The global semiconductor bonding market was valued at $0.88 billion in 2021 and is projected to reach $1.27 billion by 2031, growing at a CAGR of 3.6% from 2022 to 2031.
Report Code : A31532 | Pages : 290 | Category : Semiconductor and Electronics
The global die bonder equipment market was valued at $785.2 million in 2023, and is projected to reach $1,861.3 million by 2032, growing at a CAGR of 10.8% from 2024 to 2032.
Report Code : A44671 | Pages : 315 | Category : Construction & Manufacturing
