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Upcoming Allied Market Research
2023
Multichip Package Market

Multichip Package Market

by Type (Hybrid Circuit (HC) or Hybrid Integrated Circuit (HIC), Multichip Module (MCM), 3-D Packaging, System in Package (SiP) or System on Package (SoP)), by Packaging Technology (2D IC, 2.5D IC, 3D IC), by Packaging Type (Ball Grid Array, Surface Mount Package, Pin Grid Array, Flat Package, Small Outline Package) and by Industry Vertical (Consumer Electronics, Aerospace defense, Automotive Transport, Industrial, Others): Global Opportunity Analysis and Industry Forecast, 2023-2032

Report Code: A08177
Nov 2023 | Pages: NA
Tables: NA
Charts: NA
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COVID-19

Pandemic disrupted the entire world and affected many industries.

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Multichip Package Market Outlook - 2027

Multichip package (MCP) is a chip packaging configuration in which multiple chips are incorporated in a single package via wire bonds to a multilayer circuit board and fabricated with low-cost ceramic package for protection. In MCP, chips are attached to a die paddle without a substrate and inter-die communication is achieved through die-to-die wire bonding. Multichip modules are integrated in large scale in the consumer electronics sector in smartphones and personal digital assistants as they are compact, light-weight, low cost, and offer high integration density and low power consumption in smaller footprint. 

In addition, MCP is used for packaging of mainstream CPU as it enhances circuit performance, controls cycle time and energy dissipation as well as facilitates integration of different technology-made chip modules such as DRAM with minimum interference. MCPs are adopted in IoT applications such as active safety, navigation, and automotive infotainment systems as these support real-time analytics and fulfills the need of high-performance memory solutions in smaller packages across wide range of close-range wireless networks. 

MCP finds a niche role in packaging hence, acts as a transitory stage between fulfilling product needs and chip integration. Ongoing advancements including e-MMC-based MCP in computer memory, UFS-based MCP in mobile device storage, and NOR & NAND based multichip packaging acts as a transitory stage between product needs and chip integration, which implies that the multichip package market share would undergo a substantial growth in the coming years.

COVID-19 scenario Analysis:

  • Multichip package manufacturers are forced to shut down production operations, owing to government-imposed lockdowns in the wake of COVID-19 pandemic, which, in turn, has led to supply chain disruption in the chip manufacturing & supply industry.
  • The COVID-19 pandemic has led to a shrink in demand for products powered by semiconductors. There is a halt in production of devices, owing to the lockdown scenario. This has caused disruption in overall supply chain of the global multichip package market.
  • Contrarily, the multichip package industry sees an opportunity in the unprecedented crisis as organizations begin to work-from-home and end users begin to consume more content on digital platforms. This has increased importance of storage and memory solutions for data centers, laptops, and other devices.
  • Companies manufacturing semiconductor devices are anticipated to revise production planning, sourcing strategy, and change industry dynamics to stimulate growth after lockdown restrictions are lifted.

Top Impacting Factors: Market Scenario Analysis, Trends, Driver, and Impact analysis

Rise in integration of flip chip packaging method in baseband and application processors for mobile platforms, owing to miniaturized size and reduction in wire length with minimum interference among other increased functionalities. However, issues of over-heating, owing to highly dense multilevel integration results in greater thermal resistance along with heat dissipation creating large interconnect delays, which hampers the multichip package market growth.

On the contrary, use of infrared wavelength of multichip modules in laser treatment for hair removal, face-lifting, skin rejuvenation, blood vessel removal, wrinkle reduction, and acne treatment in the healthcare sector boosts the multichip package market revenue. Extensive integration of this equipment in miniaturized consumer electronic items such as smartphone and tablets drive the shift from 3G and 4G LTE to 5G technology hence presenting present new pathways to the multichip package industry.

New Product Launches to flourish the market:

Automation of processing and successful product innovation by leading market players have helped to improve overall density and performance of multichip packages that are designed to fit on slim and compact midrange smartphone designs.

In March 2020, Micron Technology Inc., an American producer of computer memory and data storage launched a universal flash storage (UFS)multi-chip package (uMCP) with low power DDR5 {LPDDR5} DRAM. The multichip package comprises low-power DRAM, smallest 512GB 96L 3D NAND die, an on-board controller using 40% low space than 2-chip solution while offering 50% increase in memory and storage bandwidth while reducing power. The high-density low-power storage multi-chip package provides high storage and memory density at 256GB and 12GB, respectively. 

The 297-ball grid array (BGA) package supports two-channel LPDDR5 with speeds up to 6,400 Mbps that depicts 50% performance increase over the previous-generation interface. This optimized configuration enables 5G smartphones operate with low latency response time, reduce memory footprint, and support flagship smartphone features such as multiple high-resolution cameras, multiplayer gaming and AR/VR applications. LPDDR5 allows 5G smartphones to process data up to speed of 6.4Gbps that is critical for preventing data-processing bottleneck.

Surge in use in industrial and automotive application

Multichip packages are used by self-driven cars for wireless safety and operational data between vehicles and roadway infrastructure to communicate with each other to reduce collision and optimize traffic low. It helps automobiles to communicate to get cloud-based map updates, real-time traffic management, automatic fare collection, and emergency vehicle access.

In October 2019, Samsung Electronics Co. Ltd., a global leader in the advanced semiconductor technology launched the Exynos 990 premium mobile processor, 5G-enable Exynos modem 5123, 3rd Gen 10nm-class DRAM, and 12GB LPDDR4X UFS-based multichip package(uMCP). The 3rd Gen10nm-class(1z-nm) DRAM is optimized for premium server platform development, which would open door to cutting-edge memory solutions such as DDR5, LPDDR5, HBM2E, and GDDR6 products. This provides highest performance, energy-efficiency, and capacity.

The 12GB LPDDR4X uMCP combines four 24GB LPDDR4X chips and an ultra-fast eUFS 3.0 NAND storage in a single package. This breaks the current 8GB package limit in midrange smartphones bringing 10GB memory to the broader smartphone market.

