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Outsourced Semiconductor Assembly and Testing Market By Service Type (Testing and Assembly), Packaging Type (Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, and Quad & Dual), and Application (Automotive, Consumer Electronics, Industrial, Telecommunication, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2028

A08874
Pages: 260
Jun 2021 | 1462 Views
   
Author(s) : Shantanu Sachan , Vineet Kumar
Tables: 123
Charts: 77
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COVID-19

Pandemic disrupted the entire world and affected many industries.

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Outsourced Semiconductor Assembly and Testing Market Outlook - 2028

The global outsourced semiconductor assembly and testing market size was valued at $33,372.0 million in 2019, and outsourced semiconductor assembly and testing market size is projected to reach $51,037.5 million by 2028, growing at a CAGR of 5.1% from 2021 to 2028. North America was the highest revenue contributor, accounting for $13,442.2 million in 2019, and is estimated to reach $18,036.7 million by 2028, with a CAGR of 3.5%. 

COVID-19 scenario to impact automotive segment outsourced semiconductor assembly and test Market negatively.

Outsourced semiconductor assembly and test (OSAT) are the vendors that offer third-party IC-packaging and test services. Such vendors package semiconductor devices that are made by foundries as well as test devices prior to shipping to the market. Companies operating in the market offer innovative and cost-effective solutions that deliver processing speeds, higher performance, and functionality with a reduction in space in an electronic device. 

Outsourced-semiconductor-assembly-and-testing-Market-2021-2028

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Increase in demand for consumer electronics and surge in degree of urbanization across the globe primarily fuels growth of the market. In addition, growth in disposable income of people across the globe has significantly increase sales of consumer electronics devices such as TVs, mobile phones, and tablets, which boosts demand for outsourced semiconductor assembly and test services.

Outsourced Semiconductor Assembly and Testing Market
By Service type

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Assembly segment will grow at a highest CAGR of 5.8% during 2021 - 2028

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The global outsourced semiconductor assembly and test market share is analyzed by service type, packaging type, application, and region. On the basis of service type, the market is analyzed across testing and assembly. On the basis of packaging type, the market is divided into ball grid array, chip scale package, multi package, stacked die, and quad & dual. As per the application, the outsourced semiconductor assembly and testing market is categorized into automotive, consumer electronics, industrial, telecommunication, and others

Segment Overview

The global outsourced semiconductor assembly and test market share is analyzed by service type, packaging type, application, and region. On the basis of service type, the market is analyzed across testing and assembly. On the basis of packaging type, the market is divided into ball grid array, chip scale package, multi package, stacked die, and quad & dual. As per the application, the market is categorized into automotive, consumer electronics, industrial, telecommunication, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.

Region wise, the outsourced semiconductor assembly and testing market trends are analyzed across North America the (U.S., Canada, and Mexico), Europe (the UK, Germany, France, Russia, and rest of Europe), Asia-Pacific (China, Japan, India, Taiwan, and rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).  Asia-Pacific is estimated to be the largest and fastest-growing region in the outsourced semiconductor assembly and test market in terms of revenue. Further, surge in trend in the global automotive sector for advanced semiconductor chip package solutions is expected to propel growth of the market during the forecast period.

Outsourced Semiconductor Assembly and Testing Market
By Packaging Type

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Manufacturing segment generated the highest revenue in 2020.

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Leading outsourced semiconductor assembly and testing market players such as ASE Group, UTAC, SPIL, and Amkor are focusing their investments on technologically advanced and cost-effective products as well as rapid geographical expansions. For instance, in June 2020, four top global companies in assembly, testing, marking, and packaging business, including Taiwanese majors ASE Technology Holding, a provider of assembly and testing services planned to set up their manufacturing units in India to develop export hubs to undertake outsourced semiconductor packaging and test services.

Top Impacting Factors

Increase in demand for consumer electronics and surge in degree of urbanization across the globe primarily fuel growth of the outsourced semiconductor assembly and testing market. In addition, rise in disposable income of people across the globe has significantly increased sales of consumer electronics devices such as TVs, mobile phones, and tablets, which boosts demand for outsourced semiconductor assembly and test services. Moreover, increase in adoption of smartphones significantly propels the outsourced semiconductor assembly and testing market growth. 

However, high cost associated with OSAT services is anticipated to hamper growth of the market during the forecast period. On the contrary, growth in the chip market is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rise in transition toward OSAT in emerging economies such as India, China, and South Korea is opportunistic for the outsourced semiconductor assembly and testing market growth.

