0
New
New
2022
Semiconductor Bonding Market

Semiconductor Bonding Market

by Type (Die Bonder, Wafer Bonder, Flip Chip Bonder), by Proces Type (Die To Die Bonding, Die To Wafer Bonding, Wafer To Wafer Bonding), by Bonding Technology (Die Bonding Technology, Wafer Bonding Technology), by Application (RF Devices, Mems and Sensors, CMOS Image Sensors, LED, 3D NAND): Global Opportunity Analysis and Industry Forecast, 2021-2031

Report Code: A31532
Pages: 290
Oct 2022 | 634 Views
Author(s) : Himanshu J, Tanuj B, and K , Vineet K
Tables: 236
Charts: 70
  • Formats*:

  • pdf

    Single User License, Five User
    License & Enterprise User License

  • xls

    Data Pack Excel License

  • ppt

    It comes with the additional cost
    of $2500.00 contact sales.

 

The global semiconductor bonding market was valued at $888.6 million in 2021, and is projected to reach $1279.40 million by 2031, growing at a CAGR of 3.6% from 2022 to 2031 

Semiconductors’ arrangements comprise atoms bonded together to form a homogeneous structure and it is used in the making of several integrated circuits (ICs) and fabrication devices. The structure of the material is homogeneous and virtually similar throughout the bonding model.

The semiconductor bonding market is being driven by the growing adoption of stacked die technology in IoT devices and the rising demand for electric and hybrid vehicles in various regions. Furthermore, increasing demand for 3D semiconductor assembly and packaging as well as the growing adoption of IoT and AI in the automotive sector will provide new opportunities for the semiconductor bonding industry.

The outbreak of COVID-19 significantly impacted the growth of the global semiconductor bonding market in 2021, owing to a significant impact on prime players operating in the supply chain. However, the rise in investment in IoT and AI in the automotive sector globally is one of the major factors that propelled the market growth during the COVID-19 pandemic. On the contrary, the market was principally hit by several obstacles amid the COVID-19 pandemic, such as a lack of skilled workforce availability and delay or cancelation of projects due to partial or complete lockdowns, globally. Furthermore, the surge in demand for 3D semiconductor assembly and packaging globally is strengthening the semiconductor bonding market globally post-COVID-19. However, the negative impact caused by COVID-19 on the global semiconductor bonding market is expected to continue for a short period. Conversely, by late 2022, the market is anticipated to witness a robust recovery due to extensive demand for consumer electronics. In addition, the ongoing pandemic is expected to escalate the need for semiconductor bonding solutions and services, which is creating opportunities for market growth.

Semiconductor Bonding Market

The semiconductor bonding market analysis is segmented into Type, Proces Type, Bonding Technology, and Application.

Semiconductor Bonding Market
By Type

Your browser does not support the canvas element.

Wafer Bonder segment hold domination position in 2021.

Get more information on this report : Request Sample Pages

On the basis of type, the semiconductor bonding market size is divided into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment dominated the market, in terms of revenue, in 2021, and is expected to follow the same trend during the forecast period.

Semiconductor Bonding Market
By Proces Type

Your browser does not support the canvas element.

Die To Die Bonding segment influenced the market in 2021, and expected to follow the same in future.

Get more information on this report : Request Sample Pages

By process type, the semiconductor bonding market share is segmented into die-to-die bonding, die-to wafer bonding, and wafer-to-wafer bonding. The die-to-die bonding segment acquired the largest share in 2021 and is expected to grow at a high CAGR from 2022 to 2031.

Semiconductor Bonding Market
By Bonding Technology

Your browser does not support the canvas element.

Die Bonding Technology segment hold domination position in 2021.

Get more information on this report : Request Sample Pages

By bonding technology, the semiconductor bonding market growth is segregated into die bonding technology and wafer bonding technology. The die-bonding technology segment dominated the market, in terms of revenue, in 2021, and is expected to follow the same trend during the forecast period.

Semiconductor Bonding Market
By Application

Your browser does not support the canvas element.

LED segment hold domination position in 2021.

