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2021
Semiconductor Assembly Equipment Market

Semiconductor Assembly Equipment Market by Product Type (Inspection and Dicing Equipment, Die-Attach Equipment, Wire Bonding Equipment, and Plating Equipment), Supply Chain Process (IDM, OSAT, and Foundry), and End User Industry (Consumer Electronics, Healthcare, Automotive, IT & Telecommunication, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2030

A13637
Pages: 305
Sep 2021 | 327 Views
   
Author(s) : Amar Chinchane , Onkar Sumant
Tables: 124
Charts: 78
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COVID-19

Pandemic disrupted the entire world and affected many industries.

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The global semiconductor assembly equipment market size was valued at $3,599.8 million in 2020, and is projected to reach $8,162.3 million by 2030, registering a CAGR of 8.4% from 2021 to 2030. Semiconductor assembly is a challenging procedure that ensures the quality of a variety of semiconductor devices. Semiconductor assembly equipment is utilized for manufacturing of semiconductor part assembly, overall device testing, and wafer fabrication. The growing demand for electronics and gadget services has aided the growth of the semiconductor assembly equipment market significantly.

The COVID 19 outbreak has affected the growth of the semiconductor assembly equipment industry owing to the lockdown measure in the countries and delay in manufacturing and production of semiconductor assembly equipment which are utilized for manufacturing semicondutor chips, ICs, and others.

Semiconductors are crystalline or amorphous materials that under certain conditions, may conduct electricity, making them an ideal medium for current control. Semiconductors are materials with free electrons in their structure, which allow electricity to flow more freely between atoms. The most prevalent semiconductor material is silicon. Equipment for wafer fabrication is used in the early phases of the semiconductor manufacturing process, whereas testing and assembly equipment is utilized in the later stages.

Semiconductor-Assembly-Equipment-Market-2021-2030

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IDM companies are continuously investing in R&D sector to develop technologically advanced, energy-efficient, and miniaturized products such as RFID circuits, ICs, low-power microcontrollers, and advanced sensors for various applications such as consumer electronics, automotive, and industrial applications. For instance, in 2019, Texas Instruments and Samsung, for example, spent $1.6 billion and $16.8 billion on R&D of technologically sophisticated and miniaturized goods, respectively.

The novel coronavirus has rapidly spread across various countries and regions, causing enormous impact on lives of people and overall community. Originating as a crisis to human health, it now poses significant threat to worldwide trade, economy, and finance. Due to the continuous lockdown in key global countries, the COVID-19 pandemic has halted assembly of many items in the semiconductor assembly equipment business. The players in semiconductor assembly equipment market can afford a complete lockdown only for a limited period, after which they would have to alter their investment plans. Furthermore, number of COVID-19 cases are expected to reduce in the near term as vaccine for COVID-19 has been introduced in the market. This is further expected to lead to re-initiation of semiconductor assembly equipment companies at their full-scale capacities, which would aid the market to recover by the start of 2022. After COVID-19 infection instances start to decline, equipment and machinery producers must focus on protecting their staff, operations, and supply networks in order to respond to urgent emergencies and establish new methods of working.

Various companies are improving their product portfolio by launching semiconductor assembly equipment with advanced technology to strengthen their position in semiconductor assembly equipment market. For instance, in May 2021, Applied Materials, Inc. launched Alx TM, which accelerate the manufacturing and assembly of latest technology chip. Furthermore, Applies Material and BE semiconductor Industries N.V have an agreement to develop proven equipment solution for die-based hybrid bonding with chip-to-chip connecting technology, which improve the performance design. Hence, these strategies implemented by the players are expected to fuel the semiconductor assembly equipment market growth during the forecast period.

Semiconductor Assembly Equipment Market
By Product Type

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Inspection and dicing Equipment is projected to grow at a significant CAGR

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The semiconductor assembly equipment market is segmented on the basis of product type, supply chain process, end user industry, and region. By product type, the market is divided into inspection and dicing equipment, die-attach equipment, wire bonding equipment and plating equipment. By supply chain process, the market is segmented into IDM, OSAT and foundry. By end user industry the semiconductor assembly equipment  market is divided into consumer electronics, healthcare, automotive, IT & telecommunication and others. Region wise, the semiconductor assembly equipment market analysis is conducted across North America (the U.S., Canada, and Mexico), Europe (the UK, France, Germany, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).

