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Fan-Out Wafer Level Packaging Market: Global Opportunity Analysis and Industry Forecast, 2023-2032
Fan-out Wafer Level Packaging (FOWLP) is an integrated circuit (IC) packaging technology that allows simultaneous packaging of several components on the same substrate, hence lowering the overall cost ...
Report Code : A08259 | Category : Semiconductor and Electronics
Silicon Wafer Market: Global Opportunity Analysis and Industry Forecast, 2023-2032
The global silicon wafer market was valued at $15.4 billion in 2022, and is projected to reach $25.9 billion by 2032, growing at a CAGR of 5.4% from 2023 to 2032.
Report Code : A09975 | Pages : 250 | Category : Semiconductor and Electronics