Competitive Analysis

Competitive analysis and profiles of the major outsourced semiconductor assembly and testing market players such as ASE Technology Holding, Co., LTD, Amkor Technology, Inc., Jiangsu Changjiang Electronics Technology Co., LTD, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, TongFu Microelectronics Co., LTD, King Yuan Electronics Corp., Hana Micron Inc., ChipMOS Technology Inc., and Unisem Group.

Outsourced Semiconductor Assembly and Testing Market
By Application

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automotive Segment holds a dominant position throughout the forecast period.

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Covid-19 Impact Analysis

Global outsourced semiconductor assembly and test (OSAT) market has been significantly impacted by the COVID-19 outbreak. Production facilities of electronics and semiconductors have been halted, owing to slowdown and unavailability of workforce across the globe. COVID-19 outbreak has caused a significant and protracted drop in manufacturing utilization and travel bans & facility closures kept workers out of their factories, which have led to slowdown in growth of the OSAT market in 2020.  

Asian and European countries under lockdowns have suffered major loss of business and revenue, owing to shutdown of manufacturing units in these regions. Operations of production and manufacturing industries have been heavily impacted by outbreak of the COVID-19 disease; thereby, leading to slowdown in growth of the OSAT market.  

However, negative impact of COVID-19 on the outsourced semiconductor assembly and test market is expected to be there for a short period of time, and in 2021 the market is anticipated to observe robust recovery rate due to extensive demand for installation of IoT devices across numerous industries and rapidly growing initiatives for smart cities and rapid adoption of smart devices technologies.

Outsourced Semiconductor Assembly and Testing Market
By Region

2028
Asia-pacific 
North America
Europe
Lamea

North America segment generated the highest revenue in 2020.

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Key Benefits For Stakeholders

  • This study comprises analytical depiction of the global outsourced semiconductor assembly and testing industry size along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall outsourced semiconductor assembly and testing market analysis is determined to understand the profitable trends to gain a stronger foothold.
  • The outsourced semiconductor assembly and testing industry report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current outsourced semiconductor assembly and testing market forecast is quantitatively analyzed from 2019 to 2027 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and the outsourced semiconductor assembly and testing market share of key vendors.
  • The report includes the market trends and the market share of key vendors.

Key Market Segments

By Service Type

  • Testing
  • Assembly

By Packaging Type

  • Ball Grid Array
  • Chip Scale Package
  • Multi Package
  • Stacked Die
  • Quad & Dual

By Application

  • Automotive
  • Consumer electronics
  • Industrial
  • Telecommunication
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Russia
    • Rest of Europe
  • Asia-Pacific
    • China 
    • Japan
    • India
    • Taiwan
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East 
    • Africa

Key Players

  • ASE Technology Holding, Co., LTD.
  • Amkor Technology, Inc.
  • Jiangsu Changjiang Electronics Technology Co., LTD
  • Powertech Technology Inc.
  • Tianshui Huatian Technology Co., LTD.
  • TongFu Microelectronics Co., LTD.
  • King Yuan Electronics Corp.
  • Hana Micron Inc.
  • ChipMOS Technology Inc.
  • Unisem Group
 

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings

2.1.1.Top impacting factors
2.1.2.Top investment pockets

2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key forces shaping outsourced semiconductor assembly and test (OSAT) market
3.3.Market dynamics

3.3.1.Drivers

3.3.1.1.Increase in demand for consumer electronics
3.3.1.2.Surge in degree of urbanization across the globe
3.3.1.3.Increase in adoption of smartphones

3.3.2.Restraint

3.3.2.1.High cost associated with OSAT services

3.3.3.Opportunities

3.3.3.1.Chip market to provide a huge opportunity for OSAT companies
3.3.3.2.Rise in transition toward OSAT in emerging economies

3.4.COVID-19 impact analysis on outsourced semiconductor assembly and test (OSAT)

3.4.1.Impact on market size
3.4.2.End user trends, preferences, and budget impact
3.4.3.Key player strategies to tackle the COVID-19 impact

CHAPTER 4:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY SERVICE TYPE

4.1.Overview
4.2.Testing

4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country

4.3.Assembly

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country

CHAPTER 5:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PACKAGING TYPE

5.1.Overview
5.2.Ball grid array

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country

5.3.Chip scale package

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country

5.4.Multi-package

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country

5.5.Stacked die

5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis, by country

5.6.Quad & dual

5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market analysis, by country

