The global wire and cable market was valued at $213.6 billion in 2022, and is projected to reach $323.8 billion by 2032, growing at a CAGR of 4.6% from 2023 to 2032.
Wire bonding is the technology in which an integrated circuit (IC) or other semiconductor device is interconnected using its packaging during the production of semiconductor devices. Wire bonding ...
Report Code : A09771 | Category : Semiconductor and Electronics
