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2021
Semiconductor Packaging Market

Semiconductor Packaging Market by Type (Flip-Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Packaging Material (Organic Substrate, Bonding Wire, Leadframe, Ceramic Package, Die Attach Material, and Others), Wafer Material (Simple Semiconductor (Silicon (Si) and Germanium (Ge)) and Compound Semiconductor (III-V (Gallium Arsenide (GaAs), Indium Phosphide (InP), Gallium Nitride (GaN), Gallium Phosphide (GaP), and Others), II-VI (Zinc Sulfide (ZnS) and Zinc Selenide (ZnSe)), and IV-IV (Silicon Carbide (SiC) and Silicon-Germanium (SiGe)), and Technology (Grid Array, Small Outline Package, Flat No-Leads Packages (Dual-flat no-leads (DFN) and Quad-flat no-leads (QFN)), Dual In-Line Package (Plastic Dual Inline Package (PDIP) and Ceramic Dual Inline Package (CDIP)), and Others), and Industry Vertical (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2030

A09496
Pages: 425
Jun 2021 | 2271 Views
   
Author(s) : Avinash Savekar , Vineet Kumar
Tables: 180
Charts: 105
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COVID-19

Pandemic disrupted the entire world and affected many industries.

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The global semiconductor packaging market size is expected to reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030.  

Semiconductor packaging plays an important role in protecting IC chips from the surrounding environment and ensuring the electrical connection for chip mount on printed wiring boards. High demand for high-speed, high-integration, and low power consumption of integrated circuits (ICs) complements the rapid progress of electronics technology such as AI and cloud computing. Semiconductor packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory during the final stage of semiconductor manufacturing process. It allows the chip to be connected to a circuit board. These packaging involves grouping of a variety of distinct techniques, which includes 2.5D, 3D packaging, fan-out-wafer-level packaging, and system-in-package. Different ICs have different packaging requirements, thereby providing growth opportunities for semiconductor packaging market over traditional packaging process.  

Semiconductor-Packaging-Market-2021-2030

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In addition, in consumer electronics and industrial products, advanced packaging relies on mechanical engineering principles, such as dynamics, stress analysis, heat transfer, and fluid mechanics, and protects components from mechanical damage, cooling, RF noise emission, and electrostatic discharge. Thus, to improve the performance, reliability, and cost-effectiveness of electronics systems, advanced packaging technology is being used for packaging of semiconductors. 

With rapid growth in semiconductor packaging market revenue, specifically fan-out wafer level packaging along with increase in demand for smartphone, devices, and Internet of Things (IoT), semiconductor packaging suppliers are developing processes and ways to reduce the overall cost of advanced packaging and provide maximum operational efficiency. During recent times, it is is mainly used for high-end products and for applications related to niche-market, such as wafer and die production, due to its high cost in its operation.

Semiconductor packaging technology is expected to increase the value of a semiconductor product by adding functionality in its operation, increasing and maintaining the performance while lowering the overall cost of packaging. The adoption of semiconductor packaging is also creating demand for high-performance chips for various consumer electronic products. This augments the demand for 3D and 2.5D packaging chips used in smartphones and other mobile devices.

The global semiconductor packaging market share is segmented into type, packaging material, wafer material, technology, industry vertical, and region. Based on type, the market is divided into flip-chip, embedded die, fan-in WLP, and fan-out WLP. On the basis of packaging material, it is analyzed across organic substrate, bonding wire, leadframe, ceramic package, die attach material, and others. On the basis of wafer material, the semiconductor packaging market is classified into simple semiconductor and compound semiconductor. The simple semiconductor further sub-segmented into silicon (Si) and germanium (Ge). The compound semiconductor is further sub-segmented into III-V (Gallium Arsenide (GaAs), Indium Phosphide (InP), Gallium Nitride (GaN), Gallium phosphide (GaP), and others), II-VI (Zinc Sulfide (ZnS) and Zinc Selenide (ZnSe)), and IV-IV (Silicon Carbide (SiC) and Silicon-Germanium (SiGe)). Based on technology, the market is categorized into grid array, small outline package, flat no-leads packages (Dual-flat no-leads (DFN) & Quad-flat no-leads (QFN)), dual in-line package (Plastic Dual Inline Package (PDIP) & Ceramic Dual Inline Package (CDIP)), and others.   

By industry vertical, the semiconductor packaging market trends is studied across consumer electronics, automotive, healthcare, IT & telecommunication, aerospace & defense, and others. The automotive segment accounted for the highest market share in 2020, whereas the consumer electronics segment is expected to grow at the highest CAGR from 2021 to 2030. By region, the semiconductor packaging market trends are analyzed across the North America, Europe, Asia-Pacific, and LAMEA.  

Semiconductor Packaging Market
By Type

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Flip Chip segment is projected as one of the most lucrative segments.

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Top Impacting Factors

The prominent factors that drive the semiconductor packaging market growth include growth of Internet of Things (IoT) technology, high adoption of consumer electronics devices, and evolving trends toward semiconductor wafers in the automotive industry. However, high cost associated with semiconductor packaging materials hampers its adoption, which is expected to pose a major threat to the global market growth. However, evolving trends toward the fan-out wafer level packaging are expected to provide lucrative opportunities to the semiconductor packaging market growth.   

