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2022
Outsourced Semiconductor Assembly And Testing Market

Outsourced Semiconductor Assembly and Testing Market

by Process (Sawing, Sorting, Testing, Assembly), by Packaging Type (Ball grid array, Chip scale package, Multi-package, Stacked die, Quad and dual), by Application (Automotive, Consumer electronics, Industrial, Telecommunication, Aerospace and defense, Medical and healthcare, Logistics and transportation): Global Opportunity Analysis and Industry Forecast, 2021-2031

SE : Semiconductors
Report Code: A08874
Sep 2022 | Pages: 225
Tables: 160
Charts: 66

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The global outsourced semiconductor assembly and testing market size was valued at $34.6 billion in 2021, and is projected to reach $60.3 billion by 2031, growing at a CAGR of 6.3% from 2022 to 2031.

Assembly and testing (manufacturing) of outsourced semiconductors offer IC-packaging and testing facilities to third parties. OSATs are merchant vendors. Integrated database management system and foundries often outsource a certain percentage of their IC-packaging production to OSATs with internal packaging operations. Fabless companies often outsource their packaging to foundries and/or OSATs. Semiconductors are also used by many modern consumer goods in daily uses, such as in cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. In addition, preference for large displays and curved OLEDs, owing to growth in popularity of smart TVs, 4K ultra-HD TVs, 3D programming, and video-on-demand content drives OSAT revenues. OSATs offer cost-effective and creative solutions, which deliver higher efficiency, processing speeds, and functionality with space reduction in electronic devices.

Global outsourced semiconductor assembly and test (OSAT) market has been significantly impacted by the COVID-19 outbreak. Owing to strict lockdown imposed by the government of several nations the production facilities of semiconductor companies have severely affected. As government has issued the companies to offer work from home to their employees this has resulted in negative growth impact for the manufacturing companies. Asian and European countries under lockdowns have suffered major loss of business and revenue, owing to shutdown of manufacturing units in these regions. Operations of production and manufacturing industries have been heavily impacted by outbreak of the COVID-19 disease; thereby, leading to slowdown in growth of the OSAT market. Thus, the companies are operating at half of their working man power which has thus reduced their production capacity by more than 50%. However, owing to lockdown and work from home policy there is been rising demand for consumer electronics products among end-users. This rising demand has created opportunities for the outsourced semiconductor assembly and test (OSAT) market growth in the near future.

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Increase in demand for consumer electronics and surge in degree of urbanization across the globe, primarily fuels outsourced semiconductor assembly and testing market growth. In addition, rise in disposable income of people across the globe significantly fuels sales of consumer electronics devices such as TV, mobile phones, and tablets, which boosts demand for outsourced semiconductor assembly and test services. Moreover, increase in adoption of smartphones significantly propels the market growth. However, high cost associated with OSAT services is anticipated to hamper growth of the market during the forecast period. On the contrary, growing chip market is anticipated to provide outsourced semiconductor assembly and testing market opportunity. Furthermore, rise in transition toward OSAT in emerging economies such as India, China, and South Korea is opportunistic for the market growth.

The outsourced semiconductor assembly and testing industry is segmented into Process, Packaging Type and Application.

Outsourced Semiconductor Assembly and Testing Market

On the basis of process the market is segmented into sawing, sorting, testing and assembly. The assembly segment was the highest revenue contributor to the market in 2021 of outsourced semiconductor assembly and testing market share. This growth is attributed owing to surge in demand for telecom infrastructure as well as consumer electronics around the globe primarily fuels growth in demand for assembly services. In addition, rise in demand for semiconductor wafers fuel growth of the market.

Outsourced Semiconductor Assembly and Testing Market

On the basis of packaging type the market is segmented into ball grid array, chip scale package, multi-package, stacked die, and quad & dual. The ball grid array segment was the highest revenue contributor to the market in 2021. The factor primarily drives growth of the ball grid array type of packaging, is owing to several miniaturization advantages that it offers. In addition, BGA components offer various benefits such as lower soldering defects, higher packaging reliability, more solid soldering joints, excellent electrical and frequency characteristics, higher number of I/O ends & large I/O end spacing, and guaranteed BGA soldering planarity

Outsourced Semiconductor Assembly and Testing Market

By Application the market is segmented into automotive, consumer electronics, industrial, telecommunication, and aerospace and defense, medical and healthcare, logistics and transportation.The consumer electronics segment was the highest revenue contributor to the market in 2021. The aerospace and defense and medical and healthcare segments are expected to witness considerable growth during the forecast period.

