Semiconductor Bonding Market

The global semiconductor bonding market was valued at $888.6 million in 2021, and is projected to reach $1279.40 million by 2031, growing at a CAGR of 3.6% from 2022 to 2031 

Semiconductors’ arrangements comprise atoms bonded together to form a homogeneous structure and it is used in the making of several integrated circuits (ICs) and fabrication devices. The structure of the material is homogeneous and virtually similar throughout the bonding model.

The semiconductor bonding market is being driven by the growing adoption of stacked die technology in IoT devices and the rising demand for electric and hybrid vehicles in various regions. Furthermore, increasing demand for 3D semiconductor assembly and packaging as well as the growing adoption of IoT and AI in the automotive sector will provide new opportunities for the semiconductor bonding industry.

The outbreak of COVID-19 significantly impacted the growth of the global semiconductor bonding market in 2021, owing to a significant impact on prime players operating in the supply chain. However, the rise in investment in IoT and AI in the automotive sector globally is one of the major factors that propelled the market growth during the COVID-19 pandemic. On the contrary, the market was principally hit by several obstacles amid the COVID-19 pandemic, such as a lack of skilled workforce availability and delay or cancelation of projects due to partial or complete lockdowns, globally. Furthermore, the surge in demand for 3D semiconductor assembly and packaging globally is strengthening the semiconductor bonding market globally post-COVID-19. However, the negative impact caused by COVID-19 on the global semiconductor bonding market is expected to continue for a short period. Conversely, by late 2022, the market is anticipated to witness a robust recovery due to extensive demand for consumer electronics. In addition, the ongoing pandemic is expected to escalate the need for semiconductor bonding solutions and services, which is creating opportunities for market growth.

The semiconductor bonding market analysis is segmented into Type, Proces Type, Bonding Technology, and Application.

On the basis of type, the semiconductor bonding market size is divided into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment dominated the market, in terms of revenue, in 2021, and is expected to follow the same trend during the forecast period.

By process type, the semiconductor bonding market share is segmented into die-to-die bonding, die-to wafer bonding, and wafer-to-wafer bonding. The die-to-die bonding segment acquired the largest share in 2021 and is expected to grow at a high CAGR from 2022 to 2031.

By bonding technology, the semiconductor bonding market growth is segregated into die bonding technology and wafer bonding technology. The die-bonding technology segment dominated the market, in terms of revenue, in 2021, and is expected to follow the same trend during the forecast period.

On the basis of application, the semiconductor bonding industry is divided into RF devices, MEMS and sensors, CMOS image sensors, LED, and 3D NAND. The LED segment acquired the largest share in 2021, and the 3D NAND segment is expected to grow at a high CAGR from 2022 to 2031.

Region-wise, the semiconductor bonding market overview is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, France, the UK, Italy, Spain, and the rest of Europe), Asia-Pacific (China, Japan, South Korea, Taiwan, India, and the rest of the Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific, specifically China, remains a significant participant in the global capacitive tactile sensor industry. Major organizations and government institutions in the country are intensely putting resources into the technology to develop next-generation semiconductor bonding solutions such as gold wire bonding and semiconductor wafer bonding solutions.

Competitive analysis and profiles of the major players in the global semiconductor bonding market forecast are provided in the report include, including ASM Pacific Technology, BE Semiconductor Industries N.V., Panasonic Corporation, Fasford Technology, Shinkawa Ltd, EV Group, SUSS MicroTech SE, Kulicke & Soffa Industries, Palomar Technologies, Shibaura Mechatronics, TDK Corporation, Tokyo Electron Limited, Mitsubishi Heavy Industries Machine Tools, Mycronic Group, INTEL Corporation, Skywater, and Tessera Technologies, Inc.

Key Benefits For Stakeholders

• This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the semiconductor bonding market from 2021 to 2031 to identify the prevailing semiconductor bonding market opportunities.
• Market research is offered along with information related to key drivers, restraints, and opportunities.
• Porter's five forces analysis highlights buyers' and suppliers' potency to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
• An in-depth analysis of the semiconductor bonding market segmentation assists in determining the prevailing market opportunities.
• Major countries in each region are mapped according to their revenue contribution to the global market.
• Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
• The report includes the analysis of the regional as well as global semiconductor bonding market trends, key players, market segments, application areas, and market growth strategies.

 Semiconductor Bonding Market Report Highlights