Semiconductor Fabrication Material Market by Material Type (Silicon Wafers, Photomasks, Photoresists, Wet Chemicals, CMP Slurry and Pads, Gases, Sputter Targets, and Photoresist Ancillaries) - Global Opportunity Analysis and Industry Forecast, 2020-2027
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Mar 2020 |
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Semiconductor device fabrication is the process of developing integrated circuits that are used in electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps to develop electronic circuits on a wafer made of pure semiconducting material.
Silicon is the most commonly used material used for manufacturing semiconductors, however other compound semiconductors are used for specialized applications. The complete manufacturing process starting from assembly for electronic components to shipment of packaged chips, takes about six to eight weeks, and is performed in highly specialized facilities known as fabs.
The global semiconductor fabrication material market has witnessed significant growth over the past few years. The semiconductor fabrication material market is expected to witness significant growth in the near future, owing to inclination towards digital integrated circuits (ICs). Moreover, growing demand for CPM slurry in consumer electronic devices has supplemented the market growth. Moreover, increasing demand for 300mm wafers in semiconductors production has fueled the market growth. However, volatile prices of raw materials hamper the growth of the market.
The global semiconductor fabrication material market is segmented based on type, and geography. Based on type, the market is divided into silicon wafers, photomasks, photoresists, wet chemicals, CMP slurry & pads, gases, sputter targets, and photoresist ancillaries. Based on geography, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The major players operating in the global market have adopted key strategies such as mergers, acquisitions, collaborations, and partnerships to strengthen their market outreach and sustain the stiff competition in the market.
Key Market Players:
- BASF SE
- Kanto Chemical Co., Inc.
- Air Liquide SA
- Linde AG
- Praxair, Inc.
- Taiyo Nippon Sanso
- Dow Chemical Company
- Air Products and Chemicals Inc.
- JSR Corporation
- Alent Plc
Key Benefits
- This report provides a quantitative analysis of the current trends, estimations, and dynamics from 2016 to 2023 to assist in identifying the prevailing market opportunities.
- The major countries in each region have been mapped based on their market revenues.
- This study evaluates the competitive landscape to understand the competitive environment across geographies.
- An in-depth analysis of each segment of the global semiconductor fabrication material market is provided in the report.
Semiconductor Fabrication Material Market Key Segments:
By Material Type
- Silicon Wafers
- Photomasks
- Photoresists
- Wet Chemicals
- CMP Slurry & Pads
- Gases
- Sputter Targets
- Photoresist Ancillaries
By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- Germany
- France
- UK
- Italy
- Russia
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Brazil
- Argentina
- South Africa
- Rest of LAMEA
CHAPTER 1 INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY
1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools & models
CHAPTER 2 EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE
CHAPTER 3 MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top investment pockets
