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2021

Semiconductor Assembly Equipment Market

Semiconductor Assembly Equipment Market Size, Share, Competitive Landscape and Trend Analysis Report, by Product Type, Supply Chain Process and End User Industry : Global Opportunity Analysis and Industry Forecast, 2021-2030

CM : Engineering, Equipment and Machinery

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Author's: Amar Chinchane | Sonia Mutreja
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The global semiconductor assembly equipment market size was valued at $3,599.8 million in 2020, and is projected to reach $8,162.3 million by 2030, registering a CAGR of 8.4% from 2021 to 2030. Semiconductor assembly is a challenging procedure that ensures the quality of a variety of semiconductor devices. Semiconductor assembly equipment is utilized for manufacturing of semiconductor part assembly, overall device testing, and wafer fabrication. The growing demand for electronics and gadget services has aided the growth of the semiconductor assembly equipment market significantly.

Semiconductors are crystalline or amorphous materials that under certain conditions, may conduct electricity, making them an ideal medium for current control. Semiconductors are materials with free electrons in their structure, which allow electricity to flow more freely between atoms. The most prevalent semiconductor material is silicon. Equipment for wafer fabrication is used in the early phases of the semiconductor manufacturing process, whereas testing and assembly equipment is utilized in the later stages.

Semiconductor-Assembly-Equipment-Market-2021-2030

IDM companies are continuously investing in R&D sector to develop technologically advanced, energy-efficient, and miniaturized products such as RFID circuits, ICs, low-power microcontrollers, and advanced sensors for various applications such as consumer electronics, automotive, and industrial applications. For instance, in 2019, Texas Instruments and Samsung, for example, spent $1.6 billion and $16.8 billion on R&D of technologically sophisticated and miniaturized goods, respectively.

The novel coronavirus has rapidly spread across various countries and regions, causing enormous impact on lives of people and overall community. Originating as a crisis to human health, it now poses significant threat to worldwide trade, economy, and finance. Due to the continuous lockdown in key global countries, the COVID-19 pandemic has halted assembly of many items in the semiconductor assembly equipment business. The players in semiconductor assembly equipment market can afford a complete lockdown only for a limited period, after which they would have to alter their investment plans. Furthermore, number of COVID-19 cases are expected to reduce in the near term as vaccine for COVID-19 has been introduced in the market. This is further expected to lead to re-initiation of semiconductor assembly equipment companies at their full-scale capacities, which would aid the market to recover by the start of 2022. After COVID-19 infection instances start to decline, equipment and machinery producers must focus on protecting their staff, operations, and supply networks in order to respond to urgent emergencies and establish new methods of working.

Various companies are improving their product portfolio by launching semiconductor assembly equipment with advanced technology to strengthen their position in semiconductor assembly equipment market. For instance, in May 2021, Applied Materials, Inc. launched Alx TM, which accelerate the manufacturing and assembly of latest technology chip. Furthermore, Applies Material and BE semiconductor Industries N.V have an agreement to develop proven equipment solution for die-based hybrid bonding with chip-to-chip connecting technology, which improve the performance design. Hence, these strategies implemented by the players are expected to fuel the semiconductor assembly equipment market growth during the forecast period.

Semiconductor Assembly Equipment Market
By Product Type
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Inspection and dicing Equipment is projected to grow at a significant CAGR

The semiconductor assembly equipment market is segmented on the basis of product type, supply chain process, end user industry, and region. By product type, the market is divided into inspection and dicing equipment, die-attach equipment, wire bonding equipment and plating equipment. By supply chain process, the market is segmented into IDM, OSAT and foundry. By end user industry the semiconductor assembly equipment  market is divided into consumer electronics, healthcare, automotive, IT & telecommunication and others. Region wise, the semiconductor assembly equipment market analysis is conducted across North America (the U.S., Canada, and Mexico), Europe (the UK, France, Germany, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).

Semiconductor Assembly Equipment Market
By End User Industry
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Consumer Electronics segment holds dominant position in 2020

Asia-Pacific garners significantly high semiconductor assembly equipment market share and growth with comparatively high CAGR during the forecast period. The region's high concentration of IC makers is expected to drive the demand for semiconductor assembly equipment in Asia-Pacific. ICs are widely used in a variety of industries, including consumer electronics, industrial, telecommunications, data centers, and automotive. For example, ICs are utilized for sensing and processing applications in high-density storage devices such as solid-state drives (SSDs) and vehicles. As a result of the growing number of chip fabrication facilities around the globe, the semiconductor industry in Asia is predicted to witness growth throughout the forecast period.

Semiconductor Assembly Equipment Market
By Region
2030
Asia-pacific 
North America
Europe
LAMEA

Asia-Pacific holds a dominant position in 2020 and is expected to grow at a significant rate during the forecast period.

Competition Analysis

Key companies profiled in the semiconductor assembly equipment market report include AlsilMaterial, Applied Materials Inc., ASML Holdings N.V., Intel Corporation, Micron Technology Inc., Qualcomm Technologies, Inc., Samsung Group, Screen Holdings Co., Ltd., Teradyne Inc., and Tokyo Electron Limited.

