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Pin Fin Heat Sink for IGBT Market by Material Type (Copper and Aluminum): Global Opportunity Analysis and Industry Forecast, 2019–2025

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SE_195292
Pages: 191
May 2019 | 176 Views
 
Author(s) : Rahul Kumar , Supradip Baul
Tables: 71
Charts: 67
 

Pin Fin Heat Sink for IGBT Market Outlook - 2025

The Pin Fin Heat Sink for IGBT market was valued at $799.4 million in 2018, and is projected to reach $1,084.3 million by 2025, registering a CAGR of 4.4% from 2019 to 2025. Asia-Pacific was the highest contributor to the global pin fin heat sink for IGBT market, with $400.5 million in 2018, and is estimated to reach $586.1 million by 2025, registering a CAGR of 5.5% during the forecast period.

Pin Fin Heat Sink for IGBT Market Outlook

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Pin fin heat sinks are compact sinks that are fabricated with a large number of pins created to dissipate heat out into the surrounding air. These heat sinks are designed and structured geometrically to make them highly effective. A heat sink is typically a solid block of copper or aluminum with multiple fins that increase the available surface area for heat transfer. Pin fins simultaneously increase both the heat transfer surface area and the heat transfer coefficient. 

Increase in need for effective cooling of the consumer electronics by proper heat dissipation method, followed by increase in demand for huge power supply due to growing population and digitization are some of the major factors that drive the global pin fin heat sink for IGBT market growth.  Moreover, rise in demand for pin fin heat sinks owing to its multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks is also expected to fuel the growth of pin fin heat sink for IGBT market. In addition, increase in use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink are expected to provide lucrative opportunities for the pin fin heat sink for IGBT industry during the forecast period. However, low capacity utilization of pin fin heat sink manufacturers is affecting the growth of this market.

Pin Fin Heat Sink for IGBT Market By Material Type

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The global pin fin heat sink for IGBT market analysis includes material type and region. Based on material type, it is bifurcated into copper and aluminum. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

The global pin fin heat sink for IGBT market segments are dominated by players such as Apex Microtechnology, Aavid Thermalloy LLC, Honeywell International Inc., Comair Rotron, CUI Inc., Advanced Thermal Solutions, Kunshan Googe Metal Products Co. Ltd., Allbrass Industrial, The Brass Forging Company, and others.

Pin Fin Heat Sink for IGBT Market By Regional Analysis

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Top Impacting Factors

The significant impacting factors in the global pin fin Heat Sink industry include rise in need for effective cooling of the consumer electronics by proper heat dissipation method and greater demand for pin fin heat sinks owing to their multiple advantages over other types of heat sinks. In addition, the market is also influenced by low capacity utilization of pin fin heat sink manufacturers, emerging trend of increasing usage of IGBT modules in the automotive field for HEVs, and use of hybrid pin fin heat sink. Each of these factors is anticipated to have a definite impact on the pin fin heat sink for IGBT market size during the forecast period. 

Greater demand for pin fin heat sinks owing to their multiple advantages over other types of heat sinks 

The volumetric efficiency of pin fins is higher than the other heat-sink types. As a result, pin fin heat sinks are significantly smaller and lighter as compared to their cooling ability. In one instance, switching to a pin fin heat sink while keeping the same 1 × 1-in. footprint dropped the temperature by 10°C. In some instances, pin fins are 2 to 10 times more efficient than extrusion-type heat sinks.

In addition, pin fin heat sinks are available at low cost and provide the necessary thermal performance. For the electronic manufacturers and its limited resources, high-efficiency pin fin heat sinks offer thermal performance on a budget with the flexibility to fit into a variety of systems and designs. Heat sink efficiency is measured by the thermal performance generated per given volume. An efficient heat sink provides considerable cooling while consuming a less physical volume. Because of a compact pin fin structure, forged pin fin heat sinks provide efficient cooling solutions. In addition, the omnidirectional structure of pin fin is very efficient. Pin fins possess a large surface area per given volume. Moreover, due to the structure of a round pin, air blustered into the heat sink creates a significant amount of turbulence between the pins, breaking the boundary layers around the pins. This effect enhances the heat sink's high thermal co-efficiencies. As a result, pin fins provide low thermal resistances per given volume.

