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High-Density Interconnect (HDI) PCB Market by End User (Consumer Electronics, Automotive, Industrial Electronics, IT & Telecommunications, and Others) and Application (Smartphone & Tablet, Laptop & PC, Smart Wearables, and Others): Global Opportunity Analysis and Industry Forecast, 2018 - 2025

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SE_185096
Pages: 238
Nov 2018 | 155 Views
 
Author's : Prasad Kakade
Tables: 80
Charts: 68
 

HDI PCB Market Overview:

The Global HDI PCB Market was valued at $9,491.0 million in 2017 and is projected to reach $22,258.8 million by 2025, registering a CAGR of 11.1% from 2018 to 2025. Asia-Pacific accounted for the highest revenue share of $4555.7 million in 2017 and is estimated to reach $9971.9 million by 2025, registering a CAGR of 10.1% during forecast period.

A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.

The factors that drive the global HDI PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics. In addition, increase in utilization of HDI technology in automobiles is expected to provide lucrative growth opportunities for the market. On the contrary, high construction cost is anticipated to restrain the growth of the global market.

The global HDI PCB market is dominated by key players such as Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP Corporation, and Meiko.

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The global HDI PCB market is segmented based on end-user, application, and region. Based on end-user, the market is classified into consumer electronics, automotive, industrial electronics, IT & telecommunications, and others. Based on application, it is categorized into smartphone & tablet, laptop & PC, smart wearables, and others. Based on region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

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Top Impacting Factors

 

Miniaturization of size and lower weight

HDI PCBs enable accommodation of more components on either side of the PCB, which increases its functionality and maximizes the abilities of the products or equipment in which it is incorporated. In addition to the high functionality of the HDI boards, the size and weight of the products are also reduced as compared to the traditional PCBs. These boards are heavily utilized in communication devices such as smartphones and tablets, as these products are small and require high functionality in limited space. Moreover, rising need of better power performance of consumer electronic devices and larger color display demands larger battery space reducing the space for PCBs in these devices, thereby driving the growth of the global HDI PCB market.

High efficiency

The HDI PCBs utilize minimum materials and boards for its composition and also increase the efficiency of HDI boards as compared to conventional PCBs. In addition, the time required for the construction of these boards is less that helps faster production. Such functionalities of HDI boards increases the performance of the devices in which it is incorporated. All these factors are expected to drive the growth of the global HDI PCB market.

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Growing sales of consumer electronics

The growing sales of consumer electronics and a substantial rise in the demand for HDI PCBs in these applications are driving the growth of the global HDI PCB market. Therefore, the consumer electronics industry is becoming one of the important end-user markets for high-density technology. Currently, application of these boards in consumer electronic devices such as smartphones, smart wearables, gaming consoles, tablets, and others are significant. Thereby with increasing demand and production of these devices, the global HDI PCB market is projected to grow in the forecast period.

High construction cost

The manufacturing of HDI PCBs requires special methods such as laser direct imaging (LDI). This method is used in the fabrication process as HDI requires the construction of fine lines on the boards. In addition to the fine lines, implementation of tighter spacing of the components makes LDI a necessary element in this process. As the expense of the overall LDI equipment and machinery costs are significantly higher it makes the construction of HDI PCBs expensive. Moreover, the individual operating or handling the construction of the HDIs needs sufficient knowledge and intense training to handle the complete manufacturing process. These factors increase the cost of HDI PCBs, which in turn restrains the growth of the global market.

Increase in utilization of HDI technology in automobiles

The factors such as rising trend toward sophisticated safety systems, autonomous driving, and miniaturization of electronic devices in the automobile sector are expected to boost the growth of the global HDI PCB market in the near future. In addition, with the advent of autonomous driving, connected cars, and 5G, the global HDI PCB market is expected to propel during the forecast period. Moreover, the number of applications in the automotive industry such as advanced driver assistance systems, GPS navigation, and infotainment utilize high-density boards providing lucrative growth opportunities for the global market.

Key Benefits for HDI PCB Market:

  • This study presents an analytical depiction of the global HDI PCB market along with the current trends and future estimations to depict the imminent investment pockets.