Semiconductor Assembly Equipment Market
By End User Industry

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Consumer Electronics segment holds dominant position in 2020

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Asia-Pacific garners significantly high semiconductor assembly equipment market share and growth with comparatively high CAGR during the forecast period. The region's high concentration of IC makers is expected to drive the demand for semiconductor assembly equipment in Asia-Pacific. ICs are widely used in a variety of industries, including consumer electronics, industrial, telecommunications, data centers, and automotive. For example, ICs are utilized for sensing and processing applications in high-density storage devices such as solid-state drives (SSDs) and vehicles. As a result of the growing number of chip fabrication facilities around the globe, the semiconductor industry in Asia is predicted to witness growth throughout the forecast period.

Semiconductor Assembly Equipment Market
By Region

2030
Asia-pacific 
North America
Europe
Lamea

Asia-Pacific holds a dominant position in 2020 and is expected to grow at a significant rate during the forecast period.

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Competition Analysis

Key companies profiled in the semiconductor assembly equipment market report include AlsilMaterial, Applied Materials Inc., ASML Holdings N.V., Intel Corporation, Micron Technology Inc., Qualcomm Technologies, Inc., Samsung Group, Screen Holdings Co., Ltd., Teradyne Inc., and Tokyo Electron Limited.

Key Benefits For Stakeholders

  • The report provides an extensive analysis of the current and emerging semiconductor assembly equipment market trends and dynamics. 
  • In-depth emerging semiconductor assembly equipment market analysis is conducted by constructing estimations for key segments between 2021 and 2030.
  • Extensive analysis of the emerging semiconductor assembly equipment market is conducted by following key product positioning and monitoring of top competitors within the market framework.
  • A comprehensive analysis of all the regions is provided to determine the prevailing opportunities.
  • The global emerging semiconductor assembly equipment market forecast analysis from 2021 to 2030 is included in the report.
  • The key players within emerging semiconductor assembly equipment market are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the emerging semiconductor assembly equipment industry.

Global Semiconductor Assembly Equipment Market Segments

Key Segments

By Product Type

  • Inspection & dicing equipment
  • Die-attach equipment
  • Wire bonding equipment
  • Plating equipment

By Supply Chain Process

  • IDM
  • OSAT
  • Foundry

By End-user Industry

  • Consumer electronics
  • Healthcare
  • Automotive
  • IT & telecommunication
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

Key Players

  • AlsilMaterial
  • Applied Materials Inc.
  • ASML Holdings N.V.
  • Intel Corporation
  • Micron Technology Inc.
  • Qualcomm Technologies, Inc.
  • Samsung Group
  • Screen Holdings Co., Ltd.
  • Teradyne Inc.
  • Tokyo Electron Limited.
 

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings of the study
2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key findings

3.2.1.Top investment pockets
3.2.2.Top winning strategies

3.3.Market player positioning, 2020
3.4.Porter's five forces analysis
3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Rise in demand for electronics products
3.5.1.2.Growth in demand for hybrid circuits from medical, military, photonics, and wireless electronics applications
3.5.1.3.Growth of the semiconductor industry

3.5.2.Restraint

3.5.2.1.Fluctuation in raw material prices

3.5.3.Opportunities

3.5.3.1.Growth in usage of LED circuits

3.6.COVID-19 Impact Analysis

CHAPTER 4:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE

4.1.Overview

4.1.1.Market size and forecast, by product type

4.2.Inspection and dicing Equipment

4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market size and forecast, by country

4.3.Die-Attach Equipment

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market size and forecast, by die attach equipment type

4.3.3.1.Flip Chip Bonder
4.3.3.2.Die Bonder

4.3.4.Market size and forecast, by country

4.4.Wire Bonding Equipment

4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market size and forecast, by country