Rise in need for effective cooling of the consumer electronics by proper heat dissipation method

The performance reliability and life of electronic equipment are inversely related to the component temperature of the equipment. Thus, to maintain operating temperature of the electronic components, there is a constant need for effective cooling by proper heat dissipation method, thus keeping operating conditions within safe level. Pin fin heat sinks are devices that improve heat dissipation from a hot surface, generally the case of a heat generating component, to a cooler ambient, usually air. A heat sink lowers the “solid surface and coolant air” barrier mainly by increasing the surface area that is in direct contact with the coolant. This permits more heat to be dissipated and drops the device operating temperature. The prime purpose of a heat sink is to maintain the device temperature beneath the maximum permissible temperature specified by the device manufacturers. In addition, heat is dissipated by conduction from the electronic components by means of interface at the junction and into the fin, from which heat is ejected through convection and radiation. According to a paper published in IOP Conference Series - “Heat Transfer Numerical Simulation and Optimization of a Heat Sink” – it was demonstrated that pin fins belong to the group of fins that simultaneously increase both the heat transfer surface area and the heat transfer coefficient. Elliptical fin heat sinks are good for electronic cooling purpose. Thus, for reducing the temperature of the electronic components and maintaining the heat dissipation, the need for using the pin fin heat sink is on the rise, which drives the growth of this market.

Low capacity utilization of pin fin heat sink manufacturers

Due to various technological advanced manufacturing methods such as hot and cold forging, metal injection molding, and additive manufacturing; the production capacity of pin fin heat sinks for IGBT manufacturers is still not completely being utilized. Thus, the complexity of manufacturing the pin fin heat sinks is expected to restrain the growth of this market.

Use of hybrid pin fin heat sink 

Hybrid pin fin heat sinks consist of aluminum pin fins that are reflowed onto a copper plate. Hybrid pin fin heat sinks have better performance than aluminum and copper pin fin heat sinks. It is observed from the results of CFD analysis of splayed pin fin heat sink for electronic cooling that optimum cooling is attained by splayed & hybrid pin fin heat sinks, as these heat sink designs keep electronic circuits 20 to 40% cooler than standard pin fin heat sinks. Further, hybrid heat sinks are manufactured for devices that feature small and focused heat sources. Such devices entail heat sinks that are significantly bigger than the devices they reside on. These heat sinks are also proposed for multi-device cooling, in which a single heat sink is used to cool more than one module. Thus, this trend of using hybrid pin fin heat sink is expected to offer significant opportunities for pin fin heat sink for IGBT market in the coming years.

Key Benefits for Pin Fin Heat Sink for IGBT Market:

  • This study comprises analytical depiction of the global pin fin heat sink for IGBT market size along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall pin fin heat sink for IGBT market potential is determined to understand the profitable trends to gain a stronger foothold.
  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current pin fin heat sink for IGBT market forecast is quantitatively analyzed from 2019 to 2025 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the pin fin heat sink for IGBT market.
  • The report includes the pin fin heat sink for IGBT market share of key vendors and pin fin heat sink for IGBT market trends.

Pin Fin Heat Sink for IGBT Market Key Segments:

By Material Type 

  • Copper
  • Aluminum

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Market Players Profiled

  • Advanced Micro Devices (AMD)
  • Apex Microtechnology 
  • Aavid Thermalloy, LLC
  • Advanced Thermal Solutions, Inc.
  • Allbrass Industrial The Brass
  • CUI Inc
  • Comair Rotron
  • Honeywell International Inc
  • Kunshan Googe Metal Products Co., Ltd.
 

