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| A05430 | Pages: 228 | Jan 2021 | 4121 Views | | |
| Author(s) : Sachin Wankhede | Tables: 79 | Charts: 76 |
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Pandemic disrupted the entire world and affected many industries.
Get detailed COVID-19 impact analysis on the Mixed Signal Ic Market
Request Now !The global mixed signal IC market size was valued at $94.10 billion in 2019, and is projected to reach $149.80 billion by 2027, registering a CAGR of 6.6% from 2020 to 2027.
Automotive segment impacted negatively, due to COVID-19.
Mixed signal IC is a combination of analog and digital ICs. Mixed signal IC is an integrated circuit that has both analog and digital circuits on a single semiconductor die. Mixed signal ICs are widely used in consumer electronics applications. Thus, increase in penetration of mobile phones and other portable electronics devices has notably boosted the production of mixed signal ICs.
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The use of mixed signal IC in mobile phones and electronics devices is on rise, owing to exponential growth of the consumer electronics, telecommunication, and other industries. Introduction of 5G network and surge in demand for low-power consumption devices have boosted the mixed signal IC market growth, globally.
The global mixed signal IC market is segmented into type, end-use industry, and region. On the basis of type, the market is categorized into mixed signal SoC, microcontroller, and data converter IC. Depending on end-use industry, it is segmented into consumer electronics, medical & healthcare, telecommunication, automotive, and military & defense. Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with its prominent countries.
The key market leaders in the mixed signal IC market profiled in the report include Analog Devices, Broadcom Inc., Cypress Semiconductor Corporation, Dialog Semiconductor, Ensilica Ltd., NXP Semiconductor, Renesas Electronics Corporation, STMicroelectronics, Telephonics Corporation, and Texas Instrument. Market players have adopted various strategies such as product development, business expansion, joint venture, collaboration, investment, and acquisition to strengthen their foothold in the market.
The outbreak of the COVID-19 crisis resulted in uncertainty in the stock market, disruption of the supply chain, slowdown of business, and increase in panic among customer segments. The overall impact of the pandemic impacted the production process of several industries, including semiconductor & electronics. Trade barriers further constrain the demand and supply outlook. Governments of different countries have already declared total lockdown and have temporarily shut down industries, which adversely affected the overall production process.
COVID-19 has a huge impact on end use and economy. Electronics manufacturing hubs have been temporarily shut down to restrict COVID-19 spread among individuals. This has majorly affected supply chain of the mixed signal IC market by creating shortages of components and finished goods. Lack of business continuity has negatively impacted shareholder returns and revenue, which are expected to create financial disruptions in the mixed signal IC industry.
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The impact of COVID-19 on the manufacturing industry has significantly affected the global economy. Electronic components, such as PCBs, LED chips & wafers, ICs, and other semiconductor devices, are majorly imported from China. The prices of semiconductor components have increased by 2–3%, owing to shortage of supplies, due to shutdown of manufacturing units. However, with the start of 2021, the market is expected to resume its supply chain operation.
The significant factors that impact growth of the global mixed signal IC market revenue include the development of 5G technology and increase in demand for low power consumption electronics devices. High demand has been witnessed for mixed signal IC in the consumer electronics, medical & healthcare, and telecommunication industry, which notably contributes toward the market growth. However, complex process of integration of analog and digital circuits on to a single IC hampers growth of the market. On the contrary, increase in use of mixed signal ICs in the automotive and military & defense and consumer electronics industry is expected to provide lucrative opportunities for growth of the global mixed signal IC market forecast period.
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5G technology has huge demand for the high frequency switching circuits. These switching circuits are more commonly used in mixed signal ICs. Adoption of 5G technology and other wireless technologies has increased the popularity of mixed signal ICs. At higher frequencies, losses and distortion increase. This creates the need for special techniques which is available in mixed signal ICs. Furthermore, mixed signal IC market find major applications in the consumer electronics industry, where they are deployed in mobile phones, led drivers, tablet, notebook, and other electronic devices.
