Potting Compound Market by Resin Type (Epoxy, Polyurethane, Silicone, Polyester, Polyamide, Polyolefin, and Acrylics), Curing Techniques (UV Curing, Thermal Curing, and Room Temperature Curing), and Application (Electrical and Electronics), and End User (Electronics, Aerospace, Automotive, Industrial, and Others): Global Opportunity Analysis and Industry Forecast, 2018 - 2025
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MA_171624
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Pages: 505
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Apr
2019 |
4714 Views
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Author(s) :
Krunal Yeware and Abhijith Yenduri
, Onkar sumant
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Tables: 376
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Charts: NA
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Formats*:
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Potting Compound Market Outlook - 2025
The global potting compound market was valued at $2,904.2 million in 2017, and is expected to reach $3,836.5 million by 2025, registering a CAGR of 3.6% from 2018 to 2025. Potting compounds are encapsulants that are used in the electronic assembly to protect the electronic component, equipment, and products by maintaining its quality. Silicone, Epoxy, and polyurethane are the prominent resins used in the potting process, which exhibit excellent properties against environmental conditions.
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The global potting compound market is expected to grow significantly during the forecast period considering the growth in major application areas of potting compounds. The growth of this market is highly attributed to suitable properties of potting compounds in the electronics and electrical applications. Potting compound market size is driven by its superior characteristics such as excellent thermal conductivity and stability, super adhesive strength, chemical resistance, and outstanding electrical insulation.
Thermal conductivity and stability associated with potting compounds has been fueling its adoption as electrical equipment are regularly used in low, medium, and high voltage applications. Furthermore, expanding consumer electronics industry linked with trend for microelectronics is further encouraging the demand for potting compounds. In microelectronics, potting compounds are used in the mass production, therefore, rise in the demand for microelectronics is expected to provide lucrative opportunities for the market growth over the coming years.
The potting compound market is segmented into resin type, curing techniques, application, end user, and region. Based on type, the market is divided into epoxy, polyurethane, silicone, polyester, polyamide, polyolefin, and acrylics. Based on the curing technology, the market is classified into UV curing, thermal curing, and room temperature curing. Market segmentation based on the application includes electricals and electronics applications. Based on end user, the market is categorized into electronics, aerospace, automotive, industrial, and others. Based on region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
Asia-Pacific accounted for the largest market share in 2017 and is expected to further dominate the global potting compound market during the forecast period. Presence of major application industries such as automotive and electronics is the prominent growth driver in this region. Silicone is one of the largely adopted resin in this region due to growing automotive production and sale.
The potting compound market analysis covers in-depth information of major industry participants. Some of the major players in the market include Henkel AG & Co. KGaA, The 3M Company, MG Chemicals, ELANTAS GmbH, ALPAS Srl, Dymax Corporation, Aremco Products, Inc., DowDuPont Inc, HItach Chemical LLC, WEVO-CHEMIE GmbH, Huntsman Advanced Materials, and Wacker-Chemie. The other players in the value chain include Master Bond, Inc., Lord Corporation, RBC Industries, Inc., and Shanghai Sepna Chemical Technology Co. Ltd.
Most of the key industry participants are opting product launch and acquisition as their key business strategies in order to attain competitive edge over other market players. The potting compound market is moving toward the growth phase; therefore, heavy investment in the new product developments are projected during the forecast period.
Potting Compound Market Share, by Resin Type
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Based on type, the market is classified into epoxy, polyurethane, silicone, polyester, polyamide, polyolefin, and acrylics. Silicone emerged as the largest revenue generating segment among others as a result of its compatibility to work in the high as well as low-temperature range. On the other hand, polyester resin segment is anticipated to exhibit highest CAGR during the forecast period.
Potting Compound Market Share, by Curing Techniques
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Based on technology, the market is divided into UV curing, thermal curing, and room temperature curing. UV curing technique is accounted for the largest market share in 2017 and it is anticipated to continue its dominance during the assessment period.
Potting Compound Market Share, by Application
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Based on application, the market is bifurcated into electrical and electronics. Electronics applications acquired the largest market share in 2017 as a result of high demand for potting compounds in the surface mount packages and memory devices and microprocessors applications.
Potting Compound Market Share, by End User
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Based on End User, the potting compound market is classified into electronics, aerospace, automotive, industrial, and others. Electronics end use industry was the largest shareholder in 2017 due to suitable properties of potting compounds in the electronics and electrical applications. On the other hand, the automotive industry is expected to exhibit highest growth rate during review period on account of high growth in automotive production and sales.