CHAPTER 6:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION

6.1.Overview
6.2.Automotive

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market analysis, by country

6.3.Consumer electronics

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market analysis, by country

6.4.Industrial

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market analysis, by country

6.5.Telecommunication

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market analysis, by country

6.6.Others

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market analysis, by country

CHAPTER 7:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY REGION

7.1.Overview
7.2.North America

7.2.1.Key market trends, growth factors, and opportunities
7.2.2.Market size and forecast, by service type
7.2.3.Market size and forecast, by packaging type
7.2.4.Market size and forecast, by application
7.2.5.Market analysis, by country

7.2.5.1.U.S.

7.2.5.1.1.Market size and forecast, by service type
7.2.5.1.2.Market size and forecast, by packaging type
7.2.5.1.3.Market size and forecast, by application

7.2.5.2.Canada

7.2.5.2.1.Market size and forecast, by service type
7.2.5.2.2.Market size and forecast, by packaging type
7.2.5.2.3.Market size and forecast, by application

7.2.5.3.Mexico

7.2.5.3.1.Market size and forecast, by service type
7.2.5.3.2.Market size and forecast, by packaging type
7.2.5.3.3.Market size and forecast, by application

7.3.Europe

7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Market size and forecast, by service type
7.3.3.Market size and forecast, by packaging type
7.3.4.Market size and forecast, by application
7.3.5.Market analysis, by country

7.3.5.1.UK

7.3.5.1.1.Market size and forecast, by service type
7.3.5.1.2.Market size and forecast, by packaging type
7.3.5.1.3.Market size and forecast, by application

7.3.5.2.Germany

7.3.5.2.1.Market size and forecast, by service type
7.3.5.2.2.Market size and forecast, by packaging type
7.3.5.2.3.Market size and forecast, by application

7.3.5.3.France

7.3.5.3.1.Market size and forecast, by service type
7.3.5.3.2.Market size and forecast, by packaging type
7.3.5.3.3.Market size and forecast, by application

7.3.5.4.Russia

7.3.5.4.1.Market size and forecast, by service type
7.3.5.4.2.Market size and forecast, by packaging type
7.3.5.4.3.Market size and forecast, by application

7.3.5.5.Rest of Europe

7.3.5.5.1.Market size and forecast, by service type
7.3.5.5.2.Market size and forecast, by packaging type
7.3.5.5.3.Market size and forecast, by application

7.4.Asia-Pacific

7.4.1.Key market trends, growth factors, and opportunities
7.4.2.Market size and forecast, by service type
7.4.3.Market size and forecast, by packaging type
7.4.4.Market size and forecast, by application
7.4.5.Market analysis, by country

7.4.5.1.China

7.4.5.1.1.Market size and forecast, by service type
7.4.5.1.2.Market size and forecast, by packaging type
7.4.5.1.3.Market size and forecast, by application

7.4.5.2.Japan

7.4.5.2.1.Market size and forecast, by service type
7.4.5.2.2.Market size and forecast, by packaging type
7.4.5.2.3.Market size and forecast, by application

7.4.5.3.India

7.4.5.3.1.Market size and forecast, by service type
7.4.5.3.2.Market size and forecast, by packaging type
7.4.5.3.3.Market size and forecast, by application

7.4.5.4.Taiwan

7.4.5.4.1.Market size and forecast, by service type
7.4.5.4.2.Market size and forecast, by packaging type
7.4.5.4.3.Market size and forecast, by application

7.4.5.5.Rest of Asia-Pacific

7.4.5.5.1.Market size and forecast, by service type
7.4.5.5.2.Market size and forecast, by packaging type
7.4.5.5.3.Market size and forecast, by application

7.5.LAMEA

7.5.1.Key market trends, growth factors, and opportunities
7.5.2.Market size and forecast, by service type
7.5.3.Market size and forecast, by packaging type
7.5.4.Market size and forecast, by application
7.5.5.Market analysis, by country

7.5.5.1.Latin America

7.5.5.1.1.Market size and forecast, by service type
7.5.5.1.2.Market size and forecast, by packaging type
7.5.5.1.3.Market size and forecast, by application

7.5.5.2.Middle East

7.5.5.2.1.Market size and forecast, by service type
7.5.5.2.2.Market size and forecast, by packaging type
7.5.5.2.3.Market size and forecast, by application

7.5.5.3.Africa

7.5.5.3.1.Market size and forecast, by service type
7.5.5.3.2.Market size and forecast, by packaging type
7.5.5.3.3.Market size and forecast, by application

CHAPTER 8:COMPETITIVE LANDSCAPE

8.1.Introduction
8.2.Key players Positioning, 2020
8.3.Top winning strategies

8.3.1.Top winning strategies, by year
8.3.2.Top winning strategies, by development
8.3.3.Top winning strategies, by company

CHAPTER 9:COMPANY PROFILES

9.1.AMKOR TECHNOLOGY, INC.

