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Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, 2D IC), Bumping Technology (Copper Pillar, Solder Bumping, Tin-lead eutectic solder, Lead-free solder, Gold Bumping), Industry (Electronics, Industrial, Automotive & Transport) - Global Opportunity Analysis and Industry Forecast, 2014 - 2022

SE_161691
Pages: 204
Aug 2016 | 3005 Views
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Author's : Rachna Singh, Ayushi Bajpai and Gaurav Shukla
Tables: 57
Charts: 131
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Flip Chip Market Analysis: 

The global flip chip market size is expected to reach $46 billion by 2022, registering a CAGR of 9% during the forecast period 2016‐2022. Flip chip, also known as controlled collapse chip connection (C4), is used for interconnecting semiconductor devices, such as IC chips, microscopic devices, micro sensors, and microprocessor, to external circuitry while utilizing deposited solder bumps onto the chip pads. Use of flip chip interconnections offers numerous advantages over conventional wire bond, which includes superior thermal and electrical performance, reduced form factors, well-defined construction, substrate flexibility for varying performance requirements, and the highest I/O capability.

The flip chip market is majorly driven by the imminent need of circuit miniaturization, growth in internet of things (IoT), and technological superiority over wire bonding. However, the major restraints associated with the flip chip industry include the huge initial investment required for setting up new manufacturing facility and less available options for customization. Moreover, growth in demand of sensors in smartphone industry and increase in application in personal electronic devices, such as personal computers and mobiles, opens new opportunities in the flip chip market.

The demand of flip chip is expected to increase in the coming years due to heavy investments in the research and development by the key players such as TSMC, Ltd., Amkor Technology, Inc., and IBM, which has led to constant improvements in chip quality. This has also resulted in intense market competition among the existing players.

Segment review

The market is segmented based on flip chip packaging technology, bumping technology, industry vertical, and geography.

Flip Chip Market Segment Overview

Key Players Operating In Global Flip Chip Market

KEY PLAYERS OPERATING IN WORLD FLIP CHIP MARKET

Global Flip Chip Market By Packaging Technology

World flip chip market by packaging technology

 

2.5D IC packaging is extensively used in flip chips owing to its several advantages such as enhanced capacity, improved performance, reduced system space requirements, and low power consumption. However, 3D IC is expected to witness a substantial growth as it is an advancement of 2.5D IC and is equipped with the added advantages of 2.5D IC as well as some extra features.

Global Flip Chip Market Scenario

The fundamental properties of flip chip make it promising interconnection technology for a multitude of applications. Flip chip has attracted great interest for IoT (internet of things) because of its varied applications in IT & telecommunication, consumer electronics, automotive & transport, industrial, healthcare, aerospace & defense, and renewable energy resources. However, flip chips have their limitations due to less customization options available when compared to wired bonding, and high cost due to addition of bumping cost. At present, flip chip is one of the most studied packaging technologies for electrical interconnections and the results of the research from many companies approve its potential to change todays packaging landscape. Flip chip offers several advantages for electronic devices (smartphones, digital camera & camcorders, laptops & tablets, wearable electronics, and household electronics) such as smaller IC footprint, reduced height & weight, improved performance, better reliability, and enhanced thermal capabilities.

World Flip Chip Market Scenario

Value Chain Analysis In The Global Flip Chip Market

VALUE CHAIN ANALYSIS IN THE WORLD FLIP CHIP MARKET

Technological superiority of flip chip over wire bond technology

Demand for flip chip interconnect technology is being driven by its technological advancements over the wire bonding technology. In addition, flip chips offer a wide range of advantages as compared to customary wire-bond packaging such as highest I/O capability, superior thermal and electrical performance, substrate flexibility for varying performance requirements, proven construction, well-established process equipment proficiency, and reduced form factors. Moreover, flip chip is the cost-effective, efficient & reliable technology, and an innovative packaging solution which has been fulfilling the demands of customers and driving the designers to maximize package performance. Therefore, the on-going advancements and various technological superiority factors of flip chips over its alternatives are expected to propel the growth of flip chip market share in years to come.