4.5.Plating Equipment

4.5.1.Key market trends, growth factors, and opportunities
4.5.2.Market size and forecast, by region
4.5.3.Market size and forecast, by country

CHAPTER 5:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS

5.1.Overview

5.1.1.Market size and forecast, by supply chain process

5.2.IDM

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market size and forecast, by country

5.3.OSAT

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market size and forecast, by country

5.4.Foundry

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market size and forecast, by country

CHAPTER 6:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY

6.1.Overview

6.1.1.Market size and forecast, by end user industry

6.2.Consumer Electronics

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market size and forecast, by country

6.3.Healthcare

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market size and forecast, by country

6.4.Automotive

6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market size and forecast, by country

6.5.IT and Telecommunication

6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market size and forecast, by country

6.6.Others

6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market size and forecast, by country

CHAPTER 7:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY REGION

7.1.Market overview

7.1.1.Market size and forecast, by region

7.2.North America

7.2.1.Key market trends, growth factors, and opportunities
7.2.2.North America market size and forecast, by product type
7.2.2.1.Market size and forecast, by die attach equipment type
7.2.3.North America market size and forecast, by end user industry
7.2.4.North America market size and forecast, by supply chain process
7.2.5.North America market size and forecast, by country

7.2.5.1.U.S.

7.2.5.1.1.U.S. market size and forecast, by product type
7.2.5.1.2.U.S. market size and forecast, by supply chain process
7.2.5.1.3.U.S. market size and forecast, by end user industry

7.2.5.2.Canada

7.2.5.2.1.Canada market size and forecast, by product type
7.2.5.2.2.Canada market size and forecast, by supply chain process
7.2.5.2.3.Canada market size and forecast, by end user industry

7.2.5.3.Mexico

7.2.5.3.1.Mexico market size and forecast, by product type
7.2.5.3.2.Mexico market size and forecast, by supply chain process
7.2.5.3.3.Mexico market size and forecast, by end user industry

7.3.Europe

7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Europe market size and forecast, by product type
7.3.2.1.Market size and forecast, by die attach equipment type
7.3.3.Europe market size and forecast, by supply chain process
7.3.4.Europe market size and forecast, by end user industry
7.3.5.Europe market size and forecast, by country

7.3.5.1.Germany

7.3.5.1.1.Germany market size and forecast, by product type
7.3.5.1.2.Germany market size and forecast, by supply chain process
7.3.5.1.3.Germany market size and forecast, by end user industry

7.3.5.2.France

7.3.5.2.1.France market size and forecast, by product type
7.3.5.2.2.France market size and forecast, by supply chain process
7.3.5.2.3.France market size and forecast, by end user industry

7.3.5.3.UK

7.3.5.3.1.UK market size and forecast, by product type
7.3.5.3.2.UK market size and forecast, by supply chain process
7.3.5.3.3.UK market size and forecast, by end user industry

7.3.5.4.Italy

7.3.5.4.1.Italy market size and forecast, by product type
7.3.5.4.2.Italy market size and forecast, by supply chain process
7.3.5.4.3.Italy market size and forecast, by end user industry

7.3.5.5.Rest of Europe

7.3.5.5.1.Rest of Europe market size and forecast, by product type
7.3.5.5.2.Rest of Europe market size and forecast, by supply chain process
7.3.5.5.3.Rest of Europe market size and forecast, by end user industry

7.4.Asia-Pacific

7.4.1.Key market trends, growth factors, and opportunities
7.4.2.Asia-Pacific market size and forecast, by product type
7.4.2.1.Market size and forecast, by die attach equipment type
7.4.3.Asia-Pacific market size and forecast, by supply chain process
7.4.4.Asia-Pacific market size and forecast, by end user industry
7.4.5.Asia-Pacific market size and forecast, by country

7.4.5.1.China

7.4.5.1.1.China market size and forecast, by product type
7.4.5.1.2.China market size and forecast, by supply chain process
7.4.5.1.3.China market size and forecast, by end user industry

7.4.5.2.India

7.4.5.2.1.India market size and forecast, by product type
7.4.5.2.2.Taiwan market size and forecast, by supply chain process
7.4.5.2.3.Taiwan market size and forecast, by end user industry