Outsourced Semiconductor Assembly and Testing Market

By region, the market is analyzed across North America, Europe, Asia pacific, and LAMEA. North America was the highest revenue contributor in 2021. Surge in development of advance chip applications in the U.S and Canada is the major factor for growth of the market. Besides, new government initiatives in North America such as new legislation in the U.S and Canadian initiative to build a $7 billion semiconductor industry are anticipated to propel growth of the outsourced semiconductor market in the region. Furthermore, Asia Pacific is anicpated witness significant growth during the forecast period. This growth is attributed owing to the presence of number of outsoucing facilities in the region. 

The key players profiled in the outsourced semiconductor assembly and testing market outlook include Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive). Market players have adopted various strategies such as product launch, expansion, collaboration, partnership, and acquisition to strengthen their foothold in the outsourced semiconductor assembly and test industry.

Historical Data & Information

The global outsourced semiconductor assembly and test (OSAT) market is highly competitive owing to the strong presence of existing vendors. Vendors of the market with extensive technical and financial resources are expected to gain a competitive advantage over their competitors as they can cater to the market demands. The competitive environment in this market is expected to intensify as technological innovations, product launch, and different strategies adopted by key vendors increase.

Key Developments/Strategies

Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive) are the top companies holding a prime share in the outsourced semiconductor assembly and test (OSAT) market. These market players have adopted various strategies, such as product launch, expansion, collaboration, partnership, and acquisition to expand their foothold in the outsourced semiconductor assembly and test (OSAT) market.

  • In July 2022, Jiangsu Changjiang Electronics Technology Co. Ltd (JCET) started the construction of a new high-end manufacturing base in Jiangyin. According to the JCET, the products to be produced in this new global-class manufacturing facility would be focused on the high-performance packaging & testing of microsystem integration applications combining high-density flip-chip technology and high-density wafer-level technology, representing the main development direction of the packaging and testing industry.
  • In June 2022, UTAC Holdings Ltd announced a new cost-effective, next-generation test system solution for CMOS image sensors. The test solution was jointly developed by AEM, a leading semiconductor test and handling solution provider based in Singapore.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the outsourced semiconductor assembly and testing market analysis from 2021 to 2031 to identify the prevailing outsourced semiconductor assembly and testing market opportunities.
  • The market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
  • In-depth analysis of the outsourced semiconductor assembly and testing market segmentation assists to determine the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The outsourced semiconductor assembly and testing market forecast includes the analysis of the regional as well as global outsourced semiconductor assembly and testing market trends, key players, market segments, application areas, and market growth strategies.

 Outsourced Semiconductor Assembly and Testing Market Report Highlights

Aspects Details
Market Size By 2031 USD 60.3 billion
Growth Rate CAGR of 6.3%
Forecast period 2021 - 2031
Report Pages 225
By Process
  • Sawing
  • Sorting
  • Testing
  • Assembly
By Packaging Type
  • Ball grid array
  • Chip scale package
  • Multi-package
  • Stacked die
  • Quad and dual
By Application
  • Automotive
  • Consumer electronics
  • Industrial
  • Telecommunication
  • Aerospace and defense
  • Medical and healthcare
  • Logistics and transportation
By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (UK, Germany, France, Italy, Russia, Sweden, Netherlands, Rest Of Europe)
  • Asia-Pacific  (China, India, Japan, South Korea, Rest Of Europe)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players ALPHACORE INC., Sencio BV, SHORTLINK GROUP, ADVANCED SILICON S.A., DEVICE ENGINEERING INC., LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING), HIDENSITY GROUP (HMT MICROELECTRONIC AG), PRESTO ENGINEERING GROUP, SIFIVE, INC. (OPENFIVE), AMKOR TECHNOLOGY, INC.
 