PROPERTIESWIRED CONNECTION FLIP-CHIP
Length of connection Requires wire of a considerable length for making the connection Solder bumps are used and hence the length of connection is reduced
Power lossThe wire used for the connection eats up a considerable amount of powerUse of bumps saves the power
Frequency of transmissionFrequency of transmission is limitedFrequency of transmission is considerably high
EfficiencyLow efficiencyHigher in comparison to wired connection

 

Key Benefits

  • Comprehensive analysis of the current and future trends in the global flip chip market is provided in this report
  • The report offers a competitive scenario of the market along with the growth trends, structure, driving factors, scope, opportunities, and challenges
  • The report includes a comprehensive analysis of the flip chip industry segments to provide insights on the market dynamics
  • Porter’s Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making
  • Value chain analysis provides key inputs on the role of stakeholders involved at various stages of the value chain

Flip Chip Market Key Segmentation:

The market is segmented on the basis of packaging technology, bumping technology, industry vertical, and geography.

By Packaging Technology

  • 3D IC
  • 2.5D IC
  • 2D IC

By Bumping Technology

  • Copper Pillar
  • Solder Bumping
  • Tin-lead eutectic solder
  • Lead-free solder
  • Gold Bumping
  • Others (Aluminum & Conductive polymer)

By Industry

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace and Defense
  • Others (Renewable Energy and Media & Entertainment )

By Geography

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • Korea
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
 

Chapter: 1 Introduction

1.1 Report Description
1.2 Key benefits
1.3 Key Market Segments
1.4 Research Methodology

1.4.1 Secondary research
1.4.2 Primary research
1.4.3 Analyst tools and models

Chapter: 2 EXECUTIVE SUMMARY

2.1 CXO Perspective

Chapter: 3 MARKET OVERVIEW

3.1 Market Definition and Scope
3.2 Key findings

3.2.1 Top investment pockets
3.2.2 Top winning strategies

3.3 Porters five force analysis

3.3.1 Bargaining power of suppliers
3.3.2 Bargaining power of buyers
3.3.3 Threats from the new entrants
3.3.4 Threats of substitutes
3.3.5 Competitive rivalry

3.4 Value chain analysis
3.5 Market share analysis
3.6 Drivers

3.6.1 Thriving portable electronic market and increasing popularity of internet of things (IoT)
3.6.2 Usage in graphic cards and processors used in real world gaming
3.6.3 Impending need for circuit miniaturization in microelectronic devices
3.6.4 Technological superiority over wire bonding