Competition Analysis

The key players profiled in the semiconductor packaging market report include Amkor Technology (U.S.), ASE Group (Taiwan), ChipMOS Technologies, Inc. (Taiwan), Powertech Technology, Inc. (Taiwan), Intel Corporation (U.S.), Jiangsu Changjiang Electronics Technology Co., LTD (China), Samsung Electronics Co., Ltd. (South Korea), Taiwan Semiconductor Manufacturing Company (Taiwan), Texas Instruments (U.S.), and Fujitsu Limited (Japan). Market players have adopted various strategies, such as product launch, collaboration, product development, agreement, and expansion, to expand their foothold in the semiconductor packaging industry.  

Semiconductor Packaging Market
By Industry Vertical

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Consumer Electronics segment is expected to secure leading position during forecast period.

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Covid 19 Impact Analysis

The impact of COVID-19 on the manufacturing industry has significantly affected the global economy. Electronic components, such as PCBs, LED chips and wafers, ICs, and other semiconductor devices, are mostly imported from China. Attributed to the shutdown of manufacturing units, the prices of semiconductor components have increased by 2-3%, owing to shortage of supplies. 

COVID-19 has a large impact on both consumer and the economy. Electronics manufacturing hubs have been temporarily shut down to limit the COVID-19 spread among individuals. This has majorly affected the supply chain of the semiconductor market by creating shortages of materials, components, and finished goods. Lack of business continuity has ensured significant negative impacts on revenue and shareholder returns, which is expected to create financial disruptions in the semiconductor packaging market growth.

However, slowdown in productions by OEMs and reduction in demand for mobile phones and other consumer electronics have slightly pulled down the semiconductors packaging market. In addition, reduction in various capital budgets and delay in planned projects in various end-use industries have hampered the global economy. 

Semiconductor Packaging Market
By Region

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Asia-Pacific region would exhibit the highest CAGR of 10.10% during 2021-2030

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Key Benefits For Stakeholders

  • This study comprises analytical depiction of the global semiconductor packaging market outlook along with the current trends and future estimations to depict the imminent investment pockets.
  • The overall semiconductor packaging market analysis is determined to understand the profitable trends to gain a stronger foothold. 
  • The report presents information related to key drivers, restraints, and semiconductor packaging market opportunities with a detailed impact analysis.
  • The current semiconductor packaging market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.  
  • Porter’s five forces analysis illustrates the potency of the buyers and the semiconductor packaging market share of key vendors. 
  • The report includes the trends and the semiconductor packaging market share of key vendors.

Key Market Segments

By Type

  • Flip Chip
  • Embedded DIE
  • Fan-in WLP
  • Fan-out WLP

By Packaging Material

  • Organic Substrate
  • Bonding Wire
  • Leadframe
  • Ceramic Package
  • Die Attach Material
  • Others

By Wafer Material

  • Simple  Semiconductor    
    • Silicon (Si)    
    • Germanium (Ge)    
  • Compound Semiconductor    
    • III-V    
      • Gallium Arsenide (GaAs)
      • Indium Phosphide (InP)
      • Gallium Nitride (GaN) 
      • Gallium phosphide (GaP)
      • Others
    • II-VI    
      • Zinc Sulfide (ZnS)
      • Zinc Selenide (ZnSe)
    • IV-IV    
      • Silicon Carbide (SiC)
      • Silicon-Germanium (SiGe)

By Technology

  • Grid Array    
  • Small Outline Package    
  • Flat no-leads packages    
    • Dual-flat no-leads (DFN) 
    • Quad-flat no-leads (QFN)
  • Dual In-Line Package    
    • Plastic Dual Inline Package (PDIP)
    • Ceramic Dual Inline Package (CDIP)
  • Others    

By End User

  • Consumer Electronics 
  • Automotive 
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense
  • Others 

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany 
    • UK
    • France    
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China 
    • Japan
    • India
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East & Africa

Key Players

  • Amkor Technology, Inc.
  • ASE Group
  • ChipMOS Technologies, Inc.
  • Powertech Technology, Inc.
  • Fujitsu Ltd.
  • Intel Corporation
  • Texas Instruments
  • Jiangsu Changjiang Electronics Technology Co., LTD 
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company 
 

CHAPTER 1:INTRODUCTION

1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology

1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings

2.1.1.Top impacting factors
2.1.2.Top investment pockets

2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope
3.2.Key forces shaping the semiconductor packaging
3.3.Patent analysis

3.3.1.By region, 2012–2020
3.3.2.By applicant, 2012–2020

3.4.Covid-19 impact analysis

3.4.1.COVID-19 outbreak
3.4.2.Impact on market size
3.4.3.End user trends, preferences, and budget impact
3.4.4.Parent industry impact
3.4.5.Opportunity window

3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Surging Internet of Things (IoT) technology
3.5.1.2.High adoption of consumer electronics devices
3.5.1.3.Evolving trends toward semiconductor wafers in the automotive industry

3.5.2.Restraint

3.5.2.1.High-cost associated with semiconductor materials

3.5.3.Opportunity

3.5.3.1.Evolving trends towards the fan-out wafer level packaging

CHAPTER 4:SEMICONDUCTOR PACKAGING MARKET , BY PACKAGING PLATFORM

4.1.Overview
4.2.Flip Chip

4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis, by country

4.3.Embedded die

4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis, by country

4.4.Fan-in WLP

4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis, by country

4.5.Fan-out WLP

4.5.1.Key market trends, growth factors, and opportunities
4.5.2.Market size and forecast, by region
4.5.3.Market analysis, by country