Potting Compound Market Share, by Region
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Based on Region, the potting compound market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific emerged as a global leader in 2017 and is anticipated to continue its dominance during the forecast period. The region has a presence of electronics industry and automotive industry which are the two largest end user industries for potting compound. Whereas, North America projected to grow at the highest CAGR during the assessment period.
Key Benefits for Potting Compound Market:
- The report provides an in-depth analysis of the potting compound market forecast along with the current and future potting compound market trends.
- This report highlights the key drivers, opportunities, and restraints of the market along with the impact analysis of the forecast period.
- Porter’s five forces analysis helps analyze the potential of the buyers & suppliers and the competitive scenario of the potting compound industry for strategy building.
- A comprehensive analysis of the factors that drive and restrain the growth of the potting compound market is provided.
- The qualitative data in this report aims on market dynamics, trends, and developments.
- The potting compound market size is provided in terms of volume as well as revenue.
- An extensive analysis of various regions provides insights that are expected to allow companies to strategically plan their business moves.
- The profiles of key players along with their key strategic developments are enlisted in the report
Potting Compound Market Segmentation:
The potting compound market is segmented based on type, technology, application, and region.
Key Market Segments
By Resin Type
- Epoxy
- Polyurethane
- Silicone
- Polyester
- Polyamide
- Polyolefin
- Acrylics
By Curing Techniques
- UV Curing
- Thermal Curing
- Room Temperature Curing
By Application
-
Electrical
-
Electronics
By End User
- Electronics
- Aerospace
- Automotive
- Industrial
- Others
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- UK
- France
- Italy
- Spain
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- Australia
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Brazil
- Saudi Arabia
- South Africa
- Rest of LAMEA
CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Secondary research
1.4.2. Primary research
1.5. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.2.2. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Perfectly suitable properties for electronic applications
3.4.1.2. Increased consumer electronic industry output and trend for miniaturization
3.4.2. Restraint
3.4.2.1. Improper section of potting resin
3.4.3. Opportunity
3.4.3.1. Gradual adoption of two component polyurethane potting compounds
3.5. Top player positioning, 2017
CHAPTER 4: GLOBAL POTTING COMPOUNDS MARKET, BY RESIN TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Epoxy
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis, by country
4.3. Polyurethane
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis, by country
4.4. Silicone
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis, by country
4.5. Polyester
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market share analysis, by country
4.6. Polyamide
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market share analysis, by country
4.7. Polyolefin
4.7.1. Key market trends, growth factors, and opportunities
4.7.2. Market size and forecast, by region
4.7.3. Market share analysis, by country
4.8. Acrylics
4.8.1. Key market trends, growth factors, and opportunities
4.8.2. Market size and forecast, by region
4.8.3. Market share analysis, by country
CHAPTER 5: GLOBAL POTTING COMPOUNDS MARKET, BY CURING TECHNIQUE
5.1. Overview
5.1.1. Market size and forecast
5.2. UV Curing
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis, by country
5.3. Thermal Curing
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis, by country
5.4. Room Temperature Curing
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis, by country
CHAPTER 6: GLOBAL POTTING COMPOUNDS MARKET, BY APPLICATION
6.1. Overview
6.1.1. Market size and forecast
6.2. Electrical
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market size and forecast, by type
6.2.4. Market share analysis, by country
6.3. Electronics
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market size and forecast, by type
6.3.4. Market share analysis, by country
CHAPTER 7: GLOBAL POTTING COMPOUNDS MARKET, BY END USER
7.1. Overview
7.1.1. Market size and forecast
7.2. Electronics
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis, by country
7.3. Aerospace
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis, by country
7.5. Industrial
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis, by country
7.6. Others
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis, by country
CHAPTER 8: GLOBAL POTTING COMPOUNDS MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by resin type
