0
2022
Thermal Interface Material Market

Thermal Interface Material Market

by Type (Greases and Adhesives, Tapes and Films, Gap Fillers Metallic TIMs, Phase Change Materials, Others), by Application (Computers, Telecom, Medical Devices, Industrial Machinery, Consumer Durables, Automotive Electronics): Global Opportunity Analysis and Industry Forecast, 2021-2031

Report Code: A00883
Dec 2022 | Pages: 256
Tables: 123
Charts: 64
  • Formats*:

  • pdf

    Single User License, Five User
    License & Enterprise User License

  • xls

    Data Pack Excel License

  • ppt

    It comes with the additional cost
    of $2500.00 contact sales.

 

Thermal Interface Material Market Research, 2031

The global thermal interface material market size was valued at $4.7 billion in 2021, and is projected to reach $10.8 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.

Report Key Highlighters:

  • The thermal interface material market forecast has been analyzed in both value and volume. The value of thermal interface material market is analyzed in millions.
  • Global thermal interface material market is fragmented in nature with many players such as Laird Technologies Inc., DuPont, Honeywell International Inc. (Honeywell), Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal Solutions, Inc., Parker-Hannifin Corporation, and Momentive. Also tracked key strategies such as product launches and business expansion of various manufacturers of thermal interface material.
  • Conducted primary interviews with raw material suppliers, wholesalers, suppliers, and manufacturers of thermal interface material to understand the market trends, growth factors, pricing, and key players competitive strategies.

Growing consumer preference for compact PCs has escalated the need for effective thermal interface materials for effective dissipation of heat from the source. On the other hand, the demand for embedded PCs is growing globally. Embedded PCs are those computer devices that have high performance, minimal weight, and compact size.

Thermal Interface Material Market

Thermal interface materials are a group of thermal management products that are applied between two interface surfaces or components in order to improve the thermal coupling. Thermal greases (thermal compounds/thermal paste) are silicone or hydrocarbon containing thermal interface materials that are used to eliminate microscopic air pockets. Thermal tapes or thermal adhesive tapes are types of thermal interface materials with adhesive on one or both surfaces. In addition, use of pressure-sensitive adhesive on the thermal tape surface/surfaces eases the application.

Gap fillers are a type of thermal interface materials that are used to fill large gaps or voids present between heat generating and dissipating surfaces. Thermal interface phase change material tends to soften under melting temperature or upon reaching component operating temperature. Thus, with additional application of clamp pressure, these phase change materials conform precisely over mating surfaces and offer maximum heat dissipating characteristic.

Thermal interface phase change materials are used widely for high heat dissipation electronic applications across aerospace & military, consumer electronics, automotive, and industrial end-use industries. Phase change materials are used as an alternative over thermal greases. Traditionally, thermal greases are used as thermal interface material between power devices and their respective heat sinks.

However, high heat dispensable characteristics of thermal interface phase change material make it prominent TIM is the key market trend. Non-thixotropic characteristic of phase change material allows easy handling and application process during high volume electronic production drives the demand of the global market. Thermal interface phase change material is capable of completely filling the voids and eliminating air gaps. In addition, these thermal interface materials are proven to displace trapped air between electronic components that are dissipating power. Use of phase change materials for void filling improvises heat sink performance and enhances electronic component reliability.

These are the major growth factors. Moreover, phase change materials tend to melt after reaching elevated temperature and form minimum bond-line thickness (MBLT) between the voids or surfaces. This further ensures proper thermal management between two electronic surfaces. Formation of MBLT results in zero thermal contact resistance owing to minimal thermal resistance path. All these factors are extremely important and considerable factors for using thermal interface material in advanced electronic components. These factors are considered to drive the demand of the global market.

However, there are certain limitations associated with the use of thermal interface materials across pre-defined applications. For instance, thermal pads are used to fill the large voids between heat sink and its components. However, the production process of thermal pads intended to be used across miniature devices is restricted. In addition, high costs associated with use of thermal pad across most demanding applications hampers the market growth. On the other hand, thermal grease requires advanced production equipment in order to maintain coating thickness. High coating thickness of thermal grease will reduce thermal conductivity and thus hamper the heat dissipation. In addition, the thickness of thermal grease should not exceed 0.2 mm and thermal greases are not suitable to be used for large scale coating application.