Key benefits of the stakeholders:

  • The study gives an analytical overview of multichip package market forecast with current trends and future estimations to determine imminent investment pockets.
  • The report provides information related to key drivers, restraints, and opportunities along with detailed overall multichip package market analysis.
  • The current multichip package market trends are quantitatively analyzed.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 

Questions answered in the multichip package market research report:

  • Who are the leading players in the multichip package market?
  • What are the current trends that would influence the market in the next few years?
  • What are the driving factors, restraints, and opportunities in the market?
  • What are the projections for the future that would help in taking further strategic steps?
  • What would be the detailed impact of COVID-19 on the market?

Multichip Package Market Report Highlights

Aspects Details
By Type
  • Hybrid Circuit (HC) or Hybrid Integrated Circuit (HIC)
  • Multichip Module (MCM)
  • 3-D Packaging
  • System in Package (SiP) or System on Package (SoP)
By Packaging Technology
  • 2D IC
  • 2.5D IC
  • 3D IC
By Packaging Type
  • Ball Grid Array
  • Surface Mount Package
  • Pin Grid Array
  • Flat Package
  • Small Outline Package
By Industry Vertical
  • Consumer Electronics
  • Aerospace & defense
  • Automotive & Transport
  • Industrial
  • Others
By Region
  • North America  (US, Canada, Mexico)
  • Europe  (Germany, UK, France, Russia, rest of Europe)
  • Asia Pacific  (India, Japan, South Korea, rest of Asia Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players IBM, Intel Corporation., ASE Group, AT&S, Micron Technology Inc., Samsung Electronics Co. Ltd., Amkor Technology Inc., SK Hynix Inc, Texas Instruments, Cypress Semiconductor Corporation
 
  • CHAPTER 1: INTRODUCTION

    • 1.1. Report Description

    • 1.2. Key Market Segments

    • 1.3. Key Benefits

    • 1.4. Research Methodology

      • 1.4.1. Primary Research

      • 1.4.2. Secondary Research

      • 1.4.3. Analyst Tools and Models

  • CHAPTER 2: EXECUTIVE SUMMARY

    • 2.1. CXO Perspective

  • CHAPTER 3: MARKET LANDSCAPE

    • 3.1. Market Definition and Scope

    • 3.2. Key Findings

      • 3.2.1. Top Investment Pockets

      • 3.2.2. Top Winning Strategies

    • 3.3. Porter's Five Forces Analysis

      • 3.3.1. Bargaining Power of Suppliers

      • 3.3.2. Threat of New Entrants

      • 3.3.3. Threat of Substitutes

      • 3.3.4. Competitive Rivalry

      • 3.3.5. Bargaining Power among Buyers

    • 3.5. Market Dynamics

      • 3.5.1. Drivers

      • 3.5.2. Restraints

      • 3.5.3. Opportunities

    • 3.6. COVID-19 Impact Analysis

  • CHAPTER 4: MULTICHIP PACKAGE MARKET, BY TYPE

    • 4.1. Market Overview

      • 4.1.1 Market Size and Forecast, By Type

    • 4.2. Hybrid Circuit (HC) Or Hybrid Integrated Circuit (HIC)

      • 4.2.1. Key Market Trends, Growth Factors and Opportunities

      • 4.2.2. Market Size and Forecast, By Region

      • 4.2.3. Market Share Analysis, By Country

    • 4.3. Multichip Module (MCM)

      • 4.3.1. Key Market Trends, Growth Factors and Opportunities

      • 4.3.2. Market Size and Forecast, By Region

      • 4.3.3. Market Share Analysis, By Country

    • 4.4. 3-D Packaging

      • 4.4.1. Key Market Trends, Growth Factors and Opportunities

      • 4.4.2. Market Size and Forecast, By Region

      • 4.4.3. Market Share Analysis, By Country

    • 4.5. System In Package (SiP) Or System On Package (SoP)