7.4.5.3.Japan

7.4.5.3.1.Japan market size and forecast, by product type
7.4.5.3.2.Japan market size and forecast, by supply chain process
7.4.5.3.3.Japan market size and forecast, by end user industry

7.4.5.4.South Korea

7.4.5.4.1.South Korea market size and forecast, by product type
7.4.5.4.2.South Korea market size and forecast, by supply chain process
7.4.5.4.3.South Korea market size and forecast, by end user industry

7.4.5.5.Rest of Asia-Pacific

7.4.5.5.1.Rest of Asia-Pacific market size and forecast, by product type
7.4.5.5.2.Rest of Asia-Pacific market size and forecast, by supply chain process
7.4.5.5.3.Rest of Asia-Pacific market size and forecast, by end user industry

7.5.LAMEA

7.5.1.Key market trends, growth factors, and opportunities
7.5.2.LAMEA market size and forecast, by product type

7.5.2.1.Market size and forecast, by die attach equipment type

7.5.3.LAMEA market size and forecast, by supply chain process
7.5.4.LAMEA market size and forecast, by end user industry
7.5.5.LAMEA market size and forecast, by country

7.5.5.1.Latin America

7.5.5.1.1.Latin America market size and forecast, by product type
7.5.5.1.2.Latin America market size and forecast, by supply chain process
7.5.5.1.3.Latin America market size and forecast, by end user industry

7.5.5.2.Middle East

7.5.5.2.1.Middle East market size and forecast, by product type
7.5.5.2.2.Middle East market size and forecast, by supply chain process
7.5.5.2.3.Middle East market size and forecast, by end user industry

7.5.5.3.Africa

7.5.5.3.1.Africa market size and forecast, by product type
7.5.5.3.2.Africa market size and forecast, by supply chain process
7.5.5.3.3.Africa market size and forecast, by end user industry

CHAPTER 8:COMPANY PROFILES

8.1.ALSILMATERIAL

8.1.1.Company overview
8.1.2.Key executive
8.1.3.Company snapshot
8.1.4.Product portfolio

8.2.APPLIED MATERIALS, INC.

8.2.1.Company overview
8.2.2.Key executive
8.2.3.Company snapshot
8.2.4.Operating business segments
8.2.5.Product portfolio
8.2.6.R&D expenditure
8.2.7.Business performance
8.2.8.Key strategic moves and developments

8.3.ASML HOLDING N.V.

8.3.1.Company overview
8.3.2.Key executive
8.3.3.Company snapshot
8.3.4.Operating business segments
8.3.5.Product portfolio
8.3.6.R&D expenditure
8.3.7.Business performance

8.4.INTEL CORPORATION

8.4.1.Company overview
8.4.2.Key executive
8.4.3.Company snapshot
8.4.4.Operating business segments
8.4.5.Product portfolio
8.4.6.R&D expenditure
8.4.7.Business performance
8.4.8.Key strategic moves and developments

8.5.MICRON TECHNOLOGY, INC.

8.5.1.Company overview
8.5.2.Key executive
8.5.3.Company snapshot
8.5.4.Operating business segments
8.5.5.Product portfolio
8.5.6.R&D expenditure
8.5.7.Business performance
8.5.8.Key strategic moves and developments

8.6.QUALCOMM TECHNOLOGIES, INC

8.6.1.Company overview
8.6.2.Key executive
8.6.3.Company snapshot
8.6.4.Operating business segments
8.6.5.Product portfolio
8.6.6.R&D expenditure
8.6.7.Business performance
8.6.8.Key strategic moves and developments

8.7.SAMSUNG ELECTRONICS CO., LTD.

8.7.1.Company overview
8.7.2.Key executive
8.7.3.Company snapshot
8.7.4.Operating business segments
8.7.5.Product portfolio
8.7.6.R&D expenditure
8.7.7.Business performance
8.7.8.Key strategic moves and developments

8.8.SCREEN HOLDINGS CO., LTD.