3.7 Restraints

3.7.1 Higher cost and less customization options available in comparison to wire bonding

3.8 Opportunities

3.8.1 Impending need of high frequency in electronic gadgets

Chapter: 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY

4.1 Overview
4.2 3D IC

4.2.1 Key market trends
4.2.2 Key growth factors and opportunities
4.2.3 Market size and forecast

4.3. 5D IC

4.3.1 Key market trends
4.3.2 Key growth factors and opportunities
4.3.3 Market size and forecast

4.4 2D IC

4.4.1 Key market trends
4.4.2 Key growth factors and opportunities
4.4.3 Market size and forecast

Chapter: 5 WORLD FLIP CHIP MARKET, BY INDUSTRY

5.1 Overview
5.2 Electronics

5.2.1 Key market trends
5.2.2 Key growth factors and opportunities
5.2.3 Market size and forecast

5.3 Industrial

5.3.1 Key market trends
5.3.2 Key growth factors and opportunities
5.3.3 Market size and forecast

5.4 Automotive & Transport

5.4.1 Key market trends
5.4.2 Key growth factors and opportunities
5.4.3 Market size and forecast

5.5 Healthcare

5.5.1 Key market trends
5.5.2 Key growth factors and opportunities
5.5.3 Market size and forecast

5.6 IT & Telecommunication

5.6.1 Key market trends occupied
5.6.2 Key growth factors and opportunities
5.6.3 Market size and forecast

5.7 Aerospace & Defense

5.7.1 Key market trends
5.7.2 Key growth factors and opportunities
5.7.3 Market size and forecast

5.8 Others

5.8.1 Key market trends
5.8.2 Key growth factors and opportunities
5.8.3 Market size and forecast

Chapter: 6 WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY

6.1 Overview
6.2 Copper pillar

6.2.1 Key market trends
6.2.2 Key growth factors and opportunities
6.2.3 Market size and forecast

6.3 Solder bumping

6.3.1 Market size and forecast
6.3.2 Tin-Lead solder

6.3.2.1 Key market trends
6.3.2.2 Key growth factors and opportunities
6.3.2.3 Market size and forecast

6.3.3 Lead free solder

6.3.3.1 Key market trends
6.3.3.2 Key growth factors and opportunities
6.3.3.3 Market size and forecast

6.4 Gold bumping

6.4.1 Key market trends
6.4.2 Key growth factors and opportunities
6.4.3 Market size and forecast

6.5 Others

6.5.1 Key market trends
6.5.2 Key growth factors and opportunities
6.5.3 Market size and forecast

Chapter: 7 WORLD FLIP CHIP MARKET BY GEOGRAPHY

7.1 Overview
7.2 North America

7.2.1 Key market trends
7.2.2 Market size and forecast
7.2.3 U.S.
7.2.4 Canada
7.2.5 Mexico

7.3 Europe

7.3.1 Key market trends
7.3.2 Market size and forecast
7.3.3 U.K.
7.3.4 Germany
7.3.5 Turkey
7.3.6 Spain
7.3.7 Rest of Europe

7.4 Asia-Pacific

7.4.1 Key market trends
7.4.2 Market size and forecast
7.4.3 Australia
7.4.4 China
7.4.5 Japan
7.4.6 India
7.4.7 Rest of Asia-Pacific

7.5 LAMEA

7.5.1 Key market trends
7.5.2 Market size and forecast
7.5.3 Africa
7.5.4 Middle East
7.5.5 Latin America

Chapter: 8 COMPANY PROFILES

8.1 International Business Machines Corporation (IBM)

8.1.1 Company overview
8.1.2 Company snapshot
8.1.3 Operating business segments
8.1.4 Business performance
8.1.5 Key strategic moves and developments

8.2 3M

8.2.1 Company overview
8.2.2 Company snapshot
8.2.3 Operating business segments
8.2.4 Business performance
8.2.5 Key strategic moves and developments

8.3 Texas Instruments, Inc.

8.3.1 Company overview
8.3.2 Company snapshot
8.3.3 Operating business segments
8.3.4 Business performance
8.3.5 Key strategic moves and developments

8.4 Taiwan Semiconductor Manufacturing Company Ltd.

8.4.1 Company overview
8.4.2 Company snapshot
8.4.3 Operating business segments
8.4.4 Business performance
8.4.5 Key strategic moves and developments

8.5 Apple Inc.

8.5.1 Company overview
8.5.2 Company snapshot
8.5.3 Operating business segments
8.5.4 Business performance
8.5.5 Key strategic moves and developments

8.6 Fujitsu

8.6.1 Company overview
8.6.2 Company snapshot
8.6.3 Operating business segments
8.6.4 Business performance
8.6.5 Key strategic moves and developments

8.7 Intel Corporation

8.7.1 Company overview
8.7.2 Company snapshot
8.7.3 Operating Business Segments:-
8.7.4 Business performance
8.7.5 Key strategic moves and developments

8.8 Advanced Micro Devices, Inc.

8.8.1 Company overview
8.8.2 Company snapshot
8.8.3 Operating business segments
8.8.4 Business performance
8.8.5 Key strategic moves and developments

8.9 Amkor Technology, Inc.

8.9.1 Company overview
8.9.2 Company snapshot
8.9.3 Operating business segments
8.9.4 Business performance
8.9.5 Key strategic moves and developments