  • The overall market potential is determined to understand the profitable trends to gain a stronger foothold.

  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.

  • The current market is quantitatively analyzed from 2017 to 2025 to benchmark the financial competency.

  • Porters five forces analysis illustrates the potency of the buyers and suppliers in the industry.

HDI PCB Key Market Segments:

By End User

  • Consumer Electronics

  • Automotive

  • Industrial Electronics

  • IT & Telecommunications

  • Others

By Application

  • Smartphone & Tablet

  • Laptop & PC

  • Smart Wearables

  • Others

BY Region

  • North America

    • U.S.

    • Canada

    • Mexico

  • Europe

    • UK

    • Germany

    • France

    • Russia

    • Rest of Europe

  • Asia-Pacific

    • China

    • Japan

    • India

    • South Korea

    • Rest of Asia-Pacific

  • LAMEA

    • Latin America

    • Middle East

    • Africa

Key Market Players Profiled

  • Siemens AG

  • Compeq Manufacturing Co. Ltd.

  • TTM Technologies, Inc.

  • Unimicron

  • AT&S

  • Ibiden Group

  • SEMCO

  • Unitech Printed Circuit Board Corp.

  • Tripod Technology Corp.

  • DAP Corporation

  • Meiko Electronics Co. Ltd.

 

Chapter: 1: INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models

Chapter: 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter: 3: MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies

3.3. PORTERS FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS (2017)
3.5. MARKET DYNAMICS

3.5.1. Drivers

3.5.1.1. Miniaturization of size and lower weight
3.5.1.2. High efficiency
3.5.1.3. Growing sales of consumer electronics

3.5.2. Restraint

3.5.2.1. High Construction Cost

3.5.3. Opportunities

3.5.3.1. Increase in utilization of HDI technology in automobiles

Chapter: 4: HDI PCB MARKET, BY END-USER

4.1. OVERVIEW
4.2. CONSUMER ELECTRONICS

4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country

4.3. AUTOMOTIVE

4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country

4.4. INDUSTRIAL ELECTRONICS

4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country

4.5. IT & TELECOMMUNICATIONS

4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country

4.6. OTHERS

4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country

Chapter: 5: HDI PCB MARKET, BY APPLICATION

5.1. OVERVIEW
5.2. SMARTPHONE & TABLET

5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country

5.3. PC & LAPTOP

5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country

5.4. SMART WEARABLE

5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country

5.5. OTHERS

5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country

Chapter: 6: HDI PCB MARKET, BY REGION

6.1. OVERVIEW
6.2. NORTH AMERICA

6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by End-User
6.2.3. Market size and forecast, by application
6.2.4. Market analysis by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by End-User
6.2.4.1.2. Market size and forecast, by application

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by End-User
6.2.4.2.2. Market size and forecast, by application

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by End-User
6.2.4.3.2. Market size and forecast, by application

6.3. EUROPE

6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by End-User
6.3.3. Market size and forecast, by application
6.3.4. Market analysis by country

6.3.4.1. U.K.

6.3.4.1.1. Market size and forecast, by End-User
6.3.4.1.2. Market size and forecast, by application

6.3.4.2. Germany

6.3.4.2.1. Market size and forecast, by End-User
6.3.4.2.2. Market size and forecast, by application

6.3.4.3. France

6.3.4.3.1. Market size and forecast, by End-User
6.3.4.3.2. Market size and forecast, by application

6.3.4.4. Russia

6.3.4.4.1. Market size and forecast, by End-User
6.3.4.4.2. Market size and forecast, by application

6.3.4.5. Rest of Europe

6.3.4.5.1. Market size and forecast, by End-User
6.3.4.5.2. Market size and forecast, by application

6.4. ASIA-PACIFIC

6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by End-User
6.4.3. Market size and forecast, by application
6.4.4. Market analysis by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by End-User
6.4.4.1.2. Market size and forecast, by application

