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Through-Silicon Via (TSV) IC Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032
A through-silicon via (TSV) or through-chip via in electronic engineering is a vertical electrical connection (via) that needs to pass or dies entirely through a silicon wafer. TSVs ...
Report Code : A09770 | Category : Semiconductor and Electronics
Space Semiconductor Market: Global Opportunity Analysis and Industry Forecast, 2023-2032
The global space semiconductor market was valued at $2.1 billion in 2022, and is projected to reach $4.8 billion by 2032, growing at a CAGR of 8.8% from 2023 to 2032.
Report Code : A321013 | Pages : 445 | Category : Aerospace & Defense