3.2.2. Top winning strategies
3.3. MARKET SHARE ANALYSIS, 2016
3.4. PORTER’S FIVE FORCES ANALYSIS
3.4.1. MARKET DYNAMICS
3.4.2. Drivers
3.4.3. Restraints
3.4.4. Opportunities
CHAPTER 4 GLOBAL SEMICONDUCTOR FABRICATION MATERIAL MARKET, BY MATERIAL TYPE
4.1. OVERVIEW
4.1.1. Market size and forecast
4.2. SILICON WAFERS
4.2.1. Key market trends
4.2.2. Growth factors and opportunities
4.2.3. Market size and forecast
4.3. PHOTOMASKS
4.3.1. Key market trends
4.3.2. Growth factors and opportunities
4.3.3. Market size and forecast
4.4. PHOTORESISTS
4.4.1. Key market trends
4.4.2. Growth factors and opportunities
4.4.3. Market size and forecast
4.5. WET CHEMICALS
4.5.1. Key market trends
4.5.2. Growth factors and opportunities
4.5.3. Market size and forecast
4.6. CMP SLURRY AND PADS
4.6.1. Key market trends
4.6.2. Growth factors and opportunities
4.6.3. Market size and forecast
4.7. GASES
4.7.1. Key market trends
4.7.2. Growth factors and opportunities
4.7.3. Market size and forecast
4.8. SPUTTER TARGETS
4.8.1. Key market trends
4.8.2. Growth factors and opportunities
4.8.3. Market size and forecast
4.9. PHOTORESIST ANCILLARIES
4.9.1. Key market trends
4.9.2. Growth factors and opportunities
4.9.3. Market size and forecast
CHAPTER 5 GLOBAL SEMICONDUCTOR FABRICATION MATERIAL MARKET, BY GEOGRAPHY
5.1. OVERVIEW
5.2. NORTH AMERICA
5.2.1. Key market trends
5.2.2. Key growth factors and opportunities
5.2.3. Market size and forecast
5.2.3.1. By Material Type
5.2.4. U.S.
5.2.4.1. Market size and forecast, by Material Type
5.2.5. Canada
5.2.5.1. Market size and forecast, by Material Type
5.2.6. Mexico
5.2.6.1. Market size and forecast, by Material Type
5.3. EUROPE
5.3.1. Key market trends
5.3.2. Key growth factors and opportunities
5.3.3. Market size and forecast
5.3.3.1. By Material Type
5.3.4. Germany
5.3.4.1. Market size and forecast, by Material Type
5.3.5. France
5.3.5.1. Market size and forecast, by Material Type
5.3.6. UK
5.3.6.1. Market size and forecast, by Material Type
5.3.7. Italy
5.3.7.1. Market size and forecast, by Material Type
5.3.8. Russia
5.3.8.1. Market size and forecast, by Material Type
5.3.9. Rest of Europe
5.3.9.1. Market size and forecast, by Material Type
5.4. ASIA-PACIFIC
5.4.1. Key market trends
5.4.2. Key growth factors and opportunities
5.4.3. Market size and forecast
5.4.3.1. By Material Type
5.4.4. China
5.4.4.1. Market size and forecast, by Material Type
5.4.5. Japan
5.4.5.1. Market size and forecast, by Material Type
5.4.6. India
5.4.6.1. Market size and forecast, by Material Type
5.4.7. Australia
5.4.7.1. Market size and forecast, by Material Type
5.4.8. South Korea
5.4.8.1. Market size and forecast, by Material Type
5.4.9. Rest of Asia-Pacific
5.4.9.1. Market size and forecast, by Material Type
5.5. LAMEA
5.5.1. Key market trends
5.5.2. Key growth factors and opportunities
5.5.3. Market size and forecast
5.5.3.1. By Material Type
5.5.4. Brazil
5.5.4.1. Market size and forecast, by Material Type
5.5.5. Argentina
5.5.5.1. Market size and forecast, by Material Type
5.5.6. South Africa
5.5.6.1. Market size and forecast, by Material Type
5.5.7. Rest of LAMEA
5.5.7.1. Market size and forecast, by Material Type
CHAPTER 6 COMPANY PROFILES
6.1. BASF SE
6.1.1. Operating business segments
6.1.2. Business performance
6.1.3. Key strategic moves and developments
6.2. KANTO CHEMICAL CO., INC.
6.2.1. Operating business segments
6.2.2. Business performance
6.2.3. Key strategic moves and developments
6.3. AIR LIQUIDE SA
6.3.1. Operating business segments
6.3.2. Business performance
6.3.3. Key strategic moves and developments
6.4. LINDE AG
6.4.1. Operating business segments
6.4.2. Business performance
6.4.3. Key strategic moves and developments
6.5. PRAXAIR, INC.
6.5.1. Operating business segments
6.5.2. Business performance
6.5.3. Key strategic moves and developments
6.6. TAIYO NIPPON SANSO
6.6.1. Operating business segments
6.6.2. Business performance
6.6.3. Key strategic moves and developments
6.7. DOW CHEMICAL COMPANY
6.7.1. Operating business segments
6.7.2. Business performance
6.7.3. Key strategic moves and developments
6.8. AIR PRODUCTS AND CHEMICAL INC.
6.8.1. Operating business segments
6.8.2. Business performance
6.8.3. Key strategic moves and developments
6.9. JSR CORPOARTION
6.9.1. Operating business segments
6.9.2. Business performance
6.9.3. Key strategic moves and developments
6.10. ALENT PLC
6.10.1. Operating business segments
6.10.2. Business performance
6.10.3. Key strategic moves and developments
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