CHAPTER 1:    INTRODUCTION

1.1.    REPORT DESCRIPTION
1.2.    KEY BENEFITS FOR STAKEHOLDERS
1.3.    RESEARCH METHODOLOGY

1.3.1.    Secondary research
1.3.2.    Primary research
1.3.3.    Analyst tools & models

CHAPTER 2:    EXECUTIVE SUMMARY

2.1.    CXO PERSPECTIVE

CHAPTER 3:    MARKET OVERVIEW

3.1.    MARKET DEFINITION AND SCOPE
3.2.    KEY FINDINGS

3.2.1.    Top investment pockets
3.2.2.    Top winning strategies of customers of pin-fin heat sink

3.3.    PORTER'S FIVE FORCES ANALYSIS
3.4.    KEY PLAYER POSITIONING
3.5.    MARKET DYNAMICS

3.5.1.    Drivers

3.5.1.1.    Rise in need for effective cooling of the consumer electronics by proper heat dissipation method
3.5.1.2.    Greater demand for pin fin heat sinks owing to its multiple advantages over other types of heat sinks
3.5.1.3.    Rise in demand for power supply devices and usage of IGBTs

3.5.2.    Restraints

3.5.2.1.    Low capacity utilization of pin fin heat sink manufacturers

3.5.3.    Opportunities

3.5.3.1.    Emerging trend of increasing usage of IGBT modules in the automotive sector for HEVs
3.5.3.2.    Use of hybrid pin fin heat sink

3.6.    TECHNOLOGY LANDSCAPE

3.6.1.    Pin Fin Technology
3.6.2.    Various Pin Fin Manufacturing Techniques

3.6.2.1.    Hot and Cold Forging
3.6.2.2.    Metal Injection Molding
3.6.2.3.    Additive Manufacturing

3.7.    COMPETITIVE LANDSCAPE

CHAPTER 4:    PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE

4.1.    OVERVIEW
4.2.    COPPER

4.2.1.    Key market trends, growth factors and opportunities
4.2.2.    Market size and forecast, by region
4.2.3.    Market analysis, by country

4.3.    ALUMINIUM

4.3.1.    Key market trends, growth factors and opportunities
4.3.2.    Market size and forecast, by region
4.3.3.    Market analysis, by country

CHAPTER 5:    PIN FIN HEAT SINK FOR IGBT MARKET, BY REGION

5.1.    OVERVIEW
5.2.    NORTH AMERICA

5.2.1.    Key market trends and opportunities
5.2.2.    Market size and forecast, by material type
5.2.3.    Market size and forecast, by country
5.2.4.    U.S.

5.2.4.1.    Market size and forecast, by material type

5.2.5.    Canada

5.2.5.1.    Market size and forecast, by material type

5.2.6.    Mexico

5.2.6.1.    Market size and forecast, by material type

5.3.    EUROPE

5.3.1.    Key market trends and opportunities
5.3.2.    Market size and forecast, by material type
5.3.3.    Market size and forecast, by country

5.3.4.    UK

5.3.4.1.    Market size and forecast, by material type

5.3.5.    Germany

5.3.5.1.    Market size and forecast, by material type

5.3.6.    France

5.3.6.1.    Market size and forecast, by material type

5.3.7.    Italy

5.3.7.1.    Market size and forecast, by material type

5.3.8.    Rest of Europe

5.3.8.1.    Market size and forecast, by material type

5.4.    ASIA-PACIFIC

5.4.1.    Key market trends and opportunities
5.4.2.    Market size and forecast, by material type
5.4.3.    Market size and forecast, by country
5.4.4.    China

5.4.4.1.    Market size and forecast, by material type

5.4.5.    India

5.4.5.1.    Market size and forecast, by material type

5.4.6.    Japan

5.4.6.1.    Market size and forecast, by material type

5.4.7.    Rest of Asia-Pacific

5.4.7.1.    Market size and forecast, by material type

5.5.    LAMEA

5.5.1.    Key market trends and opportunities
5.5.2.    Market size and forecast, by material type
5.5.3.    Market size and forecast, by country
5.5.4.    Latin America

5.5.4.1.    Market size and forecast, by material type

5.5.5.    Middle East

5.5.5.1.    Market size and forecast, by material type

5.5.6.    Africa

5.5.6.1.    Market size and forecast, by material type

CHAPTER 6:    SUPPLIER/MANUFACTURER: COMPANY PROFILES

6.1.    APEX MICROTECHNOLOGY (HEICO CORPORATION)

6.1.1.    Company overview
6.1.2.    Company snapshot
6.1.3.    Operating business segments
6.1.4.    Product portfolio
6.1.5.    Business performance

6.2.    AAVID THERMALLOY, LLC (BOYD CORPORATION)

6.2.1.    Company overview
6.2.2.    Company snapshot
6.2.3.    Product portfolio
6.2.4.    Key strategic moves and developments

