The global semiconductor bonding market was valued at $0.88 billion in 2021 and is projected to reach $1.27 billion by 2031, growing at a CAGR of 3.6% from 2022 to 2031.
The global die bonder equipment market was valued at $785.2 million in 2023, and is projected to reach $1,861.3 million by 2032, growing at a CAGR of 10.8% from 2024 to 2032.