Thus, key-players in the electronic industry tend to switch to alternative materials in such instances. Phase change materials are another popular thermal interface material used in the electronic and automotive industries. However, storage and transport of phase change thermal interface materials is a high-cost process. For instance, this thermal interface material tends to change its physical phase upon changing environmental conditions. Thus, it requires proper storage and ambient temperature in order to avoid the phase change. All these factors escalate the production cost; thus allowing consumers to choose alternatives over thermal interface materials, which hampers the market growth.

Conversely, proper thermal exchange between computer processor such as integrated heat spreader (IHS) and the fan-heatsink is crucial to run the computer components effectively. Thermal interface materials allow effective thermal transfer between integrated heat spreader (IHS) and the fan-heatsink in computer systems. In addition, use of processors in computers without any thermal compound or thermal interface material leads to damaged compressor. Computer system efficiency depends on the performance of heat sink.

Thermal interface materials such as thermal paste and greases are used to fill the microscopic void present between computer's CPU and heat sink. This in turn allows cooling capability of heat sink that further allows smooth CPU running is anticipated to offer new growth opportunities. In addition, thermal management plays a vital role in the telecommunication industry. The telecom industry uses different and advanced high-power electronic components. These electronic components require use of thermal interface materials for improved operation of the components and to extend the reliability of the telecom systems. In addition, several key-players in the thermal interface materials are launching innovative products that are intended to be used in the telecom industry.

For instance, Henkel launched one-part high thermal conductivity dispensable thermal interface gel that is sold under the trade name of BERGQUIST LIQUI FORM TLF 10000. The thermal interface gel is used to fill the voids present in the high-power telecommunication components. Technological development in the telecommunication industry has diversified the use of 5G telecom infrastructure equipment such as routers & servers and microchips such as ASICs and FPGAs. These advanced servers, routers, and microchips need proper thermal interface materials for heat dissipation. Growing demand for fast and swift data processing in the telecommunication sector demands for advanced thermal interface materials for thermal management. All these factors are driving the demand for thermal interface materials across telecom application thereby expected to offer lucrative growth opportunities during the forecast period.

Technological development in the telecommunication industry has diversified the use of 5G telecom infrastructure equipment such as routers & servers and microchips such as ASICs and FPGAs. These advanced servers, routers, and microchips need proper thermal interface materials for heat dissipation. Growing demand for fast and swift data processing in telecommunication sector demands for advanced thermal interface materials for thermal management. All these factors are driving the demand for thermal interface materials across telecom applications. Medical devices use different semiconductors that act as source of heat sinks. For instance, graphics processors, integrated circuits (ICs) for computing, power semiconductors, RF power devices, and others. These semiconductor heat sinks must operate efficiently in order to run medical devices such as surgical lamps, operating theater lighting fixtures, CT scanners, and surgical laser systems. Diverse portfolio of thermal interface materials is employed in a complex medical electronics system. In addition, thermal design factor plays an important role in medical imaging and surgical devices.

Growing demand for thermal interface materials in medical devices and electronics

Thus, thermal interface materials are embedded within the medical imaging devices, surgical devices, and other CT scanners for allowing proper heat dissipation in the heat sinks that are attached to these medical devices is the key market trend. Gap filling thermal interface materials are used to fill the large voids present on the surface of graphics processors, integrated circuits (ICs), and RF power devices. Technological development, population growth, and increasing consumer trend toward the use of advanced technologies for treatment has augmented the need for advanced medical devices and electronic equipment.

In order to comply with the ongoing technological trend, key-players in the medical electronics and devices are producing small yet powerful devices. However, these small devices need proper heat transfer and thermal management products. Key-players in the thermal interface materials are partnering with medical device manufacturers in order to offer the best suited thermal interface materials for electronic devices. For instance, Boyd, a leading player in thermal management products has been in the market for over 50 years and is continually working along with the medical devices manufacturers for supply of required thermal interface materials. All these factors have escalated the global demand of the market.