6.3.    ADVANCED THERMAL SOLUTIONS, INC.

6.3.1.    Company overview
6.3.2.    Company snapshot
6.3.3.    Product portfolio

6.4.    ALLBRASS INDUSTRIAL

6.4.1.    Company overview
6.4.2.    Company snapshot
6.4.3.    Product portfolio

6.5.    CUI INC.

6.5.1.    Company overview
6.5.2.    Company snapshot
6.5.3.    Operating business segments
6.5.4.    Product portfolio
6.5.5.    Key strategic moves and developments

6.6.    COMAIR ROTRON

6.6.1.    Company overview
6.6.2.    Company snapshot
6.6.3.    Product portfolio

6.7.    HONEYWELL INTERNATIONAL INC.

6.7.1.    Company overview
6.7.2.    Company snapshot
6.7.3.    Operating business segments
6.7.4.    Product portfolio
6.7.5.    Business performance

6.8.    KUNSHAN GOOGE METAL PRODUCTS CO., LTD.

6.8.1.    Company overview
6.8.2.    Company snapshot
6.8.3.    Product portfolio

CHAPTER 7:    CUSTOMERS - COMPANY PROFILES

7.1.    ABB LTD.

7.1.1.    Company overview
7.1.2.    Key Executives
7.1.3.    Company snapshot
7.1.4.    Operating business segments
7.1.5.    R&D Expenditure
7.1.6.    Business performance
7.1.7.    Key strategic moves and developments

7.2.    FUJI ELECTRIC CO., LTD.

7.2.1.    Company overview
7.2.2.    Key Executives
7.2.3.    Company snapshot
7.2.4.    Operating business segments
7.2.5.    R&D Expenditure
7.2.6.    Business performance
7.2.7.    Key strategic moves and developments

7.3.    HITACHI, LTD.

7.3.1.    Company overview
7.3.2.    Key Executives
7.3.3.    Company snapshot
7.3.4.    Operating business segments
7.3.5.    Business performance
7.3.6.    Key strategic moves and developments

7.4.    INFINEON TECHNOLOGIES AG

7.4.1.    Company overview
7.4.2.    Key Executives
7.4.3.    Company snapshot
7.4.4.    Operating business segments
7.4.5.    R&D Expenditure
7.4.6.    Business performance
7.4.7.    Key strategic moves and developments

7.5.    MITSUBISHI ELECTRIC CORPORATION

7.5.1.    Company overview
7.5.2.    Key Executives
7.5.3.    Company snapshot
7.5.4.    Operating business segments
7.5.5.    R&D Expenditure
7.5.6.    Business performance
7.5.7.    Key strategic moves and developments

7.6.    ROBERT BOSCH GMBH

7.6.1.    Company overview
7.6.2.    Key Executives
7.6.3.    Company snapshot
7.6.4.    Operating business segments
7.6.5.    R&D Expenditure
7.6.6.    Business performance
7.6.7.    Key strategic moves and developments

7.7.    SEMIKRON INTERNATIONAL GMBH

7.7.1.    Company overview
7.7.2.    Key Executives
7.7.3.    Company snapshot
7.7.4.    Key strategic moves and developments

7.8.    SIEMENS AG

7.8.1.    Company overview
7.8.2.    Key Executives
7.8.3.    Company snapshot
7.8.4.    Operating business segments
7.8.5.    R&D Expenditure
7.8.6.    Business performance
7.8.7.    Key strategic moves and developments