Get more information on this report : Request Sample Pages

On the basis of application, the semiconductor bonding industry is divided into RF devices, MEMS and sensors, CMOS image sensors, LED, and 3D NAND. The LED segment acquired the largest share in 2021, and the 3D NAND segment is expected to grow at a high CAGR from 2022 to 2031.

Semiconductor Bonding Market
By Region

2031
Asia-pacific 
North America
Europe
LAMEA

Asia-Pacific segment garnered significant market share in 2021.

Get more information on this report : Request Sample Pages

Region-wise, the semiconductor bonding market overview is analyzed across North America (the U.S., Canada, and Mexico), Europe (Germany, France, the UK, Italy, Spain, and the rest of Europe), Asia-Pacific (China, Japan, South Korea, Taiwan, India, and the rest of the Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific, specifically China, remains a significant participant in the global capacitive tactile sensor industry. Major organizations and government institutions in the country are intensely putting resources into the technology to develop next-generation semiconductor bonding solutions such as gold wire bonding and semiconductor wafer bonding solutions.

Competitive analysis and profiles of the major players in the global semiconductor bonding market forecast are provided in the report include, including ASM Pacific Technology, BE Semiconductor Industries N.V., Panasonic Corporation, Fasford Technology, Shinkawa Ltd, EV Group, SUSS MicroTech SE, Kulicke & Soffa Industries, Palomar Technologies, Shibaura Mechatronics, TDK Corporation, Tokyo Electron Limited, Mitsubishi Heavy Industries Machine Tools, Mycronic Group, INTEL Corporation, Skywater, and Tessera Technologies, Inc.

Key Benefits For Stakeholders

  • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the semiconductor bonding market from 2021 to 2031 to identify the prevailing semiconductor bonding market opportunities.
  • Market research is offered along with information related to key drivers, restraints, and opportunities.
  • Porter's five forces analysis highlights buyers' and suppliers' potency to enable stakeholders to make profit-oriented business decisions and strengthen their supplier-buyer network.
  • An in-depth analysis of the semiconductor bonding market segmentation assists in determining the prevailing market opportunities.
  • Major countries in each region are mapped according to their revenue contribution to the global market.
  • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
  • The report includes the analysis of the regional as well as global semiconductor bonding market trends, key players, market segments, application areas, and market growth strategies.

Semiconductor Bonding Market Report Highlights

Aspects Details
Market Size By 2031 USD 1.3 billion
Growth Rate CAGR of 3.6%
Forecast period 2021 - 2031
Report Pages 290
Type
  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder
Proces Type
  • Die To Die Bonding
  • Die To Wafer Bonding
  • Wafer To Wafer Bonding
Bonding Technology
  • Die Bonding Technology
  • Wafer Bonding Technology
    • Wafer Bonding Technology
      • Direct and Anodic Wafer Bonding
      • Indirect Wafer Bonding
Application
  • RF Devices
  • CMOS Image Sensors
  • LED
  • 3D NAND
  • Mems and Sensors
By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (Germany, France, UK, Italy, Spain, Rest of Europe)
  • Asia-Pacific  (Japan, South Korea, Taiwan, Republic Of China, China, India, Rest of Asia-Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players ASMPT, Panasonic Corporation, Fasford Technology Co.,Ltd., SHINKAWA Electric Co., Ltd, SUSS MicroTec SE, EV Group (EVG), Kulicke and Soffa Industries, Palomar Technologies, Shibuara Mechatronics Corporation, TDK Corporation, Tokyo Electron Limited, Mitsubishi Heavy Industries, Ltd., Mycronic Group, Intel Corporation, Sky Water Technology, Tessera Technologies, Inc., Besemiconductor
 

Loading Table Of Content...


 
 

The increasing demand for microelectromechanical systems (MEMS) will likely cause a major increase in the global market for semiconductor bonding during the forecast period. However, the widespread use of stacked die technology in cutting-edge internet of things (IoT) devices is probably going to support market growth. Stacked die technology helps in facilitating multiple functionalities by utilizing the same area on a substrate. Therefore, this technology is widely used across semiconductor applications globally.