  • CHAPTER 1:INTRODUCTION

    • 1.1.Report description

    • 1.2.Key market segments

    • 1.3.Key benefits to the stakeholders

    • 1.4.Research Methodology

      • 1.4.1.Secondary research

      • 1.4.2.Primary research

      • 1.4.3.Analyst tools and models

  • CHAPTER 2:EXECUTIVE SUMMARY

    • 2.1.Key findings of the study

    • 2.2.CXO Perspective

  • CHAPTER 3:MARKET OVERVIEW

    • 3.1.Market definition and scope

    • 3.2.Key findings

      • 3.2.1.Top investment pockets

    • 3.3.Porter’s five forces analysis

    • 3.4.Top player positioning

    • 3.5.Market dynamics

      • 3.5.1.Drivers

      • 3.5.2.Restraints

      • 3.5.3.Opportunities

    • 3.6.COVID-19 Impact Analysis on the market

  • CHAPTER 4: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS

    • 4.1 Overview

      • 4.1.1 Market size and forecast

    • 4.2 Sawing

      • 4.2.1 Key market trends, growth factors and opportunities

      • 4.2.2 Market size and forecast, by region

      • 4.2.3 Market analysis by country

    • 4.3 Sorting

      • 4.3.1 Key market trends, growth factors and opportunities

      • 4.3.2 Market size and forecast, by region

      • 4.3.3 Market analysis by country

    • 4.4 Testing

      • 4.4.1 Key market trends, growth factors and opportunities

      • 4.4.2 Market size and forecast, by region

      • 4.4.3 Market analysis by country

    • 4.5 Assembly

      • 4.5.1 Key market trends, growth factors and opportunities

      • 4.5.2 Market size and forecast, by region

      • 4.5.3 Market analysis by country

  • CHAPTER 5: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE

    • 5.1 Overview

      • 5.1.1 Market size and forecast

    • 5.2 Ball grid array

      • 5.2.1 Key market trends, growth factors and opportunities

      • 5.2.2 Market size and forecast, by region

      • 5.2.3 Market analysis by country

    • 5.3 Chip scale package

      • 5.3.1 Key market trends, growth factors and opportunities

      • 5.3.2 Market size and forecast, by region

      • 5.3.3 Market analysis by country

    • 5.4 Multi-package

      • 5.4.1 Key market trends, growth factors and opportunities

      • 5.4.2 Market size and forecast, by region

      • 5.4.3 Market analysis by country

    • 5.5 Stacked die

      • 5.5.1 Key market trends, growth factors and opportunities

      • 5.5.2 Market size and forecast, by region

      • 5.5.3 Market analysis by country

    • 5.6 Quad and dual

      • 5.6.1 Key market trends, growth factors and opportunities

      • 5.6.2 Market size and forecast, by region

      • 5.6.3 Market analysis by country

  • CHAPTER 6: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION

    • 6.1 Overview

      • 6.1.1 Market size and forecast

    • 6.2 Automotive

      • 6.2.1 Key market trends, growth factors and opportunities

      • 6.2.2 Market size and forecast, by region

      • 6.2.3 Market analysis by country

    • 6.3 Consumer electronics

      • 6.3.1 Key market trends, growth factors and opportunities

      • 6.3.2 Market size and forecast, by region

      • 6.3.3 Market analysis by country

    • 6.4 Industrial

      • 6.4.1 Key market trends, growth factors and opportunities

      • 6.4.2 Market size and forecast, by region

      • 6.4.3 Market analysis by country

    • 6.5 Telecommunication

      • 6.5.1 Key market trends, growth factors and opportunities

      • 6.5.2 Market size and forecast, by region

      • 6.5.3 Market analysis by country

    • 6.6 Aerospace and defense

      • 6.6.1 Key market trends, growth factors and opportunities

      • 6.6.2 Market size and forecast, by region

      • 6.6.3 Market analysis by country

    • 6.7 Medical and healthcare

      • 6.7.1 Key market trends, growth factors and opportunities

      • 6.7.2 Market size and forecast, by region

      • 6.7.3 Market analysis by country

    • 6.8 Logistics and transportation

      • 6.8.1 Key market trends, growth factors and opportunities

      • 6.8.2 Market size and forecast, by region

      • 6.8.3 Market analysis by country

  • CHAPTER 7: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION

    • 7.1 Overview

      • 7.1.1 Market size and forecast

    • 7.2 North America

      • 7.2.1 Key trends and opportunities

      • 7.2.2 North America Market size and forecast, by Process

      • 7.2.3 North America Market size and forecast, by Packaging Type

      • 7.2.4 North America Market size and forecast, by Application

      • 7.2.5 North America Market size and forecast, by country

        • 7.2.5.1 U.S.
          • 7.2.5.1.1 Market size and forecast, by Process
          • 7.2.5.1.2 Market size and forecast, by Packaging Type
          • 7.2.5.1.3 Market size and forecast, by Application
        • 7.2.5.2 Canada
          • 7.2.5.2.1 Market size and forecast, by Process
          • 7.2.5.2.2 Market size and forecast, by Packaging Type
          • 7.2.5.2.3 Market size and forecast, by Application
        • 7.2.5.3 Mexico
          • 7.2.5.3.1 Market size and forecast, by Process
          • 7.2.5.3.2 Market size and forecast, by Packaging Type
          • 7.2.5.3.3 Market size and forecast, by Application