      • 4.5.1. Key Market Trends, Growth Factors and Opportunities

      • 4.5.2. Market Size and Forecast, By Region

      • 4.5.3. Market Share Analysis, By Country

  • CHAPTER 5: MULTICHIP PACKAGE MARKET, BY PACKAGING TECHNOLOGY

    • 5.1. Market Overview

      • 5.1.1 Market Size and Forecast, By Packaging Technology

    • 5.2. 2D IC

      • 5.2.1. Key Market Trends, Growth Factors and Opportunities

      • 5.2.2. Market Size and Forecast, By Region

      • 5.2.3. Market Share Analysis, By Country

    • 5.3. 2.5D IC

      • 5.3.1. Key Market Trends, Growth Factors and Opportunities

      • 5.3.2. Market Size and Forecast, By Region

      • 5.3.3. Market Share Analysis, By Country

    • 5.4. 3D IC

      • 5.4.1. Key Market Trends, Growth Factors and Opportunities

      • 5.4.2. Market Size and Forecast, By Region

      • 5.4.3. Market Share Analysis, By Country

  • CHAPTER 6: MULTICHIP PACKAGE MARKET, BY PACKAGING TYPE

    • 6.1. Market Overview

      • 6.1.1 Market Size and Forecast, By Packaging Type

    • 6.2. Ball Grid Array

      • 6.2.1. Key Market Trends, Growth Factors and Opportunities

      • 6.2.2. Market Size and Forecast, By Region

      • 6.2.3. Market Share Analysis, By Country

    • 6.3. Surface Mount Package

      • 6.3.1. Key Market Trends, Growth Factors and Opportunities

      • 6.3.2. Market Size and Forecast, By Region

      • 6.3.3. Market Share Analysis, By Country

    • 6.4. Pin Grid Array

      • 6.4.1. Key Market Trends, Growth Factors and Opportunities

      • 6.4.2. Market Size and Forecast, By Region

      • 6.4.3. Market Share Analysis, By Country

    • 6.5. Flat Package

      • 6.5.1. Key Market Trends, Growth Factors and Opportunities

      • 6.5.2. Market Size and Forecast, By Region

      • 6.5.3. Market Share Analysis, By Country

    • 6.6. Small Outline Package

      • 6.6.1. Key Market Trends, Growth Factors and Opportunities

      • 6.6.2. Market Size and Forecast, By Region

      • 6.6.3. Market Share Analysis, By Country

  • CHAPTER 7: MULTICHIP PACKAGE MARKET, BY INDUSTRY VERTICAL

    • 7.1. Market Overview

      • 7.1.1 Market Size and Forecast, By Industry Vertical

    • 7.2. Consumer Electronics

      • 7.2.1. Key Market Trends, Growth Factors and Opportunities

      • 7.2.2. Market Size and Forecast, By Region

      • 7.2.3. Market Share Analysis, By Country

    • 7.3. Aerospace Defense

      • 7.3.1. Key Market Trends, Growth Factors and Opportunities

      • 7.3.2. Market Size and Forecast, By Region

      • 7.3.3. Market Share Analysis, By Country

    • 7.4. Automotive Transport

      • 7.4.1. Key Market Trends, Growth Factors and Opportunities

      • 7.4.2. Market Size and Forecast, By Region

      • 7.4.3. Market Share Analysis, By Country

    • 7.5. Industrial

      • 7.5.1. Key Market Trends, Growth Factors and Opportunities

      • 7.5.2. Market Size and Forecast, By Region

      • 7.5.3. Market Share Analysis, By Country

    • 7.6. Others

      • 7.6.1. Key Market Trends, Growth Factors and Opportunities

      • 7.6.2. Market Size and Forecast, By Region

      • 7.6.3. Market Share Analysis, By Country

  • CHAPTER 8: MULTICHIP PACKAGE MARKET, BY REGION

    • 8.1. Market Overview

      • 8.1.1 Market Size and Forecast, By Region

    • 8.2. North America

      • 8.2.1. Key Market Trends and Opportunities

      • 8.2.2. Market Size and Forecast, By Type

      • 8.2.3. Market Size and Forecast, By Packaging Technology

      • 8.2.4. Market Size and Forecast, By Packaging Type

      • 8.2.5. Market Size and Forecast, By Industry Vertical

      • 8.2.6. Market Size and Forecast, By Country

      • 8.2.7. U.S. Multichip Package Market

        • 8.2.7.1. Market Size and Forecast, By Type
        • 8.2.7.2. Market Size and Forecast, By Packaging Technology
        • 8.2.7.3. Market Size and Forecast, By Packaging Type
        • 8.2.7.4. Market Size and Forecast, By Industry Vertical
      • 8.2.8. Canada Multichip Package Market

        • 8.2.8.1. Market Size and Forecast, By Type
        • 8.2.8.2. Market Size and Forecast, By Packaging Technology
        • 8.2.8.3. Market Size and Forecast, By Packaging Type
        • 8.2.8.4. Market Size and Forecast, By Industry Vertical
      • 8.2.9. Mexico Multichip Package Market

        • 8.2.9.1. Market Size and Forecast, By Type
        • 8.2.9.2. Market Size and Forecast, By Packaging Technology
        • 8.2.9.3. Market Size and Forecast, By Packaging Type
        • 8.2.9.4. Market Size and Forecast, By Industry Vertical
    • 8.3. Europe

      • 8.3.1. Key Market Trends and Opportunities

      • 8.3.2. Market Size and Forecast, By Type

      • 8.3.3. Market Size and Forecast, By Packaging Technology

      • 8.3.4. Market Size and Forecast, By Packaging Type

      • 8.3.5. Market Size and Forecast, By Industry Vertical

      • 8.3.6. Market Size and Forecast, By Country

      • 8.3.7. France Multichip Package Market

        • 8.3.7.1. Market Size and Forecast, By Type
        • 8.3.7.2. Market Size and Forecast, By Packaging Technology
        • 8.3.7.3. Market Size and Forecast, By Packaging Type
        • 8.3.7.4. Market Size and Forecast, By Industry Vertical
      • 8.3.8. Germany Multichip Package Market

        • 8.3.8.1. Market Size and Forecast, By Type
        • 8.3.8.2. Market Size and Forecast, By Packaging Technology
        • 8.3.8.3. Market Size and Forecast, By Packaging Type
        • 8.3.8.4. Market Size and Forecast, By Industry Vertical
      • 8.3.9. Italy Multichip Package Market

        • 8.3.9.1. Market Size and Forecast, By Type
        • 8.3.9.2. Market Size and Forecast, By Packaging Technology
        • 8.3.9.3. Market Size and Forecast, By Packaging Type
        • 8.3.9.4. Market Size and Forecast, By Industry Vertical
      • 8.3.10. Spain Multichip Package Market

        • 8.3.10.1. Market Size and Forecast, By Type
        • 8.3.10.2. Market Size and Forecast, By Packaging Technology
        • 8.3.10.3. Market Size and Forecast, By Packaging Type
        • 8.3.10.4. Market Size and Forecast, By Industry Vertical
      • 8.3.11. UK Multichip Package Market

        • 8.3.11.1. Market Size and Forecast, By Type
        • 8.3.11.2. Market Size and Forecast, By Packaging Technology
        • 8.3.11.3. Market Size and Forecast, By Packaging Type
        • 8.3.11.4. Market Size and Forecast, By Industry Vertical
      • 8.3.12. Russia Multichip Package Market

        • 8.3.12.1. Market Size and Forecast, By Type
        • 8.3.12.2. Market Size and Forecast, By Packaging Technology
        • 8.3.12.3. Market Size and Forecast, By Packaging Type
        • 8.3.12.4. Market Size and Forecast, By Industry Vertical
      • 8.3.13. Rest Of Europe Multichip Package Market