The thermal interface material market is segmented on the basis of type, application, and region. By type, the market is divided into greases & adhesives, tapes & films, gap filler metallic TIMs, phase change materials, and others. The applications covered in the report include computers, telecom, medical devices, industrial machinery, consumer durables, and automobile electronics. On the basis of region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. Key players in thermal interface material industry include Laird Technologies Inc., DuPont, Honeywell International Inc. (Honeywell), Henkel Corporation, Zalman, 3M, Indium Corporation, Wakefield Thermal Solutions, Inc., Parker-Hannifin Corporation, and Momentive.

Thermal Interface Material Market

On the basis of type, the global market is divided into greases & adhesives, tapes & films, gap fillers metallic TIMs, phase change materials, and others. The greases & adhesives segment accounted for 31% thermal interface material market share in 2021 and is expected to maintain its dominance during the forecast period. Combination of conductive filler and silicone-free thermal greases are gaining importance across the electronic sector, as this type of thermal grease offers improved thermal management.

Thermal grease tends to spread out as a thin layer after application across flat surfaces. Formation of thin layers over two electronic flat surfaces ensure minimal thermal resistance between the applied surface that further offers proper thermal management. In addition, use of mounting hardware and spring forces during application of thermal greases increases thermal management characteristics of the grease. High volume electronic production requires the use of consistent grease application. Use of thermal grease for high volume production with template screening controls distribution of applied thermal grease. All these factors have escalated the demand for thermal grease across the electronic end-use industry.

Adhesives or thermal conductive adhesives are formulated to offer proper thermal management in heat-generating components. In addition, this thermal interface material serves as a bonding product between two electronic parts. Thermally conductive adhesives are mainly used for facilitating thermal management and removing the use of space-restrictive mechanical fasteners. Strong bond between heat sinks and electronic components is crucial, as it reduces the use of screws and clips. Thermally conductive adhesives are strong adhesion products used for effective thermal management and adhesion of electronic components is the key market trend.

Pad, liquid, and laminates are different thermal conductive adhesive forms available in the market. Adhesive thermal interface material is proven to offer reliable, long-lasting bonding capability, and effective heat dissipation in electronic devices, which drives the demand of the global market.

Thermal Interface Material Market

By application, it is divided into computers, telecom, medical devices, industrial machinery, consumer durables, and automotive electronics. Computer applications accounted for the largest revenue share in the thermal interface material market in 2021. Technological development has led to the development of high-power computers with minimalistic weight and design. However, constrained package area for computer components increases the risk of thermal management. Thus, in order to overcome this problem, advanced thermal interface materials are being used for packaging of processors.

Factors such as low thermal impedance, high thermal conductivity, improved conformability, and high adhesion strength make thermal grease a crucial thermal interface material in computers. All these factors are driving the demand for thermal interface materials in computer applications. Moreover, thermal grease and paste removes heat from computer semiconductor junction to ambient environment or heat sinks. Thus, the demand and use of thermal interface materials across advanced PCs for proper thermal management is anticipated to offer new growth opportunities. 

Sometimes the operating temperature of the embedded PCs tends to be more than the expected operating temperature, which further leads to performance loss, components failure, and associated downtime cost. Thus, such PCs require use of advanced thermal management materials for ensuring proper working and high performance. All these factors are driving the demand of the global market.

Thermal Interface Material Market

On the basis of region, Asia-Pacific accounted for 49% thermal interface material market share in 2021 and is expected to maintain its dominance during the forecast period. Consumer durable products such as electronic products use processors or batteries. These processors or batteries tend to generate heat and thermal management is important in these consumer electronic products.

Other consumer durable wearables also require thermal management for assuring reliable functioning of the products. Asia-Pacific region is a leading consumer and producer of consumer durable electronic goods, which has escalated the demand of thermal interface materials. Factors such as shifting consumer preferences and demographic factors have further escalated the demand for electronic products across Asia-Pacific.

COVID-19 Impact On The Global Thermal Interface Materials Market:

The COVID-19 pandemic led to the temporary long-term halting of automotive and electronics production in major economies such as the U.S., Germany, and China. A similar economic decline was witnessed in other countries as well. This decline in production output deeply hampered the global thermal interface material market.