9.1.1.Company overview
9.1.2.Key executives
9.1.3.Company snapshot
9.1.4.Operating business segments
9.1.5.Product portfolio
9.1.6.R&D expenditure
9.1.7.Business performance
9.1.8.Key strategic moves and developments

9.2.ASE TECHNOLOGY HOLDING, CO., LTD.

9.2.1.Company overview
9.2.2.Key executives
9.2.3.Company snapshot
9.2.4.Operating business segments
9.2.5.Product portfolio
9.2.6.R&D expenditure
9.2.7.Business performance
9.2.8.Key strategic moves and developments

9.3.CHIPMOS TECHNOLOGY INC.

9.3.1.Company overview
9.3.2.Key executives
9.3.3.Company snapshot
9.3.4.Operating business segments
9.3.5.Product portfolio
9.3.6.R&D expenditure
9.3.7.Business performance

9.4.HANA MICRON INC.

9.4.1.Company overview
9.4.2.Key executives
9.4.3.Company snapshot
9.4.4.Operating business segments
9.4.5.Product portfolio
9.4.6.R&D expenditure
9.4.7.Business performance
9.4.8.Key strategic moves and developments

9.5.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD (JCET)

9.5.1.Company overview
9.5.2.Key executives
9.5.3.Company snapshot
9.5.4.Operating business segments
9.5.5.Product portfolio
9.5.6.R&D expenditure
9.5.7.Business performance
9.5.8.Key strategic moves and developments

9.6.KING YUAN ELECTRONICS CORP. (KYEC)

9.6.1.Company overview
9.6.2.Key executives
9.6.3.Company snapshot
9.6.4.Operating business segments
9.6.5.Product portfolio
9.6.6.R&D expenditure
9.6.7.Business performance
9.6.8.Key strategic moves and developments

9.7.POWERTECH TECHNOLOGY INC. (PTI)

9.7.1.Company overview
9.7.2.Key executives
9.7.3.Company snapshot
9.7.4.Operating business segments
9.7.5.Product portfolio
9.7.6.R&D expenditure
9.7.7.Business performance
9.7.8.Key strategic moves and developments

9.8.TIANSHUI HUATIAN TECHNOLOGY CO., LTD

9.8.1.Company overview
9.8.2.Key executives
9.8.3.Company snapshot
9.8.4.Operating business segments
9.8.5.Product portfolio
9.8.6.Business performance

9.9.TONGFU MICROELECTRONICS CO., LTD

9.9.1.Company overview
9.9.2.Key executives
9.9.3.Company snapshot
9.9.4.Operating business segments
9.9.5.Product portfolio
9.9.6.Business performance
9.9.7.Key strategic moves and developments

9.10.UNISEM GROUP

9.10.1.Company overview
9.10.2.Key executives
9.10.3.Company snapshot
9.10.4.Operating business segments
9.10.5.Product portfolio
9.10.6.R&D expenditure
9.10.7.Business performance
9.10.8.Key strategic moves and developments

