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Flip Chip Market Expected to Reach $39.67 Billion by 2027

 

Report Code : A01364

quote Factors such as increase in demand for enhanced performance of smartphones & automotive MCUs and development of the electric vehicle industry & electronics industry in countries such as China, Japan, and India are the key driving factors of the Asia-Pacific flip chip market. In addition, flip chip exhibits advantages such as less space consumption, better process efficiency, more I/O options, and improved heat dissipation, which make them an ideal substitute of wire bond. Thus, all these factors collectively contribute toward the growth of the global flip chip market in the coming years quote

Makarand Sinnarkar
Research Analyst, ICT at Allied Market Research

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According to a recent report published by Allied Market Research, titled, “Flip Chip Market by Packaging Technology, Bumping Technology, and Industry: Opportunity Analysis and Industry Forecast, 2020–2027,” the flip chip market size was valued at $24.76 billion in 2019, and is projected to reach $39.67 billion by 2027, growing at a CAGR of 6.1% from 2020 to 2027. 

Increase in demand for high speed and compact size electronic products has boosted the adoption of flip chip technology in the electronic industry. Internet of Things (IoT) has been gaining popularity, and serves as a key driver of the market. Products used in IoT, such as sensors & actuators, analog & mixed-signal translators, and microcontrollers or embedded processors require efficient and reliable packaging solutions, which can be done using flip chips. 

In comparison to customary wire-bond packaging, flip chip offers various benefits such as, superior thermal & electrical performance, substrate flexibility for varying performance requirements, remarkable I/O capability, reduced form factors, and well-established process equipment expertise. Gold bumping technology contributes the second largest share in overall flip chip market. The gold bumping segment is expected to witness sluggish growth rate as compared to other bumping technologies, owing to its high manufacturing cost, fragile construction, and complexities involved in bumping process. In addition, improved heat dissipation of ball grid array type flip chips makes them suitable choice in applications where smaller size chips are preferred without the need for external heat sink.

The solder bumping technology segment garners the third largest share in the global flip chip market. This is attributed to low cost of solder bumping technology and considerably improved bonding efficiency. The rapid downfall of tin lead eutectic solder is attributed by the collective oppose of the usage of lead across the globe, owing to its severe threat to environment. Moreover, being an old technology, it is currently being used in most of the flip chip fabrication. However, its growth rate is expected to decline, due to implementation of government regulations, which restrict the usage of lead in chips due to its hazardous effects to environment.

Flip chip possess the potential to reduce size, weight, and thickness of circuits and increase their signal power and high I/O count, owing to its substantially high spectrum bandwidth and enhanced electrical, thermal, and mechanical properties. The 2.5D IC packaging technology poses several challenges, such as lack of foundries and assembly houses which is supported by 3D IC packaging technology. Thus, flip chip technology have witnessed unawareness of cost-effectiveness & improved performances, which could hamper its adoption in the manufacturing industry. 

Asia-Pacific region dominates the flip chip market in terms of number of manufacturer and in terms of consumers. In 2019, reduction in China’s supply chain significantly impacted on companies across the globe and disrupted the electronics value chain. The outbreak of corona virus constrained governments across the globe to force lockdown initiatives which halted many production facilities operations which in tun disrupted the worldwide economy at a significant extent. Moreover, industries such as manufacturing and construction across the globe have witnessed shortage of labors and various hardware components from supplier side. This hindered the market growth to a certain extent, but is further expected to adjust the growth of flip chip market in the coming years.

Key Findings Of The Study

  • By packaging technology, the 2.5D IC segment dominated the flip chip market growth. However, the 2D IC segment is expected to exhibit significant growth during the forecast period.
  • Depending on bumping technology, the copper pillar segment led the flip chip market share in 2019. However, the gold bumping segment is expected to display highest growth during the forecast period.
  • On the basis of industry, the electronics segment witnessed significant growth in the flip chip market trends. However, the IT & telecommunication segment is anticipated to dominate the market during the forecast period in the industry.
  • Region wise, Asia-Pacific dominated the flip chip market size in 2019. However, North America is expected to witness significant growth in terms of revenue in the coming years owing to high demand for smart electronics in this region. 

Some of the key market players profiled in the flip chip industry include 3M, AMD, Inc., Amkor Packaging Technology, Inc., Apple, Inc., Fujitsu Ltd, IBM Corporation, Intel Corporation, Samsung electronics Co., Ltd, TSMC, Ltd,, and Texas Instruments, Inc. Major players operating in this market have witnessed significant adoption of strategies such as business expansion and partnership to reduce supply and demand gap. With increase in digitalization initiatives and industry revolution across the globe, major players have collaborated their product portfolio to provide differentiated and innovative products.

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quote Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, and 2D IC), Bumping Technology (Solder Bumping, Gold Bumping, and Others), and Industry (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027 quote

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