    • 7.3 Europe

      • 7.3.1 Key trends and opportunities

      • 7.3.2 Europe Market size and forecast, by Process

      • 7.3.3 Europe Market size and forecast, by Packaging Type

      • 7.3.4 Europe Market size and forecast, by Application

      • 7.3.5 Europe Market size and forecast, by country

        • 7.3.5.1 UK
          • 7.3.5.1.1 Market size and forecast, by Process
          • 7.3.5.1.2 Market size and forecast, by Packaging Type
          • 7.3.5.1.3 Market size and forecast, by Application
        • 7.3.5.2 Germany
          • 7.3.5.2.1 Market size and forecast, by Process
          • 7.3.5.2.2 Market size and forecast, by Packaging Type
          • 7.3.5.2.3 Market size and forecast, by Application
        • 7.3.5.3 France
          • 7.3.5.3.1 Market size and forecast, by Process
          • 7.3.5.3.2 Market size and forecast, by Packaging Type
          • 7.3.5.3.3 Market size and forecast, by Application
        • 7.3.5.4 Italy
          • 7.3.5.4.1 Market size and forecast, by Process
          • 7.3.5.4.2 Market size and forecast, by Packaging Type
          • 7.3.5.4.3 Market size and forecast, by Application
        • 7.3.5.5 Russia
          • 7.3.5.5.1 Market size and forecast, by Process
          • 7.3.5.5.2 Market size and forecast, by Packaging Type
          • 7.3.5.5.3 Market size and forecast, by Application
        • 7.3.5.6 Sweden
          • 7.3.5.6.1 Market size and forecast, by Process
          • 7.3.5.6.2 Market size and forecast, by Packaging Type
          • 7.3.5.6.3 Market size and forecast, by Application
        • 7.3.5.7 Netherlands
          • 7.3.5.7.1 Market size and forecast, by Process
          • 7.3.5.7.2 Market size and forecast, by Packaging Type
          • 7.3.5.7.3 Market size and forecast, by Application
        • 7.3.5.8 Rest of Europe
          • 7.3.5.8.1 Market size and forecast, by Process
          • 7.3.5.8.2 Market size and forecast, by Packaging Type
          • 7.3.5.8.3 Market size and forecast, by Application

    • 7.4 Asia-Pacific

      • 7.4.1 Key trends and opportunities

      • 7.4.2 Asia-Pacific Market size and forecast, by Process

      • 7.4.3 Asia-Pacific Market size and forecast, by Packaging Type

      • 7.4.4 Asia-Pacific Market size and forecast, by Application

      • 7.4.5 Asia-Pacific Market size and forecast, by country

        • 7.4.5.1 China
          • 7.4.5.1.1 Market size and forecast, by Process
          • 7.4.5.1.2 Market size and forecast, by Packaging Type
          • 7.4.5.1.3 Market size and forecast, by Application
        • 7.4.5.2 India
          • 7.4.5.2.1 Market size and forecast, by Process
          • 7.4.5.2.2 Market size and forecast, by Packaging Type
          • 7.4.5.2.3 Market size and forecast, by Application
        • 7.4.5.3 Japan
          • 7.4.5.3.1 Market size and forecast, by Process
          • 7.4.5.3.2 Market size and forecast, by Packaging Type
          • 7.4.5.3.3 Market size and forecast, by Application
        • 7.4.5.4 South Korea
          • 7.4.5.4.1 Market size and forecast, by Process
          • 7.4.5.4.2 Market size and forecast, by Packaging Type
          • 7.4.5.4.3 Market size and forecast, by Application
        • 7.4.5.5 Rest of Europe
          • 7.4.5.5.1 Market size and forecast, by Process
          • 7.4.5.5.2 Market size and forecast, by Packaging Type
          • 7.4.5.5.3 Market size and forecast, by Application

    • 7.5 LAMEA

      • 7.5.1 Key trends and opportunities

      • 7.5.2 LAMEA Market size and forecast, by Process

      • 7.5.3 LAMEA Market size and forecast, by Packaging Type

      • 7.5.4 LAMEA Market size and forecast, by Application

      • 7.5.5 LAMEA Market size and forecast, by country

        • 7.5.5.1 Latin America
          • 7.5.5.1.1 Market size and forecast, by Process
          • 7.5.5.1.2 Market size and forecast, by Packaging Type
          • 7.5.5.1.3 Market size and forecast, by Application
        • 7.5.5.2 Middle East
          • 7.5.5.2.1 Market size and forecast, by Process
          • 7.5.5.2.2 Market size and forecast, by Packaging Type
          • 7.5.5.2.3 Market size and forecast, by Application
        • 7.5.5.3 Africa
          • 7.5.5.3.1 Market size and forecast, by Process
          • 7.5.5.3.2 Market size and forecast, by Packaging Type
          • 7.5.5.3.3 Market size and forecast, by Application