        • 8.3.13.1. Market Size and Forecast, By Type
        • 8.3.13.2. Market Size and Forecast, By Packaging Technology
        • 8.3.13.3. Market Size and Forecast, By Packaging Type
        • 8.3.13.4. Market Size and Forecast, By Industry Vertical
    • 8.4. Asia-Pacific

      • 8.4.1. Key Market Trends and Opportunities

      • 8.4.2. Market Size and Forecast, By Type

      • 8.4.3. Market Size and Forecast, By Packaging Technology

      • 8.4.4. Market Size and Forecast, By Packaging Type

      • 8.4.5. Market Size and Forecast, By Industry Vertical

      • 8.4.6. Market Size and Forecast, By Country

      • 8.4.7. China Multichip Package Market

        • 8.4.7.1. Market Size and Forecast, By Type
        • 8.4.7.2. Market Size and Forecast, By Packaging Technology
        • 8.4.7.3. Market Size and Forecast, By Packaging Type
        • 8.4.7.4. Market Size and Forecast, By Industry Vertical
      • 8.4.8. Japan Multichip Package Market

        • 8.4.8.1. Market Size and Forecast, By Type
        • 8.4.8.2. Market Size and Forecast, By Packaging Technology
        • 8.4.8.3. Market Size and Forecast, By Packaging Type
        • 8.4.8.4. Market Size and Forecast, By Industry Vertical
      • 8.4.9. India Multichip Package Market

        • 8.4.9.1. Market Size and Forecast, By Type
        • 8.4.9.2. Market Size and Forecast, By Packaging Technology
        • 8.4.9.3. Market Size and Forecast, By Packaging Type
        • 8.4.9.4. Market Size and Forecast, By Industry Vertical
      • 8.4.10. South Korea Multichip Package Market

        • 8.4.10.1. Market Size and Forecast, By Type
        • 8.4.10.2. Market Size and Forecast, By Packaging Technology
        • 8.4.10.3. Market Size and Forecast, By Packaging Type
        • 8.4.10.4. Market Size and Forecast, By Industry Vertical
      • 8.4.11. Australia Multichip Package Market

        • 8.4.11.1. Market Size and Forecast, By Type
        • 8.4.11.2. Market Size and Forecast, By Packaging Technology
        • 8.4.11.3. Market Size and Forecast, By Packaging Type
        • 8.4.11.4. Market Size and Forecast, By Industry Vertical
      • 8.4.12. Thailand Multichip Package Market

        • 8.4.12.1. Market Size and Forecast, By Type
        • 8.4.12.2. Market Size and Forecast, By Packaging Technology
        • 8.4.12.3. Market Size and Forecast, By Packaging Type
        • 8.4.12.4. Market Size and Forecast, By Industry Vertical
      • 8.4.13. Malaysia Multichip Package Market

        • 8.4.13.1. Market Size and Forecast, By Type
        • 8.4.13.2. Market Size and Forecast, By Packaging Technology
        • 8.4.13.3. Market Size and Forecast, By Packaging Type
        • 8.4.13.4. Market Size and Forecast, By Industry Vertical
      • 8.4.14. Indonesia Multichip Package Market

        • 8.4.14.1. Market Size and Forecast, By Type
        • 8.4.14.2. Market Size and Forecast, By Packaging Technology
        • 8.4.14.3. Market Size and Forecast, By Packaging Type
        • 8.4.14.4. Market Size and Forecast, By Industry Vertical
      • 8.4.15. Rest of Asia Pacific Multichip Package Market

        • 8.4.15.1. Market Size and Forecast, By Type
        • 8.4.15.2. Market Size and Forecast, By Packaging Technology
        • 8.4.15.3. Market Size and Forecast, By Packaging Type
        • 8.4.15.4. Market Size and Forecast, By Industry Vertical
    • 8.5. LAMEA

      • 8.5.1. Key Market Trends and Opportunities

      • 8.5.2. Market Size and Forecast, By Type

      • 8.5.3. Market Size and Forecast, By Packaging Technology

      • 8.5.4. Market Size and Forecast, By Packaging Type

      • 8.5.5. Market Size and Forecast, By Industry Vertical

      • 8.5.6. Market Size and Forecast, By Country

      • 8.5.7. Brazil Multichip Package Market

        • 8.5.7.1. Market Size and Forecast, By Type
        • 8.5.7.2. Market Size and Forecast, By Packaging Technology
        • 8.5.7.3. Market Size and Forecast, By Packaging Type
        • 8.5.7.4. Market Size and Forecast, By Industry Vertical
      • 8.5.8. South Africa Multichip Package Market

        • 8.5.8.1. Market Size and Forecast, By Type
        • 8.5.8.2. Market Size and Forecast, By Packaging Technology
        • 8.5.8.3. Market Size and Forecast, By Packaging Type
        • 8.5.8.4. Market Size and Forecast, By Industry Vertical
      • 8.5.9. Saudi Arabia Multichip Package Market

        • 8.5.9.1. Market Size and Forecast, By Type
        • 8.5.9.2. Market Size and Forecast, By Packaging Technology
        • 8.5.9.3. Market Size and Forecast, By Packaging Type
        • 8.5.9.4. Market Size and Forecast, By Industry Vertical
      • 8.5.10. UAE Multichip Package Market

        • 8.5.10.1. Market Size and Forecast, By Type
        • 8.5.10.2. Market Size and Forecast, By Packaging Technology
        • 8.5.10.3. Market Size and Forecast, By Packaging Type
        • 8.5.10.4. Market Size and Forecast, By Industry Vertical
      • 8.5.11. Argentina Multichip Package Market

        • 8.5.11.1. Market Size and Forecast, By Type
        • 8.5.11.2. Market Size and Forecast, By Packaging Technology
        • 8.5.11.3. Market Size and Forecast, By Packaging Type
        • 8.5.11.4. Market Size and Forecast, By Industry Vertical
      • 8.5.12. Rest of LAMEA Multichip Package Market

        • 8.5.12.1. Market Size and Forecast, By Type
        • 8.5.12.2. Market Size and Forecast, By Packaging Technology
        • 8.5.12.3. Market Size and Forecast, By Packaging Type
        • 8.5.12.4. Market Size and Forecast, By Industry Vertical
  • CHAPTER 9: COMPETITIVE LANDSCAPE

    • 9.1. Introduction

    • 9.2. Top Winning Strategies

    • 9.3. Product Mapping Of Top 10 Player

    • 9.4. Competitive Dashboard

    • 9.5. Competitive Heatmap

    • 9.6. Top Player Positioning,2022

  • CHAPTER 10: COMPANY PROFILES

    • 10.1. Samsung Electronics Co. Ltd.

