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Electronic Packaging Market Type By Type (Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags & Pouches, Blister Packs & Clamshell, and Protective Packaging), Material (Plastic, Metal, Glass, and Others), Technology (EAS and RFID), Industry Vertical (Consumer Electronics, Aerospace & Defence, Automotive, Healthcare, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2027

A08928
Pages: NA
Dec 2020 | 46 Views
 
Author(s) : NA
Tables: NA
Charts: NA
 

COVID-19

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Electronic packaging is defined as design and production of enclosures for electronic devices ranging from individual semiconductors to complete systems such as mainframe computer. This protects from mechanical damage, cooling, radio frequency noise emission, and electrostatic discharge. Efficient electronic and semiconductor packaging is used during manufacture of consumer electronic products such as smartphones, TVs, tablets, set-top boxes, digital media adapters to protect from electrostatic discharge, water, harsh weather condition, corrosion, and dust. It is used in several army and aerospace facilities packed with semiconductor devices such as information handling units, information screen system, and control units for aircraft as it facilitates reduced board area, decreased weight and routing complexity at PCB level. Electronic packaging includes communication ICs, memory power management devices, analog, digital, mixed-signal ICs to drive applications in clinical diagnostics, therapy, and medical imaging as it enhances product upgradeability using die shrinks in the same package. Integrating electronics opens vast possibilities for the human interface and higher density efficient battery technologies imply that the electronic packaging market share would undergo significantly high growth in the forecast years.

Covid-19 Scenario Analysis:

  • The electronic package manufacturers are forced to shut down production operations due to restrictions imposed by the government in the wake of COVID-19 pandemic that has led to supply chain disruption of the overall semiconductor manufacturing & supply industry.
  • The COVID-19 pandemic has led to a shrink in demand for products powered by semiconductors. There is a halt in production of devices, owing to the lockdown scenario. This has caused disruption in the overall supply chain of the global electronic packaging market.
  • Contrarily, the electronic packaging industry sees an opportunity in the unprecedented crisis as organizations begin to work-from-home and end-users begin to consume more content on digital platforms thus surging the importance of storage and memory solutions for data centers, laptops and other devices. Use of medical devices with integrated electronic packaging for bio-imaging and clinical diagnostics purposes currently drives the market.
  • Companies manufacturing ICs and semiconductor devices are anticipated to revise production planning, sourcing strategy, change industry dynamics to stimulate growth after shutdown and transport restrictions are lifted.

Top Impacting Factors: Market Scenario Analysis, Trends, Driver, and Impact analysis

Rise in adoption of consumer electronic devices such as smartphones, tablets, wearable devices, television and digital cameras containing innovative packaging products such as air bubble wraps and air pillows to protect from harsh weather conditions primarily drive the market growth. In addition, demand for all-weather protective packaging for fragile electronic products such as routers, network servers, and sensors further fuels the electronic packaging market growth. However, potential reliability issues, as it is prone to stress as well as complex difficult maintenance of defects after components are soldered onto the circuit board tends to restrain the market growth.

On the other hand, necessity of high-quality military-grade packaging in aerospace and defence sector for naval warships, satellite communication on-board channels, weapon control system, data display system, and aircraft guidance-control assemblies further propels the electronic packaging market revenue. Growth of IoT network market and continued investments in R&D to enable productive electronic and semiconductor packaging is expected to present new pathways to the electronic packaging industry.

New Product Launches to Flourish the Market:

Leading electronic packaging market players adopt necessary methods to develop prime solutions for integration of flexible electronics including high performance batteries and offers compact electronic packaging.

In May 2020, Curtiss-Wright, global diversified product manufacturer and service provider, launched a new family of miniature Data Acquisition System (DAC) to offer balanced square form factor to system designers. 

The TTC-MDW is a high-speed miniature Double Wide Form Factor wideband DAW measuring 140*66*97mm (5.5*2.6*3.8”) in an 8-module configuration with 50watt power supply integrated into base plate and can support 1 to 14 modules. It is designed to interface a variety of analog and digital sensors and encode the sources into wideband PCM output data stream up to 20Mbps. It can be configured with a wide range of sensors and transducers and can operate in standalone PCM and Ethernet networked systems depending on overhead and interface modules selected. The Remote Bus which is the primary internal communication bus is used to transfer power, control, configuration and data among the modules. The TTC-MDW DAU family is used in flight test instrumentation system solutions such as hypersonic ordnance and rotorcraft. 

Surge in use in Industrial and Automotive Applications

Electronic packaging of a large number of memory devices, processors, discrete power devices, sensors, analog and digital circuits is integrated in electric and hybrid vehicles hence transforming the automotive landscape through transition from mechanical system to electronic assemblies.  

In June 2019, Cymbet Corp., leader in thin-film solid-state storage devices and energy harvesting technology, introduced the EnerChip solid-state rechargeable micro-battery, and next generation of Power Management with RTC (PMRTC) products. This product integrates an ultra-low power real time clock (RTC) with power management and power switching optimized for innovative applications such as battery-less sensors and wearable sensors. PMRTC offers on-chip temperature sensor with 12C and SPI bus options and is available in many packaging options from die to fully integrated devices with EnerChip battery for complete customer solutions. The die options along with EnerChip die offers customers quick time to market of the revolutionary solutions enabled by EnerChip battery. 