8.2.3. Market size and forecast, by curing technique
8.2.4. Market size and forecast, by application
8.2.4.1. Market size and forecast, by electrical application
8.2.4.2. Market size and forecast, by electronics application
8.2.4.3. Market size and forecast, by electrical application
8.2.4.4. Market size and forecast, by electronics application
8.2.5. Market size and forecast, by end-user
8.2.6. Market share analysis, by country
8.2.7. U.S.
8.2.7.1. Market size and forecast, by resin type
8.2.7.2. Market size and forecast, by curing technique
8.2.7.3. Market size and forecast, by application
8.2.7.3.1. Market size and forecast, by electrical application
8.2.7.3.2. Market size and forecast, by electronics application
8.2.7.3.3. Market size and forecast, by electrical application
8.2.7.3.4. Market size and forecast, by electronics application
8.2.7.4. Market size and forecast, by end-user
8.2.8. Canada
8.2.8.1. Market size and forecast, by resin type
8.2.8.2. Market size and forecast, by curing technique
8.2.8.3. Market size and forecast, by application
8.2.8.3.1. Market size and forecast, by electrical application
8.2.8.3.2. Market size and forecast, by electronics application
8.2.8.3.3. Market size and forecast, by electrical application
8.2.8.3.4. Market size and forecast, by electronics application
8.2.8.4. Market size and forecast, by end-user
8.2.9. Mexico
8.2.9.1. Market size and forecast, by resin type
8.2.9.2. Market size and forecast, by curing technique
8.2.9.3. Market size and forecast, by application
8.2.9.3.1. Market size and forecast, by electrical application
8.2.9.3.2. Market size and forecast, by electronics application
8.2.9.3.3. Market size and forecast, by electrical application
8.2.9.3.4. Market size and forecast, by electronics application
8.2.9.4. Market size and forecast, by end-user
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by resin type
8.3.3. Market size and forecast, by curing technique
8.3.4. Market size and forecast, by application
8.3.4.1. Market size and forecast, by electrical application
8.3.4.2. Market size and forecast, by electronics application
8.3.4.3. Market size and forecast, by electrical application
8.3.4.4. Market size and forecast, by electronics application
8.3.5. Market size and forecast, by end-user
8.3.6. Market share analysis, by country
8.3.7. France
8.3.7.1. Market size and forecast, by resin type
8.3.7.2. Market size and forecast, by curing technique
8.3.7.3. Market size and forecast, by application
8.3.7.3.1. Market size and forecast, by electrical application
8.3.7.3.2. Market size and forecast, by electronics application
8.3.7.3.3. Market size and forecast, by electrical application
8.3.7.3.4. Market size and forecast, by electronics application
8.3.7.4. Market size and forecast, by end-user
8.3.8. Germany
8.3.8.1. Market size and forecast, by resin type
8.3.8.2. Market size and forecast, by curing technique
8.3.8.3. Market size and forecast, by application
8.3.8.3.1. Market size and forecast, by electrical application
8.3.8.3.2. Market size and forecast, by electronics application
8.3.8.3.3. Market size and forecast, by electrical application
8.3.8.3.4. Market size and forecast, by electronics application
8.3.8.4. Market size and forecast, by end-user
8.3.9. UK
8.3.9.1. Market size and forecast, by resin type
8.3.9.2. Market size and forecast, by curing technique
8.3.9.3. Market size and forecast, by application
8.3.9.3.1. Market size and forecast, by electrical application
8.3.9.3.2. Market size and forecast, by electronics application
8.3.9.3.3. Market size and forecast, by electrical application
8.3.9.3.4. Market size and forecast, by electronics application
8.3.9.4. Market size and forecast, by end-user
8.3.10. Spain
8.3.10.1. Market size and forecast, by resin type
8.3.10.2. Market size and forecast, by curing technique
8.3.10.3. Market size and forecast, by application
8.3.10.3.1. Market size and forecast, by electrical application
8.3.10.3.2. Market size and forecast, by electronics application
8.3.10.3.3. Market size and forecast, by electrical application
8.3.10.3.4. Market size and forecast, by electronics application
8.3.10.4. Market size and forecast, by end-user
8.3.11. Italy
8.3.11.1. Market size and forecast, by resin type
8.3.11.2. Market size and forecast, by curing technique
8.3.11.3. Market size and forecast, by application
8.3.11.3.1. Market size and forecast, by electrical application
8.3.11.3.2. Market size and forecast, by electronics application
8.3.11.3.3. Market size and forecast, by electrical application
8.3.11.3.4. Market size and forecast, by electronics application