    Key Benefits For Stakeholders

    • This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the thermal interface material market analysis from 2021 to 2031 to identify the prevailing thermal interface material market opportunities.
    • The market research is offered along with information related to key drivers, restraints, and opportunities.
    • Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
    • In-depth analysis of the thermal interface material market segmentation assists to determine the prevailing market opportunities.
    • Major countries in each region are mapped according to their revenue contribution to the global market.
    • Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
    • The report includes the analysis of the regional as well as global thermal interface material market trends, key players, market segments, application areas, and market growth strategies.

    Thermal Interface Material Market Report Highlights

    Aspects Details
    Market Size By 2031 USD 10.8 billion
    Growth Rate CAGR of 8.8%
    Forecast period 2021 - 2031
    Report Pages 256
    By Type
    • Tapes and Films
    • Gap Fillers Metallic TIMs
    • Phase Change Materials
    • Others
    • Greases and Adhesives
    By Application
    • Computers
    • Telecom
    • Medical Devices
    • Industrial Machinery
    • Consumer Durables
    • Automotive Electronics
    By Region
    • North America  (U.S., Canada, Mexico)
    • Europe  (Germany, UK, France, Spain, Italy, Rest of Europe)
    • Asia-Pacific  (China, India, Japan, South Korea, Australia, Rest of Asia-Pacific)
    • LAMEA  (Brazil, Saudi Arabia, South Africa, Rest of LAMEA)
    Key Market Players Laird Technologies Inc., Parker Hannifin Corporation, Momentive, DuPont, Zalman, Honeywell International Inc., Wakefield Thermal, Inc., Henkel Corporation, 3M, Indium Corporation
    Other Key Market Players Fujipoly, Bergquist Company, SIBELCO, Shin-Etsu, SEMIKRON, Linseis GmbH, DuPont, Dycotec Materials Ltd, KraFAB, Advanced Thermal Solutions, Inc.
     
    • CHAPTER 1:INTRODUCTION

      • 1.1.Report description

      • 1.2.Key market segments

      • 1.3.Key benefits to the stakeholders

      • 1.4.Research Methodology

        • 1.4.1.Secondary research

        • 1.4.2.Primary research

        • 1.4.3.Analyst tools and models

    • CHAPTER 2:EXECUTIVE SUMMARY

      • 2.1.Key findings of the study

      • 2.2.CXO Perspective

    • CHAPTER 3:MARKET OVERVIEW

      • 3.1.Market definition and scope

      • 3.2.Key findings

        • 3.2.1.Top investment pockets

      • 3.3.Porter’s five forces analysis

      • 3.4.Market dynamics

        • 3.4.1.Drivers

          • 3.4.1.1. Growing demand for thermal interface materials for miniature device packaging
          • 3.4.1.2. Growing demand for thermal interface materials in automotive electronics