8.10 Samsung Electronics Co. Ltd.

8.10.1 Company overview
8.10.2 Operating Business Segments
8.10.3 Business performance
8.10.4 Key Strategic Moves and Developments

List of Figures

FIG. 1 WORLD FLIP CHIP MARKET, RESEARCH METHODOLOGY
FIG. 2 WORLD FLIP CHIP MARKET, SEGMENTATION REVENUE & CAGR (2016-2022)
FIG. 3 WORLD FLIP CHIP MARKET, COMPARATIVE ANALYSIS, 2015 & 2022 (%)
FIG. 4 TOP IMPACTING FACTORS
FIG. 5 WORLDWIDE SMARTPHONE USERS, MILLION (2014-2019)
FIG. 6 TOP INVESTMENT POCKETS
FIG. 7 TOP WINNING STRATEGIES
FIG. 8 PORTERS FIVE FORCE ANALYSIS
FIG. 9 VALUE CHAIN ANALYSIS
FIG. 10 COMPANIES/INSTITUTES INVOLED IN DIFFERENT ACTIVITIES IN THE VALUE CHAIN
FIG. 11 MARKET SHARE ANALYSIS, 2015
FIG. 12 GLOBAL PORTABLE ELECTRONICS MARKET REVENUE (2010 - 2015)
FIG. 13 COMPARISON BETWEEN THE PROPERTIES OF WIRE BONDING AND FLIP CHIPS
FIG. 14 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (% SHARE)
FIG. 15 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP 3D IC MARKET, 2015 & 2022 (% SHARE)
FIG. 16 WORLD FLIP CHIP 3D IC MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 17 WORLD FLIP CHIP 3D IC MARKET REVENUE, 2015 - 2022 (%)
FIG. 18 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP 2.5D IC MARKET, 2015 & 2022 (% SHARE)
FIG. 19 WORLD FLIP CHIP 2.5D IC MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 20 WORLD FLIP CHIP 2.5D IC MARKET REVENUE, 2015 - 2022 (%)
FIG. 21 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP 2D IC MARKET, 2015 & 2022 (% SHARE)
FIG. 22 WORLD FLIP CHIP 2D IC MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 23 WORLD FLIP CHIP 2D IC MARKET REVENUE, 2015 - 2022 (%)
FIG. 24 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD FLIP CHIP MARKET, BY INDUSTRY, 2015 & 2022 (% SHARE)
FIG. 25 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP CONSUMER ELECTRONICS MARKET, 2015 & 2022 (% SHARE)
FIG. 26 WORLD FLIP CHIP ELECTRONICS MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 27 WORLD FLIP CHIP ELECTRONICS MARKET REVENUE, 2015 - 2022 (%)
FIG. 28 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP INDUSTRIAL MARKET, 2015 & 2022 (% SHARE)
FIG. 29 WORLD FLIP CHIP INDUSTRIAL MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 30 WORLD FLIP CHIP INDUSTRIAL MARKET REVENUE, 2015 - 2022 (%)
FIG. 31 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET, 2015 & 2022 (% SHARE)
FIG. 32 WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 33 1WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET REVENUE, 2015 - 2022 (%)
FIG. 34 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP HEALTHCARE MARKET, 2015 & 2022 (% SHARE)
FIG. 35 WORLD FLIP CHIP HEALTHCARE MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 36 WORLD FLIP CHIP HEALTHCARE MARKET REVENUE, 2015 - 2022 (%)
FIG. 37 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP TELECOMMUNICATION MARKET, 2015 & 2022 (% SHARE)
FIG. 38 WORLD FLIP CHIP TELECOMMUNICATION MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 39 WORLD FLIP CHIP TELECOMMUNICATION MARKET REVENUE, 2015 - 2022 (%)
FIG. 40 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP AEROSPACE & DEFENCE MARKET, 2015 & 2022 (% SHARE)