CHAPTER 5:SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL

5.1.Overview
5.2.Organic Substrate

5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis, by country

5.3.Bonding-Wire

5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis, by country

5.4.Leadframe

5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis, by country

5.5.Ceramic Package

5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis, by country

5.6.Die-Attach Material

5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market analysis, by country

5.7.Others

5.7.1.Key market trends, growth factors, and opportunities
5.7.2.Market size and forecast, by region
5.7.3.Market analysis, by country

CHAPTER 6:SEMICONDUCTOR PACKAGING MARKET , BY WAFER MATERIAL

6.1.Overview
6.2.Simple Semiconductor

6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region

6.2.2.1.Silicon (Si)
6.2.2.2.Germanium (Ge)

6.2.3.Market analysis, by country

6.3.Compound Semiconductor

6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region

6.3.2.1.III–V Compound Semiconductor

6.3.2.1.1.Gallium Arsenide (GaAs)
6.3.2.1.2.Indium Phosphide (InP)
6.3.2.1.3.Gallium Nitride (GaN)
6.3.2.1.4.Gallium phosphide (GaP)
6.3.2.1.5.Others

6.3.2.2.II-VI Compound Semiconductor

6.3.2.2.1.Zinc Sulfide (ZnS)
6.3.2.2.2.Zinc Selenide (ZnSe)

6.3.2.3.IV-IV Compound Semiconductor

6.3.2.3.1.Silicon carbide (SiC)
6.3.2.3.2.Silicon-Germanium (SiGe)

6.3.3.Market analysis, by country

CHAPTER 7:SEMICONDUCTOR PACKAGING, BY TECHNOLOGY

7.1.Overview
7.2.Grid Array Package

7.2.1.Key market trends, growth factors, and opportunities
7.2.2.Market size and forecast, by region
7.2.3.Market analysis, by country

7.3.Small Outline Package

7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Market size and forecast, by region
7.3.3.Market analysis, by country

7.4.Flat No-Leads Package

7.4.1.Key market trends, growth factors, and opportunities
7.4.2.Market size and forecast, by region

7.4.2.1.Dual Flat No-Leads (DFN) Package
7.4.2.2.Quad Flat No-Leads (QFN) Package

7.4.3.Market analysis, by country

7.5.Dual In-Line Package

7.5.1.Key market trends, growth factors, and opportunities
7.5.2.Market size and forecast, by region

7.5.2.1.Plastic Dual In-line Package (PDIP)
7.5.2.2.Ceramic Dual Inline Package (CDIP)

7.5.3.Market analysis, by country

7.6.Others

7.6.1.Key market trends, growth factors, and opportunities
7.6.2.Market size and forecast, by region
7.6.3.Market analysis, by country

CHAPTER 8:SEMICONDUCTOR PACKAGING, BY INDUSTRY VERTICAL

8.1.Overview
8.2.Consumer electronics

8.2.1.Key market trends, growth factors, and opportunities
8.2.2.Market size and forecast, by region
8.2.3.Market analysis, by country

8.3.Automotive

8.3.1.Key market trends, growth factors, and opportunities
8.3.2.Market size and forecast, by region
8.3.3.Market analysis, by country

8.4.Healthcare

8.4.1.Key market trends, growth factors, and opportunities
8.4.2.Market size and forecast, by region
8.4.3.Market analysis, by country

8.5.IT & Telecommunication

8.5.1.Key market trends, growth factors, and opportunities
8.5.2.Market size and forecast, by region
8.5.3.Market analysis, by country

8.6.Aerospace & Defense

8.6.1.Key market trends, growth factors, and opportunities
8.6.2.Market size and forecast, by region
8.6.3.Market analysis, by country

8.7.Others

8.7.1.Key market trends, growth factors, and opportunities
8.7.2.Market size and forecast, by region
8.7.3.Market analysis, by country

CHAPTER 9:SEMICONDUCTOR PACKAGING MAREKT, BY REGION

9.1.Overview
9.2.North America

9.2.1.Key market trends, growth factors, and opportunities
9.2.2.Market size and forecast, by type
9.2.3.Market size and forecast, by packaging material
9.2.4.Market size and forecast, by wafer material
9.2.5.Market size and forecast, by technology
9.2.6.Market size and forecast, by industry vertical
9.2.7.Market analysis, by country

9.2.7.1.U.S.

9.2.7.1.1.Market size and forecast, by type
9.2.7.1.2.Market size and forecast, by packaging material
9.2.7.1.3.Market size and forecast, by wafer material
9.2.7.1.4.Market size and forecast, by technology
9.2.7.1.5.Market size and forecast, by industry vertical

9.2.7.2.Canada

9.2.7.2.1.Market size and forecast, by type
9.2.7.2.2.Market size and forecast, by packaging material
9.2.7.2.3.Market size and forecast, by wafer material
9.2.7.2.4.Market size and forecast, by technology
9.2.7.2.5.Market size and forecast, by industry vertical

9.2.7.3.Mexico

9.2.7.3.1.Market size and forecast, by type
9.2.7.3.2.Market size and forecast, by packaging material
9.2.7.3.3.Market size and forecast, by wafer material
9.2.7.3.4.Market size and forecast, by technology
9.2.7.3.5.Market size and forecast, by industry vertical