      • 10.1.1. Company Overview

      • 10.1.2. Key Executives

      • 10.1.3. Company Snapshot

      • 10.1.4. Operating Business Segments

      • 10.1.5. Product Portfolio

      • 10.1.6. Business Performance

      • 10.1.7. Key Strategic Moves and Developments

    • 10.2. Texas Instruments

      • 10.2.1. Company Overview

      • 10.2.2. Key Executives

      • 10.2.3. Company Snapshot

      • 10.2.4. Operating Business Segments

      • 10.2.5. Product Portfolio

      • 10.2.6. Business Performance

      • 10.2.7. Key Strategic Moves and Developments

    • 10.3. Micron Technology Inc.

      • 10.3.1. Company Overview

      • 10.3.2. Key Executives

      • 10.3.3. Company Snapshot

      • 10.3.4. Operating Business Segments

      • 10.3.5. Product Portfolio

      • 10.3.6. Business Performance

      • 10.3.7. Key Strategic Moves and Developments

    • 10.4. IBM

      • 10.4.1. Company Overview

      • 10.4.2. Key Executives

      • 10.4.3. Company Snapshot

      • 10.4.4. Operating Business Segments

      • 10.4.5. Product Portfolio

      • 10.4.6. Business Performance

      • 10.4.7. Key Strategic Moves and Developments

    • 10.5. SK Hynix Inc

      • 10.5.1. Company Overview

      • 10.5.2. Key Executives

      • 10.5.3. Company Snapshot

      • 10.5.4. Operating Business Segments

      • 10.5.5. Product Portfolio

      • 10.5.6. Business Performance

      • 10.5.7. Key Strategic Moves and Developments

    • 10.6. ASE Group

      • 10.6.1. Company Overview

      • 10.6.2. Key Executives

      • 10.6.3. Company Snapshot

      • 10.6.4. Operating Business Segments

      • 10.6.5. Product Portfolio

      • 10.6.6. Business Performance

      • 10.6.7. Key Strategic Moves and Developments

    • 10.7. Cypress Semiconductor Corporation

      • 10.7.1. Company Overview

      • 10.7.2. Key Executives

      • 10.7.3. Company Snapshot

      • 10.7.4. Operating Business Segments

      • 10.7.5. Product Portfolio

      • 10.7.6. Business Performance

      • 10.7.7. Key Strategic Moves and Developments

    • 10.8. Amkor Technology Inc.

      • 10.8.1. Company Overview

      • 10.8.2. Key Executives

      • 10.8.3. Company Snapshot

      • 10.8.4. Operating Business Segments

      • 10.8.5. Product Portfolio

      • 10.8.6. Business Performance

      • 10.8.7. Key Strategic Moves and Developments

    • 10.9. ATAndS

      • 10.9.1. Company Overview

      • 10.9.2. Key Executives

      • 10.9.3. Company Snapshot

      • 10.9.4. Operating Business Segments

      • 10.9.5. Product Portfolio

      • 10.9.6. Business Performance

      • 10.9.7. Key Strategic Moves and Developments

    • 10.10. Intel Corporation.

