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Electronic Packaging Market

Electronic Packaging Market Size, Share, Competitive Landscape and Trend Analysis Report by Type, by Material, by Technology and by Industry Vertical : Global Opportunity Analysis and Industry Forecast, 2023-2032

SE : Emerging and Next Generation Technologies

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Author's: | Sonia Mutreja
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Electronic packaging is defined as design and production of enclosures for electronic devices ranging from individual semiconductors to complete systems such as mainframe computer. This protects from mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge. Efficient electronic and semiconductor packaging is used during manufacture of consumer electronic products such as smartphones, TVs, tablets, set-top boxes, digital media adapters to protect from electrostatic discharge, water, harsh weather condition, corrosion, and dust. It is used in several army and aerospace facilities packed with semiconductor devices such as information handling units, information screen system, and control units for aircraft as it facilitates reduced board area, decreased weight and routing complexity at PCB level. Electronic packaging includes communication ICs, memory power management devices, analog, digital, mixed-signal ICs to drive applications in clinical diagnostics, therapy, and medical imaging as it enhances product upgradeability using die shrinks in the same package. Integrating electronics opens vast possibilities for the human interface and higher density efficient battery technologies imply that the electronic packaging market share would undergo significantly high growth in the forecast years.

Covid-19 Scenario Analysis:

  • The electronic package manufacturers are forced to shut down production operations due to restrictions imposed by the government in the wake of COVID-19 pandemic that has led to supply chain disruption of the overall semiconductor manufacturing & supply industry.
  • The COVID-19 pandemic has led to a shrink in demand for products powered by semiconductors. There is a halt in production of devices, owing to the lockdown scenario. This has caused disruption in the overall supply chain of the global electronic packaging market.
  • Contrarily, the electronic packaging industry sees an opportunity in the unprecedented crisis as organizations begin to work-from-home and end-users begin to consume more content on digital platforms thus surging the importance of storage and memory solutions for data centers, laptops and other devices. Use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics purposes currently drives the market.
  • Companies manufacturing ICs and semiconductor devices are anticipated to revise production planning, sourcing strategy, change industry dynamics to stimulate growth after shutdown and transport restrictions are lifted.

Top Impacting Factors: Market Scenario Analysis, Trends, Driver, and Impact analysis

Rise in adoption of consumer electronic devices such as smartphones, tablets, wearable devices, television and digital cameras containing innovative packaging products such as air bubble wraps and air pillows to protect from harsh weather conditions primarily drive the market growth. In addition, demand for all-weather protective packaging for fragile electronic products such as routers, network servers, and sensors further fuels the electronic packaging market growth. However, potential reliability issues, as it is prone to stress as well as complex difficult maintenance of defects after components are soldered onto the circuit board tends to restrain the market growth.

On the other hand, necessity of high-quality military-grade packaging in aerospace and defence sector for naval warships, satellite communication on-board channels, weapon control system, data display system, and aircraft guidance-control assemblies further propels the electronic packaging market revenue. Growth of IoT network market and continued investments in R&D to enable productive electronic and semiconductor packaging is expected to present new pathways to the electronic packaging industry.

New Product Launches to Flourish the Market:

Leading electronic packaging market players adopt necessary methods to develop prime solutions for integration of flexible electronics including high performance batteries and offers compact electronic packaging.

In May 2020, Curtiss-Wright, global diversified product manufacturer and service provider, launched a new family of miniature Data Acquisition System (DAC) to offer balanced square form factor to system designers. 

The TTC-MDW is a high-speed miniature Double Wide Form Factor wideband DAW measuring 140*66*97mm (5.5*2.6*3.8”) in an 8-module configuration with 50watt power supply integrated into base plate and can support 1 to 14 modules. It is designed to interface a variety of analog and digital sensors and encode the sources into wideband PCM output data stream up to 20Mbps. It can be configured with a wide range of sensors and transducers and can operate in standalone PCM and Ethernet networked systems depending on overhead and interface modules selected. The Remote Bus which is the primary internal communication bus is used to transfer power, control, configuration and data among the modules. The TTC-MDW DAU family is used in flight test instrumentation system solutions such as hypersonic ordnance and rotorcraft. 

Surge in use in Industrial and Automotive Applications

Electronic packaging of a large number of memory devices, processors, discrete power devices, sensors, analog and digital circuits is integrated in electric and hybrid vehicles hence transforming the automotive landscape through transition from mechanical system to electronic assemblies.  

In June 2019, Cymbet Corp., leader in thin-film solid-state storage devices and energy harvesting technology, introduced the EnerChip solid-state rechargeable micro-battery, and next generation of Power Management with RTC (PMRTC) products. This product integrates an ultra-low power real time clock (RTC) with power management and power switching optimized for innovative applications such as battery-less sensors and wearable sensors. PMRTC offers on-chip temperature sensor with 12C and SPI bus options and is available in many packaging options from die to fully integrated devices with EnerChip battery for complete customer solutions. The die options along with EnerChip die offers customers quick time to market of the revolutionary solutions enabled by EnerChip battery. 

Key benefits of the stakeholders:

  • The study gives an analytical overview of Electronic Packaging market forecast with current trends and future estimations to determine imminent investment pockets.
  • The report provides information related to key drivers, restraints, and opportunities along with detailed electronic packaging market analysis.
  • The current electronic packaging market trends are quantitatively analyzed.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 

Questions answered in the Electronic Packaging Market research report:

  • Who are the leading players in the Electronic Packaging market?
  • What are the current trends that would influence the market in the next few years?
  • What are the driving factors, restraints, and opportunities in the market?
  • What are the projections for the future that would help in taking further strategic steps?
  • What would be the detailed impact of COVID-19 on the market?

Electronic Packaging Market Report Highlights

Aspects Details
By Type
  • Corrugated Boxes
  • Paperboard Boxes
  • Thermoformed Trays
  • Bags and Pouches
  • Blister packs and Clamshell
  • Protective Packaging
By Material
  • Plastic
  • Metal
  • Glass
  • Others
By Technology
  • Electronic Article Surveillance(EAS)
  • Radio-frequency Identification
By Industry Vertical
  • Consumer Electronics
  • Aerospace and Defense
  • Automotive
  • Healthcare
  • Others
By Region
  • North America  (US, Canada)
  • Europe  (Germany, UK, France, Italy, Spain, Rest of Europe)
  • Asia Pacific  (India, Japan, China, Australia, South Korea, Rest of Asia Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players

Holst Centre, Front Edge Technology, Excellatron Solid State, Blue Spark Technology, Cymbet., Canatu, Infinite Power Solutions, Dordan Manufacturing Company, UFP Technologies Inc., AMETEK Inc.

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Electronic Packaging Market

Global Opportunity Analysis and Industry Forecast, 2023-2032