9.3.Europe

9.3.1.Key market trends, growth factors, and opportunities
9.3.2.Market size and forecast, by type
9.3.3.Market size and forecast, by packaging material
9.3.4.Market size and forecast, by wafer material
9.3.5.Market size and forecast, by technology
9.3.6.Market size and forecast, by industry vertical
9.3.7.Market analysis, by country

9.3.7.1.Germany

9.3.7.1.1.Market size and forecast, by type
9.3.7.1.2.Market size and forecast, by packaging material
9.3.7.1.3.Market size and forecast, by wafer material
9.3.7.1.4.Market size and forecast, by technology
9.3.7.1.5.Market size and forecast, by industry vertical

9.3.7.2.UK

9.3.7.2.1.Market size and forecast, by type
9.3.7.2.2.Market size and forecast, by packaging material
9.3.7.2.3.Market size and forecast, by wafer material
9.3.7.2.4.Market size and forecast, by technology
9.3.7.2.5.Market size and forecast, by industry vertical

9.3.7.3.France

9.3.7.3.1.Market size and forecast, by type
9.3.7.3.2.Market size and forecast, by packaging material
9.3.7.3.3.Market size and forecast, by wafer material
9.3.7.3.4.Market size and forecast, by technology
9.3.7.3.5.Market size and forecast, by industry vertical

9.3.7.4.Italy

9.3.7.4.1.Market size and forecast, by type
9.3.7.4.2.Market size and forecast, by packaging material
9.3.7.4.3.Market size and forecast, by wafer material
9.3.7.4.4.Market size and forecast, by technology
9.3.7.4.5.Market size and forecast, by industry vertical

9.3.7.5.Rest of Europe

9.3.7.5.1.Market size and forecast, by type
9.3.7.5.2.Market size and forecast, by packaging material
9.3.7.5.3.Market size and forecast, by wafer material
9.3.7.5.4.Market size and forecast, by technology
9.3.7.5.5.Market size and forecast, by industry vertical

9.4.Asia-Pacific

9.4.1.Key market trends, growth factors, and opportunities
9.4.2.Market size and forecast, by type
9.4.3.Market size and forecast, by packaging material
9.4.4.Market size and forecast, by wafer material
9.4.5.Market size and forecast, by technology
9.4.6.Market size and forecast, by industry vertical
9.4.7.Market analysis, by country

9.4.7.1.China

9.4.7.1.1.Market size and forecast, by type
9.4.7.1.2.Market size and forecast, by packaging material
9.4.7.1.3.Market size and forecast, by wafer material
9.4.7.1.4.Market size and forecast, by technology
9.4.7.1.5.Market size and forecast, by industry vertical

9.4.7.2.Japan

9.4.7.2.1.Market size and forecast, by type
9.4.7.2.2.Market size and forecast, by packaging material
9.4.7.2.3.Market size and forecast, by wafer material
9.4.7.2.4.Market size and forecast, by technology
9.4.7.2.5.Market size and forecast, by industry vertical

9.4.7.3.India

9.4.7.3.1.Market size and forecast, by type
9.4.7.3.2.Market size and forecast, by packaging material
9.4.7.3.3.Market size and forecast, by wafer material
9.4.7.3.4.Market size and forecast, by technology
9.4.7.3.5.Market size and forecast, by industry vertical

9.4.7.4.South Korea

9.4.7.4.1.Market size and forecast, by type
9.4.7.4.2.Market size and forecast, by packaging material
9.4.7.4.3.Market size and forecast, by wafer material
9.4.7.4.4.Market size and forecast, by technology
9.4.7.4.5.Market size and forecast, by industry vertical

9.4.7.5.Taiwan

9.4.7.5.1.Market size and forecast, by type
9.4.7.5.2.Market size and forecast, by packaging material
9.4.7.5.3.Market size and forecast, by wafer material
9.4.7.5.4.Market size and forecast, by technology
9.4.7.5.5.Market size and forecast, by industry vertical

9.4.7.6.Rest of Asia-Pacific

9.4.7.6.1.Market size and forecast, by type
9.4.7.6.2.Market size and forecast, by packaging material
9.4.7.6.3.Market size and forecast, by wafer material
9.4.7.6.4.Market size and forecast, by technology
9.4.7.6.5.Market size and forecast, by industry vertical

9.5.LAMEA

9.5.1.Key market trends, growth factors, and opportunities
9.5.2.Market size and forecast, by type
9.5.3.Market size and forecast, by packaging material
9.5.4.Market size and forecast, by wafer material
9.5.5.Market size and forecast, by technology
9.5.6.Market size and forecast, by industry vertical
9.5.7.Market analysis, by country

9.5.7.1.Latin America

9.5.7.1.1.Market size and forecast, by type
9.5.7.1.2.Market size and forecast, by packaging material
9.5.7.1.3.Market size and forecast, by wafer material
9.5.7.1.4.Market size and forecast, by technology
9.5.7.1.5.Market size and forecast, by industry vertical

9.5.7.2.Middle East and Africa

9.5.7.2.1.Market size and forecast, by type
9.5.7.2.2.Market size and forecast, by packaging material
9.5.7.2.3.Market size and forecast, by wafer material
9.5.7.2.4.Market size and forecast, by technology
9.5.7.2.5.Market size and forecast, by industry vertical

CHAPTER 10:COMPETITIVE LANDSCAPE

10.1.Introduction

10.1.1.Market player positioning, 2020

10.2.Top winning strategies
10.3.Product mapping of top 10 player
10.4.Competitive dashboard
10.5.Competitive heatmap