7.9.    STARPOWER EUROPE AG

7.9.1.    Company overview
7.9.2.    Company snapshot

7.10.    UNITED AUTOMOTIVE ELECTRONICS CO., LTD. (UAES)

7.10.1.    Company overview
7.10.2.    Company snapshot
7.10.3.    Key strategic moves and developments

LIST OF TABLES

TABLE 01.    COMPETITVE LANDSCAPE
TABLE 02.    GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET REVENUE, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 03.    PIN FIN HEAT SINK FOR IGBT MARKET REVENUE, FOR COPPER, BY REGION, 2018–2025 ($MILLION)
TABLE 04.    PIN FIN HEAT SINK FOR IGBT MARKET REVENUE, FOR ALUMINIUM, BY REGION, 2018–2025 ($MILLION)
TABLE 05.    PIN FIN HEAT SINK FOR IGBT MARKET REVENUE, BY REGION, 2018–2025 ($MILLION)
TABLE 06.    NORTH AMERICA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 07.    NORTH AMERICA PIN FIN HEAT SINK FOR IGBT MARKET, BY COUNTRY, 2018–2025 ($MILLION)
TABLE 08.    U.S. PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 09.    CANADA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 10.    MEXICO PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 11.    EUROPE PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 12.    EUROPE PIN FIN HEAT SINK FOR IGBT MARKET, BY COUNTRY, 2018–2025 ($MILLION)
TABLE 13.    UK PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 14.    GERMANY PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 15.    FRANCE PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 16.    ITALY PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 17.    REST OF EUROPE PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 18.    ASIA-PACIFIC PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 19.    ASIA-PACIFIC PIN FIN HEAT SINK FOR IGBT MARKET, BY COUNTRY, 2018–2025 ($MILLION)
TABLE 20.    CHINA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 21.    INDIA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 22.    JAPAN PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 23.    REST OF ASIA-PACIFIC PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 24.    LAMEA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 25.    LAMEA PIN FIN HEAT SINK FOR IGBT MARKET, BY COUNTRY, 2018–2025 ($MILLION)
TABLE 26.    LATIN AMERICA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 27.    MIDDLE EAST PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 28.    AFRICA PIN FIN HEAT SINK FOR IGBT MARKET, BY MATERIAL TYPE, 2018–2025 ($MILLION)
TABLE 29.    APEX MICROTECHNOLOGY: COMPANY SNAPSHOT
TABLE 30.    HEICO CORPORATION: OPERATING SEGMENTS
TABLE 31.    APEX MICROTECHNOLOGY: PRODUCT PORTFOLIO
TABLE 32.    AAVID THERMALLOY, LLC: COMPANY SNAPSHOT
TABLE 33.    AAVID THERMALLOY, LLC: PRODUCT PORTFOLIO
TABLE 34.    AAVID THERMALLOY, LLC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 35.    ADVANCED THERMAL SOLUTIONS, INC.: COMPANY SNAPSHOT
TABLE 36.    ADVANCED THERMAL SOLUTIONS, INC.: PRODUCT PORTFOLIO
TABLE 37.    ALLBRASS INDUSTRIAL: COMPANY SNAPSHOT
TABLE 38.    ALLBRASS INDUSTRIAL: PRODUCT PORTFOLIO
TABLE 39.    CUI INC.: COMPANY SNAPSHOT
TABLE 40.    CUI INC.: OPERATING SEGMENTS
TABLE 41.    CUI INC.: PRODUCT PORTFOLIO
TABLE 42.    CUI INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 43.    COMAIR ROTRON: COMPANY SNAPSHOT
TABLE 44.    COMAIR ROTRON: PRODUCT PORTFOLIO
TABLE 45.    HONEYWELL INTERNATIONAL INC.: COMPANY SNAPSHOT
TABLE 46.    HONEYWELL INTERNATIONAL INC.: OPERATING SEGMENTS
TABLE 47.    HONEYWELL INTERNATIONAL INC.: PRODUCT PORTFOLIO
TABLE 48.    KUNSHAN GOOGE METAL PRODUCTS CO., LTD.: COMPANY SNAPSHOT
TABLE 49.    KUNSHAN GOOGE METAL PRODUCTS CO., LTD.: PRODUCT PORTFOLIO
TABLE 50.    ABB LTD.:KEY EXECUTIVES
TABLE 51.    ABB LTD.: COMPANY SNAPSHOT
TABLE 52.    ABB LTD.: OPERATING SEGMENTS
TABLE 53.    FUJI ELECTRIC CO., LTD:KEY EXECUTIVES
TABLE 54.    FUJI ELECTRIC CO., LTD.: COMPANY SNAPSHOT
TABLE 55.    FUJI ELECTRIC CO., LTD.: OPERATING SEGMENTS
TABLE 56.    HITACHI, LTD.: COMPANY SNAPSHOT
TABLE 57.    HITACHI, LTD.: OPERATING SEGMENTS
TABLE 58.    INFINEON TECHNOLOGIES AG: KEY EXECUTIVES
TABLE 59.    INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT
TABLE 60.    INFINEON TECHNOLOGIES AG: OPERATING SEGMENTS
TABLE 61.    MITSUBISHI ELECTRIC CORPORATION.: COMPANY SNAPSHOT
TABLE 62.    MITSUBISHI ELECTRIC CORPORATION: OPERATING SEGMENTS
TABLE 63.    KEY EXECUTIVES
TABLE 64.    ROBERT BOSCH GMBH: COMPANY SNAPSHOT
TABLE 65.    ROBERT BOSCH GMBH: OPERATING SEGMENTS
TABLE 66.    SEMIKRON INTERNATIONAL GMBH: COMPANY SNAPSHOT
TABLE 67.    SIEMENS AG:KEY EXECUTIVES
TABLE 68.    SIEMENS AG: COMPANY SNAPSHOT
TABLE 69.    SIEMENS AG: OPERATING SEGMENTS
TABLE 70.    STARPOWER EUROPE AG: COMPANY SNAPSHOT
TABLE 71.    UNITED AUTOMOTIVE ELECTRONICS CO., LTD. (UAES): COMPANY SNAPSHOT