LIST OF TABLES

TABLE 01.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 02.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR TESTING, BY REGION 2019–2028 ($MILLION)
TABLE 03.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR ASSEMBLY, BY REGION 2019–2028 ($MILLION)
TABLE 04.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 05.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR BALL GRID ARRAY, BY REGION  2019–2028 ($MILLION)
TABLE 06.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR CHIP SCALE PACKAGE, BY REGION 2019–2028 ($MILLION)
TABLE 07.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR MULTI-PACKAGE, BY REGION  2019–2028 ($MILLION)
TABLE 08.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR STACKED DIE, BY REGION 2019-2028 ($MILLION)
TABLE 09.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR QUAD & DUAL, BY REGION  2019-2028 ($MILLION)
TABLE 10.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 11.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR AUTOMOTIVE, BY REGION 2019–2028 ($MILLION)
TABLE 12.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR CONSUMER ELECTRONICS, BY REGION 2019–2028($MILLION)
TABLE 13.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR INDUSTRIAL, BY REGION 2019–2028 ($MILLION)
TABLE 14.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR TELECOMMUNICATION, BY REGION 2019–2028 ($MILLION)
TABLE 15.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR OTHERS, BY REGION 2019-2028 ($MILLION)
TABLE 16.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE  2019–2028 ($MILLION)
TABLE 17.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028($MILLION)
TABLE 18.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION  2019–2028 ($MILLION)
TABLE 19.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019-2028 ($MILLION)
TABLE 20.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 21.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 22.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 23.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE,  2019–2028 ($MILLION)
TABLE 24.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION 2019–2028 ($MILLION)
TABLE 25.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 26.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028 ($MILLION)
TABLE 27.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 28.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 29.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 30.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 31.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 32.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 33.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 34.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 35.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE,  2019–2028 ($MILLION)
TABLE 36.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 37.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 38.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 39.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 40.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE2019–2028 ($MILLION)
TABLE 41.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 42.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 43.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE, TYPE2019–2028 ($MILLION)
TABLE 44.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 45.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION,  2019–2028 ($MILLION)
TABLE 46.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 47.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028($MILLION)
TABLE 48.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 49.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE2019–2028 ($MILLION)
TABLE 50.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028 ($MILLION)
TABLE 51.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 52.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 53.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 54.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 55.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 56.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 57.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 58.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 59.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE,  2019–2028 ($MILLION)
TABLE 60.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 61.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028($MILLION)
TABLE 62.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028($MILLION)
TABLE 63.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 64.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 65.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 66.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 67.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE,  2019–2028 ($MILLION)
TABLE 68.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 69.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION,  2019–2028 ($MILLION)
TABLE 70.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE,  2019–2028 ($MILLION)
TABLE 71.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028($MILLION)
TABLE 72.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION,  2019–2028 ($MILLION)
TABLE 73.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)
TABLE 74.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)
TABLE 75.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)
TABLE 76.AMKOR TECHNOLOGY, INC.:KEY EXECUTIVES
TABLE 77.AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 78.AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 79.AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO
TABLE 80.AMKOR TECHNOLOGY, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 81.ASE TECHNOLOGY HOLDING, CO., LTD:KEY EXECUTIVES
TABLE 82.ASE TECHNOLOGY HOLDING, CO., LTD: COMPANY SNAPSHOT
TABLE 83.ASE TECHNOLOGY HOLDING, CO., LTD: OPERATING SEGMENTS
TABLE 84.ASE TECHNOLOGY HOLDING, CO., LTD: PRODUCT PORTFOLIO
TABLE 85.ASE TECHNOLOGY HOLDING, CO., LTD: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 86.CHIPMOS TECHNOLOGY INC.:KEY EXECUTIVES
TABLE 87.CHIPMOS TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 88.CHIPMOS TECHNOLOGY INC.: OPERATING SEGMENTS
TABLE 89.CHIPMOS TECHNOLOGY INC.: PRODUCT PORTFOLIO
TABLE 90.HANA MICRON INC.:KEY EXECUTIVES
TABLE 91.HANA MICRON INC.: COMPANY SNAPSHOT
TABLE 92.HANA MICRON INC.: OPERATING SEGMENTS
TABLE 93.HANA MICRON INC.: PRODUCT PORTFOLIO
TABLE 94.HANA MICRON INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 95.JCET:KEY EXECUTIVES
TABLE 96.JCET: COMPANY SNAPSHOT
TABLE 97.JCET: OPERATING SEGMENTS
TABLE 98.JCET: PRODUCT PORTFOLIO
TABLE 99.JCET: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 100.KING YUAN ELECTRONICS CORP.:KEY EXECUTIVES
TABLE 101.KING YUAN ELECTRONICS CORP.: COMPANY SNAPSHOT
TABLE 102.KING YUAN ELECTRONICS CORP.: OPERATING SEGMENTS
TABLE 103.KING YUAN ELECTRONICS CORP.: PRODUCT PORTFOLIO
TABLE 104.KING YUAN ELECTRONICS CORP.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 105.POWER TECHNOLOGY INC.:KEY EXECUTIVES
TABLE 106.POWER TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 107.POWER TECHNOLOGY INC.: PRODUCT CATEGORY
TABLE 108.POWER TECHNOLOGY INC.: PRODUCT PORTFOLIO
TABLE 109.POWER TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 110.TIANSHUI HUATIAN TECHNOLOGY CO., LTD:KEY EXECUTIVES
TABLE 111.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: COMPANY SNAPSHOT
TABLE 112.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: OPERATING SEGMENTS
TABLE 113.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: PRODUCT PORTFOLIO
TABLE 114.TONGFU MICROELECTRONICS CO., LTD:KEY EXECUTIVES
TABLE 115.TONGFU MICROELECTRONICS CO., LTD: COMPANY SNAPSHOT
TABLE 116.TONGFU MICROELECTRONICS CO., LTD: OPERATING SEGMENTS
TABLE 117.TONGFU MICROELECTRONICS CO., LTD: PRODUCT PORTFOLIO
TABLE 118.TONGFU MICROELECTRONICS CO., LTD: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 119.UNISEM GROUP:KEY EXECUTIVES
TABLE 120.UNISEM GROUP: COMPANY SNAPSHOT
TABLE 121.UNISEM GROUP: OPERATING SEGMENTS
TABLE 122.UNISEM GROUP: PRODUCT PORTFOLIO
TABLE 123.UNISEM GROUP: KEY STRATEGIC MOVES AND DEVELOPMENTS