  • CHAPTER 8: COMPANY LANDSCAPE

    • 8.1. Introduction

    • 8.2. Top winning strategies

    • 8.3. Product Mapping of Top 10 Player

    • 8.4. Competitive Dashboard

    • 8.5. Competitive Heatmap

    • 8.6. Key developments

  • CHAPTER 9: COMPANY PROFILES

    • 9.1 ADVANCED SILICON S.A.

      • 9.1.1 Company overview

      • 9.1.2 Company snapshot

      • 9.1.3 Operating business segments

      • 9.1.4 Product portfolio

      • 9.1.5 Business performance

      • 9.1.6 Key strategic moves and developments

    • 9.2 ALPHACORE INC.

      • 9.2.1 Company overview

      • 9.2.2 Company snapshot

      • 9.2.3 Operating business segments

      • 9.2.4 Product portfolio

      • 9.2.5 Business performance

      • 9.2.6 Key strategic moves and developments

    • 9.3 AMKOR TECHNOLOGY, INC

      • 9.3.1 Company overview

      • 9.3.2 Company snapshot

      • 9.3.3 Operating business segments

      • 9.3.4 Product portfolio

      • 9.3.5 Business performance

      • 9.3.6 Key strategic moves and developments

    • 9.4 DEVICE ENGINEERING INC.

      • 9.4.1 Company overview

      • 9.4.2 Company snapshot

      • 9.4.3 Operating business segments

      • 9.4.4 Product portfolio

      • 9.4.5 Business performance

      • 9.4.6 Key strategic moves and developments

    • 9.5 HIDENSITY GROUP (HMT MICROELECTRONIC AG)

      • 9.5.1 Company overview

      • 9.5.2 Company snapshot

      • 9.5.3 Operating business segments

      • 9.5.4 Product portfolio

      • 9.5.5 Business performance

      • 9.5.6 Key strategic moves and developments

    • 9.6 PRESTO ENGINEERING GROUP

      • 9.6.1 Company overview

      • 9.6.2 Company snapshot

      • 9.6.3 Operating business segments

      • 9.6.4 Product portfolio

      • 9.6.5 Business performance

      • 9.6.6 Key strategic moves and developments

    • 9.7 Sencio BV

      • 9.7.1 Company overview

      • 9.7.2 Company snapshot

      • 9.7.3 Operating business segments

      • 9.7.4 Product portfolio

      • 9.7.5 Business performance

      • 9.7.6 Key strategic moves and developments

    • 9.8 SHORTLINK GROUP

      • 9.8.1 Company overview

      • 9.8.2 Company snapshot

      • 9.8.3 Operating business segments

      • 9.8.4 Product portfolio

      • 9.8.5 Business performance

      • 9.8.6 Key strategic moves and developments

    • 9.9 SIFIVE, INC. (OPENFIVE)

      • 9.9.1 Company overview

      • 9.9.2 Company snapshot

      • 9.9.3 Operating business segments

      • 9.9.4 Product portfolio

      • 9.9.5 Business performance

      • 9.9.6 Key strategic moves and developments

    • 9.10 LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)