      • 10.10.1. Company Overview

      • 10.10.2. Key Executives

      • 10.10.3. Company Snapshot

      • 10.10.4. Operating Business Segments

      • 10.10.5. Product Portfolio

      • 10.10.6. Business Performance

      • 10.10.7. Key Strategic Moves and Developments

  • LIST OF TABLES

  • TABLE 1. GLOBAL MULTICHIP PACKAGE MARKET, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 2. GLOBAL MULTICHIP PACKAGE MARKET FOR HYBRID CIRCUIT (HC) OR HYBRID INTEGRATED CIRCUIT (HIC), BY REGION, 2022-2032 ($MILLION)
  • TABLE 3. GLOBAL MULTICHIP PACKAGE MARKET FOR MULTICHIP MODULE (MCM), BY REGION, 2022-2032 ($MILLION)
  • TABLE 4. GLOBAL MULTICHIP PACKAGE MARKET FOR 3-D PACKAGING, BY REGION, 2022-2032 ($MILLION)
  • TABLE 5. GLOBAL MULTICHIP PACKAGE MARKET FOR SYSTEM IN PACKAGE (SIP) OR SYSTEM ON PACKAGE (SOP), BY REGION, 2022-2032 ($MILLION)
  • TABLE 6. GLOBAL MULTICHIP PACKAGE MARKET, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 7. GLOBAL MULTICHIP PACKAGE MARKET FOR 2D IC, BY REGION, 2022-2032 ($MILLION)
  • TABLE 8. GLOBAL MULTICHIP PACKAGE MARKET FOR 2.5D IC, BY REGION, 2022-2032 ($MILLION)
  • TABLE 9. GLOBAL MULTICHIP PACKAGE MARKET FOR 3D IC, BY REGION, 2022-2032 ($MILLION)
  • TABLE 10. GLOBAL MULTICHIP PACKAGE MARKET, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 11. GLOBAL MULTICHIP PACKAGE MARKET FOR BALL GRID ARRAY, BY REGION, 2022-2032 ($MILLION)
  • TABLE 12. GLOBAL MULTICHIP PACKAGE MARKET FOR SURFACE MOUNT PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 13. GLOBAL MULTICHIP PACKAGE MARKET FOR PIN GRID ARRAY, BY REGION, 2022-2032 ($MILLION)
  • TABLE 14. GLOBAL MULTICHIP PACKAGE MARKET FOR FLAT PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 15. GLOBAL MULTICHIP PACKAGE MARKET FOR SMALL OUTLINE PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 16. GLOBAL MULTICHIP PACKAGE MARKET, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 17. GLOBAL MULTICHIP PACKAGE MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2022-2032 ($MILLION)
  • TABLE 18. GLOBAL MULTICHIP PACKAGE MARKET FOR AEROSPACE DEFENSE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 19. GLOBAL MULTICHIP PACKAGE MARKET FOR AUTOMOTIVE TRANSPORT, BY REGION, 2022-2032 ($MILLION)
  • TABLE 20. GLOBAL MULTICHIP PACKAGE MARKET FOR INDUSTRIAL, BY REGION, 2022-2032 ($MILLION)
  • TABLE 21. GLOBAL MULTICHIP PACKAGE MARKET FOR OTHERS, BY REGION, 2022-2032 ($MILLION)
  • TABLE 22. GLOBAL MULTICHIP PACKAGE MARKET, BY REGION, 2022-2032 ($MILLION)
  • TABLE 23. NORTH AMERICA MULTICHIP PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 24. NORTH AMERICA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 25. NORTH AMERICA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 26. NORTH AMERICA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 27. NORTH AMERICA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 28. U.S. MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 29. U.S. MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 30. U.S. MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 31. U.S. MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 32. CANADA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 33. CANADA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 34. CANADA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 35. CANADA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 36. MEXICO MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 37. MEXICO MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 38. MEXICO MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 39. MEXICO MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 40. EUROPE MULTICHIP PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 41. EUROPE MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 42. EUROPE MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 43. EUROPE MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 44. EUROPE MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 45. FRANCE MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 46. FRANCE MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 47. FRANCE MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 48. FRANCE MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 49. GERMANY MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 50. GERMANY MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 51. GERMANY MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 52. GERMANY MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 53. ITALY MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 54. ITALY MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 55. ITALY MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 56. ITALY MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 57. SPAIN MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 58. SPAIN MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 59. SPAIN MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 60. SPAIN MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 61. UK MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 62. UK MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 63. UK MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 64. UK MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 65. RUSSIA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 66. RUSSIA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 67. RUSSIA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 68. RUSSIA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 69. REST OF EUROPE MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 70. REST OF EUROPE MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 71. REST OF EUROPE MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 72. REST OF EUROPE MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 73. ASIA-PACIFIC MULTICHIP PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 74. ASIA-PACIFIC MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 75. ASIA-PACIFIC MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 76. ASIA-PACIFIC MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 77. ASIA-PACIFIC MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 78. CHINA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 79. CHINA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 80. CHINA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 81. CHINA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 82. JAPAN MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 83. JAPAN MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 84. JAPAN MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 85. JAPAN MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 86. INDIA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 87. INDIA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 88. INDIA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 89. INDIA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 90. SOUTH KOREA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 91. SOUTH KOREA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 92. SOUTH KOREA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 93. SOUTH KOREA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 94. AUSTRALIA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 95. AUSTRALIA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 96. AUSTRALIA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 97. AUSTRALIA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 98. THAILAND MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 99. THAILAND MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 100. THAILAND MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 101. THAILAND MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 102. MALAYSIA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 103. MALAYSIA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 104. MALAYSIA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 105. MALAYSIA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 106. INDONESIA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 107. INDONESIA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 108. INDONESIA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 109. INDONESIA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 110. REST OF ASIA PACIFIC MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 111. REST OF ASIA PACIFIC MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 112. REST OF ASIA PACIFIC MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 113. REST OF ASIA PACIFIC MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 114. LAMEA MULTICHIP PACKAGE, BY REGION, 2022-2032 ($MILLION)
  • TABLE 115. LAMEA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 116. LAMEA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 117. LAMEA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 118. LAMEA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 119. BRAZIL MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 120. BRAZIL MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 121. BRAZIL MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 122. BRAZIL MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 123. SOUTH AFRICA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 124. SOUTH AFRICA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 125. SOUTH AFRICA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 126. SOUTH AFRICA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 127. SAUDI ARABIA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 128. SAUDI ARABIA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 129. SAUDI ARABIA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 130. SAUDI ARABIA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 131. UAE MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 132. UAE MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 133. UAE MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 134. UAE MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 135. ARGENTINA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 136. ARGENTINA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 137. ARGENTINA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 138. ARGENTINA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 139. REST OF LAMEA MULTICHIP PACKAGE, BY TYPE, 2022-2032 ($MILLION)
  • TABLE 140. REST OF LAMEA MULTICHIP PACKAGE, BY PACKAGING TECHNOLOGY, 2022-2032 ($MILLION)
  • TABLE 141. REST OF LAMEA MULTICHIP PACKAGE, BY PACKAGING TYPE, 2022-2032 ($MILLION)
  • TABLE 142. REST OF LAMEA MULTICHIP PACKAGE, BY INDUSTRY VERTICAL, 2022-2032 ($MILLION)
  • TABLE 143. SAMSUNG ELECTRONICS CO. LTD.: KEY EXECUTIVES
  • TABLE 144. SAMSUNG ELECTRONICS CO. LTD.: COMPANY SNAPSHOT
  • TABLE 145. SAMSUNG ELECTRONICS CO. LTD.: OPERATING SEGMENTS
  • TABLE 146. SAMSUNG ELECTRONICS CO. LTD.: PRODUCT PORTFOLIO
  • TABLE 147. SAMSUNG ELECTRONICS CO. LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 148. TEXAS INSTRUMENTS: KEY EXECUTIVES
  • TABLE 149. TEXAS INSTRUMENTS: COMPANY SNAPSHOT
  • TABLE 150. TEXAS INSTRUMENTS: OPERATING SEGMENTS
  • TABLE 151. TEXAS INSTRUMENTS: PRODUCT PORTFOLIO
  • TABLE 152. TEXAS INSTRUMENTS: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 153. MICRON TECHNOLOGY INC.: KEY EXECUTIVES
  • TABLE 154. MICRON TECHNOLOGY INC.: COMPANY SNAPSHOT
  • TABLE 155. MICRON TECHNOLOGY INC.: OPERATING SEGMENTS
  • TABLE 156. MICRON TECHNOLOGY INC.: PRODUCT PORTFOLIO
  • TABLE 157. MICRON TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 158. IBM: KEY EXECUTIVES
  • TABLE 159. IBM: COMPANY SNAPSHOT
  • TABLE 160. IBM: OPERATING SEGMENTS
  • TABLE 161. IBM: PRODUCT PORTFOLIO
  • TABLE 162. IBM: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 163. SK HYNIX INC: KEY EXECUTIVES
  • TABLE 164. SK HYNIX INC: COMPANY SNAPSHOT
  • TABLE 165. SK HYNIX INC: OPERATING SEGMENTS
  • TABLE 166. SK HYNIX INC: PRODUCT PORTFOLIO
  • TABLE 167. SK HYNIX INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 168. ASE GROUP: KEY EXECUTIVES
  • TABLE 169. ASE GROUP: COMPANY SNAPSHOT
  • TABLE 170. ASE GROUP: OPERATING SEGMENTS
  • TABLE 171. ASE GROUP: PRODUCT PORTFOLIO
  • TABLE 172. ASE GROUP: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 173. CYPRESS SEMICONDUCTOR CORPORATION: KEY EXECUTIVES
  • TABLE 174. CYPRESS SEMICONDUCTOR CORPORATION: COMPANY SNAPSHOT
  • TABLE 175. CYPRESS SEMICONDUCTOR CORPORATION: OPERATING SEGMENTS
  • TABLE 176. CYPRESS SEMICONDUCTOR CORPORATION: PRODUCT PORTFOLIO
  • TABLE 177. CYPRESS SEMICONDUCTOR CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 178. AMKOR TECHNOLOGY INC.: KEY EXECUTIVES
  • TABLE 179. AMKOR TECHNOLOGY INC.: COMPANY SNAPSHOT
  • TABLE 180. AMKOR TECHNOLOGY INC.: OPERATING SEGMENTS
  • TABLE 181. AMKOR TECHNOLOGY INC.: PRODUCT PORTFOLIO
  • TABLE 182. AMKOR TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 183. ATANDS: KEY EXECUTIVES
  • TABLE 184. ATANDS: COMPANY SNAPSHOT
  • TABLE 185. ATANDS: OPERATING SEGMENTS
  • TABLE 186. ATANDS: PRODUCT PORTFOLIO
  • TABLE 187. ATANDS: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • TABLE 188. INTEL CORPORATION.: KEY EXECUTIVES
  • TABLE 189. INTEL CORPORATION.: COMPANY SNAPSHOT
  • TABLE 190. INTEL CORPORATION.: OPERATING SEGMENTS
  • TABLE 191. INTEL CORPORATION.: PRODUCT PORTFOLIO
  • TABLE 192. INTEL CORPORATION.: KEY STRATEGIC MOVES AND DEVELOPMENTS
  • LIST OF FIGURES