        • 3.4.2.Restraints

          • 3.4.2.1. Disadvantages associated with use of thermal interface materials

        • 3.4.3.Opportunities

          • 3.4.3.1. Growing demand for thermal interface materials in medical electronics

      • 3.5.COVID-19 Impact Analysis on the market

      • 3.6.Value Chain Analysis

      • 3.7.Key Regulation Analysis

      • 3.8.Patent Landscape

      • 3.9.Regulatory Guidelines

    • CHAPTER 4: THERMAL INTERFACE MATERIAL MARKET, BY TYPE

      • 4.1 Overview

        • 4.1.1 Market size and forecast

      • 4.2. Greases and Adhesives

        • 4.2.1 Key market trends, growth factors and opportunities

        • 4.2.2 Market size and forecast, by region

        • 4.2.3 Market share analysis by country

      • 4.3. Tapes and Films

        • 4.3.1 Key market trends, growth factors and opportunities

        • 4.3.2 Market size and forecast, by region

        • 4.3.3 Market share analysis by country

      • 4.4. Gap Fillers Metallic TIMs

        • 4.4.1 Key market trends, growth factors and opportunities

        • 4.4.2 Market size and forecast, by region

        • 4.4.3 Market share analysis by country

      • 4.5. Phase Change Materials

        • 4.5.1 Key market trends, growth factors and opportunities

        • 4.5.2 Market size and forecast, by region

        • 4.5.3 Market share analysis by country

      • 4.6. Others

        • 4.6.1 Key market trends, growth factors and opportunities

        • 4.6.2 Market size and forecast, by region

        • 4.6.3 Market share analysis by country

    • CHAPTER 5: THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION

      • 5.1 Overview

        • 5.1.1 Market size and forecast

      • 5.2. Computers

        • 5.2.1 Key market trends, growth factors and opportunities

        • 5.2.2 Market size and forecast, by region

        • 5.2.3 Market share analysis by country

      • 5.3. Telecom

        • 5.3.1 Key market trends, growth factors and opportunities

        • 5.3.2 Market size and forecast, by region

        • 5.3.3 Market share analysis by country

      • 5.4. Medical Devices

        • 5.4.1 Key market trends, growth factors and opportunities

        • 5.4.2 Market size and forecast, by region

        • 5.4.3 Market share analysis by country

      • 5.5. Industrial Machinery

        • 5.5.1 Key market trends, growth factors and opportunities

        • 5.5.2 Market size and forecast, by region

        • 5.5.3 Market share analysis by country

      • 5.6. Consumer Durables

        • 5.6.1 Key market trends, growth factors and opportunities

        • 5.6.2 Market size and forecast, by region

        • 5.6.3 Market share analysis by country

      • 5.7. Automotive Electronics

        • 5.7.1 Key market trends, growth factors and opportunities

        • 5.7.2 Market size and forecast, by region

        • 5.7.3 Market share analysis by country

    • CHAPTER 6: THERMAL INTERFACE MATERIAL MARKET, BY REGION

      • 6.1 Overview

        • 6.1.1 Market size and forecast

      • 6.2 North America

        • 6.2.1 Key trends and opportunities

        • 6.2.2 North America Market size and forecast, by Type

        • 6.2.3 North America Market size and forecast, by Application

        • 6.2.4 North America Market size and forecast, by country

          • 6.2.4.1 U.S.
            • 6.2.4.1.1 Key market trends, growth factors and opportunities
            • 6.2.4.1.2 Market size and forecast, by Type
            • 6.2.4.1.3 Market size and forecast, by Application
          • 6.2.4.2 Canada
            • 6.2.4.2.1 Key market trends, growth factors and opportunities
            • 6.2.4.2.2 Market size and forecast, by Type
            • 6.2.4.2.3 Market size and forecast, by Application
          • 6.2.4.3 Mexico
            • 6.2.4.3.1 Key market trends, growth factors and opportunities
            • 6.2.4.3.2 Market size and forecast, by Type
            • 6.2.4.3.3 Market size and forecast, by Application
      • 6.3 Europe

        • 6.3.1 Key trends and opportunities

        • 6.3.2 Europe Market size and forecast, by Type

        • 6.3.3 Europe Market size and forecast, by Application

        • 6.3.4 Europe Market size and forecast, by country

          • 6.3.4.1 Germany
            • 6.3.4.1.1 Key market trends, growth factors and opportunities
            • 6.3.4.1.2 Market size and forecast, by Type
            • 6.3.4.1.3 Market size and forecast, by Application
          • 6.3.4.2 UK
            • 6.3.4.2.1 Key market trends, growth factors and opportunities
            • 6.3.4.2.2 Market size and forecast, by Type
            • 6.3.4.2.3 Market size and forecast, by Application
          • 6.3.4.3 France
            • 6.3.4.3.1 Key market trends, growth factors and opportunities
            • 6.3.4.3.2 Market size and forecast, by Type
            • 6.3.4.3.3 Market size and forecast, by Application
          • 6.3.4.4 Spain
            • 6.3.4.4.1 Key market trends, growth factors and opportunities
            • 6.3.4.4.2 Market size and forecast, by Type
            • 6.3.4.4.3 Market size and forecast, by Application
          • 6.3.4.5 Italy
            • 6.3.4.5.1 Key market trends, growth factors and opportunities
            • 6.3.4.5.2 Market size and forecast, by Type
            • 6.3.4.5.3 Market size and forecast, by Application
          • 6.3.4.6 Rest of Europe
            • 6.3.4.6.1 Key market trends, growth factors and opportunities
            • 6.3.4.6.2 Market size and forecast, by Type
            • 6.3.4.6.3 Market size and forecast, by Application
      • 6.4 Asia-Pacific