FIG. 41 WORLD FLIP CHIP AEROSPACE & DEFENSE MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 42 WORLD FLIP CHIP AEROSPACE & DEFENSE MARKET REVENUE, 2015 - 2022 (%)
FIG. 43 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP OTHERS MARKET, 2015 & 2022 (% SHARE)
FIG. 44 WORLD FLIP CHIP OTHERS MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 45 WORLD FLIP CHIP OTHERS MARKET REVENUE, 2015 - 2022 (%)
FIG. 46 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY, 2015 & 2022 (% SHARE)
FIG. 47 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP COPPER PILLAR MARKET, 2015 & 2022 (% SHARE)
FIG. 48 WORLD FLIP CHIP COPPER PILLAR MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 49 WORLD FLIP CHIP COPPER PILLAR MARKET REVENUE, 2015 - 2022 (%)
FIG. 50 WORLD FLIP CHIP SOLDER BUMPING MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 51 WORLD FLIP CHIP SOLDER BUMPING MARKET REVENUE, 2015 - 2022 (%)
FIG. 52 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP TIN LEAD SOLDER MARKET, 2015 & 2022 (% SHARE)
FIG. 53 WORLD FLIP CHIP TIN-LEAD EUTECTIC SOLDER MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 54 WORLD FLIP CHIP TIN-LEAD EUTECTIC SOLDER MARKET REVENUE, 2015 - 2022 (%)
FIG. 55 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP LEAD-FREE SOLDER MARKET, 2015 & 2022 (% SHARE)
FIG. 56 WORLD FLIP CHIP LEAD-FREE SOLDER MARKET REVENUE, 2015 - 2022 ($MILLION)
FIG. 57 WORLD FLIP CHIP LEAD-FREE SOLDER MARKET REVENUE, 2015 - 2022 (%)
FIG. 58 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP GOLD BUMPING MARKET, 2015 & 2022 (% SHARE)
FIG. 59 WORLD FLIP CHIP GOLD BUMPING MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 60 WORLD FLIP CHIP GOLD BUMPING MARKET REVENUE, 2015 - 2022 (%)
FIG. 61 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FLIP CHIP OTHERS MARKET, 2015 & 2022 (% SHARE)
FIG. 62 WORLD FLIP CHIP OTHERS MARKET REVENUE, 2014 - 2022 ($MILLION)
FIG. 63 WORLD FLIP CHIP OTHERS MARKET REVENUE, 2015 - 2022 (%)
FIG. 64 NORTH AMERICA: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
FIG. 65 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF NORTH AMERICAN MARKET, BY TYPE, 2015 & 2022 (%)
FIG. 66 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF NORTH AMERICAN MARKET, BY INDUSTRY, 2015 & 2022 (%)
FIG. 67 NORTH AMERICA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 68 NORTH AMERICA: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
FIG. 69 NORTH AMERICA: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
FIG. 70 U.S.: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 71 CANADA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 72 EUROPE: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
FIG. 73 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF EUROPEAN MARKET,BY TYPE, 2015 & 2022 (%)
FIG. 74 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF EUROPEAN MARKET, BY INDUSTRY, 2015 & 2022 (%)
FIG. 75 EUROPE: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 76 EUROPE: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
FIG. 77 EUROPE: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