CHAPTER 11:COMPANY PROFILES

11.1.AMKOR TECHNOLOGY

11.1.1.Company overview
11.1.2.Key executive
11.1.3.Company snapshot
11.1.4.Product portfolio
11.1.5.R&D expenditure
11.1.6.Business performance

11.2.ASE Group

11.2.1.Company overview
11.2.2.Key executives
11.2.3.Company snapshot
11.2.4.Operating business segments
11.2.5.Product portfolio
11.2.6.R&D expenditure
11.2.7.Business performance

11.3.FUJITSU LIMITED

11.3.1.Company overview
11.3.2.Key executive
11.3.3.Company snapshot
11.3.4.Operating business segments
11.3.5.Product portfolio
11.3.6.R&D expenditure
11.3.7.Business performance

11.4.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

11.4.1.Company overview
11.4.2.Key Executives
11.4.3.Company snapshot.
11.4.4.Product portfolio
11.4.5.R&D Expenditure
11.4.6.Business performance
11.4.7.Key strategic moves and developments

11.5.TEXAS INSTRUMENTS INCORPORATED

11.5.1.Company overview
11.5.2.Key Executives
11.5.3.Company snapshot
11.5.4.Operating business segments
11.5.5.Product portfolio
11.5.6.R&D Expenditure
11.5.7.Business performance
11.5.8.Key strategic moves and developments

11.6.ChipMOS Technology Inc.

11.6.1.Company overview
11.6.2.Key executives
11.6.3.Company snapshot
11.6.4.Operating business segments
11.6.5.Product portfolio
11.6.6.R&D expenditure
11.6.7.Business performance

11.7.Intel Corporation

11.7.1.Company overview
11.7.2.Key executives
11.7.3.Company snapshot
11.7.4.Operating business segments
11.7.5.Product portfolio
11.7.6.R&D expenditure
11.7.7.Business performance
11.7.8.Key strategic moves and developments

11.8.Samsung Electronics Co. Ltd.

11.8.1.Company overview
11.8.2.Key executives
11.8.3.Company snapshot.
11.8.4.Operating business segments
11.8.5.Product portfolio
11.8.6.R&D expenditure
11.8.7.Business performance
11.8.8.Key strategic moves and developments

11.9.Powertech Technology Inc. (PTI)

11.9.1.Company overview
11.9.2.Key executives
11.9.3.Company snapshot
11.9.4.Operating business segments
11.9.5.Product portfolio
11.9.6.R&D expenditure
11.9.7.Business performance
11.9.8.Key strategic moves and developments

11.10.Jiangsu Changjiang Electronics Technology Co., LTD (JCET)

11.10.1.Company overview
11.10.2.Key executives
11.10.3.Company snapshot
11.10.4.Operating business segments
11.10.5.Product portfolio
11.10.6.R&D expenditure
11.10.7.Business performance
11.10.8.Key strategic moves and developments