        • 6.4.1 Key trends and opportunities

        • 6.4.2 Asia-Pacific Market size and forecast, by Type

        • 6.4.3 Asia-Pacific Market size and forecast, by Application

        • 6.4.4 Asia-Pacific Market size and forecast, by country

          • 6.4.4.1 China
            • 6.4.4.1.1 Key market trends, growth factors and opportunities
            • 6.4.4.1.2 Market size and forecast, by Type
            • 6.4.4.1.3 Market size and forecast, by Application
          • 6.4.4.2 India
            • 6.4.4.2.1 Key market trends, growth factors and opportunities
            • 6.4.4.2.2 Market size and forecast, by Type
            • 6.4.4.2.3 Market size and forecast, by Application
          • 6.4.4.3 Japan
            • 6.4.4.3.1 Key market trends, growth factors and opportunities
            • 6.4.4.3.2 Market size and forecast, by Type
            • 6.4.4.3.3 Market size and forecast, by Application
          • 6.4.4.4 South Korea
            • 6.4.4.4.1 Key market trends, growth factors and opportunities
            • 6.4.4.4.2 Market size and forecast, by Type
            • 6.4.4.4.3 Market size and forecast, by Application
          • 6.4.4.5 Australia
            • 6.4.4.5.1 Key market trends, growth factors and opportunities
            • 6.4.4.5.2 Market size and forecast, by Type
            • 6.4.4.5.3 Market size and forecast, by Application
          • 6.4.4.6 Rest of Asia-Pacific
            • 6.4.4.6.1 Key market trends, growth factors and opportunities
            • 6.4.4.6.2 Market size and forecast, by Type
            • 6.4.4.6.3 Market size and forecast, by Application
      • 6.5 LAMEA

        • 6.5.1 Key trends and opportunities

        • 6.5.2 LAMEA Market size and forecast, by Type

        • 6.5.3 LAMEA Market size and forecast, by Application

        • 6.5.4 LAMEA Market size and forecast, by country

          • 6.5.4.1 Brazil
            • 6.5.4.1.1 Key market trends, growth factors and opportunities
            • 6.5.4.1.2 Market size and forecast, by Type
            • 6.5.4.1.3 Market size and forecast, by Application
          • 6.5.4.2 Saudi Arabia
            • 6.5.4.2.1 Key market trends, growth factors and opportunities
            • 6.5.4.2.2 Market size and forecast, by Type
            • 6.5.4.2.3 Market size and forecast, by Application
          • 6.5.4.3 South Africa
            • 6.5.4.3.1 Key market trends, growth factors and opportunities
            • 6.5.4.3.2 Market size and forecast, by Type
            • 6.5.4.3.3 Market size and forecast, by Application
          • 6.5.4.4 Rest of LAMEA
            • 6.5.4.4.1 Key market trends, growth factors and opportunities
            • 6.5.4.4.2 Market size and forecast, by Type
            • 6.5.4.4.3 Market size and forecast, by Application
    • CHAPTER 7: COMPETITIVE LANDSCAPE

      • 7.1. Introduction

      • 7.2. Top winning strategies

      • 7.3. Product Mapping of Top 10 Player

      • 7.4. Competitive Dashboard

      • 7.5. Competitive Heatmap

      • 7.6. Top player positioning, 2021

    • CHAPTER 8: COMPANY PROFILES

      • 8.1 Laird Technologies Inc.

        • 8.1.1 Company overview

        • 8.1.2 Key Executives

        • 8.1.3 Company snapshot

        • 8.1.4 Operating business segments

        • 8.1.5 Product portfolio

        • 8.1.6 Business performance

        • 8.1.7 Key strategic moves and developments

      • 8.2 DuPont

        • 8.2.1 Company overview

        • 8.2.2 Key Executives

        • 8.2.3 Company snapshot

        • 8.2.4 Operating business segments

        • 8.2.5 Product portfolio

        • 8.2.6 Business performance

        • 8.2.7 Key strategic moves and developments

      • 8.3 Honeywell International Inc.