FIG. 78 U.K.: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 79 GERMANY: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 80 TURKEY: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 81 SPAIN: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 82 REST OF EUROPE: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 83 ASIA PACIFIC: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
FIG. 84 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF ASIA-PACIFIC MARKET, BY TYPE, 2015 & 2022 (%)
FIG. 85 COMPARATIVE GRAPHENE BATTERY MARKET SHARE ANALYSIS OF ASIA-PACIFIC MARKET, BY INDUSTRY, 2015 & 2022 (%)
FIG. 86 ASIA-PACIFIC: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 87 ASIA-PACIFIC: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
FIG. 88 ASIA-PACIFIC: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
FIG. 89 AUSTRALIA: FLIP CHIP MAREKT, 2014 - 2022 ($MILLION)
FIG. 90 CHINA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 91 JAPAN: FLIP CHIP SYSTEM MARKET, 2014 - 2022 ($MILLION)
FIG. 92 INDIA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 93 REST OF ASIA-PACIFIC: FLIP CHIP MARKET, 2014-222 ($MILLION)
FIG. 94 LAMEA: WORLD FLIP CHIP MARKET ANALYSIS, 2015 ($MILLION)
FIG. 95 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF LAMEA MARKET, BY TYPE 2015 & 2022 (%)
FIG. 96 COMPARATIVE FLIP CHIP MARKET SHARE ANALYSIS OF LAMEA MARKET, BY INDUSTRY, 2015 & 2022 (%)
FIG. 97 LAMEA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 98 LAMEA: FLIP CHIP MARKET, BY TYPE, 2015 - 2022 (%)
FIG. 99 LAMEA: FLIP CHIP MARKET, BY INDUSTRY, 2015 - 2022 (%)
FIG. 100 AFRICA: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 101 MIDDLE EAST: FLIP CHIP MARKET, 2014 - 2022 ($MILLION)
FIG. 102 IBM CORPORATION: REVENUE, 20132015 ($MILLION)
FIG. 103 IBM CORPORATION: REVENUE BY SEGMENT, 2015 (%)
FIG. 104 IBM CORPORATION: REVENUE BY REGION, 2015 (%)
FIG. 105 3M: NET SALES, 20132015 ($MILLION)
FIG. 106 3M: REVENUE BY SEGMENT, 2015 (%)
FIG. 107 3M: REVENUE BYREGION, 2015 (%)
FIG. 108 TEXAS INSTRUMENTS: REVENUE, 20132015 ($MILLION)
FIG. 109 TEXAS INSTRUMENTS: REVENUE BY SEGMENT, 2015 (%)
FIG. 110 TEXAS INSTRUMENTS: REVENUE BY REGION, 2015 (%)
FIG. 111 TSMC: REVENUE, 20132015 ($MILLION)
FIG. 112 TSMC: REVENUE BY SEGMENT, 2015 (%)
FIG. 113 TSMC: REVENUE BY REGION, 2015 (%)
FIG. 114 APPLE: REVENUE, 20132015 ($MILLION)
FIG. 115 APPLE: REVENUE BY PRODUCTS & SERVICES, 2015 (%)
FIG. 116 APPLE: REVENUE BYREGION, 2015 (%)
FIG. 117 FUJITSU, REVENUE, 20132015 ($MILLION)
FIG. 118 FUJITSU, REVENUE, BY SEGMENT (%), 2015
FIG. 119 FUJITSU, REVENUE, BY REGION (%), 2015
FIG. 120 REVENUE OF INTEL CORPORATION, 2013-2015 ($MILLION)
FIG. 121 REVENUE OF INTEL CORPORATION BY SEGMENT (%), 2015
FIG. 122 REVENUE OF INTEL CORPORATION BY REGION (%), 2015
FIG. 123 AMD, REVENUE, 20132015 ($MILLION)
FIG. 124 AMD, REVENUE, BY SEGMENT (%), 2015
FIG. 125 REVENUE OF AMD BY REGION (%), 2015
FIG. 126 AMKOR TECHNOLOGY: REVENUE, 20132015 ($MILLION)
FIG. 127 AMKOR TECHNOLOGY: REVENUE BY GEOGRAPHY, 2015 (%)
FIG. 128 AMKOR TECHNOLOGY: REVENUE BY SEGMENT, 2015 (%)
FIG. 129 REVENUE OF SAMSUNG ELECTRONICS CO. LTD. 2013 -2015, $MILLION
FIG. 130 SAMSUNG ELECTRONICS CO. LTD: REVENUE BY GEOGRAPHY, 2015 (%)
FIG. 131 SAMSUNG ELECTRONICS: REVENUE BY SEGMENT, 2015 (%)

