPERATING SEGMENTS
TABLE 102.FASFORD TECHNOLOGY CO. LIMITED : PRODUCT PORTFOLIO
TABLE 103.INSETO UK LIMITED:KEY EXECUTIVE
TABLE 104.INSETO UK LIMITED: COMPANY SNAPSHOT
TABLE 105.INSETO UK LIMITED: OPERATING SEGMENTS
TABLE 106.ABC: PRODUCT PORTFOLIO
TABLE 107.KULICKE AND SOFFA INDUSTRIES, INC:KEY EXECUTIVE
TABLE 108.KULICKE AND SOFFA INDUSTRIES, INC ABC: COMPANY SNAPSHOT
TABLE 109.KULICKE AND SOFFA INDUSTRIES, INC ABC: OPERATING SEGMENTS
TABLE 110.KULICKE AND SOFFA INDUSTRIES, INC: PRODUCT PORTFOLIO
TABLE 111.MICROASSEMBLY TECHNOLOGIES, LIMITED : KEY EXECUTIVE
TABLE 112.MICROASSEMBLY TECHNOLOGIES, LIMITED : COMPANY SNAPSHOT
TABLE 113.MICROASSEMBLY TECHNOLOGIES, LIMITED : PRODUCT PORTFOLIO
TABLE 114.KEY EXECUTIVE: PALOMAR TECHNOLOGIES
TABLE 115.PALOMAR TECHNOLOGIES: COMPANY SNAPSHOT
TABLE 116.PALOMAR TECHNOLOGIES: OPERATING SEGMENTS
TABLE 117.PALOMAR TECHNOLOGIES: PRODUCT PORTFOLIO
TABLE 118.SHINKAWA LIMITED : KEY EXECUTIVE
TABLE 119.SHINKAWA LIMITED : COMPANY SNAPSHOT
TABLE 120.SHINKAWA LIMITED : OPERATING SEGMENTS
TABLE 121.SHINKAWA LIMITED : PRODUCT PORTFOLIO

LIST OF FIGURES

FIGURE 01.KEY MARKET SEGMENTS
FIGURE 02.EXECUTIVE SUMMARY
FIGURE 03.TOP INVESTMENT POCKETS
FIGURE 04.GLOBAL DIE ATTACH MACHINE MARKET SHARE
FIGURE 05.DIE ATTACH MACHINE MARKET, BY TYPE, 2020–2028
FIGURE 06.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR FLIP CHIP BONDER, BY COUNTRY, 2020 & 2028 (%)
FIGURE 07.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR DIE BONDER, BY COUNTRY, 2020 & 2028 (%)
FIGURE 08.DIE ATTACH MACHINE MARKET, BY TECHNIQUE, 2020–2028
FIGURE 09.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR EPOXY, BY COUNTRY, 2020 & 2028 (%)
FIGURE 10.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR SOFT SOLDER, BY COUNTRY, 2020 & 2028 (%)
FIGURE 11.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR SINTERING, BY COUNTRY, 2020 & 2028 (%)
FIGURE 12.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR EUTECTIC, BY COUNTRY, 2020 & 2028 (%)
FIGURE 13.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR OTHERS, BY COUNTRY, 2020 & 2028 (%)
FIGURE 14.DIE ATTACH MACHINE MARKET, BY APPLICATION, 2020–2028
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR RF AND MEMS, BY COUNTRY, 2020 & 2028 (%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR OPTOELECTRONICS, BY COUNTRY, 2020 & 2028 (%)
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR LOGIC, BY COUNTRY, 2020 & 2028 (%)
FIGURE 18.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR MEMORY, BY COUNTRY, 2020 & 2028 (%)
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR CMOS IMAGE SENSORS, BY COUNTRY, 2020 & 2028 (%)
FIGURE 20.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR LED, BY COUNTRY, 2020 & 2028 (%)
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF DIE ATTACH MACHINE MARKET REVENUE FOR OTHERS, BY COUNTRY, 2020 & 2028 (%)
FIGURE 22.DIE ATTACH MACHINE MARKET, BY REGION, 2020–2028
FIGURE 23.U.S. DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 24.CANADA DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 25.MEXICO DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 26.GERMANY DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 27.FRANCE DIE ATTACH MACHINE MARKET REVENUE, 2020–2028($MILLION)
FIGURE 28.UK DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 29.ITALY DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 30.REST OF EUROPE DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 31.CHINA DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 32.INDIA DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 33.JAPAN DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 34.SOUTH KOREA DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 35.REST OF ASIA-PACIFIC DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 36.LATIN AMERICA DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 37.MIDDLE EAST DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 38.AFRICA DIE ATTACH MACHINE MARKET REVENUE, 2020–2028 ($MILLION)
FIGURE 39.ASM PACIFIC TECHNOLOGY LIMITED : RESEARCH AND DEVELOPMENT EXPENSES, 2018–2020 ($MILLION)
FIGURE 40.ASM PACIFIC TECHNOLOGY LIMITED : REVENUE, 2018–2020 ($MILLION)
FIGURE 41.ASM PACIFIC TECHNOLOGY LIMITED: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 42.ASM PACIFIC TECHNOLOGY LIMITED : REVENUE SHARE BY GEOGRAPHY, 2020 (%)
FIGURE 43.BE SEMICONDUCTOR INDUSTRIES N.V.: REVENUE, 2018–2020 ($MILLION)
FIGURE 44.BE SEMICONDUCTOR INDUSTRIES N.V.: REVENUE SHARE BY SEGMENT, 2020(%)
FIGURE 45.BE SEMICONDUCTOR INDUSTRIES N.V.: REVENUE SHARE BY GEOGRAPHY, 2020(%)
FIGURE 46.KULICKE AND SOFFA INDUSTRIES, INC: RESEARCH AND DEVELOPMENT EXPENSES, 2018–2020($MILLION)
FIGURE 47.KULICKE AND SOFFA INDUSTRIES, INC: REVENUE, 2018–2020($MILLION)
FIGURE 48.KULICKE AND SOFFA INDUSTRIES, INC: REVENUE SHARE BY SEGMENT, 2020(%)
FIGURE 49.KULICKE AND SOFFA INDUSTRIES, INC: REVENUE SHARE BY GEOGRAPHY, 2020(%)

 
 

The die attach machine market has witnessed significant growth in the past few years, owing to growing semiconductor industry and rise in demand for consumer electronic products.

With an increasing LED penetration rate, the demand for die-attach equipment is increasing. In coming years there will be an increase in demand for LED chips which is expected to propel the market growth in the near future. Countries such as China, Europe, and Japan are leading manufacturers of die attach LED. China has the highest number of companies producing die attach LED followed by Japan and Europe. Japanese companies are quite strong in terms of technology and have massive experience of die attach LED development.

Moreover, increase in government initiatives for development of industries such as automotive, electronics, and others is anticipated to provide lucrative opportunities for the growth of the die attach machine market.

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A. The die attach machine market size was valued at $1,129.0 million in 2020.

A. Based on type, the die bonder segment holds the maximum market share of the die attach machine market in 2020.

A. The die attach machine market is projected to reach $1,813.1 million by 2028.

A. The rise in demand for electronics products and growing semiconductor industry sector are the key trends in the die attach machine market.

A. The product launch is key growth strategy of Die Attach Machine industry players.

A. The company profile has been selected on factors such as geographical presence, market dominance (in terms of revenue and volume sales), various strategies and recent developments.

A. High fluctuation in raw material cost are the effecting factors for Die Attach Machine Market .

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