Filter Reports by Region
sale
Molded Interconnect Device Market: Global Opportunity Analysis and Industry Forecast, 2023-2032
Molded interconnect devices (MID) are injection-molded thermoplastic part with integrated electronic circuit. These 3-dimensional electromechanical components are molded with circuits using high temperature thermoplastics and the structured metallization, which opens new dimension of carrier circuit design to electronics industry.
Report Code : A08632 | Category : Semiconductor and Electronics