      • 9.10.1 Company overview

      • 9.10.2 Company snapshot

      • 9.10.3 Operating business segments

      • 9.10.4 Product portfolio

      • 9.10.5 Business performance

      • 9.10.6 Key strategic moves and developments

  • LIST OF TABLES

  • TABLE 1. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 2. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SAWING, BY REGION, 2021-2031 ($MILLION)
    TABLE 3. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SAWING, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 4. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR SORTING, BY REGION, 2021-2031 ($MILLION)
    TABLE 5. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR SORTING, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 6. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TESTING, BY REGION, 2021-2031 ($MILLION)
    TABLE 7. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TESTING, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 8. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR ASSEMBLY, BY REGION, 2021-2031 ($MILLION)
    TABLE 9. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR ASSEMBLY, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 10. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 11. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR BALL GRID ARRAY, BY REGION, 2021-2031 ($MILLION)
    TABLE 12. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR BALL GRID ARRAY, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 13. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CHIP SCALE PACKAGE, BY REGION, 2021-2031 ($MILLION)
    TABLE 14. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CHIP SCALE PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 15. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MULTI-PACKAGE, BY REGION, 2021-2031 ($MILLION)
    TABLE 16. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MULTI-PACKAGE, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 17. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR STACKED DIE, BY REGION, 2021-2031 ($MILLION)
    TABLE 18. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR STACKED DIE, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 19. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR QUAD AND DUAL, BY REGION, 2021-2031 ($MILLION)
    TABLE 20. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR QUAD AND DUAL, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 21. GLOBAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 22. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AUTOMOTIVE, BY REGION, 2021-2031 ($MILLION)
    TABLE 23. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AUTOMOTIVE, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 24. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR CONSUMER ELECTRONICS, BY REGION, 2021-2031 ($MILLION)
    TABLE 25. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 26. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR INDUSTRIAL, BY REGION, 2021-2031 ($MILLION)
    TABLE 27. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR INDUSTRIAL, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 28. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR TELECOMMUNICATION, BY REGION, 2021-2031 ($MILLION)
    TABLE 29. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 30. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR AEROSPACE AND DEFENSE, BY REGION, 2021-2031 ($MILLION)
    TABLE 31. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR AEROSPACE AND DEFENSE, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 32. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR MEDICAL AND HEALTHCARE, BY REGION, 2021-2031 ($MILLION)
    TABLE 33. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR MEDICAL AND HEALTHCARE, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 34. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, FOR LOGISTICS AND TRANSPORTATION, BY REGION, 2021-2031 ($MILLION)
    TABLE 35. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET FOR LOGISTICS AND TRANSPORTATION, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 36. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY REGION, 2021-2031 ($MILLION)
    TABLE 37. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 38. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 39. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 40. NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 41. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 42. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 43. U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 44. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 45. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 46. CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 47. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 48. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 49. MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 50. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 51. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 52. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 53. EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 54. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 55. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 56. UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 57. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 58. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 59. GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 60. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 61. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 62. FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 63. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 64. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 65. ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 66. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 67. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 68. RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 69. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 70. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 71. SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 72. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 73. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 74. NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 75. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 76. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 77. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 78. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 79. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 80. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 81. ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 82. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 83. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 84. CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 85. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 86. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 87. INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 88. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 89. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 90. JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 91. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 92. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 93. SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 94. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 95. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 96. REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 97. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 98. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 99. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 100. LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY COUNTRY, 2021-2031 ($MILLION)
    TABLE 101. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 102. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 103. LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 104. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 105. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 106. MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 107. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PROCESS, 2021-2031 ($MILLION)
    TABLE 108. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY PACKAGING TYPE, 2021-2031 ($MILLION)
    TABLE 109. AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET, BY APPLICATION, 2021-2031 ($MILLION)
    TABLE 110.ADVANCED SILICON S.A.: COMPANY SNAPSHOT
    TABLE 111.ADVANCED SILICON S.A.: OPERATING SEGMENTS
    TABLE 112.ADVANCED SILICON S.A.: PRODUCT PORTFOLIO
    TABLE 113.ADVANCED SILICON S.A.: NET SALES,
    TABLE 114.ADVANCED SILICON S.A.: KEY STRATERGIES
    TABLE 115.ALPHACORE INC.: COMPANY SNAPSHOT
    TABLE 116.ALPHACORE INC.: OPERATING SEGMENTS
    TABLE 117.ALPHACORE INC.: PRODUCT PORTFOLIO
    TABLE 118.ALPHACORE INC.: NET SALES,
    TABLE 119.ALPHACORE INC.: KEY STRATERGIES
    TABLE 120.AMKOR TECHNOLOGY, INC: COMPANY SNAPSHOT
    TABLE 121.AMKOR TECHNOLOGY, INC: OPERATING SEGMENTS
    TABLE 122.AMKOR TECHNOLOGY, INC: PRODUCT PORTFOLIO
    TABLE 123.AMKOR TECHNOLOGY, INC: NET SALES,
    TABLE 124.AMKOR TECHNOLOGY, INC: KEY STRATERGIES
    TABLE 125.DEVICE ENGINEERING INC.: COMPANY SNAPSHOT
    TABLE 126.DEVICE ENGINEERING INC.: OPERATING SEGMENTS
    TABLE 127.DEVICE ENGINEERING INC.: PRODUCT PORTFOLIO
    TABLE 128.DEVICE ENGINEERING INC.: NET SALES,
    TABLE 129.DEVICE ENGINEERING INC.: KEY STRATERGIES
    TABLE 130.HIDENSITY GROUP (HMT MICROELECTRONIC AG): COMPANY SNAPSHOT
    TABLE 131.HIDENSITY GROUP (HMT MICROELECTRONIC AG): OPERATING SEGMENTS
    TABLE 132.HIDENSITY GROUP (HMT MICROELECTRONIC AG): PRODUCT PORTFOLIO
    TABLE 133.HIDENSITY GROUP (HMT MICROELECTRONIC AG): NET SALES,
    TABLE 134.HIDENSITY GROUP (HMT MICROELECTRONIC AG): KEY STRATERGIES
    TABLE 135.PRESTO ENGINEERING GROUP: COMPANY SNAPSHOT
    TABLE 136.PRESTO ENGINEERING GROUP: OPERATING SEGMENTS
    TABLE 137.PRESTO ENGINEERING GROUP: PRODUCT PORTFOLIO
    TABLE 138.PRESTO ENGINEERING GROUP: NET SALES,
    TABLE 139.PRESTO ENGINEERING GROUP: KEY STRATERGIES
    TABLE 140.SENCIO BV: COMPANY SNAPSHOT
    TABLE 141.SENCIO BV: OPERATING SEGMENTS
    TABLE 142.SENCIO BV: PRODUCT PORTFOLIO
    TABLE 143.SENCIO BV: NET SALES,
    TABLE 144.SENCIO BV: KEY STRATERGIES
    TABLE 145.SHORTLINK GROUP: COMPANY SNAPSHOT
    TABLE 146.SHORTLINK GROUP: OPERATING SEGMENTS
    TABLE 147.SHORTLINK GROUP: PRODUCT PORTFOLIO
    TABLE 148.SHORTLINK GROUP: NET SALES,
    TABLE 149.SHORTLINK GROUP: KEY STRATERGIES
    TABLE 150.SIFIVE, INC. (OPENFIVE): COMPANY SNAPSHOT
    TABLE 151.SIFIVE, INC. (OPENFIVE): OPERATING SEGMENTS
    TABLE 152.SIFIVE, INC. (OPENFIVE): PRODUCT PORTFOLIO
    TABLE 153.SIFIVE, INC. (OPENFIVE): NET SALES,
    TABLE 154.SIFIVE, INC. (OPENFIVE): KEY STRATERGIES
    TABLE 155.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): COMPANY SNAPSHOT
    TABLE 156.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): OPERATING SEGMENTS
    TABLE 157.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): PRODUCT PORTFOLIO
    TABLE 158.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): NET SALES,
    TABLE 159.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING): KEY STRATERGIES

