A package of semiconductors is a combination of glass, metal, plastic, or ceramic casing that contains single or multiple discrete integrated circuits or semiconductor. Individual components are produced on semiconductor wafers which is followed by them being diced, checked and packed into die. The semiconductor package offers the possibility to connect it to the external environment through leads such as lands, balls, or pins, such as printed circuit boards; and safety and security against threats such as chemical contamination, mechanical impact, and exposure to light. It also assists to sublimate heat generated by the equipment, with or without the assistance of a heat spreader. Semiconductor packaging technology has developed to reduce the costs associated and increase the overall effectiveness of ICs. Market vendors are under constant pressure to provide innovative solutions in terms of packaging size, performance and the 'time-to-market' aspect.

The global semiconductor packaging market is segmented on the basis of packaging platform, material, technology, industry vertical, and region. Based on packaging platform, the market is further bifurcated into Flip Chip, Embedded DIE, FI WLP, and FO WLP. Based on material, the market is divided into organic substrate, bonding wire, leadframe, encapsulation resin, ceramic package, and die attach material. Based on technology, the market is classified into Grid Array, Small Outline Package, Dual Flat No-Leads, Quad Flat Package, Dual In-Line Package and Others. Based on end-user, the report segments the market into electronics, automotive & transport, healthcare, it & telecommunication, and aerospace & defense. Geographically, the global market is analyzed across North America (Canada, Mexico, U.S.), Europe (France, Germany, UK, Rest of Europe), Asia-Pacific (China, India, Japan, South Korea, Rest of Asia-Pacific), LAMEA (Africa, Latin America, Middle East).

Key players of the global semiconductor packaging market analyzed in the report include Amkor Technology, ASE Group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, Taiwan Semiconductor Manufacturing Company.

Top impacting factors: Market Scenario Analysis, Trends, Drivers, and Impact Analysis

The semiconductor packaging industry is witnessing a constant transformation in terms of the implementation, characteristics, and energy efficiency of the product which has led to increase in sales across various end-user verticals. Furthermore, the introduction of the 2.5D and 3D packaging method has led to semiconductor key market players to expand their wafer-level and flip-chip capabilities to their increased functionality.

The global semiconductor packaging market trends are as follows:

High consumer electronics adoption rate to increase the market growth

The electronics market with lower profiles and smaller footprints demand for faster speeds, higher power dissipation, and higher pin counts. The structure of electronic & semiconductor devices due to integration have given resulted in lighter, smaller, and more portable devices, such as smartphones, tablets, and various IoT devices. All the latest version of consumer electronic device is lighter craftier, and provide more energy-efficiency than its predecessor models. The benefit provided is sets up a extreme high expectations for the next version to launch among the consumers, which is a major driver for consumer electronics manufacturers.  Furthermore, smartphones are among the major contributing factors to the utilization of semiconductors technology and products in the consumer electronics segment. As per the trend, smartphone is capable of driving the need for semiconductors, in effect, rising the growth of the semiconductor packaging market.

North America predicted to hold the largest market share

Countries in the region, such as the United States, take the lead in semiconductor-related manufacturing, design, and research. Besides that, the United States is home to many of the largest automobile players who are investing in the segment of electric vehicles. This is set to substantially boost the demand for semiconductors in the automotive sector. Investments by key players in the country are anticipated to augment the packaging market for semiconductors. In effect it drives the packaging market for semiconductors.

Market scope and structure analysis:

COVID-19 scenario Analysis:

• COVID-19 has affected the global market in various manners such as by directly impacting production and demand, has created supply chain disruption, and has also financial impact on corporations and financial markets.
• Intel factories around the globe continue to operate on a relatively normal basis and sustains their manufacturing, assembly, test and supply chain operations in Oregon, Arizona, New Mexico, and California, as well as Ireland, Israel, China, Vietnam, Malaysia and other Intel and partner locations around the world.
• Government even in the COVID-19 scanrios have shown flexible policies to support economy of countries. For instance, In accordance with the Chinese authorities' guidelines, Ericsson’s manufacturing site in China was closed until February 9 but has been open after that. All the major manufacturing sites of Ericsson are up and running as of today. Further, the market players have startegised there moves for efficient production and delivery flow. For instance, Ericsson has developed a global supply chain which ensures that the business operates near to consumer demands through its activities in Europe, Asia and the USA.
• Although the Movement Control Order announced by the Malaysian government is expected to continue until June 9, 2020, after permission from the Malaysian government, the three production sites of Renesas Group located in Malaysia that were operating at a reduced capacity have returned to normal service.

Key benefits of the report:

• This study presents the analytical depiction of the global semiconductor packaging industry along with the current trends and future estimations to determine the imminent investment pockets.
• The report presents information related to key drivers, restraints, and opportunities along with detailed analysis of the global semiconductor packaging market share.
• The current market is quantitatively analyzed from 2020 to 2027 to highlight the global semiconductor packaging market growth scenario.
• Porter’s five forces analysis illustrates the potency of buyers & suppliers in the market. 
• The report provides a detailed global semiconductor packaging market size analysis based on competitive intensity and how the competition will take shape in coming years. 

Key segments covered:

Questions answered in the semiconductor packaging market research report:

• Which are the leading market players active in the semiconductor packaging market?
• What would be the detailed impact of COVID-19 on the market?
• What current trends would influence the market in the next few years?
• What are the driving factors, restraints, and opportunities in the semiconductor packaging market?
• What are the projections for the future that would help in taking further strategic steps?