8.8.1.Company overview
8.8.2.Key executive
8.8.3.Company snapshot
8.8.4.Operating business segments
8.8.5.Product portfolio
8.8.6.R&D expenditure
8.8.7.Business performance
8.8.8.Key strategic moves and developments

8.9.TERADYNE INC.

8.9.1.Company overview
8.9.2.Key executive
8.9.3.Company snapshot
8.9.4.Operating business segments
8.9.5.Product portfolio
8.9.6.Business performance
8.9.7.Key strategic moves and developments

8.10.TOKYO ELECTRON LIMITED

8.10.1.Company overview
8.10.2.Key executive
8.10.3.Company snapshot
8.10.4.Operating business segments
8.10.5.Product portfolio
8.10.6.R&D expenditure
8.10.7.Business performance
8.10.8.Key strategic moves and developments

LIST OF TABLES

TABLE 01.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 02.INSPECTION AND DICING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 03.DIE-ATTACH SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 04.DIE ATTACH ASSEMBLY EQUIPMENT MARKET REVENUE, BY TYPE, 2020–2030 ($MILLION)
TABLE 05.WIRE BONDING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 06.PLATING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 07.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 08.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR IDM, BY REGION, 2020–2030 ($MILLION)
TABLE 09.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR OSAT, BY REGION, 2020–2030 ($MILLION)
TABLE 10.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR FOUNDRY, BY REGION, 2020–2030 ($MILLION)
TABLE 11.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 12.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR CONSUMER ELECTRONICS, BY REGION, 2020–2030 ($MILLION)
TABLE 13.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR HEALTHCARE, BY REGION, 2020–2030 ($MILLION)
TABLE 14.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR AUTOMOTIVE, BY REGION, 2020–2030 ($MILLION)
TABLE 15.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR IT AND TELECOMMUNICATION, BY REGION, 2020–2030 ($MILLION)
TABLE 16.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR OTHERS, BY REGION, 2020–2030 ($MILLION)
TABLE 17.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY REGION, 2020–2030 ($MILLION)
TABLE 18.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 19.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 20.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 21.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 22.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 23.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 24.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 25.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 26.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 27.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 28.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 29.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 30.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 31.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 32.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 33.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 34.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 ($MILLION)
TABLE 35.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 36.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 ($MILLION)
TABLE 37.GERMANY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 38.GERMANY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 39.GEMRNAY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 40.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 41.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 42.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 43.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 44.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 45.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 46.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 47.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 48.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 49.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 50.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 51.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 52.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 53.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 54.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 55.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 56.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 57.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 58.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 59.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 60.TAIWAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 61.TAIWAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 62.TAIWAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 63.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 64.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 65.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 66.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 67.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 68.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 69.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 70.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 71.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 72.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 73.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 74.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 75.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 76.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 ($MILLION)
TABLE 77.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 78.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 79.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 80.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 81.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 82.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 83.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 84.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 85.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 86.ALSILMATERIAL: KEY EXECUTIVE
TABLE 87.ALSILMATERIAL: COMPANY SNAPSHOT
TABLE 88.ALSILMATERIAL: PRODUCT PORTFOLIO
TABLE 89.APPLIED MATERIALS: KEY EXECUTIVE
TABLE 90.APPLIED MATERIALS: COMPANY SNAPSHOT
TABLE 91.APPLIED MATERIALS: OPERATING SEGMENTS
TABLE 92.APPLIED MATERIALS: PRODUCT PORTFOLIO
TABLE 93.ASML: KEY EXECUTIVE
TABLE 94.ASML: COMPANY SNAPSHOT
TABLE 95.ASML: OPERATING SEGMENT
TABLE 96.ASML: PRODUCT PORTFOLIO
TABLE 97.INTEL CORPORATION: KEY EXECUTIVE
TABLE 98.INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 99.INTEL CORPORATION: OPERATING SEGMENTS
TABLE 100.INTEL CORPORATION: PRODUCT PORTFOLIO
TABLE 101.MICRON TECHNOLOGY: KEY EXECUTIVE
TABLE 102.MICRON TECHNOLOGY: COMPANY SNAPSHOT
TABLE 103.MICRON TECHNOLOGY: OPERATING SEGMENTS
TABLE 104.MICRON TECHNOLOGY: PRODUCT PORTFOLIO
TABLE 105.QUALCOMM TECHNOLOGIES: KEY EXECUTIVE
TABLE 106.QUALCOMM TECHNOLOGIES: COMPANY SNAPSHOT
TABLE 107.QUALCOMM TECHNOLOGIES: OPERATING SEGMENTS
TABLE 108.QUALCOMM TECHNOLOGIES: PRODUCT PORTFOLIO
TABLE 109.SAMSUNG: KEY EXECUTIVE
TABLE 110.SAMSUNG: COMPANY SNAPSHOT
TABLE 111.SAMSUNG: OPERATING SEGMENTS
TABLE 112.SAMSUNG: PRODUCT PORTFOLIO
TABLE 113.SCREEN HOLDINGS: KEY EXECUTIVE
TABLE 114.SCREEN HOLDINGS: COMPANY SNAPSHOT
TABLE 115.SCREEN HOLDINGS: OPERATING SEGMENTS
TABLE 116.SCREEN HOLDINGS: PRODUCT PORTFOLIO
TABLE 117.TERADYNE: KEY EXECUTIVE
TABLE 118.TERADYNE: COMPANY SNAPSHOT
TABLE 119.TERADYNE: OPERATING SEGMENTS
TABLE 120.TERADYNE: PRODUCT PORTFOLIO
TABLE 121.TOKYO ELECTRON LIMITED: KEY EXECUTIVE
TABLE 122.TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
TABLE 123.TOKYO ELECTRON LIMITED: OPERATING SEGMENTS
TABLE 124.TOKYO ELECTRON LIMITED: PRODUCT PORTFOLIO