LIST OF TABLES

TABLE 01.GLOBAL SEMICONDUCTOR PACKAGING, BY PACKAGING PLATFORM, 2020–2030 ($MILLION)
TABLE 02.FLIP CHIP SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020–2030 ($MILLION)
TABLE 03.EMBEDDED DIE SEMICONDUCTOR PACKAGING, BY REGION, 2020–2030 ($MILLION)
TABLE 04.FAN-IN WLP SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020–2030 ($MILLION)
TABLE 05.FAN-OUT WLP SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020–2030 ($MILLION)
TABLE 06.SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 07.SEMICONDUCTOR PACKAGING MARKET FOR ORGANIC SUBSTRATES, BY REGION, 2020–2030 ($MILLION)
TABLE 08.SEMICONDUCTOR PACKAGING MARKET FOR BONDING-WIRE, BY REGION, 2020–2030($MILLION)
TABLE 09.SEMICONDUCTOR PACKAGING MARKET FOR LEADFRAMES, BY REGION, 2020–2030($MILLION)
TABLE 10.SEMICONDUCTOR PACKAGING FOR CERAMIC PACKAGES, BY REGION, 2020–2030($MILLION)
TABLE 11.SEMICONDUCTOR PACKAGING FOR DIE-ATTACH MATERIALS, BY REGION, 2020–2030($MILLION)
TABLE 12.SEMICONDUCTOR PACKAGING FOR OTHERS, BY REGION, 2020–2030($MILLION)
TABLE 13.GLOBAL SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 14.SEMICONDUCTOR PACKAGING MARKET FOR SIMPLE SEMICONDUCTOR, BY REGION, 2020–2030 ($MILLION)
TABLE 15.SEMICONDUCTOR PACKAGING MARKET, BY SUB-SEGMENT, 2020–2030 ($MILLION)
TABLE 16.SEMICONDUCTOR PACKAGING MARKET FOR SILICON (SI), BY REGION, 2020–2030 ($MILLION)
TABLE 17.SEMICONDUCTOR PACKAGING MARKET FOR GERMANIUM (GE), BY REGION, 2020–2030 ($MILLION)
TABLE 18.SEMICONDUCTOR PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2020–2030 ($MILLION)
TABLE 19.SEMICONDUCTOR PACKAGING MARKET, BY SUB-SEGMENT, 2020–2030 ($MILLION)
TABLE 20.SEMICONDUCTOR PACKAGING MARKET FOR III–V COMPOUND SEMICONDUCTORS, BY REGION, 2020–2030 ($MILLION)
TABLE 21.III–V COMPOUND SEMICONDUCTORS, BY SUB-SEGMENT, 2020–2030 ($MILLION)
TABLE 22.SEMICONDUCTOR PACKAGING MARKET FOR II-VI COMPOUND SEMICONDUCTORS, BY REGION, 2020–2030 ($MILLION)
TABLE 23.II-VI COMPOUND SEMICONDUCTORS, BY SUB-SEGMENT, 2020–2030 ($MILLION)
TABLE 24.SEMICONDUCTOR PACKAGING MARKET FOR IV-IV COMPOUND SEMICONDUCTORS, BY REGION, 2020–2030 ($MILLION)
TABLE 25.IV-IV COMPOUND SEMICONDUCTORS, BY SUB-SEGMENT, 2020–2030 ($MILLION)
TABLE 26.GLOBAL SEMICONDUCTOR PACKAGING, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 27.SEMICONDUCTOR PACKAGING MARKET FOR GRID ARRAY PACKAGE, BY REGION, 2020–2030 ($MILLION)
TABLE 28.SEMICONDUCTOR PACKAGING MARKET FOR SMALL OUTLINE PACKAGE, BY REGION, 2020–2030 ($MILLION)
TABLE 29.SEMICONDUCTOR PACKAGING MARKET FOR FLAT NO-LEADS PACKAGES, BY REGION, 2020–2030 ($MILLION)
TABLE 30.SEMICONDUCTOR PACKAGING MARKET FOR DUAL IN-LINE PACKAGE, BY REGION, 2020–2030($MILLION)
TABLE 31.SEMICONDUCTOR PACKAGING FOR OTHERS, BY REGION, 2020–2030($MILLION)
TABLE 32.SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)
TABLE 33.SEMICONDUCTOR PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2020–2030 ($MILLION)
TABLE 34.SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE, BY REGION, 2020–2030 ($MILLION)
TABLE 35.SEMICONDUCTOR PACKAGING MARKET FOR HEALTHCARE, BY REGION, 2020–2030 ($MILLION)
TABLE 36.SEMICONDUCTOR PACKAGING MARKET FOR IT & TELECOMMUNICATION, BY REGION, 2020–2030 ($MILLION)
TABLE 37.SEMICONDUCTOR PACKAGING MARKET FOR AEROSPACE & DEFENSE, BY REGION, 2020–2030 ($MILLION)
TABLE 38.SEMICONDUCTOR PACKAGING MARKET FOR OTHERS, BY REGION, 2020–2030 ($MILLION)
TABLE 39.SEMICONDUCTOR PACKAGING MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 40.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 41.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 42.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 43.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 44.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)
TABLE 45.U.S. SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 46.U.S. SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 47.U.S. SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 48.U.S. SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 49.U.S. SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 50.CANADA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 51.CANADA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 52.CANADA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 53.CANADA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 54.CANADA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 55.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 56.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 57.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 58.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 59.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 60.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 61.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 62.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 63.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 64.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)
TABLE 65.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 66.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 67.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 68.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 69.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 70.UK SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 71.UK SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 72.UK SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 73.UK SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 74.UK SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 75.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 76.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 77.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 78.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 79.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 80.ITALY SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 81.ITALY SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 82.ITALY SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 83.ITALY SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 84.ITALY SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 85.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 86.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 87.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 88.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 89.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 90.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 91.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 92.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 93.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 94.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)
TABLE 95.CHINA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 96.CHINA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 97.CHINA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 98.CHINA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 99.CHINA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 100.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 101.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 102.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 103.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 104.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 105.INDIA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 106.INDIA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 107.INDIA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 108.INDIA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 109.INDIA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 110.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 111.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 112.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 113.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 114.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 115.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 116.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 117.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 118.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 119.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 120.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 121.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 122.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 123.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 124.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 125.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 126.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 127.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 128.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 129.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)
TABLE 130.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 131.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 132.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 133.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 134.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 135.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)
TABLE 136.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)
TABLE 137.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)
TABLE 138.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)
TABLE 139.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)
TABLE 140.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT
TABLE 141.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO
TABLE 142.KEY EXECUTIVES
TABLE 143.ASE GROUP: COMPANY SNAPSHOT
TABLE 144.ASE GROUP: OPERATING SEGMENTS
TABLE 145.ASE GROUP: PRODUCT PORTFOLIO
TABLE 146.FUJITSU LIMITED: KEY EXECUTIVE
TABLE 147.FUJITSU LIMITED: COMPANY SNAPSHOT
TABLE 148.FUJITSU LIMITED: OPERATING SEGMENTS
TABLE 149.FUJITSU LIMITED: PRODUCT PORTFOLIO
TABLE 150.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED:KEY EXECUTIVES
TABLE 151.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 152.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT PORTFOLIO
TABLE 153.TEXAS INSTRUMENTS INCORPORATED:KEY EXECUTIVES
TABLE 154.TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
TABLE 155.TI: OPERATING SEGMENTS
TABLE 156.TI: PRODUCT PORTFOLIO
TABLE 157.CHIPMOS TECHNOLOGY INC.:KEY EXECUTIVES
TABLE 158.CHIPMOS TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 159.CHIPMOS TECHNOLOGY INC.: OPERATING SEGMENTS
TABLE 160.CHIPMOS TECHNOLOGY INC.: PRODUCT PORTFOLIO
TABLE 161.INTEL CORPORATION:KEY EXECUTIVES
TABLE 162.INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 163.INTEL CORPORATION: OPERATING SEGMENTS
TABLE 164.INTEL CORPORATION: PRODUCT PORTFOLIO
TABLE 165.INTEL CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 166.SAMSUNG:KEY EXECUTIVES
TABLE 167.SAMSUNG: COMPANY SNAPSHOT
TABLE 168.SAMSUNG: OPERATING SEGMENTS
TABLE 169.SAMSUNG: PRODUCT PORTFOLIO
TABLE 170.SAMSUNG: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 171.POWER TECHNOLOGY INC.:KEY EXECUTIVES
TABLE 172.POWER TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 173.POWER TECHNOLOGY INC.: PRODUCT CATEGORY
TABLE 174.POWER TECHNOLOGY INC.: PRODUCT PORTFOLIO
TABLE 175.POWER TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 176.JCET:KEY EXECUTIVES
TABLE 177.JCET: COMPANY SNAPSHOT
TABLE 178.JCET: OPERATING SEGMENTS
TABLE 179.JCET: PRODUCT PORTFOLIO
TABLE 180.JCET: KEY STRATEGIC MOVES AND DEVELOPMENTS