List of Tables

TABLE 1 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY, 2014 - 2022 ($MILLION)
TABLE 2 WORLD FLIP CHIP 3D IC MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 3 WORLD FLIP CHIP 2.5D IC MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 4 WORLD FLIP CHIP 2D IC MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 5 WORLD FLIP CHIP MARKET, BY INDUSTRY, 2014 - 2022 ($MILLION)
TABLE 6 WORLD FLIP CHIP CONSUMER ELECTRONICS MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 7 WORLD FLIP CHIP INDUSTRIAL MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 8 WORLD FLIP CHIP AUTOMOTIVE & TRANSPORT MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 9 WORLD FLIP CHIP HEALTHCARE MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 10 WORLD FLIP CHIP TELECOMMUNICATION MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 11 WORLD FLIP CHIP AEROSPACE & DEFENCE MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 12 WORLD FLIP CHIP OTHERS MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 13 WORLD FLIP CHIP MARKET, BY BUMPING TECHNOLOGY, 2014 - 2022 ($MILLION)
TABLE 14 WORLD FLIP CHIP COPPER PILLAR MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 15 WORLD FLIP CHIP SOLDER BUMPING MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 16 WORLD FLIP CHIP TIN LEAD SOLDER MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 17 WORLD FLIP CHIP LEAD FREE SOLDER MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 18 WORLD FLIP CHIP GOLD BUMPING MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 19 WORLD FLIP CHIP OTHERS MARKET, BY GEOGRAPHY, 2014 - 2022 ($MILLION)
TABLE 20 NORTH AMERICA: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
TABLE 21 NORTH AMERICA: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
TABLE 22 NORTH AMERICA: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
TABLE 23 EUROPE: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
TABLE 24 EUROPE: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
TABLE 25 EUROPE: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
TABLE 26 ASIA-PACIFIC: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
TABLE 27 ASIA PACIFIC: FLIP CHIP MARKET, BY INDUSTRY, 2014 - 2022 ($MILLION)
TABLE 28 ASIA-PACIFIC: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
TABLE 29 LAMEA: FLIP CHIP MARKET, BY TYPE, 2014 - 2022 ($MILLION)
TABLE 30 ASIA PACIFIC: FLIP CHIP MARKET, BY INDUSTRY, 2014 - 2022 ($MILLION)
TABLE 31 LAMEA: FLIP CHIP MARKET, BY COUNTRY, 2014 - 2022 ($MILLION)
TABLE 32 IBM CORPORATION - COMPANY SNAPSHOT
TABLE 33 IBM CORPORATION COMPANY OPERATING BUSINESS SEGMENTS
TABLE 34 3M - COMPANY SNAPSHOT
TABLE 35 3M COMPANY OPERATING BUSINESS SEGMENTS
TABLE 36 TEXAS INSTRUMENTS - COMPANY SNAPSHOT
TABLE 37 TEXAS INSTRUMENTS COMPANY OPERATING BUSINESS SEGMENTS
TABLE 38 TSMC - COMPANY SNAPSHOT
TABLE 39 TSMC COMPANY OPERATING BUSINESS SEGMENTS
TABLE 40 APPLE - COMPANY SNAPSHOT
TABLE 41 APPLE COMPANY OPERATING BUSINESS SEGMENTS
TABLE 42 FUJITSU: COMPANY SNAPSHOT
TABLE 43 FUJITSU - OPERATING SEGMENTS:-
TABLE 44 SNAPSHOT OF INTEL CORPORATION
TABLE 45 INTEL CORPORATION - OPERATING SEGMENTS:-
TABLE 46 AMD: COMPANY SNAPSHOT
TABLE 47 AMD - OPERATING SEGMENTS:-
TABLE 48 AMKOR TECHNOLOGY - COMPANY SNAPSHOT
TABLE 49 AMKOR TECHNOLOGY COMPANY OPERATING BUSINESS SEGMENTS
TABLE 50 BUSINESS SNAPSHOT OF SAMSUNG ELECTRONICS CO. LTD.
TABLE 51 SAMSUNG ELECTRONICS COMPANY OPERATING BUSINESS SEGMENTS

 
 

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