  • LIST OF FIGURES

  • FIGURE 1.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET SEGMENTATION
    FIGURE 2.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031
    FIGURE 3.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031
    FIGURE 4. TOP INVESTMENT POCKETS, BY REGION
    FIGURE 5.PORTER FIVE-1
    FIGURE 6.PORTER FIVE-2
    FIGURE 7.PORTER FIVE-3
    FIGURE 8.PORTER FIVE-4
    FIGURE 9.PORTER FIVE-5
    FIGURE 10.TOP PLAYER POSITIONING
    FIGURE 11.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
    FIGURE 12.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY PROCESS,2021(%)
    FIGURE 13.COMPARATIVE SHARE ANALYSIS OF SAWING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 14.COMPARATIVE SHARE ANALYSIS OF SORTING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 15.COMPARATIVE SHARE ANALYSIS OF TESTING OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 16.COMPARATIVE SHARE ANALYSIS OF ASSEMBLY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 17.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY PACKAGING TYPE,2021(%)
    FIGURE 18.COMPARATIVE SHARE ANALYSIS OF BALL GRID ARRAY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 19.COMPARATIVE SHARE ANALYSIS OF CHIP SCALE PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 20.COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 21.COMPARATIVE SHARE ANALYSIS OF STACKED DIE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 22.COMPARATIVE SHARE ANALYSIS OF QUAD AND DUAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 23.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,BY APPLICATION,2021(%)
    FIGURE 24.COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 25.COMPARATIVE SHARE ANALYSIS OF CONSUMER ELECTRONICS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 26.COMPARATIVE SHARE ANALYSIS OF INDUSTRIAL OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 27.COMPARATIVE SHARE ANALYSIS OF TELECOMMUNICATION OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 28.COMPARATIVE SHARE ANALYSIS OF AEROSPACE AND DEFENSE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 29.COMPARATIVE SHARE ANALYSIS OF MEDICAL AND HEALTHCARE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 30.COMPARATIVE SHARE ANALYSIS OF LOGISTICS AND TRANSPORTATION OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031(%)
    FIGURE 31.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET BY REGION,2021
    FIGURE 32.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 33.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 34.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 35.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 36.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 37.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 38.ITALY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 39.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 40.SWEDEN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 41.NETHERLANDS OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 42.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 43.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 44.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 45.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 46.SOUTH KOREA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 47.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 48.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 49.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 50.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TESTING MARKET,2021-2031($MILLION)
    FIGURE 51. TOP WINNING STRATEGIES, BY YEAR
    FIGURE 52. TOP WINNING STRATEGIES, BY DEVELOPMENT
    FIGURE 53. TOP WINNING STRATEGIES, BY COMPANY
    FIGURE 54.PRODUCT MAPPING OF TOP 10 PLAYERS
    FIGURE 55.COMPETITIVE DASHBOARD
    FIGURE 56.COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
    FIGURE 57.ADVANCED SILICON S.A..: NET SALES ,($MILLION)
    FIGURE 58.ALPHACORE INC..: NET SALES ,($MILLION)
    FIGURE 59.AMKOR TECHNOLOGY, INC.: NET SALES ,($MILLION)
    FIGURE 60.DEVICE ENGINEERING INC..: NET SALES ,($MILLION)
    FIGURE 61.HIDENSITY GROUP (HMT MICROELECTRONIC AG).: NET SALES ,($MILLION)
    FIGURE 62.PRESTO ENGINEERING GROUP.: NET SALES ,($MILLION)
    FIGURE 63.SENCIO BV.: NET SALES ,($MILLION)
    FIGURE 64.SHORTLINK GROUP.: NET SALES ,($MILLION)
    FIGURE 65.SIFIVE, INC. (OPENFIVE).: NET SALES ,($MILLION)
    FIGURE 66.LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING).: NET SALES ,($MILLION)