LIST OF FIGURES

FIGURE 01.KEY MARKET SEGMENTS
FIGURE 02.EXECUTIVE SUMMARY
FIGURE 03.EXECUTIVE SUMMARY
FIGURE 04.TOP IMPACTING FACTORS
FIGURE 05.TOP INVESTMENT POCKETS
FIGURE 06.MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07.MODERATE TO HIGH THREAT OF NEW ENTRANTS
FIGURE 08.MODERATE THREAT OF SUBSTITUTES
FIGURE 09.MODERATE-TO-HIGH INTENSITY OF RIVALRY
FIGURE 10.MODERATE TO HIGH BARGAINING POWER OF BUYERS
FIGURE 11.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY SERVICE TYPE, 2019–2028
FIGURE 12.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR TESTING, BY COUNTRY, 2019 & 2028 (%)
FIGURE 13.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR ASSEMBLY, BY COUNTRY, 2019 & 2028 (%)
FIGURE 14.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PACKAGING TYPE, 2019–2028
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF BALL GRID ARRAY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2019 & 2028 (%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR CHIP SCALE PACKAGE, BY COUNTRY, 2019 & 2028 (%)
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR MULTI-PACKAGE, BY COUNTRY, 2019 & 2028 (%)
FIGURE 18.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR STACKED DIE, BY COUNTRY, 2019 & 2028 (%)
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR QUAD & DUAL, BY COUNTRY, 2019 & 2028 (%)
FIGURE 20.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION, 2019–2028
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR AUTOMOTIVE, BY COUNTRY, 2019 & 2028 (%)
FIGURE 22.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2019 & 2028 (%)
FIGURE 23.COMPARATIVE SHARE ANALYSIS OF MULTI-PACKAGE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR INDUSTRIAL, BY COUNTRY, 2019 & 2028 (%)
FIGURE 24.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR TELECOMMUNICATION, BY COUNTRY, 2019 & 2028 (%)
FIGURE 25.COMPARATIVE SHARE ANALYSIS OF OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET FOR OTHERS, BY COUNTRY, 2019 & 2028 (%)
FIGURE 26.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY REGION, 2019–2028
FIGURE 27.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY,  2019–2028
FIGURE 28.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 29.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 30.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 31.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2019–2028
FIGURE 32.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 33.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 34.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 35.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 36.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 37.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2019–2028
FIGURE 38.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 39.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 40.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 41.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 42.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE,  2019–2028 ($MILLION)
FIGURE 43.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY COUNTRY, 2019–2028
FIGURE 44.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 45.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028 ($MILLION)
FIGURE 46.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, 2019–2028($MILLION)
FIGURE 47.KEY PLAYER POSITIONG: OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, 2020
FIGURE 48.TOP WINNING STRATEGIES, BY YEAR, 2018–2021
FIGURE 49.TOP WINNING STRATEGIES, BY DEVELOPMENT, 2018–2021 (%)
FIGURE 50.TOP WINNING STRATEGIES, BY COMPANY, 2018–2021
FIGURE 51.AMKOR TECHNOLOGY, INC.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 52.AMKOR TECHNOLOGY, INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 53.AMKOR TECHNOLOGY, INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 54.ASE TECHNOLOGY HOLDING, CO., LTD: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 55.ASE TECHNOLOGY HOLDING, CO., LTD: NET SALES, 2017–2019 ($MILLION)
FIGURE 56.ASE TECHNOLOGY HOLDING, CO., LTD: REVENUE SHARE, BY SEGMENT, 2019 (%)
FIGURE 57.ASE TECHNOLOGY HOLDING, CO., LTD: REVENUE SHARE, BY REGION, 2019 (%)
FIGURE 58.CHIPMOS TECHNOLOGY INC.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 59.CHIPMOS TECHNOLOGY INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 60.CHIPMOS TECHNOLOGY INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 61.CHIPMOS TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 62.HANA MICRON INC.: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 63.HANA MICRON INC.: REVENUE, 2017–2019 ($MILLION)
FIGURE 64.JCET: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 65.JCET: REVENUE, 2018–2020 ($MILLION)
FIGURE 66.KING YUAN ELECTRONICS CORP.: R&D EXPENDITURE, 2017–2019 ($MILLION)
FIGURE 67.KING YUAN ELECTRONICS CORP.: REVENUE, 2017–2019 ($MILLION)
FIGURE 68.KING YUAN ELECTRONICS CORP.: REVENUE SHARE, BY REGION, 2019 (%)
FIGURE 69.POWER TECHNOLOGY INC.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 70.POWER TECHNOLOGY INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 71.POWER TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 72.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: REVENUE, 2018–2020 ($MILLION)
FIGURE 74.TONGFU MICROELECTRONICS CO., LTD: REVENUE, 2018–2020 ($MILLION)
FIGURE 75.UNISEM GROUP: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 76.UNISEM GROUP: REVENUE, 2018–2020 ($MILLION)
FIGURE 77.UNISEM GROUP: REVENUE SHARE, BY REGION, 2020 (%)

