Integrated Passive Device Market Outlook-2026
The continuous demand for higher performance and more compact electronic products such as mobile phones, PDAs, digital cameras, etc. is the main factor responsible for the integration of passive components such as resistors, inductors, and capacitors. Especially the requirement for high-frequency signal handling and the integration of optical signals into electronic packages are key driving factors for the integration of passives into various devices. Basically, integrated passive devices (IPDs) combine a number of passive components such as resistors, capacitors, and inductors in a single package. IPDs have benefits such as advantage in performance, compact size, and less assembly cost. Thus, IPDs are booming area of advanced packaging. The IPDs are ideally combined with wafer level packaging – yielding minimal size and low costs, since there is no longer a need for a conventional plastic package. The number of IPDs built on glass thin film substrates is increasing and the number of IPDs built on silicon-like semiconductor devices or ceramic is reduced due to high cost of silicon-like semiconductor devices or ceramic. There are various players in the integrated passive device market and the growth strategies adopted by the key players include product launches & developments, partnerships, and acquisitions. For instance, Murata launched NFZ03SG_SN series of audio line noise filter for smart phones to efficiently eliminate noise while maintaining high sound quality. Murata has also acquired IPDiA. IPDiA is a manufacturer of integrated passive devices. As a result of this acquisition, IPDiA has become a subsidiary of Murata Manufacturing, and IPDiA’s products and solutions are commercialized as part of Murata’s product portfolio.
Some of the major factors that drive the growth of the integrated passive device market include increase in adoption of IPD in consumer durables, introduction of advanced and efficient technologies in the electronics industry, and rise in demand for smart phones. However, long product design cycle for RF tuning of IPDs is expected to restrain the market growth. Moreover, rise in use of integrated passive devices in the wearable industry and inception of 5G provides lucrative opportunities for the growth of the integrated passive device market.
The integrated passive device market is segmented based on material, passive devices, application, wireless technology, end use, and region. Based on material, the market is categorized into silicon, glass, and others. By passive devices, it is divided into baluns, filter, couplers, diplexers, and customized IPDs. Based on application, it is classified into ESD/EMI, RF IPD, and digital & mixed signals. On the basis of wireless technology, it is segmented into WLAN, Bluetooth, GPS, and Cellular. Based on end use, it is categorized into consumer electronics, automotive, communication, aerospace & defense, and healthcare & lifesciences. Based on region, the market is analyzed across Europe, Asia-Pacific, North America, and LAMEA.
The major companies profiled in the integrated passive device market include STATS ChipPAC, ON Semiconductor, Infineon, STMicroelectronics, Murata, Johanson, OnChip Devices, Global Communication Semiconductors, 3DiS, Advanced Furnace Systems, and others.
KEY BENEFITS FOR STAKEHOLDERS
- This study comprises analytical depiction of the integrated passive device market share with current trends and future estimations to depict the imminent investment pockets.
- The overall potential is determined to understand the profitable trends to gain a stronger foothold in the integrated passive device industry.
- The integrated passive device market analysis report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
- The integrated passive device market forecast is quantitatively analyzed to benchmark the financial competency.
- Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
Integrated Passive Device Market Report Highlights
| Aspects | Details |
 By Material |
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 By Passive Devices |
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 By Application |
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| By Wireless Technology |
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 By End Use |
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 By Region |
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 Key Market Players | Advanced Furnace Systems, Infineon, STMicroelectronics, Johanson, ON Semiconductor, 3DiS, Global Communication Semiconductors, STATS ChipPAC, OnChip Devices, Murata |
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