The mixed signal IC industry focuses more on incorporation of multiple functionalities in a single IC leading to complex designing. Designing of a complex device requires robust methodology, skillset, and different toolset for integration. These developing innovative technologies generate demand for more functionality devices to be integrated into systems, which makes them more complex devices. In addition, incorporation of multiple circuits such as analog and digital circuits into single IC is a complex task. Therefore, all these factors collectively restrain the global mixed signal IC market growth.
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Key benefits for stakeholders
Key Market Segments
Key Market Players
CHAPTER 1:INTRODUCTION
1.1.REPORT DESCRIPTION
1.2.KEY BENEFITS FOR STAKEHOLDERS
1.3.KEY MARKET SEGMENTS
1.4.RESEARCH METHODOLOGY
1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.KEY FINDINGS OF THE STUDY
2.2.CXO PERSPECTIVE44
CHAPTER 3:MARKET OVERVIEW
3.1.MARKET DEFINITION AND SCOPE
3.2.COVID-19 IMPACT ANALYSIS
3.3.KEY FINDINGS
3.3.1.Top impacting factors
3.3.2.Top investment pockets
3.4.PORTER’S FIVE FORCES ANALYSIS
3.5.MARKET DYNAMICS
3.5.1.Drivers
3.5.1.1.Increasing adoption of 5G Technology
3.5.1.2.Rise in need for low power consumption devices
3.5.2.Restraint
3.5.2.1.Complex integration process of Mixed Signal IC
3.5.3.Opportunities
3.5.3.1.Increasing applications in Automotive Industry
3.6.COVID IMPACT
3.6.1.Impact on market size
3.6.2.End user trends, preferences, and budget impact
CHAPTER 4:GLOBAL MIXED SIGNAL IC MARKET, BY TYPE
4.1.OVERVIEW
4.2.MIXED SIGNAL SOC
4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country
4.3.MICROCONTROLLER
4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country
4.4.DATA CONVERTER
4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis, by country
CHAPTER 5:GLOBAL MIXED SIGNAL IC MARKET, BY END USE
5.1.OVERVIEW
5.2.CONSUMER ELECTRONICS
5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country
5.3.MEDICAL & HEALTHCARE
5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country
5.4.TELECOMMUNICATION
5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country
5.5.AUTOMOTIVE
5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis, by country
5.6.MILITARY & DEFENSE
5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market analysis, by country
CHAPTER 6:MIXED SIGNAL IC MARKET, BY REGION
6.1.OVERVIEW
6.2.NORTH AMERICA
6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by type
6.2.3.Market size and forecast, by end use
6.2.4.Market analysis, by country
6.2.4.1.U.S.
6.2.4.1.1.Market size and forecast, by processor
6.2.4.1.2.Market size and forecast, by form factor
6.2.4.2.Canada
6.2.4.2.1.Market size and forecast, by processor
6.2.4.2.2.Market size and forecast, by form factor
6.2.4.3.Mexico
6.2.4.3.1.Market size and forecast, by processor
6.2.4.3.2.Market size and forecast, by form factor
6.3.EUROPE
6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by type
6.3.3.Market size and forecast, by end use
6.3.4.Market analysis, by country
6.3.4.1.Germany
6.3.4.1.1.Market size and forecast, by type