        • 8.3.1 Company overview

        • 8.3.2 Key Executives

        • 8.3.3 Company snapshot

        • 8.3.4 Operating business segments

        • 8.3.5 Product portfolio

        • 8.3.6 Business performance

        • 8.3.7 Key strategic moves and developments

      • 8.4 Henkel Corporation

        • 8.4.1 Company overview

        • 8.4.2 Key Executives

        • 8.4.3 Company snapshot

        • 8.4.4 Operating business segments

        • 8.4.5 Product portfolio

        • 8.4.6 Business performance

        • 8.4.7 Key strategic moves and developments

      • 8.5 Zalman

        • 8.5.1 Company overview

        • 8.5.2 Key Executives

        • 8.5.3 Company snapshot

        • 8.5.4 Operating business segments

        • 8.5.5 Product portfolio

        • 8.5.6 Business performance

        • 8.5.7 Key strategic moves and developments

      • 8.6 3M

        • 8.6.1 Company overview

        • 8.6.2 Key Executives

        • 8.6.3 Company snapshot

        • 8.6.4 Operating business segments

        • 8.6.5 Product portfolio

        • 8.6.6 Business performance

        • 8.6.7 Key strategic moves and developments

      • 8.7 Indium Corporation

        • 8.7.1 Company overview

        • 8.7.2 Key Executives

        • 8.7.3 Company snapshot

        • 8.7.4 Operating business segments

        • 8.7.5 Product portfolio

        • 8.7.6 Business performance

        • 8.7.7 Key strategic moves and developments

      • 8.8 Wakefield Thermal, Inc.

