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Request Now !The global NOR-based multi-chip packages market is experiencing a significant growth, and is expected to grow considerably in the next few years. The global market is experiencing a significant growth, and is expected to grow considerably in the next few years. MCP refers to a packet configuration comprising at most five chips, linked through wire bonds to a multilayer circuit board, & protected with low-cost ceramic package or a molded encapsulant. At circuit level, its functioning is similar to the NOR logic function and so it is called NOR-based multi-chip package.Â
Generally, without substrate, dies can be attached to a die paddle and inter-die communication is attained through die-to-die wire bonding. MCPs can also include the practice of passive gears. Main feature of MCP is the use of standard packages as a vehicle for low-end multi-chip module applications. This allows the consumers to gladly incorporate MCP solutions since the test, mounting equipment, and handling already exist in the business. MCPs key benefits are Improved Performance, Higher Integration Density, Lower Power Consumption, Mixed Signal Applications, and Lower Cost.
The global NOR-based multi-chip packages market is segmented on the basis of product type, application, end user, and region. Based on product type, the NOR-based multi-chip packages market is bifurcated into De-Mux and AD-Mux. In terms of application, the market is categorized into servers, RF wireless modules, power amplifiers, portable electronics, LED packages, high power communication devices, wearable devices, and others. On the basis of end user, the market is divided into automotive, aerospace, consumer electronics, medical devices, defense, and others. Geographically, the market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).
Key players operating in the global NOR-based multi-chip packages industry include Palomar Technologies, Samsung Electronics, Infineon Technologies, SK HYNIX INC, STMicroelectronics, Cypress Semiconductors, Micross, Texas Instruments, TEKTRONIX INC, and Macronix International Co. Ltd. These companies have adopted several strategies such as product launches, partnerships, collaborations, mergers & acquisitions, and joint ventures to strengthen their foothold in the global market.Â
The major driving factor of the global market for NOR-based multi-chip packages is the requirement of small chip modules for the device operation improvisation and also managing its size and weight. But, continuous innovation and lack of technical expertise in the chip packaging processes is the hindrance to the market growth. However, low power supply requirement, lower cost, greater miniaturization and improved performance of the NOR-based multi-chip packages is expected to drive the market further.
A new product MT38L3031AA03JVZZI, which is the NOR- based multi-chip package, was launched by Micron. It has various improved features such as NOR density of 128 Mb, DRAM density of 64 Mb, package-TFBGA, package size 8x6x1 and others. Thus, this product flourished the market as it was able to provide greater miniaturization and improved performance in the applications.Â
As there is short distance between the ICs in the NOR-based multi-chip package, it helps in improving performance of the device. This has also led to greater miniaturization as size of the package is reduced and therefore, it can be used in trending electronic devices such as industrial wearables, servers, high power communication devices and others. Thus, there is surge in the usage of NOR-based multi-chip packages in the electronic industry. Moreover, the customization of the MCP as per the industrial applications is the added advantage and has led to the NOR-based multi-chip packages market growth as well.Â
Key Benefits of the Report
Market Scope and Structure Analysis
Report Metric | Details |
Market Size Available For Years | 2019-2027 |
Base Year Considered | 2019 |
Forecast Period | 2020-2027 |
Forecast Units | Value (USD) |
Segments Covered | Product Type, Application, End User, and Region |
Regions Covered | North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, Italy, and Rest of Europe), Asia-Pacific (China, Japan, South Korea, India, and Rest of Asia-Pacific), and LAMEA (Latin America, and Middle East, and Africa)Â Â |
Companies Covered | Palomar Technologies, Samsung Electronics, Infineon Technologies, SK HYNIX INC, STMicroelectronics, Cypress Semiconductors, Micross, Texas Instruments, TEKTRONIX INC, and Macronix International Co. Ltd. |
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COVID-19 Scenario Analysis
NOR-Based Multi-Chip Packages Market Key Segments
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Questions Answered in the NOR-Based Multi-Chip Packages Market Research Report
NOR-Based Multi-Chip Packages Market Report Highlights
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Key Market Players | Palomar Technologies, Samsung Electronics, Infineon Technologies, SK HYNIX INC, STMicroelectronics, Cypress Semiconductors, Micross, Texas Instruments, TEKTRONIX INC, Macronix International Co. Ltd. |
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