6.3.4.1.2.Market size and forecast, by end use
6.3.4.2.UK
6.3.4.2.1.Market size and forecast, by type
6.3.4.2.2.Market size and forecast, by end use
6.3.4.3.France
6.3.4.3.1.Market size and forecast, by type
6.3.4.3.2.Market size and forecast, by end use
6.3.4.4.Rest of Europe
6.3.4.4.1.Market size and forecast, by type
6.3.4.4.2.Market size and forecast, by end use
6.4.ASIA-PACIFIC
6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by type
6.4.3.Market size and forecast, by end use
6.4.4.Market analysis, by country
6.4.4.1.China
6.4.4.1.1.Market size and forecast, by type
6.4.4.1.2.Market size and forecast, by end use
6.4.4.2.Japan
6.4.4.2.1.Market size and forecast, by type
6.4.4.2.2.Market size and forecast, by end use
6.4.4.3.India
6.4.4.3.1.Market size and forecast, by type
6.4.4.3.2.Market size and forecast, by end use
6.4.4.4.South Korea
6.4.4.4.1.Market size and forecast, by type
6.4.4.4.2.Market size and forecast, by end use
6.4.4.5.Rest of Asia-Pacific
6.4.4.5.1.Market size and forecast, by type
6.4.4.5.2.Market size and forecast, by end use
6.5.LAMEA
6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by type
6.5.3.Market size and forecast, by end use
6.5.5.Market analysis, by country
6.5.5.1.Latin America
6.5.5.1.1.Market size and forecast, by type
6.5.5.1.2.Market size and forecast, by end use
6.5.5.2.Middle East
6.5.5.2.1.Market size and forecast, by type
6.5.5.2.2.Market size and forecast, by end use
6.5.5.3.Africa
6.5.5.3.1.Market size and forecast, by type
6.5.5.3.2.Market size and forecast, by end use
CHAPTER 7:COMPETITIVE LANDSCAPE
7.1.INTRODUCTION
7.1.1.Market player positioning, 2019
7.2.TOP WINNING STRATEGIES
7.3.PRODUCT MAPPING OF TOP 10 PLAYERS
7.4.COMPETITIVE DASHBOARD
7.5.COMPETITIVE HEATMAP
CHAPTER 8:COMPANY PROFILES
8.1.ANALOG DEVICES
8.1.1.Company overview
8.1.2.Key Executives
8.1.3.Company snapshot
8.1.4.Product portfolio
8.1.5.R&D Expenditure
8.1.6.Business performance
8.1.7.Key strategic moves and developments
8.2.BROADCOM INC
8.2.1.Company overview
8.2.2.Key Executives
8.2.3.Company snapshot
8.2.4.Product portfolio
8.2.5.R&D Expenditure
8.2.6.Business performance
8.2.7.Key strategic moves and developments
8.3.CYPRESS SEMICONDUCTOR CORPORATION
8.3.1.Company overview
8.3.2.Key Executive
8.3.3.Company snapshot
8.3.4.Product portfolio
8.3.5.Key strategic moves and developments
8.3.6.R&D Expenditure
8.3.7.Business performance
8.4.DIALOG SEMICONDUCTOR
8.4.1.Company overview
8.4.2.Key Executive
8.4.3.Company snapshot
8.4.4.Product portfolio
8.4.5.Key strategic moves and developments
8.4.6.R&D Expenditure
8.4.7.Business performance
8.5.ENSILICA LTD
8.5.1.Company overview
8.5.2.Key Executive
8.5.3.Company snapshot
8.5.4.Product portfolio
8.6.NXP SEMICONDUCTOR
8.6.1.Company overview
8.6.2.Company snapshot
8.6.3.Product portfolio
8.6.4.R&D Expenditure
8.6.5.Business performance
8.6.6.Key strategic moves and developments
8.7.RENESAS ELECTRONICS CORPORATION
8.7.1.Company overview
8.7.2.Company snapshot
8.7.3.Operating business segments
8.7.4.Product portfolio
8.7.5.R&D Expenditure
8.7.6.Business performance
8.7.7.Key strategic moves and developments
8.8.STMICROELECTRONICS N.V.
