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Through-Silicon Via (TSV) IC Packaging Market By Platform Type (2.5D TSV Platform and 3D TSV Platform), Application (Memory Arrays, Image Sensors, Graphics Chips, MPUs [Microprocessor Units], DRAM [Dynamic Random-Access Memory], Integrated Circuits, and Others), and End User (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, Oil & Gas, Paper & Pulp, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027

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Aug 2021 | 464 Views
 
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COVID-19

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Through-Silicon Via (TSV) IC Packaging Market Outlook – 2027 

A through-silicon via (TSV) or through-chip via in electronic engineering is a vertical electrical connection (via) that needs to pass or dies entirely through a silicon wafer. TSVs are high-performance interconnecting technologies often used to build 3D packages and 3D integrated circuits as a substitute to wire-bond and flip-chips. The interconnection and system density are considerably higher compared to the competition such as package-on-package, and the contact length is shorter. 

Innovation in IC packaging enables a smaller end product like smart cell phone, tablets. Through silicon via (TSV) is an additive manufacturing technique which is installed in less space with better connectivity. TSV is used to bridge multiple ICs in one packet. TSV finds applications in various markets such as that of MPUs, DRAMs, PLDs, chips for special purpose communications logic, chips for graphics and CMOS image sensors.

The global through-silicon via (TSV) IC packaging market is segmented on the basis of platform type, application, end user, and region. Based on platform type, through-silicon via (TSV) IC packaging market is bifurcated into 2.5D TSV platform and 3D TSV platform. In terms of application, the market is categorized into memory arrays, image sensors, graphics chips, MPUs (microprocessor units), DRAM (dynamic random-access memory), integrated circuits, and others. 

On the basis of end user, through-silicon via (TSV) IC packaging market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, oil & gas, paper & pulp, and others. Geographically, the market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).

Key players operating in the global through-silicon via (TSV) IC packaging industry include Applied Materials, International Business Machines Corporation, Amkor Micralyne, Inc., Tezzaron Semiconductors, STATS ChipPAC Ltd, Micralyne, Inc., Xilinx., Intel Corporation, Renesas Electronics Corporation, and Texas Instruments. These companies have adopted several strategies such as product launches, partnerships, collaborations, mergers & acquisitions, and joint ventures to strengthen their foothold in the global through-silicon via (TSV) IC packaging market. 

Top Impacting Factors 

The major factor catalyzing the growth of the through-silicon via (TSV) IC packaging market is the increase in adoption for advanced electronic products which drives the semiconductor & electronics industry to innovate & integrate new packaging technology and high demand for 3D packaging using TSVs are factors that drives through-silicon via (TSV) IC packaging market growth.

3D Wafer-Level Chip-Scale Packaging (WLCSP) to Hold the Largest Market Share

3D WLCSP is among the most compact package styles, with enhanced flexibility and better thermal efficiency compared to 3D TSV and 2.5D IC in printed circuit boards. 3D WLCSP has a simpler design process for the manufacture of 3D ICs, using polymers capable of handling extreme temperatures, thereby solving the temperature issue which is the key challenge for this industry. In room-constrained mobile applications and other wearable consumer devices as well as industrial goods, WLCSP has gained momentum as it offers a cost-effective, compact, lightweight, high-performance semiconductor solution.

Asia-Pacific to Account For the Largest Market Share 

The key factors that drive the Asia Pacific TSV IC packaging market are the proliferation of major semiconductor foundries that includes UMC (Taiwan) and TSMC (Taiwan), proximity to major downstream manufacturing operations in electronics, government assisted infrastructure funding, tax incentives, and relatively inexpensive availability of qualified engineers and labor.

Miniaturization of electronic devices is a crucial development that has arisen in the global market. Small, convenient, lightweight, but highly advanced electronic devices are becoming an enormous phenomenon among the global population, especially among the millennials. The through-silicon via (TSV) IC packages are a key component of these advanced electronic miniature devices. Hence their increasing sales impacts directly on the total growth of the global packaging market for through-silicon via (TSV) IC.

Key Benefits of the Report

  • This study presents the analytical depiction of the global through-silicon via (TSV) IC packaging market forecast along with the current trends and future estimations to determine the imminent investment pockets.
  • The report presents information related to key drivers, restraints, and opportunities along with detailed analysis of the global through-silicon via (TSV) IC packaging market share.
  • The current market is quantitatively analyzed from 2020 to 2027 to highlight the global through-silicon via (TSV) IC packaging market growth scenario.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 
  • The report provides a detailed global through-silicon via (TSV) IC packaging market analysis based on competitive intensity and how the competition will take shape in coming years. 