6.4.4.2. Japan

6.4.4.2.1. Market size and forecast, by End-User
6.4.4.2.2. Market size and forecast, by application

6.4.4.3. India

6.4.4.3.1. Market size and forecast, by End-User
6.4.4.3.2. Market size and forecast, by application

6.4.4.4. South Korea

6.4.4.4.1. Market size and forecast, by End-User
6.4.4.4.2. Market size and forecast, by application

6.4.4.5. Rest of Asia-Pacific

6.4.4.5.1. Market size and forecast, by End-User
6.4.4.5.2. Market size and forecast, by application

6.5. LAMEA

6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by End-User
6.5.3. Market size and forecast, by application
6.5.4. Market analysis by country

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by End-User
6.5.4.1.2. Market size and forecast, by application

6.5.4.2. Middle East

6.5.4.2.1. Market size and forecast, by End-User
6.5.4.2.2. Market size and forecast, by application

6.5.4.3. Africa

6.5.4.3.1. Market size and forecast, by End-User
6.5.4.3.2. Market size and forecast, by application

Chapter: 7: COMPANY PROFILES

7.1. AT&S

7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments

7.2. COMPEQ

7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio
7.2.4. Business performance
7.2.5. Key strategic moves and developments

7.3. DAP CORPORATION

7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Product portfolio
7.3.4. Business performance

7.4. IBIDEN CO., LTD.

7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Business performance

7.5. MEIKO ELECTRONICS CO., LTD.

7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.5.4. Business performance
7.5.5. Key strategic moves and developments

7.6. SEMCO

7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance

7.7. TTM TECHNOLOGIES

7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments

7.8. TRIPOD TECHNOLOGY

7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Product portfolio
7.8.4. Business performance

7.9. UNIMICRON

7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments

7.10. UNITECH PCB

7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
7.10.4. Business performance

LIST OF TABLES

TABLE 01. GLOBAL HDI PCB MARKET, BY END-USER, 2017-2025($MILLION)
TABLE 02. HDI PCB MARKET REVENUE FOR CONSUMER ELECTRONICS, BY REGION 2017-2025 ($MILLION)
TABLE 03. HDI PCB MARKET REVENUE FOR AUTOMOTIVE, BY REGION 2017-2025 ($MILLION)
TABLE 04. HDI PCB MARKET REVENUE FOR INDUSTRIAL ELECTRONICS, BY REGION 20172025 ($MILLION)
TABLE 05. HDI PCB MARKET REVENUE FOR IT & TELECOMMUNICATIONS, BY REGION 20172025 ($MILLION)
TABLE 06. HDI PCB MARKET REVENUE FOR OTHERS, BY REGION 20172025 ($MILLION)
TABLE 07. GLOBAL HDI PCB MARKET, BY APPLICATION, 2017-2025($MILLION)
TABLE 08. HDI PCB MARKET REVENUE FOR SMARTPHONE & TABLET, BY REGION 2017-2025 ($MILLION)
TABLE 09. HDI PCB MARKET REVENUE FOR PC & LAPTOP, BY REGION 20172025 ($MILLION)
TABLE 10. HDI PCB MARKET REVENUE FOR SMART WEARABLE, BY REGION 20172025 ($MILLION)
TABLE 11. HDI PCB MARKET REVENUE FOR OTHERS, BY REGION 20172025 ($MILLION)