8.3.11.4. Market size and forecast, by end-user
8.3.12. Rest of Europe
8.3.12.1. Market size and forecast, by resin type
8.3.12.2. Market size and forecast, by curing technique
8.3.12.3. Market size and forecast, by application
8.3.12.3.1. Market size and forecast, by electrical application
8.3.12.3.2. Market size and forecast, by electronics application
8.3.12.3.3. Market size and forecast, by electrical application
8.3.12.3.4. Market size and forecast, by electronics application
8.3.12.4. Market size and forecast, by end-user
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by resin type
8.4.3. Market size and forecast, by curing technique
8.4.4. Market size and forecast, by application
8.4.4.1. Market size and forecast, by electrical application
8.4.4.2. Market size and forecast, by electronics application
8.4.4.3. Market size and forecast, by electrical application
8.4.4.4. Market size and forecast, by electronics application
8.4.5. Market size and forecast, by end-user
8.4.6. Market share analysis, by country
8.4.7. India
8.4.7.1. Market size and forecast, by resin type
8.4.7.2. Market size and forecast, by curing technique
8.4.7.3. Market size and forecast, by application
8.4.7.3.1. Market size and forecast, by electrical application
8.4.7.3.2. Market size and forecast, by electronics application
8.4.7.3.3. Market size and forecast, by electrical application
8.4.7.3.4. Market size and forecast, by electronics application
8.4.7.4. Market size and forecast, by end-user
8.4.8. China
8.4.8.1. Market size and forecast, by resin type
8.4.8.2. Market size and forecast, by curing technique
8.4.8.3. Market size and forecast, by application
8.4.8.3.1. Market size and forecast, by electrical application
8.4.8.3.2. Market size and forecast, by electronics application
8.4.8.3.3. Market size and forecast, by electrical application
8.4.8.3.4. Market size and forecast, by electronics application
8.4.8.4. Market size and forecast, by end-user
8.4.9. Japan
8.4.9.1. Market size and forecast, by resin type
8.4.9.2. Market size and forecast, by curing technique
8.4.9.3. Market size and forecast, by application
8.4.9.3.1. Market size and forecast, by electrical application
8.4.9.3.2. Market size and forecast, by electronics application
8.4.9.3.3. Market size and forecast, by electrical application
8.4.9.3.4. Market size and forecast, by electronics application
8.4.9.4. Market size and forecast, by end-user
8.4.10. South Korea
8.4.10.1. Market size and forecast, by resin type
8.4.10.2. Market size and forecast, by curing technique
8.4.10.3. Market size and forecast, by application
8.4.10.3.1. Market size and forecast, by electrical application
8.4.10.3.2. Market size and forecast, by electronics application
8.4.10.3.3. Market size and forecast, by electrical application
8.4.10.3.4. Market size and forecast, by electronics application
8.4.10.4. Market size and forecast, by end-user
8.4.11. Australia
8.4.11.1. Market size and forecast, by resin type
8.4.11.2. Market size and forecast, by curing technique
8.4.11.3. Market size and forecast, by application
8.4.11.3.1. Market size and forecast, by electrical application
8.4.11.3.2. Market size and forecast, by electronics application
8.4.11.3.3. Market size and forecast, by electrical application
8.4.11.3.4. Market size and forecast, by electronics application
8.4.11.4. Market size and forecast, by end-user
8.4.12. Rest of Asia-Pacific
8.4.12.1. Market size and forecast, by resin type
8.4.12.2. Market size and forecast, by curing technique
8.4.12.3. Market size and forecast, by application
8.4.12.3.1. Market size and forecast, by electrical application
8.4.12.3.2. Market size and forecast, by electronics application
8.4.12.3.3. Market size and forecast, by electrical application
8.4.12.3.4. Market size and forecast, by electronics application
8.4.12.4. Market size and forecast, by end-user
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by resin type
8.5.3. Market size and forecast, by curing technique
8.5.4. Market size and forecast, by application
8.5.4.1. Market size and forecast, by electrical application
8.5.4.2. Market size and forecast, by electronics application
8.5.4.3. Market size and forecast, by electrical application
8.5.4.4. Market size and forecast, by electronics application
8.5.5. Market size and forecast, by end-user
8.5.6. Market share analysis, by country
8.5.7. Brazil
8.5.7.1. Market size and forecast, by resin type
8.5.7.2. Market size and forecast, by curing technique
8.5.7.3. Market size and forecast, by application
8.5.7.3.1. Market size and forecast, by electrical application
