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2019
Pin Fin Heat Sink For Igbt Market

Pin Fin Heat Sink for IGBT Market

by Material Type (Copper and Aluminum): Global Opportunity Analysis and Industry Forecast, 2019-2025
Update Available On-Demand

Report Code: A04929
Pages: 191
May 2019 | 8261 Views
Author(s) : Rahul Kumar , Supradip Baul
Tables: 71
Charts: 67
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Pin Fin Heat Sink for IGBT Market Outlook - 2025

The Pin Fin Heat Sink for IGBT market was valued at $799.4 million in 2018, and is projected to reach $1,084.3 million by 2025, registering a CAGR of 4.4% from 2019 to 2025. Asia-Pacific was the highest contributor to the global pin fin heat sink for IGBT market, with $400.5 million in 2018, and is estimated to reach $586.1 million by 2025, registering a CAGR of 5.5% during the forecast period.

Pin Fin Heat Sink for IGBT Market Outlook

Pin fin heat sinks are compact sinks that are fabricated with a large number of pins created to dissipate heat out into the surrounding air. These heat sinks are designed and structured geometrically to make them highly effective. A heat sink is typically a solid block of copper or aluminum with multiple fins that increase the available surface area for heat transfer. Pin fins simultaneously increase both the heat transfer surface area and the heat transfer coefficient. 

Increase in need for effective cooling of the consumer electronics by proper heat dissipation method, followed by increase in demand for huge power supply due to growing population and digitization are some of the major factors that drive the global pin fin heat sink for IGBT market growth.  Moreover, rise in demand for pin fin heat sinks owing to its multiple advantages such as higher volumetric efficiency and low cost over other types of heat sinks is also expected to fuel the growth of pin fin heat sink for IGBT market. In addition, increase in use of IGBT modules in the automotive field for HEVs and hybrid pin fin heat sink are expected to provide lucrative opportunities for the pin fin heat sink for IGBT industry during the forecast period. However, low capacity utilization of pin fin heat sink manufacturers is affecting the growth of this market.

Pin Fin Heat Sink for IGBT Market By Material Type


 

The global pin fin heat sink for IGBT market analysis includes material type and region. Based on material type, it is bifurcated into copper and aluminum. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

The global pin fin heat sink for IGBT market segments are dominated by players such as Apex Microtechnology, Aavid Thermalloy LLC, Honeywell International Inc., Comair Rotron, CUI Inc., Advanced Thermal Solutions, Kunshan Googe Metal Products Co. Ltd., Allbrass Industrial, The Brass Forging Company, and others.

Pin Fin Heat Sink for IGBT Market By Regional Analysis

Top Impacting Factors

The significant impacting factors in the global pin fin Heat Sink industry include rise in need for effective cooling of the consumer electronics by proper heat dissipation method and greater demand for pin fin heat sinks owing to their multiple advantages over other types of heat sinks. In addition, the market is also influenced by low capacity utilization of pin fin heat sink manufacturers, emerging trend of increasing usage of IGBT modules in the automotive field for HEVs, and use of hybrid pin fin heat sink. Each of these factors is anticipated to have a definite impact on the pin fin heat sink for IGBT market size during the forecast period. 

Greater demand for pin fin heat sinks owing to their multiple advantages over other types of heat sinks 

The volumetric efficiency of pin fins is higher than the other heat-sink types. As a result, pin fin heat sinks are significantly smaller and lighter as compared to their cooling ability. In one instance, switching to a pin fin heat sink while keeping the same 1 × 1-in. footprint dropped the temperature by 10°C. In some instances, pin fins are 2 to 10 times more efficient than extrusion-type heat sinks.

In addition, pin fin heat sinks are available at low cost and provide the necessary thermal performance. For the electronic manufacturers and its limited resources, high-efficiency pin fin heat sinks offer thermal performance on a budget with the flexibility to fit into a variety of systems and designs. Heat sink efficiency is measured by the thermal performance generated per given volume. An efficient heat sink provides considerable cooling while consuming a less physical volume. Because of a compact pin fin structure, forged pin fin heat sinks provide efficient cooling solutions. In addition, the omnidirectional structure of pin fin is very efficient. Pin fins possess a large surface area per given volume. Moreover, due to the structure of a round pin, air blustered into the heat sink creates a significant amount of turbulence between the pins, breaking the boundary layers around the pins. This effect enhances the heat sink's high thermal co-efficiencies. As a result, pin fins provide low thermal resistances per given volume.