LIST OF FIGURES

FIGURE 01.    GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025
FIGURE 02.    PIN FIN HEAT SINK FOR IGBT MARKET, BY REGION, 2018–2025
FIGURE 03.    GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET: KEY PLAYERS
FIGURE 04.    GLOBAL PIN FIN HEAT SINK FOR IGBT MARKET SEGMENTATION
FIGURE 05.    TOP INVESTMENT POCKETS
FIGURE 06.    TOP WINNING STRATEGIES OF CUSTOMERS OF PIN-FIN HEAT SINK, BY YEAR, 2015–2018*
FIGURE 07.    TOP WINNING STRATEGIES OF CUSTOMERS OF PIN-FIN HEAT SINK, BY DEVELOPMENT, 2015–2018* (%)
FIGURE 08.    TOP WINNING STRATEGIES OF CUSTOMERS OF PIN-FIN HEAT SINK, BY COMPANY, 2015–2018*
FIGURE 09.    MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 10.    LOW BARGAINING POWER OF BUYERS
FIGURE 11.    MODERATE THREAT OF SUBSTITUTES
FIGURE 12.    MODERATE-TO-HIGH THREAT OF NEW ENTRANTS
FIGURE 13.    LOW COMPETITIVE RIVALRY
FIGURE 14.    KEY PLAYER POSITIONING, 2018
FIGURE 15.    DRIVERS, RESTRAINTS, AND OPPORTUNITIES
FIGURE 16.    COMPARATIVE SHARE ANALYSIS OF PIN FIN HEAT SINK FOR IGBT MARKET, FOR COPPER, BY COUNTRY,  2018 & 2025 (%)
FIGURE 17.    COMPARATIVE SHARE ANALYSIS OF PIN FIN HEAT SINK FOR IGBT MARKET, FOR ALUMINIUM, BY COUNTRY,  2018 & 2025 (%)
FIGURE 18.    U.S. PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 19.    CANADA PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 20.    MEXICO PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 21.    UK PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 22.    GERMANY PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 23.    FRANCE PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 24.    ITALY PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 25.    REST OF EUROPE PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 26.    CHINA PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 27.    INDIA PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 28.    JAPAN PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 29.    REST OF ASIA-PACIFIC PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 30.    LATIN AMERICA PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 31.    MIDDLE EAST PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 32.    AFRICA PIN FIN HEAT SINK FOR IGBT MARKET, 2018–2025 ($MILLION)
FIGURE 33.    APEX MICROTECHNOLOGY: REVENUE, 2016–2018 ($MILLION)
FIGURE 34.    APEX MICROTECHNOLOGY: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 35.    APEX MICROTECHNOLOGY: REVENUE SHARE BY GEOGRAPHY, 2018 (%)
FIGURE 36.    HONEYWELL INTERNATIONAL INC.: REVENUE, 2016–2018 ($MILLION)
FIGURE 37.    HONEYWELL INTERNATIONAL INC.: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 38.    HONEYWELL INTERNATIONAL INC.: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 39.    R&D EXPENDITURE, 2016–2018 ($MILLION)
FIGURE 40.    ABB LTD.: REVENUE, 2016–2018 ($MILLION)
FIGURE 41.    ABB LTD.: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 42.    ABB LTD.: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 43.    R&D EXPENDITURE, 2016–2018 ($MILLION)
FIGURE 44.    FUJI ELECTRIC CO., LTD.: REVENUE, 2016–2018 ($MILLION)
FIGURE 45.    FUJI ELECTRIC CO., LTD.: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 46.    FUJI ELECTRIC CO., LTD.: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 47.    HITACHI, LTD.:KEY EXECUTIVES
FIGURE 48.    HITACHI, LTD.: REVENUE, 2015–2017 ($MILLION)
FIGURE 49.    HITACHI, LTD.: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 50.    HITACHI, LTD.: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 51.    R&D EXPENDITURE, 2016–2018 ($MILLION)
FIGURE 52.    INFINEON TECHNOLOGIES AG: REVENUE, 2016–2018 ($MILLION)
FIGURE 53.    INFINEON TECHNOLOGIES AG: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 54.    INFINEON TECHNOLOGIES AG: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 55.    MITSUBISHI ELECTRIC CORPORATION.: KEY EXECUTIVES
FIGURE 56.    R&D EXPENDITURE, 2016–2018 ($MILLION)
FIGURE 57.    MITSUBISHI ELECTRIC CORPORATION: REVENUE, 2016-2018 ($MILLION)
FIGURE 58.    MITSUBISHI ELECTRIC CORPORATION: REVENUE SHARE BY SEGMENT, 2017 (%)
FIGURE 59.    MITSUBISHI ELECTRIC CORPORATION: REVENUE SHARE BY REGION, 2017 (%)
FIGURE 60.    R&D EXPENDITURE, 2016–2018 ($MILLION)
FIGURE 61.    ROBERT BOSCH GMBH: REVENUE, 2016–2018 ($MILLION)
FIGURE 62.    ROBERT BOSCH GMBH: REVENUE SHARE BY SEGMENT, 2018 (%)
FIGURE 63.    ROBERT BOSCH GMBH: REVENUE SHARE BY REGION, 2018 (%)
FIGURE 64.    SEMIKRON INTERNATIONAL GMBH:KEY EXECUTIVES
FIGURE 65.    R&D EXPENDITURE, 2016–2017 ($MILLION)
FIGURE 66.    SIEMENS AG: REVENUE, 2016–2018 ($MILLION)
FIGURE 67.    SIEMENS AG: REVENUE SHARE BY SEGMENT, 2018 (%)