8.8.1.Company overview
8.8.2.Company snapshot
8.8.3.Operating business segments
8.8.4.Product portfolio
8.8.5.R&D Expenditure
8.8.6.Business performance
8.8.7.Key strategic moves and developments
8.9.TELEPHONICS CORPORATION
8.9.1.Company overview
8.9.2.Company snapshot
8.9.3.Product portfolio
8.10.TEXAS INSTRUMENTS INCORPORATED
8.10.1.Company overview
8.10.2.Company snapshot
8.10.3.Operating business segments
8.10.4.Product portfolio
8.10.5.R&D expenditure
8.10.6.Business performance
LIST OF TABLES
TABLE 01.GLOBAL MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027 ($MILLION)
TABLE 02.MIXED SIGNAL IC MARKET FOR MIXED SIGNAL SOC, BY REGION, 2019-2027 ($MILLION)
TABLE 03.MIXED SIGNAL IC FOR MICROCONTROLLER, BY REGION, 2019-2027 ($MILLION)
TABLE 04.MIXED SIGNAL IC MARKET FOR DATA CONVERTER, BY REGION, 2019-2027 ($MILLION)
TABLE 05.GLOBAL MIXED SIGNAL IC MARKET, BY END USE, 2019-2027 ($MILLION)
TABLE 06.MIXED SIGNAL IC MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2019-2027 ($MILLION)
TABLE 07.MIXED SIGNAL IC MARKET FOR MEDICAL & HEALTHCARE, BY REGION, 2019-2027 ($MILLION)
TABLE 08.MIXED SIGNAL IC MARKET FOR TELECOMMUNICATION, BY REGION, 2019-2027 ($MILLION)
TABLE 09.MIXED SIGNAL IC MARKET FOR AUTOMOTIVE, BY REGION, 2019-2027 ($MILLION)
TABLE 10.MIXED SIGNAL IC MARKET FOR MILITARY & DEFENSE, BY REGION, 2019-2027 ($MILLION)
TABLE 11.MIXED SIGNAL IC MARKET REVENUE, BY REGION, 2019–2027 ($MILLION)
TABLE 12.NORTH AMERICA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 13.NORTH AMERICA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 14.U.S. MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 15.U.S. MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 16.CANADA MIXED SIGNAL IC MARKET, BY PROCESSOR, 2019–2027 ($MILLION)
TABLE 17.CANADA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 18.MEXICO MIXED SIGNAL IC MARKET, BY PROCESSOR, 2019–2027 ($MILLION)
TABLE 19.MEXICO MIXED SIGNAL IC MARKET, BY FORM FACTOR, 2019–2027 ($MILLION)
TABLE 20.EUROPE MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 21.EUROPE MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 22.GERMANY MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 23.GERMANY MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 24.UK MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 25.UK MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 26.FRANCE MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 27.FRANCE MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 28.REST OF EUROPE MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 29.REST OF EUROPE MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 30.ASIA PACIFIC MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 31.ASIA PACIFIC MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 32.CHINA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 33.CHINA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 34.JAPAN MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 35.JAPAN MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 36.INDIA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 37.INDIA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 38.SOUTH KOREA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 39.SOUTH KOREA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 40.REST OF ASIA-PACIFIC MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 41.REST OF ASIA-PACIFIC MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 42.LAMEA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 43.LAMEA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 44.LATIN AMERICA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 45.LATIN AMERICA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 46.MIDDLE EAST MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 47.MIDDLE EAST MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 48.AFRICA MIXED SIGNAL IC MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 49.AFRICA MIXED SIGNAL IC MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 50.ANALOG DEVICES:KEY EXECUTIVES
TABLE 51.ANALOG DEVICES: COMPANY SNAPSHOT
TABLE 52.ANALOG DEVICES: PRODUCT PORTFOLIO
TABLE 53.ANALOG DEVICES: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 54.BROADCOM INC:KEY EXECUTIVES