Key Benefits For Stakeholders

  • The report provides an extensive analysis of the current and emerging semiconductor assembly equipment market trends and dynamics. 
  • In-depth emerging semiconductor assembly equipment market analysis is conducted by constructing estimations for key segments between 2021 and 2030.
  • Extensive analysis of the emerging semiconductor assembly equipment market is conducted by following key product positioning and monitoring of top competitors within the market framework.
  • A comprehensive analysis of all the regions is provided to determine the prevailing opportunities.
  • The global emerging semiconductor assembly equipment market forecast analysis from 2021 to 2030 is included in the report.
  • The key players within emerging semiconductor assembly equipment market are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the emerging semiconductor assembly equipment industry.

Global Semiconductor Assembly Equipment Market Segments

Key Segments

By Product Type

  • Inspection & dicing equipment
  • Die-attach equipment
  • Wire bonding equipment
  • Plating equipment

By Supply Chain Process

  • IDM
  • OSAT
  • Foundry

By End-user Industry

  • Consumer electronics
  • Healthcare
  • Automotive
  • IT & telecommunication
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Players

  • AlsilMaterial
  • Applied Materials Inc.
  • ASML Holdings N.V.
  • Intel Corporation
  • Micron Technology Inc.
  • Qualcomm Technologies, Inc.
  • Samsung Group
  • Screen Holdings Co., Ltd.
  • Teradyne Inc.
  • Tokyo Electron Limited.

Semiconductor Assembly Equipment Market Report Highlights

Aspects Details
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By Product Type
  • Inspection & dicing equipment
  • Die-attach equipment
    • Flip Chip Bonder
    • Die Bonder
  • Wire bonding equipment
  • Plating equipment
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By Supply Chain Process
  • IDM
  • OSAT
  • Foundry
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By End-user Industry
  • Consumer electronics
  • Healthcare
  • Automotive
  • IT & telecommunication
  • Others
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By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (France, Germany, Italy, Spain, UK, Russia, Rest of Europe)
  • Asia-Pacific  (China, Japan, India, South Korea, Australia, Thailand, Malaysia, Indonesia, Rest of Asia-Pacific)
  • LAMEA  (Brazil, South Africa, Saudi Arabia, UAE, Argentina, Rest of LAMEA)
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Key Market Players

SCREEN HOLDINGS CO., LTD., APPLIED MATERIALS, INC., ASML HOLDING N.V., TERADYNE INC., ALSILMATERIAL, MICRON TECHNOLOGY, INC., SAMSUNG ELECTRONICS CO., LTD., QUALCOMM TECHNOLOGIES, INC, INTEL CORPORATION, TOKYO ELECTRON LIMITED

Analyst Review

Quality assurance is important in the semiconductor manufacturing process, which is a complex process. Wafer manufacturing, semiconductor component assembly, and device testing are all done with this equipment. The market is expected to witness growth during the forecast period due to rise in demand for electronics and gadget services. Demand in the global market is also experiencing growth, due to its extensive use in solar panels, sensors, plug-in electric cars, wind turbines, smart meters, and other applications. The use of semiconductor manufacturing equipment in consumer electronics is driving the global demand for semiconductor manufacturing equipment.

Various important companies are extending their product portfolios by releasing the newest and most modern semiconductor manufacturing equipment as well as enhancing their market position by strategic actions such as collaboration, acquisition, company expansion, and product introduction. For example, Tokyo Electron released the CELLESTA SCD single wafer system in December 2020, which is utilized in silicon wafers in the semiconductor production process. As a result of these strategic initiatives by key companies, demand for semiconductor manufacturing equipment is projected to rise during the forecast period.

Hence, the increased need for ICs as a result of the strong demand for electronics devices has provided many opportunities for the growth of the semiconductor sector. Such factors are expected to positively impact the market growth during the forecast period.

Author Name(s) : Amar Chinchane | Sonia Mutreja
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Frequently Asked Questions?

The semiconductor assembly equipment market size was valued at $3,599.8 million in 2020.

Based on product type, the inspection and dicing equipment holds the maximum market share of the semiconductor assembly equipment market in 2020.

The semiconductor assembly equipment market is projected to reach $8,162.3 million by 2030.

Rise in demand for electronics products and growth in complexity of semiconductor IC designs are the key trends in the semiconductor assembly equipment market.

The product launch is key growth strategy of semiconductor assembly equipment industry players.

The company profile has been selected on factors such as geographical presence, market dominance (in terms of revenue and volume sales), various strategies and recent developments.

Fluctuating raw material prices is the effecting factor for semiconductor assembly equipment market.

The end user industry of semiconductor assembly equipment includes in consumer electronics, healthcare, automotive, IT & telecommunication and others.

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Semiconductor Assembly Equipment Market

Global Opportunity Analysis and Industry Forecast, 2021-2030