Market Scope and Structure Analysis:

Report Metric

Details

  Market size available for years

   2019–2027

  Base year considered

  2019

  Forecast Period

  2021–2027

  Forecast Unit

  Value ($)

  Segments Covered

  Product Type, Technology, Industry Vertical, and Region

  Regions Covered

North America(U.S., Canada, and Mexico), Europe(Germany, UK, France, Russia, and rest of Europe), Asia Pacific(India, Japan, China and rest of Asia Pacific) and LAMEA (Latin America, Middle East, and Africa)

  Companies Covered

Blue Spark Technology, AMETEK Inc., UFP Technologies Inc., Canatu, Excellatron Solid State, Front Edge Technology, Holst Centre, Infinite Power Solutions, Dordan Manufacturing Company and Cymbet.

 

Key benefits of the stakeholders:

  • The study gives an analytical overview of Electronic Packaging market forecast with current trends and future estimations to determine imminent investment pockets.
  • The report provides information related to key drivers, restraints, and opportunities along with detailed electronic packaging market analysis.
  • The current electronic packaging market trends are quantitatively analyzed from 2021 to 2027.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 

Key segments covered:

Segments

Subsegments

  Type

  • Corrugated Boxes
  • Paperboard Boxes
  • Thermoformed Trays
  • Bags and Pouches
  • Blister packs and Clamshell
  • Protective Packaging

  Material

  • Plastic
  • Metal
  • Glass
  • Others

  Technology

  • Electronic Article Surveillance(EAS)
  • Radio-frequency Identification

  Industry Vertical

  • Consumer Electronics
  • Aerospace and Defense
  • Automotive
  • Healthcare
  • Others

 

Questions answered in the Electronic Packaging Market research report:

  • Who are the leading players in the Electronic Packaging market?
  • What are the current trends that would influence the market in the next few years?
  • What are the driving factors, restraints, and opportunities in the market?
  • What are the projections for the future that would help in taking further strategic steps?
  • What would be the detailed impact of COVID-19 on the market?
 
With collective industry experience of about 200 years of its analysts and experts, Allied Market Research (AMR) encompasses most infallible research methodology for its market intelligence and industry analysis. We do not only engrave the deepest levels of markets but also sneak through its slimmest details for the purpose of our market estimates and forecasts. Our approach helps in building greater market consensus view for size, shape and industry trends within each industry segment. We carefully factor in industry trends and real developments for identifying key growth factors and future course of the market. Our research proceeds are the resultant of high quality data, expert views and analysis and high value independent opinions. Our research process is designed to deliver balanced view of the global markets and allow stakeholders to make informed decisions.

We offer our clients exhaustive research and analysis based on wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics and regional intelligence. Our in-house industry experts play instrumental role in designing analytic tools and models, tailored to the requirements of particular industry segment. These analytical tools and models sanitize the data & statistics and enhance the accuracy of our recommendations and advice. With AMR’s calibrated research process and 360` degree data-evaluation methodology, our clients are assured of receiving:

  • Consistent, valuable, robust and actionable data & analysis that can easily be referenced for strategic business planning
  • Technologically sophisticated and reliable insights through well audited and veracious research methodology
  • Sovereign research proceeds that present a tangible depiction of marketplace


With a strong methodology we are, therefore, confident that our research and analysis are most reliable and guarantees sound business planning.

Secondary research
We refer a broad array of industry sources for our secondary, which typically include; however, not limited to: Company SEC filings, annual reports, company websites, broker & financial reports and investor presentations for competitive scenario and shape of the industry

  • Patent and regulatory databases for understanding of technical & legal developments
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic new articles, web-casts and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators and relevant press releases for market estimates and forecast


Primary research
Our primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks and face-to-face interactions. We are also in professional corporate relations with various companies that allow us greater flexibility for reaching out industry participants and commentators for interviews and discussions, fulfilling following functions:

  • Validates and improves the data quality and strengthens research proceeds
  • Further develops analyst team’s market understanding and expertise
  • Supplies authentic information about market size, share, growth and forecasts


Our primary research interview and discussion panels are typically composed of most experienced industry members. These participants include; however, not limited to:

  • Chief executives and VPs of leading corporations specific to industry
  • Product and sales managers or country heads; channel partners and top level distributors; banking, investments and valuation experts Key opinion leaders (KOLs)


Analyst tools and models
AMR has developed set of analyst tools and data models to supplement and expedite the analysis process. Corresponding to markets, where there is significant lack of information and estimates, AMR’s team of experts and analyst develop specific analyst tools and industry models to translate qualitative and quantitative industry indicators into exact industry estimates. These models also allow analysts to examine the prospects and opportunities prevailing in the market to accurately forecast the course of the market.
 
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