TABLE 55.BROADCOM INC: COMPANY SNAPSHOT
TABLE 56.BROADCOM INC: PRODUCT PORTFOLIO
TABLE 57.BROADCOM INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 58.CYPRESS SEMICONDUCTOR CORPORATION: KEY EXECUTIVES
TABLE 59.CYPRESS SEMICONDUCTOR CORPORATION: COMPANY SNAPSHOT
TABLE 60.CYPRESS SEMICONDUCTOR CORPORATION: PRODUCT PORTFOLIO
TABLE 61.DIALOG SEMICONDUCTOR: KEY EXECUTIVES
TABLE 62.DIALOG SEMICONDUCTOR: COMPANY SNAPSHOT
TABLE 63.DIALOG SEMICONDUCTOR: PRODUCT PORTFOLIO
TABLE 64.ENSILICA LTD: KEY EXECUTIVES
TABLE 65.ENSILICA LTD: COMPANY SNAPSHOT
TABLE 66.ENSILICA LIMITED.: PRODUCT PORTFOLIO
TABLE 67.COMPANY SNAPSHOT
TABLE 68.NXP: PRODUCT PORTFOLIO
TABLE 69.RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT
TABLE 70.RENESAS ELECTRONICS CORPORATION: OPERATING SEGMENTS
TABLE 71.RENESAS ELECTRONICS CORPORATION: PRODUCT PORTFOLIO
TABLE 72.STMICROELECTRONICS: COMPANY SNAPSHOT
TABLE 73.STMICROELECTRONICS: OPERATING SEGMENTS
TABLE 74.STMICROELECTRONICS: PRODUCT PORTFOLIO
TABLE 75.TELEPHONICS CORPORATION: COMPANY SNAPSHOT
TABLE 76.TELEPHONICS CORPORATION: PRODUCT PORTFOLIO
TABLE 77.COMPANY SNAPSHOT
TABLE 78.TI: OPERATING SEGMENTS
TABLE 79.TI: PRODUCT PORTFOLIO
LIST OF FIGURES
FIGURE 01.KEY MARKET SEGMENTS
FIGURE 02.GLOBAL MIXED SIGNAL IC MARKET SNAPSHOT, BY SEGMENTATION
FIGURE 03.MIXED SIGNAL IC MARKET SNAPSHOT, BY REGION
FIGURE 04.TOP IMPACTING FACTORS
FIGURE 05.HIGH BARGAINING POWER OF SUPPLIERS
FIGURE 06.MODERATE THREAT OF NEW ENTRANTS
FIGURE 07.MODERATE THREAT OF SUBSTITUTES
FIGURE 08.MODERATE-TO-HIGH INTENSITY OF RIVALRY
FIGURE 09.MODERATE-TO-HIGH BARGAINING POWER OF BUYERS
FIGURE 10.GLOBAL MIXED SIGNAL IC MARKET, BY TYPE, 2019-2027
FIGURE 11.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MIXED SIGNAL SOC, BY COUNTRY, 2019 & 2027(%)
FIGURE 12.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MICROCONTROLLER, BY COUNTRY, 2019 & 2027(%)
FIGURE 13.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET DATA CONVERTER, BY COUNTRY, 2019 & 2027(%)
FIGURE 14.GLOBAL MIXED SIGNAL IC MARKET, BY END USE, 2019-2027
FIGURE 15.COMPARATIVE SHARE ANALYSIS MIXED SIGNAL IC MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2019 & 2027 (%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MEDICAL & HEALTHCARE, BY COUNTRY, 2019 & 2027 (%)
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2019 & 2027 (%)
FIGURE 18.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR AUTOMOTIVE, BY COUNTRY, 2019 & 2027(%)
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF MIXED SIGNAL IC MARKET FOR MILITARY & DEFENSE, BY COUNTRY, 2019 & 2027(%)
FIGURE 20.MIXED SIGNAL IC MARKET, BY REGION, 2019-2027 (%)
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF NORTH AMERICA MIXED SIGNAL IC MARKET, BY COUNTRY, 2019–2027 (%)
FIGURE 22.U.S. MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 23.CANADA MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 24.MEXICO MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 25.COMPARATIVE SHARE ANALYSIS OF EUROPE MIXED SIGNAL IC MARKET, BY COUNTRY, 2019–2027 (%)
FIGURE 26.GERMANY MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 27.UK MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 28.FRANCE MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 29.REST OF EUROPE MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 30.COMPARATIVE SHARE ANALYSIS OF ASIA PACIFIC MIXED SIGNAL IC MARKET, BY COUNTRY, 2019–2027 (%)
FIGURE 31.CHINA MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 32.JAPAN MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 33.INDIA MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 34.SOUTH KOREA MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 35.REST OF ASIA PACIFIC MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 36.COMPARATIVE SHARE ANALYSIS OF LAMEA MIXED SIGNAL IC MARKET, BY COUNTRY, 2019–2027 (%)
FIGURE 37.LATIN AMERICA MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 38.MIDDLE EAST MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 39.AFRICA MIXED SIGNAL IC MARKET, 2019–2027 ($MILLION)
FIGURE 40.MARKET PLAYER POSITIONING, 2019
FIGURE 41.TOP WINNING STRATEGIES, BY YEAR, 2015-2020*
FIGURE 42.TOP WINNING STRATEGIES, BY DEVELOPMENT, 2015-2020*
FIGURE 43.TOP WINNING STRATEGIES, BY COMPANY, 2017-2020*
