Allied Market Research

2024

Fan-out Panel-level Packaging (foplp) Market

Fan-out panel-level packaging (FOPLP) Market Size, Share, Competitive Landscape and Trend Analysis Report by Market Type, by Carrier Type and by Business Model : Global Opportunity Analysis and Industry Forecast, 2023-2032

SE : Emerging and Next Generation Technologies

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Author's: | Sonia Mutreja
Publish Date:

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Fan-out panel-level packaging (FOPLP) Market Report Highlights

Aspects Details
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By Market Type
  • Core Fan-Out
  • High-Density Fan-Out
  • Ultra High-density Fan Out
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By Carrier Type
  • 200 mm
  • 300 mm
  • Panel
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By Business Model
  • OSAT
  • Foundary
  • IDM
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By Geography
  • North America
    • U.S.
    • Canada
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Spain
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
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Key Market Players

STATS ChipPAC, Powertech Technology Inc., Qualcomm Technologies, Inc, Strategic Moves and Developments, Jiangsu Changjiang Electronics Tech Co., SPTS Technologies Ltd., Amkor Technology Inc., Amkor Technology, Inc., Deca Technologies, Samsung Electro-Mechanics

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Fan-out panel-level packaging (FOPLP) Market

Global Opportunity Analysis and Industry Forecast, 2023-2032