LIST OF FIGURES

FIGURE 01.SEGMENT INFORMATION
FIGURE 02.EXECUTIVE SUMMARY
FIGURE 03.EXECUTIVE SUMMARY
FIGURE 04.TOP IMPACTING FACTORS
FIGURE 05.TOP INVESTMENT POCKETS
FIGURE 06.MODERATE BARGAINING POWER OF SUPPLIERS
FIGURE 07.MODERATE TO HIGH THREAT OF NEW ENTRANTS
FIGURE 08.MODERATE THREAT OF SUBSTITUTES
FIGURE 09.MODERATE INTENSITY OF RIVALRY
FIGURE 10.MODERATE TO HIGH BARGAINING POWER OF BUYERS
FIGURE 11.PATENT ANALYSIS, BY COUNTRY
FIGURE 12.PATENT ANALYSIS, BY APPLICANT
FIGURE 13.GLOBAL SEMICONDUCTOR PACKAGING, BY PACKAGING PLATFORM, 2020–2030
FIGURE 14.COMPARATIVE SHARE ANALYSIS OF FLIP CHIP SEMICONDUCTOR PACKAGING MARKET,  BY COUNTRY, 2020 & 2030 (%)
FIGURE 15.COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE SEMICONDUCTOR PACKAGING, BY COUNTRY, 2020 & 2030 (%)
FIGURE 16.COMPARATIVE SHARE ANALYSIS OF FAN-IN WLP SEMICONDUCTOR PACKAGING MARKET,  BY COUNTRY, 2020 & 2030 (%)
FIGURE 17.COMPARATIVE SHARE ANALYSIS OF FAN-IN WLP SEMICONDUCTOR PACKAGING MARKET,  BY COUNTRY, 2020 & 2030 (%)
FIGURE 18.GLOBAL SEMICONDUCTOR PACKAGING, BY PACKAGING MATERIAL, 2020–2030
FIGURE 19.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR ORGANIC SUBSTRATES, BY COUNTRY, 2020 & 2030 (%)
FIGURE 20.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR BONDING-WIRE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 21.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR LEADFRAMES, BY COUNTRY, 2020 & 2030 (%)
FIGURE 22.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR CERAMIC PACKAGES, BY COUNTRY, 2020 & 2030 (%)
FIGURE 23.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR DIE-ATTACH MATERIALS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 24.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 25.GLOBAL SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030
FIGURE 26.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR SIMPLE SEMICONDUCTOR, BY COUNTRY, 2020 & 2030 (%)
FIGURE 27.COMPARATIVE SHARE ANALYSIS OF EMBEDDED DIE SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2020 & 2030 (%)
FIGURE 28.GLOBAL SEMICONDUCTOR PACKAGING, BY TECHNOLOGY, 2020–2030
FIGURE 29.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR GRID ARRAY PACKAGE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 30.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR SMALL OUTLINE PACKAGE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 31.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR FLAT NO-LEADS PACKAGES, BY COUNTRY, 2020 & 2030 (%)
FIGURE 32.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR DUAL IN-LINE PACKAGE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 33.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 34.SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030
FIGURE 35.COMPARATIVE SHARE ANALYSIS OF SHARE SEMICONDUCTOR PACKAGING MAREKT FOR CONSUMER ELECTRONICS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 36.COMPARATIVE SHARE ANALYSIS OF SHARE SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 37.COMPARATIVE SHARE ANALYSIS OF SHARE SEMICONDUCTOR PACKAGING MARKET FOR HEALTHCARE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 38.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR IT & TELECOMMUNICATION, BY COUNTRY, 2020 & 2030 (%)
FIGURE 39.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MAREKT FOR AEROSPACE & DEFENSE, BY COUNTRY, 2020 & 2030 (%)
FIGURE 40.COMPARATIVE SHARE ANALYSIS OF SEMICONDUCTOR PACKAGING MARKET FOR OTHERS, BY COUNTRY, 2020 & 2030 (%)
FIGURE 41.SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020-2030 (%)
FIGURE 42.COMPARATIVE SHARE ANALYSIS OF NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 43.U.S. SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 44.CANADA SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 45.MEXICO SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 46.COMPARATIVE SHARE ANALYSIS OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 47.GERMANY SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 48.UK SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 49.FRANCE SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 50.ITALY SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 51.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 52.COMPARATIVE SHARE ANALYSIS OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 53.CHINA SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 54.JAPAN SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 55.INDIA SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 56.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 57.TAIWAN SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 58.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 59.COMPARATIVE SHARE ANALYSIS OF LAMEA SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2020–2030 (%)
FIGURE 60.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 61.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, 2020–2030 ($MILLION)
FIGURE 62.MARKET PLAYER POSITIONING, 2020
FIGURE 63.TOP WINNING STRATEGIES, BY YEAR, 2018–2021
FIGURE 64.TOP WINNING STRATEGIES, BY YEAR, 2018–2021
FIGURE 65.TOP WINNING STRATEGIES, BY COMPANY, 2018–2021
FIGURE 66.PRODUCT MAPPING OF TOP 10 PLAYERS
FIGURE 67.COMPETITIVE DASHBOARD
FIGURE 68.COMPETITIVE HEATMAP OF KEY PLAYERS
FIGURE 69.AMKOR TECHNOLOGY: KEY EXECUTIVE
FIGURE 70.AMKOR TECHNOLOGY: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 71.AMKOR TECHNOLOGY: REVENUE, 2018–2020 ($BILLION)
FIGURE 72.AMKOR TECHNOLOGY: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 73.R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 74.ASE GROUP: REVENUE, 2018–2020 ($MILLION)
FIGURE 75.ASE GROUP: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 76.ASE GROUP: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 77.R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 78.FUJITSU LIMITED: REVENUE, 2018–2020 ($MILLION)
FIGURE 79.FUJITSU LIMITED: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 80.FUJITSU LIMITED: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 81.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 82.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE, 2018–2020 ($MILLION)
FIGURE 83.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 84.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 85.TI: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 86.TI: NET SALES, 2018–2020 ($MILLION)
FIGURE 87.TI: REVENUE SHARE BY SEGMENT, 2020 (%)
FIGURE 88.TI: REVENUE SHARE BY REGION, 2020 (%)
FIGURE 89.CHIPMOS TECHNOLOGY INC.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 90.CHIPMOS TECHNOLOGY INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 91.CHIPMOS TECHNOLOGY INC.: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 92.CHIPMOS TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 93.INTEL CORPORATION: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 94.INTEL CORPORATION: REVENUE, 2018–2020 ($MILLION)
FIGURE 95.INTEL CORPORATION: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 96.INTEL CORPORATION: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 97.SAMSUNG: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 98.SAMSUNG: NET SALES, 2018–2020 ($MILLION)
FIGURE 99.SAMSUNG: REVENUE SHARE, BY SEGMENT, 2020 (%)
FIGURE 100.SAMSUNG: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 101.POWER TECHNOLOGY INC.: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 102.POWER TECHNOLOGY INC.: REVENUE, 2018–2020 ($MILLION)
FIGURE 103.POWER TECHNOLOGY INC.: REVENUE SHARE, BY REGION, 2020 (%)
FIGURE 104.JCET: R&D EXPENDITURE, 2018–2020 ($MILLION)
FIGURE 105.JCET: REVENUE, 2018–2020 ($MILLION)