The original equipment manufacturers (OEMs) in the semiconductor sector are highly concentrating on enhancing the advantages of the internet of things beyond connectivity. A number of applications, including connected logistics, smart mobility & transportation, smart retail, smart manufacturing, building & home automation, and others heavily utilize internet of things technology and related devices, such as distributed control systems, smart beacons, smart meters, RFID tags, and sensors. This, in turns, is expected to provide a lucrative growth opportunity for the semiconductor bonding market, globally.

Globally, various key players and government agencies have invested in the semiconductor bonding market which strengthens their share in the market.

PURCHASE OPTIONS

Call or Email us

U.S.-Canada Toll-free: +1-800-792-5285
Int'l : +1-503-894-6022
Europe : +44-845-528-1300
Email : help@alliedmarketresearch.com
 
FREQUENTLY ASKED QUESTIONS?

A. Asia-Pacific is the largest regional market for semiconductor bonding.

A. LED is the leading application in the semiconductor bonding market.

A. The global semiconductor bonding market was valued at $888.63 million in 2021 and is projected to reach $1,279.53 million by 2031, registering a CAGR of 3.63% from 2022 to 2031.

A. Significant factors that impact the growth of the global semiconductor bonding market include increasing demand for miniature electronic components, an increase in the adoption of stacked die technology in IoT devices, and the rising demand for electric and hybrid vehicles.

A. Kulicke & Soffa Industries, BE Semiconductor Industries N.V.., TDK Corporation, and ASM Pacific Technology are the top companies to hold the market share in Semiconductor Bonding.

Looking for Customization?

 Customization Request

Have a Question?

 Speak with Analyst

Any Confusion?

 Inquire Before Buying

Have a glance of the Report

  Request Free Sample
RELATED TAGS

Purchase Full Report of
Semiconductor Bonding Market

Start reading instantly.
This Report and over 19,950+ more Reports, Available with Avenue Library. T&C*.

  • Online Only
  • $3,570
  • Online cloud access only
  • Restricted print, copy, paste & download
  • Read only
  • Free industry update
    (Within 180 days)
  • Free report update in next update cycle
    (Oct 2023 - Oct 2024)
  • Data Pack
  • $3,840
  • Restricted to one authorized user
  • One print only
  • Available in
    Excel
  • Free industry update
    (Within 180 days)
  •   Free report update in next update cycle
    (Oct 2023 - Oct 2024)
  • Single User
  • $5,730
  • Restricted to one authorized user
  • One print only
  • Available in
    PDF
  • Free industry update
    (Within 180 days)
  •   Free report update in next update cycle
    (Oct 2023 - Oct 2024)
  • Five Users
  • $6,450
  • Limited to five authorized users
  • Print upto five copies
  • Available in
    PDF
  • Free industry update
    (Within 180 days)
  •   Free report update in next update cycle
    (Oct 2023 - Oct 2024)
  • Enterprise
    License/PDF

  • $9,600
  • Unlimited
    within
    company/enterprise
  • Available in Excel & PDF
  • Free industry update
    (Within 180 days)
  •   Free report update in next update cycle
    (Oct 2023 - Oct 2024)
  • Library
    Membership

  • $999 $ 1,175
    Per User/ Per month/ Billed annually
  • Published Content
    E-access
  • Company Profiles
    E-access
  • Newly Added Content Access
  • 10 PDF
    Downloads
  • 5 Excel Data
    Pack Downloads
  • 250 Company Profiles PDF Downloads
  • Buy Now

*Taxes/Fees, if applicable will be added during checkout. All prices in USD

RELATED REPORTS
 

Why Allied Market Research?

 

Infallible Methodology

To ensure high-level data integrity, accurate analysis, and impeccable forecasts

Analyst Support

For complete satisfaction

Customization

On-demand customization of scope of the report to exactly meet your needs

TARGETED MARKET VIEW

Targeted market view to provide pertinent information and save time of readers

Get fresh content delivered

Get insights on topics that are crucial for your business. Stay abreast of your interest areas.

Get Industry Data Alerts

Why Allied Market Research?

Infallible Methodology

To ensure high-level data integrity, accurate analysis, and impeccable forecasts

Analyst Support

For complete satisfaction

Customization

On-demand customization of scope of the report to exactly meet your needs

TARGETED MARKET VIEW

Targeted market view to provide pertinent information and save time of readers