NOR-Based Multi-Chip Packages Market Outlook – 2027
The global NOR-based multi-chip packages market is experiencing a significant growth, and is expected to grow considerably in the next few years. The global market is experiencing a significant growth, and is expected to grow considerably in the next few years. MCP refers to a packet configuration comprising at most five chips, linked through wire bonds to a multilayer circuit board, & protected with low-cost ceramic package or a molded encapsulant. At circuit level, its functioning is similar to the NOR logic function and so it is called NOR-based multi-chip package.
Generally, without substrate, dies can be attached to a die paddle and inter-die communication is attained through die-to-die wire bonding. MCPs can also include the practice of passive gears. Main feature of MCP is the use of standard packages as a vehicle for low-end multi-chip module applications. This allows the consumers to gladly incorporate MCP solutions since the test, mounting equipment, and handling already exist in the business. MCPs key benefits are Improved Performance, Higher Integration Density, Lower Power Consumption, Mixed Signal Applications, and Lower Cost.
The global NOR-based multi-chip packages market is segmented on the basis of product type, application, end user, and region. Based on product type, the NOR-based multi-chip packages market is bifurcated into De-Mux and AD-Mux. In terms of application, the market is categorized into servers, RF wireless modules, power amplifiers, portable electronics, LED packages, high power communication devices, wearable devices, and others. On the basis of end user, the market is divided into automotive, aerospace, consumer electronics, medical devices, defense, and others. Geographically, the market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).
Key players operating in the global NOR-based multi-chip packages industry include Palomar Technologies, Samsung Electronics, Infineon Technologies, SK HYNIX INC, STMicroelectronics, Cypress Semiconductors, Micross, Texas Instruments, TEKTRONIX INC, and Macronix International Co. Ltd. These companies have adopted several strategies such as product launches, partnerships, collaborations, mergers & acquisitions, and joint ventures to strengthen their foothold in the global market.
Top Impacting Factors
The major driving factor of the global market for NOR-based multi-chip packages is the requirement of small chip modules for the device operation improvisation and also managing its size and weight. But, continuous innovation and lack of technical expertise in the chip packaging processes is the hindrance to the market growth. However, low power supply requirement, lower cost, greater miniaturization and improved performance of the NOR-based multi-chip packages is expected to drive the market further.
New Product Launches to Flourish the Market
A new product MT38L3031AA03JVZZI, which is the NOR- based multi-chip package, was launched by Micron. It has various improved features such as NOR density of 128 Mb, DRAM density of 64 Mb, package-TFBGA, package size 8x6x1 and others. Thus, this product flourished the market as it was able to provide greater miniaturization and improved performance in the applications.
Surge in Usage in Electronic Industry
As there is short distance between the ICs in the NOR-based multi-chip package, it helps in improving performance of the device. This has also led to greater miniaturization as size of the package is reduced and therefore, it can be used in trending electronic devices such as industrial wearables, servers, high power communication devices and others. Thus, there is surge in the usage of NOR-based multi-chip packages in the electronic industry. Moreover, the customization of the MCP as per the industrial applications is the added advantage and has led to the NOR-based multi-chip packages market growth as well.
Key Benefits of the Report
- This study presents the analytical depiction of the global NOR-based multi-chip packages market forecast along with the current trends and future estimations to determine the imminent investment pockets.
- The report presents information related to key drivers, restraints, and opportunities along with detailed analysis of the global NOR-based multi-chip packages market share.
- The current market is quantitatively analyzed to highlight the global market growth scenario.
- Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market.
- The report provides a detailed global NOR-based multi-chip packages market analysis based on competitive intensity and how the competition will take shape in coming years.
COVID-19 Scenario Analysis
- Global NOR-based multi-chip packages market has been significantly impacted by the COVID-19 outbreak. New projects throughout the world have stalled, which, in turn, have led to decline in demand for analog semiconductors.
- Global factories have struggled to integrate new NOR-based multi-chip packages as workers have stayed in their homes, which disrupted the global supply chains.
- The impact of COVID-19 on this market is temporary as just the production and supply chain is stalled. Once the situation improves, production, supply chains, and demand for NOR-based multi-chip packages are gradually going to increase.
- This COVID-19 lockdown would help companies think about more advanced NOR-based multi-chip packages to enhance efficiency.
Questions Answered in the NOR-Based Multi-Chip Packages Market Research Report
- Which are the leading market players active in the NOR-based multi-chip packages market?
- What would be the detailed impact of COVID-19 on the NOR-based multi-chip packages market size?
- How current NOR-based multi-chip packages market trends would influence the industry in the next few years?
- What are the driving factors, restraints, and opportunities in the global market?
- What are the projections for the future that would help in taking further strategic steps?
NOR-Based Multi-Chip Packages Market Report Highlights
| Aspects | Details |
 By Product Type |
|
 By Application |
|
 By End User |
|
 By Region |
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 Key Market Players | Samsung Electronics, Infineon Technologies, Cypress Semiconductors, STMicroelectronics, SK HYNIX INC, Micross, Texas Instruments, Macronix International Co. Ltd., TEKTRONIX INC, Palomar Technologies |
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