LIST OF FIGURES

FIGURE 01.KEY MARKET SEGMENTS
FIGURE 02.EXECUTIVE SUMMARY
FIGURE 03.TOP INVESTMENT POCKETS
FIGURE 04.TOP WINNING STRATEGIES, BY YEAR, 2019–2021
FIGURE 05.TOP WINNING STRATEGIES, BY DEVELOPMENT, 2019–2021 (%)
FIGURE 06.TOP WINNING STRATEGIES, BY COMPANY, 2019–2021
FIGURE 07.MARKET PLAYER POSITIONING, 2020
FIGURE 08.LOW TO MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 09.MODERATE-TO-HIGH BARGAINING POWER OF BUYERS
FIGURE 10.MODERATE-TO-HIGH THREAT OF SUBSTITUTES
FIGURE 11.MODERATE-TO-HIGH THREAT OF NEW ENTRANTS
FIGURE 12.MODERATE TO HIGH INTENSITY OF RIVALRY
FIGURE 13.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 (%)
FIGURE 14.COMPARATIVE SHARE ANALYSIS OF INSPECTION AND DICING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF DIE-ATTACH SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF WIRE BONDING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF PLATING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 18.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 (%)
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR IDM, BY COUNTRY, 2020–2030 (%)
 FIGURE 20.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR OSAT, BY COUNTRY, 2020–2030 (%)
 FIGURE 21.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR FOUNDRY, BY COUNTRY, 2020–2030 (%)
 FIGURE 22.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 (%)
FIGURE 23.COMAPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR CONSUMER ELECTRONICS, BY COUNTRY, 2020–2030 (%)
FIGURE 24.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR HEALTHCARE, BY COUNTRY, 2020–2030 (%)
 FIGURE 25.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR AUTOMOTIVE, BY COUNTRY, 2020–2030 (%)
 FIGURE 26.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET FOR IT AND TELECOMMUNICATION, BY COUNTRY, 2020–2030 (%)
 FIGURE 27.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET OTHERS, BY COUNTRY, 2020–2030 (%)
 FIGURE 28.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY REGION, 2020–2030
FIGURE 29.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 30.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 31.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 32.GERMANY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 33.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 34.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 35.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 36.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 37.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 38.INDIA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
 FIGURE 39.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 40.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 41.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 42.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 43.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 44.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, 2020-2030 ($MILLION)
FIGURE 45.APPLIED MATERIALS: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 46.APPLIED MATERIALS: REVENUE, 2018–2020 ($MILLION)
FIGURE 47.APPLIED MATERIALS: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 48.APPLIED MATERIALS: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 49.ASML: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 50.ASML: REVENUE, 2018–2020 ($MILLION)
FIGURE 51.ASML: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 52.INTEL CORPORATION: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 53.INTEL CORPORATION: REVENUE, 2018–2020 ($MILLION)
FIGURE 54.INTEL CORPORATION: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 55.INTEL CORPORATION: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 56.MICRON TECHNOLOGY: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 57.MICRON TECHNOLOGY: REVENUE, 2018–2020 ($MILLION)
FIGURE 58.MICRON TECHNOLOGY: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 59.MICRON TECHNOLOGY: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 60.QUALCOMM TECHNOLOGIES: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 61.QUALCOMM TECHNOLOGIES: REVENUE, 2018–2020 ($MILLION)
FIGURE 62.QUALCOMM TECHNOLOGIES: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 63.QUALCOMM TECHNOLOGIES: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 64.SAMSUNG: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 65.SAMSUNG: REVENUE, 2018–2020 ($MILLION)
FIGURE 66.SAMSUNG: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 67.SAMSUNG: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 68.SCREEN HOLDINGS: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 69.SCREEN HOLDINGS: REVENUE, 2018–2020 ($MILLION)
FIGURE 70.SCREEN HOLDINGS: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 71.SCREEN HOLDINGS: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 72.TERADYNE: REVENUE, 2018–2020 ($MILLION)
FIGURE 73.TERADYNE: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 74.TERADYNE: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 75.TOKYO ELECTRON LIMITED: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 76.TOKYO ELECTRON LIMITED: REVENUE, 2018–2020 ($MILLION)
FIGURE 77.TOKYO ELECTRON LIMITED: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 78.TOKYO ELECTRON LIMITED: REVENUE SHARE BY REGION, 2020 (%)