 
 

The semiconductor packaging market is expected to leverage high potential for consumer electronics and automotive verticals. The current business scenario is witnessing an increasing demand for consumer electronics devices, particularly in developing countries such as China, Japan, South Korea, India, and others. Companies in this industry are adopting various innovative techniques, such as merger & acquisition activities, to strengthen their business position in the competitive matrix. 

Semiconductor packaging is steadily gaining traction, owing to rise in demand for enhanced technologies in various industry verticals, such as integration of IoT & AI, and surge in demand for consumer electronics products. Furthermore, technological development by emerging economies in Asia-Pacific boosts the semiconductor packaging market growth. The semiconductor packaging market is competitive, owing to the strong presence of existing vendors. Semiconductor packaging vendors who have access to extensive technical and financial resources are anticipated to gain a competitive edge over their rivals, as they have the capacity to cater to the global market requirements.

The key players operating in the global market include Amkor Technology, ASE Group, Applied Materials, Inc., Infineon Technologies AG, Intel Corporation, Microsemi Semiconductor, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company, Texas Instruments, and Fujitsu Limited. These players have adopted various revenue and business growth strategies to enhance and develop their product portfolio, strengthen their market share, and help them increase their market penetration.

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A. The Semiconductor Packaging Market is estimated to grow at a CAGR of 9.10% from 2021 to 2030.

A. The Semiconductor Packaging Market is projected to reach $60.44 billion by 2030.

A. To get the latest version of sample report

A. Products used in IoT, such as sensors & actuators, analog & mixed-signal translators, and microcontrollers or embedded processors, require efficient and reliable packaging solutions contributed the highest share in the global semiconductor packaging market.

A. The key players profiled in the report include Amkor Technology (U.S.), ASE Group (Taiwan), ChipMOS Technologies, Inc. (Taiwan), Powertech Technology, Inc. (Taiwan), Intel Corporation (U.S.) and many more.

A. On the basis of top growing big corporations, we select top 10 players.

A. The Semiconductor Packaging Market is segmented on the basis of type, packaging material, wafer material, technology, industry vertical, and region.

A. The key growth strategies of Semiconductor Packaging Market players include product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations.

A. the flip chip segment accounted for maximum revenue.

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