  • FIGURE 1. GLOBAL MULTICHIP PACKAGE MARKET SEGMENTATION
  • FIGURE 2. GLOBAL MULTICHIP PACKAGE MARKET
  • FIGURE 3. SEGMENTATION MULTICHIP PACKAGE MARKET
  • FIGURE 4. TOP INVESTMENT POCKET IN MULTICHIP PACKAGE MARKET
  • FIGURE 5. MODERATE BARGAINING POWER OF BUYERS
  • FIGURE 6. MODERATE BARGAINING POWER OF SUPPLIERS
  • FIGURE 7. MODERATE THREAT OF NEW ENTRANTS
  • FIGURE 8. LOW THREAT OF SUBSTITUTION
  • FIGURE 9. HIGH COMPETITIVE RIVALRY
  • FIGURE 10. OPPORTUNITIES, RESTRAINTS AND DRIVERS: GLOBALMULTICHIP PACKAGE MARKET
  • FIGURE 11. MULTICHIP PACKAGE MARKET SEGMENTATION, BY BY TYPE
  • FIGURE 12. MULTICHIP PACKAGE MARKET FOR HYBRID CIRCUIT (HC) OR HYBRID INTEGRATED CIRCUIT (HIC), BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 13. MULTICHIP PACKAGE MARKET FOR MULTICHIP MODULE (MCM), BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 14. MULTICHIP PACKAGE MARKET FOR 3-D PACKAGING, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 15. MULTICHIP PACKAGE MARKET FOR SYSTEM IN PACKAGE (SIP) OR SYSTEM ON PACKAGE (SOP), BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 16. MULTICHIP PACKAGE MARKET SEGMENTATION, BY BY PACKAGING TECHNOLOGY
  • FIGURE 17. MULTICHIP PACKAGE MARKET FOR 2D IC, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 18. MULTICHIP PACKAGE MARKET FOR 2.5D IC, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 19. MULTICHIP PACKAGE MARKET FOR 3D IC, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 20. MULTICHIP PACKAGE MARKET SEGMENTATION, BY BY PACKAGING TYPE
  • FIGURE 21. MULTICHIP PACKAGE MARKET FOR BALL GRID ARRAY, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 22. MULTICHIP PACKAGE MARKET FOR SURFACE MOUNT PACKAGE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 23. MULTICHIP PACKAGE MARKET FOR PIN GRID ARRAY, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 24. MULTICHIP PACKAGE MARKET FOR FLAT PACKAGE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 25. MULTICHIP PACKAGE MARKET FOR SMALL OUTLINE PACKAGE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 26. MULTICHIP PACKAGE MARKET SEGMENTATION, BY BY INDUSTRY VERTICAL
  • FIGURE 27. MULTICHIP PACKAGE MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 28. MULTICHIP PACKAGE MARKET FOR AEROSPACE DEFENSE, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 29. MULTICHIP PACKAGE MARKET FOR AUTOMOTIVE TRANSPORT, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 30. MULTICHIP PACKAGE MARKET FOR INDUSTRIAL, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 31. MULTICHIP PACKAGE MARKET FOR OTHERS, BY COUNTRY, 2022-2032 ($MILLION)
  • FIGURE 32. TOP WINNING STRATEGIES, BY YEAR, 2020-2022*
  • FIGURE 33. TOP WINNING STRATEGIES, BY DEVELOPMENT, 2020-2022*
  • FIGURE 34. TOP WINNING STRATEGIES, BY COMPANY, 2020-2022*
  • FIGURE 35. PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 36. COMPETITIVE DASHBOARD
  • FIGURE 37. COMPETITIVE HEATMAP: MULTICHIP PACKAGE MARKET
  • FIGURE 38. Top player positioning, 2022
  • FIGURE 39. SAMSUNG ELECTRONICS CO. LTD.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 40. SAMSUNG ELECTRONICS CO. LTD.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 41. SAMSUNG ELECTRONICS CO. LTD.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 42. TEXAS INSTRUMENTS: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 43. TEXAS INSTRUMENTS: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 44. TEXAS INSTRUMENTS: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 45. MICRON TECHNOLOGY INC.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 46. MICRON TECHNOLOGY INC.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 47. MICRON TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 48. IBM: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 49. IBM: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 50. IBM: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 51. SK HYNIX INC: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 52. SK HYNIX INC: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 53. SK HYNIX INC: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 54. ASE GROUP: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 55. ASE GROUP: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 56. ASE GROUP: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 57. CYPRESS SEMICONDUCTOR CORPORATION: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 58. CYPRESS SEMICONDUCTOR CORPORATION: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 59. CYPRESS SEMICONDUCTOR CORPORATION: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 60. AMKOR TECHNOLOGY INC.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 61. AMKOR TECHNOLOGY INC.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 62. AMKOR TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 63. ATANDS: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 64. ATANDS: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 65. ATANDS: REVENUE SHARE, BY REGION, 2032 (%)
  • FIGURE 66. INTEL CORPORATION.: NET SALES, 2020-2022 ($MILLION)
  • FIGURE 67. INTEL CORPORATION.: REVENUE SHARE, BY SEGMENT, 2032 (%)
  • FIGURE 68. INTEL CORPORATION.: REVENUE SHARE, BY REGION, 2032 (%)