 
 

Quality assurance is important in the semiconductor manufacturing process, which is a complex process. Wafer manufacturing, semiconductor component assembly, and device testing are all done with this equipment. The market is expected to witness growth during the forecast period due to rise in demand for electronics and gadget services. Demand in the global market is also experiencing growth, due to its extensive use in solar panels, sensors, plug-in electric cars, wind turbines, smart meters, and other applications. The use of semiconductor manufacturing equipment in consumer electronics is driving the global demand for semiconductor manufacturing equipment.

Various important companies are extending their product portfolios by releasing the newest and most modern semiconductor manufacturing equipment as well as enhancing their market position by strategic actions such as collaboration, acquisition, company expansion, and product introduction. For example, Tokyo Electron released the CELLESTA SCD single wafer system in December 2020, which is utilized in silicon wafers in the semiconductor production process. As a result of these strategic initiatives by key companies, demand for semiconductor manufacturing equipment is projected to rise during the forecast period.

Hence, the increased need for ICs as a result of the strong demand for electronics devices has provided many opportunities for the growth of the semiconductor sector. Such factors are expected to positively impact the market growth during the forecast period.

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A. The semiconductor assembly equipment market size was valued at $3,599.8 million in 2020.

A. Based on product type, the inspection and dicing equipment holds the maximum market share of the semiconductor assembly equipment market in 2020.

A. The semiconductor assembly equipment market is projected to reach $8,162.3 million by 2030.

A. Rise in demand for electronics products and growth in complexity of semiconductor IC designs are the key trends in the semiconductor assembly equipment market.

A. The product launch is key growth strategy of semiconductor assembly equipment industry players.

A. The company profile has been selected on factors such as geographical presence, market dominance (in terms of revenue and volume sales), various strategies and recent developments.

A. Fluctuating raw material prices is the effecting factor for semiconductor assembly equipment market.

A. The end user industry of semiconductor assembly equipment includes in consumer electronics, healthcare, automotive, IT & telecommunication and others.

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