Market Scope and Structure Analysis

Report Metric

Details

Market Size Available For Years

2020–2027

Base Year Considered

2019

Forecast Period

2020–2027

Forecast Units

Value (USD)

Segments Covered

Platform Type, Application, End User, and Region

Regions Covered

North America (Canada, Mexico, U.S.), Europe (France, Germany, UK, Rest of Europe), Asia-Pacific (China, India, Japan, South Korea, Rest of Asia-Pacific), LAMEA (Africa, Latin America, Middle East)

Companies Covered

Applied Materials, International Business Machines Corporation, Amkor Micralyne, Inc., Tezzaron Semiconductors, STATS ChipPAC Ltd, Micralyne, Inc., Xilinx., Intel Corporation, Renesas Electronics Corporation, and Texas Instruments

 

COVID-19 Scenario Analysis

  • COVID-19 can affect the global market in various ways such as disrupted supply chain and market, direct impact on production and demand, and financial downtime on corporations and financial markets.
  • Intel factories around the globe continue to operate on a relatively normal basis and sustains their manufacturing, assembly, test and supply chain operations in California, Oregon, New Mexico, and Arizona, as well as Israel, Malaysia, Ireland, China, Vietnam and other Intel and partner locations around the world.
  • Although the Movement Control Order announced by the Malaysian government is expected to continue until June 9, 2020, after permission from the Malaysian government, the three production sites of Renesas Group located in Malaysia that were operating at a reduced capacity have returned to normal service.
  • At this moment production sites of Renesas Group located in Japan are all under regular activity. Distribution centers located within Japan are still running normally.

Through-Silicon Via (TSV) IC Packaging Market Key Segments

Segments

Sub-Segments

Platform Type

  • 2.5D TSV Platform
  • 3D TSV Platform

Application

  • Memory Arrays
  • Image Sensors
  • Graphics Chips
  • MPUs (Microprocessor Units)
  • DRAM (Dynamic Random-Access Memory)
  • Integrated Circuits
  • Others

End User

  • Consumer Electronics
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace and Defense
  • Oil and Gas
  • Paper and Pulp

 

Questions Answered in the Through-Silicon Via (TSV) IC Packaging Market Research Report

  • Which are the leading market players active in the through-silicon via (TSV) IC packaging market?
  • What would be the detailed impact of COVID-19 on the through-silicon via (TSV) IC packaging market size?
  • How current through-silicon via (TSV) IC packaging market trends would influence the industry in the next few years?
  • What are the driving factors, restraints, and opportunities in the global market?
  • What are the projections for the future that would help in taking further strategic steps?
 
With collective industry experience of about 200 years of its analysts and experts, Allied Market Research (AMR) encompasses most infallible research methodology for its market intelligence and industry analysis. We do not only engrave the deepest levels of markets but also sneak through its slimmest details for the purpose of our market estimates and forecasts. Our approach helps in building greater market consensus view for size, shape and industry trends within each industry segment. We carefully factor in industry trends and real developments for identifying key growth factors and future course of the market. Our research proceeds are the resultant of high quality data, expert views and analysis and high value independent opinions. Our research process is designed to deliver balanced view of the global markets and allow stakeholders to make informed decisions.

We offer our clients exhaustive research and analysis based on wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics and regional intelligence. Our in-house industry experts play instrumental role in designing analytic tools and models, tailored to the requirements of particular industry segment. These analytical tools and models sanitize the data & statistics and enhance the accuracy of our recommendations and advice. With AMR’s calibrated research process and 360` degree data-evaluation methodology, our clients are assured of receiving:

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With a strong methodology we are, therefore, confident that our research and analysis are most reliable and guarantees sound business planning.

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We refer a broad array of industry sources for our secondary, which typically include; however, not limited to: Company SEC filings, annual reports, company websites, broker & financial reports and investor presentations for competitive scenario and shape of the industry

  • Patent and regulatory databases for understanding of technical & legal developments
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Our primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks and face-to-face interactions. We are also in professional corporate relations with various companies that allow us greater flexibility for reaching out industry participants and commentators for interviews and discussions, fulfilling following functions:

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Our primary research interview and discussion panels are typically composed of most experienced industry members. These participants include; however, not limited to:

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AMR has developed set of analyst tools and data models to supplement and expedite the analysis process. Corresponding to markets, where there is significant lack of information and estimates, AMR’s team of experts and analyst develop specific analyst tools and industry models to translate qualitative and quantitative industry indicators into exact industry estimates. These models also allow analysts to examine the prospects and opportunities prevailing in the market to accurately forecast the course of the market.
 
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