Rise in need for effective cooling of the consumer electronics by proper heat dissipation method

The performance reliability and life of electronic equipment are inversely related to the component temperature of the equipment. Thus, to maintain operating temperature of the electronic components, there is a constant need for effective cooling by proper heat dissipation method, thus keeping operating conditions within safe level. Pin fin heat sinks are devices that improve heat dissipation from a hot surface, generally the case of a heat generating component, to a cooler ambient, usually air. A heat sink lowers the “solid surface and coolant air” barrier mainly by increasing the surface area that is in direct contact with the coolant. This permits more heat to be dissipated and drops the device operating temperature. The prime purpose of a heat sink is to maintain the device temperature beneath the maximum permissible temperature specified by the device manufacturers. In addition, heat is dissipated by conduction from the electronic components by means of interface at the junction and into the fin, from which heat is ejected through convection and radiation. According to a paper published in IOP Conference Series - “Heat Transfer Numerical Simulation and Optimization of a Heat Sink” – it was demonstrated that pin fins belong to the group of fins that simultaneously increase both the heat transfer surface area and the heat transfer coefficient. Elliptical fin heat sinks are good for electronic cooling purpose. Thus, for reducing the temperature of the electronic components and maintaining the heat dissipation, the need for using the pin fin heat sink is on the rise, which drives the growth of this market.

Low capacity utilization of pin fin heat sink manufacturers

Due to various technological advanced manufacturing methods such as hot and cold forging, metal injection molding, and additive manufacturing; the production capacity of pin fin heat sinks for IGBT manufacturers is still not completely being utilized. Thus, the complexity of manufacturing the pin fin heat sinks is expected to restrain the growth of this market.

Use of hybrid pin fin heat sink 

Hybrid pin fin heat sinks consist of aluminum pin fins that are reflowed onto a copper plate. Hybrid pin fin heat sinks have better performance than aluminum and copper pin fin heat sinks. It is observed from the results of CFD analysis of splayed pin fin heat sink for electronic cooling that optimum cooling is attained by splayed & hybrid pin fin heat sinks, as these heat sink designs keep electronic circuits 20 to 40% cooler than standard pin fin heat sinks. Further, hybrid heat sinks are manufactured for devices that feature small and focused heat sources. Such devices entail heat sinks that are significantly bigger than the devices they reside on. These heat sinks are also proposed for multi-device cooling, in which a single heat sink is used to cool more than one module. Thus, this trend of using hybrid pin fin heat sink is expected to offer significant opportunities for pin fin heat sink for IGBT market in the coming years.

Key Benefits for Pin Fin Heat Sink for IGBT Market:

  • This study comprises analytical depiction of the global pin fin heat sink for IGBT market size along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall pin fin heat sink for IGBT market potential is determined to understand the profitable trends to gain a stronger foothold.
  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current pin fin heat sink for IGBT market forecast is quantitatively analyzed from 2019 to 2025 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the pin fin heat sink for IGBT market.
  • The report includes the pin fin heat sink for IGBT market share of key vendors and pin fin heat sink for IGBT market trends.

Pin Fin Heat Sink for IGBT Market Report Highlights

Aspects Details
By Material Type
  • Copper
  • Aluminum
By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (UK, Germany, France, Italy, Rest of Europe)
  • Asia-Pacific  (China, India, Japan, Rest of Asia-Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players APEX MICROTECHNOLOGY (HEICO CORPORATION), AAVID THERMALLOY, LLC (BOYD CORPORATION), ADVANCED THERMAL SOLUTIONS, INC., ALLBRASS INDUSTRIAL, CUI INC., COMAIR ROTRON, HONEYWELL INTERNATIONAL INC., KUNSHAN GOOGE METAL PRODUCTS CO., LTD.
CUSTOMERS - COMPANY PROFILES ABB LTD., FUJI ELECTRIC CO., LTD., HITACHI, LTD., INFINEON TECHNOLOGIES AG, MITSUBISHI ELECTRIC CORPORATION, ROBERT BOSCH GMBH, SEMIKRON INTERNATIONAL GMBH, SIEMENS AG, STARPOWER EUROPE AG, UNITED AUTOMOTIVE ELECTRONICS CO., LTD. (UAES)
 

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Pin fin heat sink is a passive heat exchanger designed to solve complex thermal dissipation where heat loads are substantial and space is limited. Pin-fin heat sinks consist of a base and an array of embedded pins. These pin fin heat sinks are used for IGBT as increase in the processing power of electronic equipment often means that more transistors have to be deployed into tighter packages. The higher circuit densities increase the amount of heat that must be dissipated. Thus, to dissipate that heat the pin fin heat sinks are utilized for IGBT.

The factors such as increase in need for proper heat dissipation required in IGBT implanted electronic devices including power equipment and consumer electronics are fueling the growth of the global pin fin heat sink for IGBT market. In addition, companies are trying to leverage the mixture of aluminum as well as copper, generally called as hybrid pin fin heat sink to build effective heat exchange and improve the productivity and offerings. In the near future, increased adoption of pin fin heat sinks in the developing regions and development of smarter devices are expected to provide lucrative growth opportunities for the key players operating in the global pin fin heat sink for IGBT market.

Asia-Pacific accounted for the highest revenue share in the global market in 2018 followed by Europe, North America, and LAMEA. However, Asia-Pacific is expected to grow at a higher rate during the forecast period.

Apex Microtechnology, Aavid Thermalloy LLC, Honeywell International Inc., Comair Rotron, CUI Inc., Advanced Thermal Solutions, Kunshan Googe Metal Products Co. Ltd., Allbrass Industrial, The Brass Forging Company, and others are the key market players that occupy a significant revenue share in the pin fin heat sink for IGBT market.

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