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2021
Outsourced Semiconductor Assembly And Testing Market

Outsourced Semiconductor Assembly and Testing Market By Process (Sawing, Sorting, Testing, and Assembly), Packaging Type (Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, and Quad & Dual), and Application (Consumer Electronics, Industrial, Telecommunication, Automotive, Aerospace & Defense, Medical & Healthcare, and Logistics & Transportation): Global Opportunity Analysis and Industry Forecast, 2021–2030

A08874
Pages: 222
Oct 2021 | 5817 Views
Author(s) : Shantanu Sachan , Vineet Kumar
Tables: 102
Charts: 56
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COVID-19

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Outsourced Semiconductor Assembly and Testing Market outlook - 2030

The global outsourced semiconductor assembly and testing market was valued at $34.44 billion in 2020, and is projected to reach $52.93 billion by 2030, growing at a CAGR of 4.9% from 2021 to 2030. North America was the highest revenue contributor, accounting for $13.87 billion in 2020, and is estimated to reach $18.70 billion by 2030, with a CAGR of 3.5%. 

COVID-19 scenario to impact automotive segment outsourced semiconductor assembly and testing Market negatively.

OSAT semiconductor companies that offer third-party IC-packaging and test services. Such vendors package semiconductor devices that are made by foundries as well as test devices prior to shipping to the market. Companies operating in the market offer innovative and cost-effective solutions that deliver processing speeds, higher performance, and functionality with a reduction in space in an electronic device.

Outsourced-semiconductor-assembly-and-testing-market

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Increase in demand for consumer electronics and surge in degree of urbanization across the globe primarily fuels the growth of the market. In addition, growth in disposable income of people across the globe has significantly increased the sales of consumer electronics devices such as TVs, mobile phones, and tablets, which boost the demand for outsourced semiconductor assembly and testing industry.

Segmentation Analysis 

The outsourced semiconductor assembly and testing market share is analyzed by process, packaging type, application, and region. On the basis of process, the market is analyzed across sawing, sorting, testing, and assembly. On the basis of packaging type, the market is divided into ball grid array, chip scale package, multi package, stacked die, and quad & dual. As per the application, the market is categorized into consumer electronics, industrial, telecommunication, automotive, aerospace and defense, medical and healthcare, and logistics and transportation. 

Outsourced Semiconductor Assembly and Testing Market
By Process

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Testing segment generated the highest revenue in 2020.

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Region wise, the outsourced semiconductor assembly and testing market trends are analyzed across North America the (U.S., Canada, and Mexico), Europe (the UK, Germany, France, Russia, and rest of Europe), Asia-Pacific (China, Japan, India, Taiwan, and rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific is estimated to be the largest and fastest-growing regions in the outsourced semiconductor assembly and testing market in terms of revenue. Further, surge in trend in the global automotive sector for advanced semiconductor chip package solutions is expected to propel the growth of the outsourced semiconductor assembly and testing during the forecast period.

Leading outsourced semiconductor assembly and testing market players such as ASE Group, UTAC, SPIL, and Amkor are focusing their investments on technologically advanced and cost-effective products as well as rapid geographical expansions. For instance, in June 2020, four top global companies in assembly, testing, marking, and packaging business, including Taiwanese majors ASE Technology Holding, a provider of assembly and testing services planned to set up their manufacturing units in India to develop export hubs to undertake OSAT semiconductor packaging and test services.

Top Impacting Factors

Increase in demand for consumer electronics and surge in degree of urbanization across the globe primarily fuel growth of the outsourced semiconductor assembly and testing market size. In addition, rise in disposable income of people across the globe has significantly increased sales of consumer electronics devices such as TVs, mobile phones, and tablets, which boosts demand for outsourced semiconductor assembly and test services. 

Outsourced Semiconductor Assembly and Testing Market
By Packaging Type

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Multi Package segment will grow at a highest CAGR of 7.3% during 2021 - 2030

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Moreover, increase in adoption of smartphones significantly propels the outsourced semiconductor assembly and testing market growth. However, high cost associated with OSAT services is anticipated to hamper growth of the market during the forecast period. On the contrary, growth in the chip market is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rise in transition toward OSAT in emerging economies such as India, China, and South Korea is opportunistic for the outsourced semiconductor assembly and testing market growth.

Competitive Analysis

Competitive analysis and profiles of the major outsourced semiconductor assembly and testing market players such as ASE Technology Holding, Co., LTD, Amkor Technology, Inc., Jiangsu Changjiang Electronics Technology Co., LTD, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, TongFu Microelectronics Co., LTD, King Yuan Electronics Corp., Hana Micron Inc., ChipMOS Technology Inc., and Unisem Group.

Outsourced Semiconductor Assembly and Testing Market
By Application

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Consumer Electronic segment generated the highest revenue in 2020.

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Covid-19 Impact Analysis

The global outsourced semiconductor assembly and test (OSAT) market has been significantly impacted by the COVID-19 outbreak. Production facilities of electronics and semiconductors have been halted, owing to slowdown and unavailability of workforce across the globe. COVID-19 outbreak has caused a significant and protracted drop in manufacturing utilization and travel bans & facility closures kept workers out of their factories, which have led to slowdown in growth of the OSAT market in 2020.  