 
 
With collective industry experience of about 200 years of its analysts and experts, Allied Market Research (AMR) encompasses most infallible research methodology for its market intelligence and industry analysis. We do not only engrave the deepest levels of markets but also sneak through its slimmest details for the purpose of our market estimates and forecasts. Our approach helps in building greater market consensus view for size, shape and industry trends within each industry segment. We carefully factor in industry trends and real developments for identifying key growth factors and future course of the market. Our research proceeds are the resultant of high quality data, expert views and analysis and high value independent opinions. Our research process is designed to deliver balanced view of the global markets and allow stakeholders to make informed decisions.

We offer our clients exhaustive research and analysis based on wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics and regional intelligence. Our in-house industry experts play instrumental role in designing analytic tools and models, tailored to the requirements of particular industry segment. These analytical tools and models sanitize the data & statistics and enhance the accuracy of our recommendations and advice. With AMR’s calibrated research process and 360` degree data-evaluation methodology, our clients are assured of receiving:

  • Consistent, valuable, robust and actionable data & analysis that can easily be referenced for strategic business planning
  • Technologically sophisticated and reliable insights through well audited and veracious research methodology
  • Sovereign research proceeds that present a tangible depiction of marketplace


With a strong methodology we are, therefore, confident that our research and analysis are most reliable and guarantees sound business planning.

Secondary research
We refer a broad array of industry sources for our secondary, which typically include; however, not limited to: Company SEC filings, annual reports, company websites, broker & financial reports and investor presentations for competitive scenario and shape of the industry

  • Patent and regulatory databases for understanding of technical & legal developments
  • Scientific and technical writings for product information and related preemptions
  • Regional government and statistical databases for macro analysis
  • Authentic new articles, web-casts and other related releases for market evaluation
  • Internal and external proprietary databases, key market indicators and relevant press releases for market estimates and forecast


Primary research
Our primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks and face-to-face interactions. We are also in professional corporate relations with various companies that allow us greater flexibility for reaching out industry participants and commentators for interviews and discussions, fulfilling following functions:

  • Validates and improves the data quality and strengthens research proceeds
  • Further develops analyst team’s market understanding and expertise
  • Supplies authentic information about market size, share, growth and forecasts


Our primary research interview and discussion panels are typically composed of most experienced industry members. These participants include; however, not limited to:

  • Chief executives and VPs of leading corporations specific to industry
  • Product and sales managers or country heads; channel partners and top level distributors; banking, investments and valuation experts Key opinion leaders (KOLs)


Analyst tools and models
AMR has developed set of analyst tools and data models to supplement and expedite the analysis process. Corresponding to markets, where there is significant lack of information and estimates, AMR’s team of experts and analyst develop specific analyst tools and industry models to translate qualitative and quantitative industry indicators into exact industry estimates. These models also allow analysts to examine the prospects and opportunities prevailing in the market to accurately forecast the course of the market.

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Why Allied Market Research?

Infallible Methodology

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For complete satisfaction

Customization

On-demand customization of scope of the report to exactly meet your needs

TARGETED MARKET VIEW

Targeted market view to provide pertinent information and save time of readers