TABLE 12. NORTH AMERICA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 13. NORTH AMERICA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 14. U.S. HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 15. U.S. HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 16. CANADA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 17. CANADA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 18. MEXICO HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 19. MEXICO HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 20. EUROPE HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 21. EUROPE HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 22. U.K. HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 23. U.K. HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 24. GERMANY HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 25. GERMANY HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 26. FRANCE HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 27. FRANCE HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 28. RUSSIA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 29. RUSSIA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 30. REST OF EUROPE HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 31. REST OF EUROPE HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 32. ASIA-PACIFIC HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 33. ASIA-PACIFIC HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 34. CHINA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 35. CHINA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 36. JAPAN HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 37. JAPAN HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 38. INDIA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 39. INDIA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 40. SOUTH KOREA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 41. SOUTH KOREA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 42. REST OF ASIA-PACIFIC HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 43. REST OF ASIA-PACIFIC HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 44. LAMEA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 45. LAMEA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 46. LATIN AMERICA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 47. LATIN AMERICA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 48. MIDDLE EAST HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 49. MIDDLE EAST HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 50. AFRICA HDI PCB MARKET, BY END-USER, 20172025 ($MILLION)
TABLE 51. AFRICA HDI PCB MARKET, BY APPLICATION, 20172025 ($MILLION)
TABLE 52. AT&S: COMPANY SNAPSHOT
TABLE 53. AT&S: OPERATING SEGMENTS
TABLE 54. AT&S: PRODUCT PORTFOLIO
TABLE 55. AT&S: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 56. COMPEQ: COMPANY SNAPSHOT
TABLE 57. COMPEQ: PRODUCT PORTFOLIO
TABLE 58. COMPEQ: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 59. DAP CORPORATION: COMPANY SNAPSHOT
TABLE 60. DAP CORPORATION: PRODUCT PORTFOLIO
TABLE 61. IBIDEN CO.,LTD.: COMPANY SNAPSHOT
TABLE 62. IBIDEN CO.,LTD.: OPERATING SEGMENTS
TABLE 63. MEIKO ELECTRONICS CO., LTD.: COMPANY SNAPSHOT
TABLE 64. MEIKO ELECTRONICS CO., LTD.: PRODUCT PORTFOLIO
TABLE 65. MEIKO ELECTRONICS CO., LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 66. SEMCO: COMPANY SNAPSHOT
TABLE 67. SEMCO: OPERATING SEGMENTS
TABLE 68. SEMCO: PRODUCT PORTFOLIO
TABLE 69. TTM TECHNOLOGIES: COMPANY SNAPSHOT
TABLE 70. TTM TECHNOLOGIES: OPERATING SEGMENTS
TABLE 71. TTM TECHNOLOGIES: PRODUCT PORTFOLIO
TABLE 72. TTM TECHNOLOGIES: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 73. TRIPOD TECHNOLOGY: COMPANY SNAPSHOT
TABLE 74. TRIPOD TECHNOLOGY: PRODUCT PORTFOLIO
TABLE 75. UNIMICRON: COMPANY SNAPSHOT
TABLE 76. UNIMICRON: OPERATING SEGMENTS
TABLE 77. UNIMICRON: PRODUCT PORTFOLIO
TABLE 78. UNIMICRON: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 79. UNITECH PCB: COMPANY SNAPSHOT
TABLE 80. UNITECH PCB: PRODUCT PORTFOLIO