 
 

The outsourced semiconductor assembly and test market is going through enormous transformation and growth. Surge in demand from automotive subsystems and connected devices fuels growth of the market.

In addition, increase in demand for consumer electronics and surge in urbanization across the globe drives the outsourced semiconductor assembly and test market growth. Moreover, increase in adoption of smartphones significantly propels the market growth. However, high cost associated with OSAT services is anticipated to hamper growth of the market during the forecast period. On the contrary, growing chip market is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rise in transition toward OSAT in emerging economies such as India, China, and South Korea is opportunistic for the market growth.

The outsourced semiconductor assembly and test market is competitive and comprises a number of regional and global vendors competing based on factors such as cost of services, reliability, and support services. Owing to the competition, vendors operating in the market are offering advanced outsourced semiconductor assembly and test services facilities to improve their market presence.

For instance, in June 2020, four top companies in the assembly, testing, marking, and packaging (ATMP) business discussed to set up their manufacturing units as well as develop export hubs to undertake outsourced semiconductor packaging and test services in India. These companies include Taiwanese majors ASE Technology Holding, Powertech Technology Inc., SPIL, and US-based Amkor Technology. In addition, key players are heavily investing in R&D activities to develop effective outsourced semiconductor assembly and test technology and services offerings, which is opportunistic for the market.

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FREQUENTLY ASKED QUESTIONS?

A. The global outsourced semiconductor assembly and test market is mainly driven by increase in demand for consumer electronics and surge in degree of urbanization. In addition, increase in adoption of smartphones significantly fuels the market growth.

A. The consumer electronics segment was the highest revenue contributor segment in 2021.

A. Asia Pacific is largest regional market for Outsourced Semiconductor Assembly and Testing owing to presence of number of outsourcing facilities in the region.

A. The top companies profiled in the report include Advanced Silicon S.A., Alphacore Inc., Amkor Technology, Inc., Device Engineering Inc., HiDensity Group (HMT microelectronic AG), Luminar Technologies, Inc. (Black Forest Engineering), Presto Engineering Group, Sencio BV, ShortLink group, and SiFive, Inc. (OpenFive).

A. The global outsourced semiconductor assembly and test market was valued at $34,553.5 million in 2021, and is projected to reach $60,334.5 million by 2031, registering a CAGR of 6.32% from 2022 to 2031.

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TARGETED MARKET VIEW

Targeted market view to provide pertinent information and save time of readers

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Why Allied Market Research?

Infallible Methodology

To ensure high-level data integrity, accurate analysis, and impeccable forecasts

Analyst Support

For complete satisfaction

Customization

On-demand customization of scope of the report to exactly meet your needs

TARGETED MARKET VIEW

Targeted market view to provide pertinent information and save time of readers