Flip Chip Market Analysis:
The global flip chip market size is expected to reach $46 billion by 2022, registering a CAGR of 9% during the forecast period 2016‐2022. Flip chip, also known as controlled collapse chip connection (C4), is used for interconnecting semiconductor devices, such as IC chips, microscopic devices, micro sensors, and microprocessor, to external circuitry while utilizing deposited solder bumps onto the chip pads. Use of flip chip interconnections offers numerous advantages over conventional wire bond, which includes superior thermal and electrical performance, reduced form factors, well-defined construction, substrate flexibility for varying performance requirements, and the highest I/O capability.
The flip chip market is majorly driven by the imminent need of circuit miniaturization, growth in internet of things (IoT), and technological superiority over wire bonding. However, the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization. Moreover, growth in demand of sensors in smartphone industry and increase in application in personal electronic devices, such as personal computers and mobiles, opens new opportunities in the flip chip market.
The demand of flip chip is expected to increase in the coming years due to heavy investments in the research and development by the key players such as TSMC, Ltd., Amkor Technology, Inc., and IBM, which has led to constant improvements in chip quality. This has also resulted in intense market competition among the existing players.
The market is segmented based on flip chip packaging technology, bumping technology, industry vertical, and geography.
Key Players Operating In Global Flip Chip Market
Global Flip Chip Market By Packaging Technology
2.5D IC packaging is extensively used in flip chips owing to its several advantages such as enhanced capacity, improved performance, reduced system space requirements, and low power consumption. However, 3D IC is expected to witness a substantial growth as it is an advancement of 2.5D IC and is equipped with the added advantages of 2.5D IC as well as some extra features.
Global Flip Chip Market Scenario
The fundamental properties of flip chip make it promising interconnection technology for a multitude of applications. Flip chip has attracted great interest for IoT (internet of things) because of its varied applications in IT & telecommunication, consumer electronics, automotive & transport, industrial, healthcare, aerospace & defense, and renewable energy resources. However, flip chips have their limitations due to less customization options available when compared to wired bonding, and high cost due to addition of bumping cost. At present, flip chip is one of the most studied packaging technologies for electrical interconnections and the results of the research from many companies approve its potential to change todays packaging landscape. Flip chip offers several advantages for electronic devices (smartphones, digital camera & camcorders, laptops & tablets, wearable electronics, and household electronics) such as smaller IC footprint, reduced height & weight, improved performance, better reliability, and enhanced thermal capabilities.
Value Chain Analysis In The Global Flip Chip Market
Technological superiority of flip chip over wire bond technology
Demand for flip chip interconnect technology is being driven by its technological advancements over the wire bonding technology. In addition, flip chips offer a wide range of advantages as compared to customary wire-bond packaging such as highest I/O capability, superior thermal and electrical performance, substrate flexibility for varying performance requirements, proven construction, well-established process equipment proficiency, and reduced form factors. Moreover, flip chip is the cost-effective, efficient & reliable technology, and an innovative packaging solution which has been fulfilling the demands of customers and driving the designers to maximize package performance. Therefore, the on-going advancements and various technological superiority factors of flip chips over its alternatives are expected to propel the growth of flip chip market share in years to come.
|Length of connection||Requires wire of a considerable length for making the connection||Solder bumps are used and hence the length of connection is reduced|
|Power loss||The wire used for the connection eats up a considerable amount of power||Use of bumps saves the power|
|Frequency of transmission||Frequency of transmission is limited||Frequency of transmission is considerably high|
|Efficiency||Low efficiency||Higher in comparison to wired connection|
- Comprehensive analysis of the current and future trends in the global flip chip market is provided in this report
- The report offers a competitive scenario of the market along with the growth trends, structure, driving factors, scope, opportunities, and challenges
- The report includes a comprehensive analysis of the flip chip industry segments to provide insights on the market dynamics
- Porter’s Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making
- Value chain analysis provides key inputs on the role of stakeholders involved at various stages of the value chain
Flip Chip Market Key Segmentation:
The market is segmented on the basis of packaging technology, bumping technology, industry vertical, and geography.
By Packaging Technology
- 3D IC
- 2.5D IC
- 2D IC
By Bumping Technology
- Copper Pillar
- Solder Bumping
- Tin-lead eutectic solder
- Lead-free solder
- Gold Bumping
- Others (Aluminum & Conductive polymer)
- Automotive & Transport
- IT & Telecommunication
- Aerospace and Defense
- Others (Renewable Energy and Media & Entertainment )
- North America
- Rest of Europe
- Rest of Asia-Pacific
- Latin America
- Middle East