LIST OF FIGURES

FIGURE 01. KEY MARKET SEGMENTS
FIGURE 02. EXECUTIVE SUMMARY
FIGURE 03. EXECUTIVE SUMMARY
FIGURE 04. TOP IMPACTING FACTORS
FIGURE 05. TOP INVESTMENT POCKETS
FIGURE 06. TOP WINNING STRATEGIES, BY YEAR, 20152018*
FIGURE 07. TOP WINNING STRATEGIES, BY YEAR, 20152018*
FIGURE 08. TOP WINNING STRATEGIES, BY COMPANY, 20152018*
FIGURE 09. MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 10. LOW-TO-MODERATE THREAT OF NEW ENTRANTS
FIGURE 11. MODERATE THREAT OF SUBSTITUTES
FIGURE 12. HIGH-TO-MODERATE INTENSITY OF RIVALRY
FIGURE 13. MODERATE BARGAINING POWER OF BUYERS
FIGURE 14. MARKET SHARE ANALYSIS (2017)
FIGURE 15. GLOBAL HDI PCB MARKET SHARE, BY END-USER, 20172025 (%)
FIGURE 16. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2017 & 2025 (%)
FIGURE 17. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR AUTOMOTIVE, BY COUNTRY, 2017 & 2025 (%)
FIGURE 18. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR INDUSTRIAL ELECTRONICS, BY COUNTRY, 2017 & 2025 (%)
FIGURE 19. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR IT & TELECOMMUNICATIONS, BY COUNTRY, 2017 & 2025 (%)
FIGURE 20. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR OTHERS, BY COUNTRY, 2017 & 2025 (%)
FIGURE 21. GLOBAL HDI PCB MARKET SHARE, BY APPLICATION, 20172025 (%)
FIGURE 22. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR SMARTPHONE & TABLET, BY COUNTRY, 2017 & 2025 (%)
FIGURE 23. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR PC & LAPTOP, BY COUNTRY, 2017 & 2025 (%)
FIGURE 24. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR OTHERS, BY COUNTRY, 2017 & 2025 (%)
FIGURE 25. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET FOR OTHERS, BY COUNTRY, 2017 & 2025 (%)
FIGURE 26. HDI PCB MARKET, BY REGION, 2017-2025 (%)
FIGURE 27. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET, BY COUNTRY, 20172025 (%)
FIGURE 28. U.S. HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 29. CANADA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 30. MEXICO HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 31. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET, BY COUNTRY, 20172025 (%)
FIGURE 32. U.K. HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 33. GERMANY HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 34. FRANCE HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 35. RUSSIA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 36. REST OF EUROPE HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 37. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET, BY COUNTRY, 20172025 (%)
FIGURE 38. CHINA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 39. JAPAN HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 40. INDIA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 41. SOUTH KOREA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 42. REST OF ASIA-PACIFIC HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 43. COMPARATIVE SHARE ANALYSIS OF HDI PCB MARKET, BY COUNTRY, 20172025 (%)
FIGURE 44. LATIN AMERICA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 45. MIDDLE EAST HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 46. AFRICA HDI PCB MARKET, 20172025 ($MILLION)
FIGURE 47. AT&S: NET SALES, 20152017 ($MILLION)
FIGURE 48. AT&S: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 49. AT&S: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 50. COMPEQ: NET SALES, 20152017 ($MILLION)
FIGURE 51. COMPEQ: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 52. COMPEQ: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 53. DAP CORPORATION:NET SALES, 20152017 ($MILLION)
FIGURE 54. IBIDEN CO., LTD.: NET SALES, 20152017 ($MILLION)
FIGURE 55. IBIDEN CO., LTD.: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 56. IBIDEN CO., LTD.: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 57. MEIKO ELECTRONICS CO., LTD.: NET SALES, 20152017 ($MILLION)
FIGURE 58. MEIKO ELECTRONICS CO., LTD.: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 59. SEMCO: NET SALES, 20152017 ($MILLION)
FIGURE 60. SEMCO: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 61. SEMCO: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 62. TTM TECHNOLOGIES: NET SALES, 20152017 ($MILLION)
FIGURE 63. TTM TECHNOLOGIES: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 64. TTM TECHNOLOGIES: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 65. TRIPOD TECHNOLOGY: NET SALES, 20152017 ($MILLION)
FIGURE 66. UNIMICRON: NET SALES, 20152017 ($MILLION)
FIGURE 67. UNIMICRON: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 68. UNITECH PCB: NET SALES, 20152017 ($MILLION)

 

The global HDI PCB market has been growing at a steady growth rate. The factors such as improved accuracy, efficiency, and speed of operations are expected to drive the market growth during the forecast period. In addition, the industrial electronics and automotive end-user segments are expected to grow at the fastest CAGR during the forecast period.

The factors that drive the global HDI PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics. However, high construction cost is expected to impede the market growth. In the near future, increasing utilization of HDI technology in automobiles is expected to provide lucrative opportunities for the growth of the global market.   

The global HDI PCB market was valued at $9,491.0 million in 2017 and is projected to reach $22,258.8 million by 2025, registering a CAGR of 11.1% from 2018 to 2025. Asia-Pacific is expected to account for the highest revenue in the global market throughout the forecast period. However, LAMEA is anticipated to exhibit the highest CAGR during the forecast period, providing lucrative growth opportunities for the global HDI PCB market. The market participants continue to introduce cutting-edge technologies to remain competitive in the market and acquisition & expansion are the prominent strategies adopted by them.

The key market players analyzed in this report include Compeq Manufacturing Co. Ltd., TTM Technologies, Unimicron Printed Circuit Board Corp., AT&S, Ibiden Group, SEMCO, Unitech PCB, Tripod Technology Corp., DAP Corporation, and Meiko.

 

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