8.5.7.3.2. Market size and forecast, by electronics application
8.5.7.3.3. Market size and forecast, by electrical application
8.5.7.3.4. Market size and forecast, by electronics application
8.5.7.4. Market size and forecast, by end-user
8.5.8. Saudi Arabia
8.5.8.1. Market size and forecast, by resin type
8.5.8.2. Market size and forecast, by curing technique
8.5.8.3. Market size and forecast, by application
8.5.8.3.1. Market size and forecast, by electrical application
8.5.8.3.2. Market size and forecast, by electronics application
8.5.8.3.3. Market size and forecast, by electrical application
8.5.8.3.4. Market size and forecast, by electronics application
8.5.8.4. Market size and forecast, by end-user
8.5.9. South Africa
8.5.9.1. Market size and forecast, by resin type
8.5.9.2. Market size and forecast, by curing technique
8.5.9.3. Market size and forecast, by application
8.5.9.3.1. Market size and forecast, by electrical application
8.5.9.3.2. Market size and forecast, by electronics application
8.5.9.3.3. Market size and forecast, by electrical application
8.5.9.3.4. Market size and forecast, by electronics application
8.5.9.4. Market size and forecast, by end-user
8.5.10. Rest of LAMEA
8.5.10.1. Market size and forecast, by resin type
8.5.10.2. Market size and forecast, by curing technique
8.5.10.3. Market size and forecast, by application
8.5.10.3.1. Market size and forecast, by electrical application
8.5.10.3.2. Market size and forecast, by electronics application
8.5.10.3.3. Market size and forecast, by electrical application
8.5.10.3.4. Market size and forecast, by electronics application
8.5.10.4. Market size and forecast, by end-user
CHAPTER 9: COMPANY PROFILES
9.1. 3M
9.1.1. Company overview
9.1.2. Company snapshot
9.1.3. Operating business segments
9.1.4. Product portfolio
9.1.5. Business performance
9.2. Altana
9.2.1. Company overview
9.2.2. Company snapshot
9.2.3. Operating business segments
9.2.4. Product portfolio
9.2.5. Business performance
9.2.6. Key strategic moves and developments
9.3. Aremco Products Inc.
9.3.1. Company overview
9.3.2. Company snapshot
9.3.3. Operating business segments
9.3.4. Product portfolio
9.4. DowDuPont
9.4.1. Company overview
9.4.2. Company snapshot
9.4.3. Operating business segments
9.4.4. Product portfolio
9.4.5. Business performance
9.5. Dymax Corporation
9.5.1. Company overview
9.5.2. Company snapshot
9.5.3. Operating business segments
9.5.4. Product portfolio
9.6. Henkel AG & Co. KGaA
9.6.1. Company overview
9.6.2. Company snapshot
9.6.3. Operating business segments
9.6.4. Product portfolio
9.6.5. Business performance
9.6.6. Key strategic moves and developments
9.7. Hitachi Chemical Co., Ltd.
9.7.1. Company overview
9.7.2. Company snapshot
9.7.3. Operating business segments
9.7.4. Product portfolio
9.7.5. Business performance
9.8. Huntsman International LLC
9.8.1. Company overview
9.8.2. Company snapshot
9.8.3. Operating business segments
9.8.4. Product portfolio
9.8.5. Business performance
9.9. LORD Corporation
9.9.1. Company overview
9.9.2. Company snapshot
9.9.3. Product portfolio
9.10. Master Bond Inc.
9.10.1. Company overview
9.10.2. Company snapshot
9.10.3. Product portfolio
9.10.4. Key strategic moves and developments
9.11. MG Chemicals
9.11.1. Company overview
9.11.2. Company snapshot
9.11.3. Product portfolio
9.12. RBC Industries, Inc.
9.12.1. Company overview
9.12.2. Company snapshot
9.12.3. Operating business segments
9.12.4. Product portfolio
9.13. Shanghai SEPNA Chemical Technology Co., Ltd.
9.13.1. Company overview
9.13.2. Company snapshot
9.13.3. Operating business segments
9.13.4. Product portfolio
9.14. Wacker Chemie AG
9.14.1. Company overview
9.14.2. Company snapshot
9.14.3. Operating business segments
9.14.4. Product portfolio
9.14.5. Business performance
9.15. Wevo-Chemie GmbH
9.15.1. Company overview
9.15.2. Company snapshot
9.15.3. Product portfolio
According to the perspectives of the CXOs, expansion of the potting compound market is entirely dependent on the growth of the electronics and electrical industry. In addition, technological advancements can fuel the product innovation in the industry, thereby offering scope for further usage of potting compounds. Preferable properties of potting material in the electronics application is the major factor that drives the market growth. Asia-Pacific is the largest regional market, both in terms of value and volume for potting compounds due to presence of established electronics and electrical industry in Japan and high sale of consumer electronics across the region.
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