 

 
 

Pin fin heat sink is a passive heat exchanger designed to solve complex thermal dissipation where heat loads are substantial and space is limited. Pin-fin heat sinks consist of a base and an array of embedded pins. These pin fin heat sinks are used for IGBT as increase in the processing power of electronic equipment often means that more transistors have to be deployed into tighter packages. The higher circuit densities increase the amount of heat that must be dissipated. Thus, to dissipate that heat the pin fin heat sinks are utilized for IGBT.

The factors such as increase in need for proper heat dissipation required in IGBT implanted electronic devices including power equipment and consumer electronics are fueling the growth of the global pin fin heat sink for IGBT market. In addition, companies are trying to leverage the mixture of aluminum as well as copper, generally called as hybrid pin fin heat sink to build effective heat exchange and improve the productivity and offerings. In the near future, increased adoption of pin fin heat sinks in the developing regions and development of smarter devices are expected to provide lucrative growth opportunities for the key players operating in the global pin fin heat sink for IGBT market.

Asia-Pacific accounted for the highest revenue share in the global market in 2018 followed by Europe, North America, and LAMEA. However, Asia-Pacific is expected to grow at a higher rate during the forecast period.

Apex Microtechnology, Aavid Thermalloy LLC, Honeywell International Inc., Comair Rotron, CUI Inc., Advanced Thermal Solutions, Kunshan Googe Metal Products Co. Ltd., Allbrass Industrial, The Brass Forging Company, and others are the key market players that occupy a significant revenue share in the pin fin heat sink for IGBT market.

 

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