 
 

According to the CXOs of leading companies, the outsourced semiconductor assembly and test market is going through enormous transformation and growth. Surge in demand from automotive subsystems and connected devices is fueling the growth of the market.

In addition, increasing demand for consumer electronics and upsurge in the degree of urbanization across the globe. Moreover, increase in smartphone adoption significantly propels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the contrary, growing chip market is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rising transition towards in OSAT emerging economies such as India, China, and South Korea is opportunistic for the market growth.

The outsourced semiconductor assembly and test market is competitive and comprises a number of regional and global vendors competing based on factors such as cost of services, reliability, and support services. Owing to the competition, vendors operating in the market are offering advanced outsourced semiconductor assembly and test services facilities to improve their market presence. 

For instance, in June 2020, four top companies in the assembly, testing, marking, and packaging (ATMP) business discussed with the Indian government to set up their manufacturing units as well as develop export hubs to undertake outsourced semiconductor packaging and test services. The four companies includes, Taiwanese majors ASE Technology Holding, Powertech Technology Inc., SPIL, and US-based Amkor Technology. In addition, key players are heavily investing in R&D activities to develop effective industrial Ethernet switch technology and services offerings, which is opportunistic for the market.

 

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A. The Outsourced Semiconductor Assembly and Testing Market is estimated to grow at a CAGR of 5.1% from 2021 to 2028.

A. The Outsourced Semiconductor Assembly and Testing Market is projected to reach $51,037.5 million by 2028.

A. To get the latest version of sample report

A. Factors such as increase in adoption of smartphones drives the growth of the Outsourced Semiconductor Assembly and Testing market

A. The key players profiled in the report include ASE Technology Holding, Co., LTD, Amkor Technology, Inc., Jiangsu Changjiang Electronics Technology Co., LTD, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, TongFu Microelectronics Co., LTD, King Yuan Electronics Corp., Hana Micron Inc., ChipMOS Technology Inc., and Unisem Group. and many more.

A. On the basis of top growing big corporations, we select top 10 players.

A. The Outsourced Semiconductor Assembly and Testing Market is segmented on the basis of service type, packaging type, application, and region.

A. The key growth strategies of Outsourced Semiconductor Assembly and Testing market players include product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations.

A. Automotive Segment holds a dominant position throughout the forecast period.

A. Assembly segment will grow at a highest CAGR of 5.8% during 2021 - 2028

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