Asian and European countries under lockdowns have suffered major loss of business and revenue, owing to shutdown of manufacturing units in these regions. Operations of production and manufacturing industries have been heavily impacted by outbreak of the COVID-19 disease; thereby, leading to slowdown in growth of the OSAT market.  

However, negative impact of COVID-19 on the outsourced semiconductor assembly and test market is expected to be there for a short period of time, and in 2021 the market is anticipated to observe robust recovery rate due to extensive demand for installation of IoT devices across numerous industries and rapidly growing initiatives for smart cities and rapid adoption of smart devices technologies.

Outsourced Semiconductor Assembly and Testing Market
By Region

2030
Asia-pacific 
North America
Europe
Lamea

North America segment generated the highest revenue in 2020.

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Key Benefits For Stakeholders

  • This study comprises analytical depiction of the global outsourced semiconductor assembly and testing industry size along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall outsourced semiconductor assembly and testing market analysis is determined to understand the profitable trends to gain a stronger foothold.
  • The outsourced semiconductor assembly and testing industry report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current outsourced semiconductor assembly and testing market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and the outsourced semiconductor assembly and testing market share of key vendors.
  • The report includes the market trends and the market share of key vendors.

Key Market Segments

  • BY PROCESS
    • Sawing
    • Sorting
    • Testing
    • Assembly
  • BY PACKAGING TYPE
    • Ball grid array
    • Chip scale package
    • Multi-package
    • Stacked die
    • Quad & dual
  • BY APPLICATION
    • Automotive
    • Consumer electronics
    • Industrial
    • Telecommunication
    • Aerospace and defense
    • Medical and healthcare
    • Logistics and transportation
  • BY REGION
    • North America
      • U.S.
      • Canada
      • Mexico
    • Europe
      • UK
      • Germany
      • France
      • Italy
      • Russia
      • Sweden
      • Netherlands
      • Rest of Europe
    • Asia-Pacific
    • LAMEA


Key Market Players

  • ADVANCED SILICON S.A
  • ALPHACORE INC.
  • AMKOR TECHNOLOGY, INC.
  • DEVICE ENGINEERING INC.
  • HIDENSITY GROUP (HMT MICROELECTRONIC AG)
  • LUMINAR TECHNOLOGIES, INC. (BLACK FOREST ENGINEERING)
  • PRESTO ENGINEERING GROUP
  • SENCIO BV
  • SHORTLINK GROUP
  • SIFIVE, INC. (OPENFIVE)
 

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According to the CXOs of leading companies, the outsourced semiconductor assembly and test market is going through enormous transformation and growth. Surge in demand from automotive subsystems and connected devices is fueling the growth of the market.

In addition, increasing demand for consumer electronics and upsurge in the degree of urbanization across the globe. Moreover, increase in smartphone adoption significantly propels the market growth. However, high cost associated with OSAT services may hamper growth of the market during forecast period. On the contrary, growing chip met is anticipated to provide a huge opportunity for OSAT companies. Furthermore, rising transition towards in OSAT emerging economies such as India, China, and South Korea is opportunistic for the market growth.

The outsourced semiconductor assembly and test market is competitive and comprises a number of regional and global vendors competing based on factors such as cost of services, reliability, and support services. Owing to the competition, vendors operating in the market are offering advanced outsourced semiconductor assembly and test services facilities to improve their market presence. 

For instance, in June 2020, four top companies in the assembly, testing, marking, and packaging (ATMP) business discussed with the Indian government to set up their manufacturing units as well as develop export hubs to undertake outsourced semiconductor packaging and test services. The four companies includes, Taiwanese majors ASE Technology Holding, Powertech Technology Inc., SPIL, and US-based Amkor Technology. In addition, key players are heavily investing in R&D activities to develop effective industrial Ethernet switch technology and services offerings, which is opportunistic for the market.

 

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FREQUENTLY ASKED QUESTIONS?

A. The Outsourced Semiconductor Assembly and Testing Market is estimated to grow at a CAGR of 4.9% from 2021 to 2030.

A. The Outsourced Semiconductor Assembly and Testing Market is projected to reach $52.9 billion by 2030.

A. To get the latest version of sample report

A. Factors such as Increase in demand for consumer electronics and surge in degree of urbanization across the globe primarily fuels drives the growth of the Outsourced Semiconductor Assembly and Testing market

A. The key players profiled in the report include ASE Technology Holding, Co., LTD, Amkor Technology, Inc., Jiangsu Changjiang Electronics Technology Co., LTD, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD, TongFu Microelectronics Co., LTD, King Yuan Electronics Corp., Hana Micron Inc., ChipMOS Technology Inc., and Unisem Group, and many more.

A. On the basis of top growing big corporations, we select top 10 players.

A. The Outsourced Semiconductor Assembly and Testing Market is segmented on the basis of process, packaging type, application, and region.

A. The key growth strategies of Outsourced Semiconductor Assembly and Testing market players include product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations.

A. subsegments of process are sawing, sorting, testing, and assembly.

A. Multi Package segment will grow at a highest CAGR of 7.3% during 2021 - 2030.

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