FIGURE 44.PRODUCT MAPPING OF TOP 10 PLAYERS
FIGURE 45.COMPETITIVE DASHBOARD
FIGURE 46.COMPETITIVE HEATMAP OF KEY PLAYERS
FIGURE 47.ANALOG DEVICES: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 48.ANALOG DEVICES: NET SALES, 2017–2019 ($MILLION)
FIGURE 49.ANALOG DEVICES: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 50.BROADCOM INC: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 51.BROADCOM INC: NET SALES, 2018–2020 ($MILLION)
FIGURE 52.BROADCOM INC: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 53.CYPRESS SEMICONDUCTOR CORPORATION: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 54.CYPRESS SEMICONDUCTOR CORPORATION: REVENUE, 2017–2019 ($MILLION)
FIGURE 55.CYPRESS SEMICONDUCTOR CORPORATION: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 56.CYPRESS SEMICONDUCTOR CORPORATION: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 57.DIALOG SEMICONDUCTOR: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 58.DIALOG SEMICONDUCTOR: REVENUE, 2017–2019 ($MILLION)
FIGURE 59.DIALOG SEMICONDUCTOR: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 60.DIALOG SEMICONDUCTOR: REVENUE SHARE BY REGION, 2019 (%)
FIGURE 61.NXP: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 62.NXP: NET SALES, 2016–2018 ($MILLION)
FIGURE 63.NXP: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 64.NXP: REVENUE SHARE, BY REGION, 2019 (%)
FIGURE 65.RENESAS ELECTRONICS CORPORATION: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 66.RENESAS ELECTRONICS CORPORATION: NET SALES, 2017–2019 ($MILLION)
FIGURE 67.RENESAS ELECTRONICS CORPORATION: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 68.RENESAS ELECTRONICS CORPORATION: REVENUE SHARE, BY REGION, 2019 (%)
FIGURE 69.STMICROELECTRONICS: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 70.STMICROELECTRONICS: NET SALES, 2017–2019 ($MILLION)
FIGURE 71.STMICROELECTRONICS: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 72.STMICROELECTRONICS: REVENUE SHARE, BY REGION, 2019 (%)
FIGURE 73.TI: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 74.TI: NET SALES, 2017–2019 ($MILLION)
FIGURE 75.TI: REVENUE SHARE BY SEGMENT, 2019 (%)
FIGURE 76.TI: REVENUE SHARE BY REGION, 2019 (%)
The mixed signal IC market is highly competitive, owing to the strong presence of existing vendors. The mixed signal IC vendors who have access to extensive technical and financial resources are anticipated to gain a competitive edge over their rivals, as they have the capacity to cater to the global market requirements. The competitive environment in this market is expected to further intensify with increase in technological innovations, product extensions, and different strategies adopted by key vendors.
Processors play a revolutionary role in the mixed signal IC market. The current business scenario has been witnessing an increase in demand for mixed signal ICs across various industry verticals, particularly in the developed regions such as the U.S., Europe, and Asia-Pacific. Companies in this industry have been launching variety of products based on mixed signal ICs and their requirement, owing to their increase in usage in end-use segments such as consumer electronics, medical & healthcare, telecommunication, automotive, and military & defense. Therefore, this has significantly contributed toward the growth of the global mixed signal IC market.
Furthermore, increase has been witnessed in the adoption of low power consumption ICs, owing to the fact that they can be operated more efficiently. In addition, compact size of mixed signal ICs in mission-critical
applications, such as military & defense and the medical and healthcare sectors further fuels the growth of the mixed signal IC market. With increase in new entrants in the Asia-Pacific market, the mixed signal IC market is expected to witness the strongest growth rate during the forecast period.
The mixed signal IC market provides numerous growth opportunities to players such are Analog Devices, Broadcom Inc., Cypress Semiconductor Corporation, Dialog Semiconductor, Ensilica Ltd., NXP Semiconductor, Renesas Electronics Corporation, STMicroelectronics, Telephonics Corporation, and Texas Instrument.
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