        • 8.8.1 Company overview

        • 8.8.2 Key Executives

        • 8.8.3 Company snapshot

        • 8.8.4 Operating business segments

        • 8.8.5 Product portfolio

        • 8.8.6 Business performance

        • 8.8.7 Key strategic moves and developments

      • 8.9 Parker Hannifin Corporation

        • 8.9.1 Company overview

        • 8.9.2 Key Executives

        • 8.9.3 Company snapshot

        • 8.9.4 Operating business segments

        • 8.9.5 Product portfolio

        • 8.9.6 Business performance

        • 8.9.7 Key strategic moves and developments

      • 8.10 Momentive

        • 8.10.1 Company overview

        • 8.10.2 Key Executives

        • 8.10.3 Company snapshot

        • 8.10.4 Operating business segments

        • 8.10.5 Product portfolio

        • 8.10.6 Business performance

        • 8.10.7 Key strategic moves and developments

    • LIST OF TABLES

    • TABLE 1. GLOBAL THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 2. THERMAL INTERFACE MATERIAL MARKET FOR GREASES AND ADHESIVES, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 3. THERMAL INTERFACE MATERIAL MARKET FOR TAPES AND FILMS, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 4. THERMAL INTERFACE MATERIAL MARKET FOR GAP FILLERS METALLIC TIMS, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 5. THERMAL INTERFACE MATERIAL MARKET FOR PHASE CHANGE MATERIALS, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 6. THERMAL INTERFACE MATERIAL MARKET FOR OTHERS, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 7. GLOBAL THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 8. THERMAL INTERFACE MATERIAL MARKET FOR COMPUTERS, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 9. THERMAL INTERFACE MATERIAL MARKET FOR TELECOM, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 10. THERMAL INTERFACE MATERIAL MARKET FOR MEDICAL DEVICES, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 11. THERMAL INTERFACE MATERIAL MARKET FOR INDUSTRIAL MACHINERY, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 12. THERMAL INTERFACE MATERIAL MARKET FOR CONSUMER DURABLES, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 13. THERMAL INTERFACE MATERIAL MARKET FOR AUTOMOTIVE ELECTRONICS, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 14. THERMAL INTERFACE MATERIAL MARKET, BY REGION, 2021-2031 (REVENUE, $MILLION)
      TABLE 15. NORTH AMERICA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 16. NORTH AMERICA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 17. NORTH AMERICA THERMAL INTERFACE MATERIAL MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
      TABLE 18. U.S. THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 19. U.S. THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 20. CANADA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 21. CANADA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 22. MEXICO THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 23. MEXICO THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 24. EUROPE THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 25. EUROPE THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 26. EUROPE THERMAL INTERFACE MATERIAL MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
      TABLE 27. GERMANY THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 28. GERMANY THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 29. UK THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 30. UK THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 31. FRANCE THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 32. FRANCE THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 33. SPAIN THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 34. SPAIN THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 35. ITALY THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 36. ITALY THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 37. REST OF EUROPE THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 38. REST OF EUROPE THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 39. ASIA-PACIFIC THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 40. ASIA-PACIFIC THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 41. ASIA-PACIFIC THERMAL INTERFACE MATERIAL MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
      TABLE 42. CHINA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 43. CHINA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 44. INDIA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 45. INDIA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 46. JAPAN THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 47. JAPAN THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 48. SOUTH KOREA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 49. SOUTH KOREA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 50. AUSTRALIA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 51. AUSTRALIA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 52. REST OF ASIA-PACIFIC THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 53. REST OF ASIA-PACIFIC THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 54. LAMEA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 55. LAMEA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 56. LAMEA THERMAL INTERFACE MATERIAL MARKET, BY COUNTRY, 2021-2031 (REVENUE, $MILLION)
      TABLE 57. BRAZIL THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 58. BRAZIL THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 59. SAUDI ARABIA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 60. SAUDI ARABIA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 61. SOUTH AFRICA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 62. SOUTH AFRICA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 63. REST OF LAMEA THERMAL INTERFACE MATERIAL MARKET, BY TYPE, 2021-2031 (REVENUE, $MILLION)
      TABLE 64. REST OF LAMEA THERMAL INTERFACE MATERIAL MARKET, BY APPLICATION, 2021-2031 (REVENUE, $MILLION)
      TABLE 65. LAIRD TECHNOLOGIES INC.: KEY EXECUTIVES
      TABLE 66. LAIRD TECHNOLOGIES INC.: COMPANY SNAPSHOT
      TABLE 67. LAIRD TECHNOLOGIES INC.: OPERATING SEGMENTS
      TABLE 68. LAIRD TECHNOLOGIES INC.: PRODUCT PORTFOLIO
      TABLE 69. LAIRD TECHNOLOGIES INC.: NET SALES
      TABLE 70. LAIRD TECHNOLOGIES INC.: KEY STRATERGIES
      TABLE 71. DUPONT: KEY EXECUTIVES
      TABLE 72. DUPONT: COMPANY SNAPSHOT
      TABLE 73. DUPONT: OPERATING SEGMENTS
      TABLE 74. DUPONT: PRODUCT PORTFOLIO
      TABLE 75. DUPONT: NET SALES
      TABLE 76. DUPONT: KEY STRATERGIES
      TABLE 77. HONEYWELL INTERNATIONAL INC.: KEY EXECUTIVES
      TABLE 78. HONEYWELL INTERNATIONAL INC.: COMPANY SNAPSHOT
      TABLE 79. HONEYWELL INTERNATIONAL INC.: OPERATING SEGMENTS
      TABLE 80. HONEYWELL INTERNATIONAL INC.: PRODUCT PORTFOLIO
      TABLE 81. HONEYWELL INTERNATIONAL INC.: NET SALES
      TABLE 82. HONEYWELL INTERNATIONAL INC.: KEY STRATERGIES
      TABLE 83. HENKEL CORPORATION: KEY EXECUTIVES
      TABLE 84. HENKEL CORPORATION: COMPANY SNAPSHOT
      TABLE 85. HENKEL CORPORATION: OPERATING SEGMENTS
      TABLE 86. HENKEL CORPORATION: PRODUCT PORTFOLIO
      TABLE 87. HENKEL CORPORATION: NET SALES
      TABLE 88. HENKEL CORPORATION: KEY STRATERGIES
      TABLE 89. ZALMAN: KEY EXECUTIVES
      TABLE 90. ZALMAN: COMPANY SNAPSHOT
      TABLE 91. ZALMAN: OPERATING SEGMENTS
      TABLE 92. ZALMAN: PRODUCT PORTFOLIO
      TABLE 93. ZALMAN: NET SALES
      TABLE 94. ZALMAN: KEY STRATERGIES
      TABLE 95. 3M: KEY EXECUTIVES
      TABLE 96. 3M: COMPANY SNAPSHOT
      TABLE 97. 3M: OPERATING SEGMENTS
      TABLE 98. 3M: PRODUCT PORTFOLIO
      TABLE 99. 3M: NET SALES
      TABLE 100. 3M: KEY STRATERGIES
      TABLE 101. INDIUM CORPORATION: KEY EXECUTIVES
      TABLE 102. INDIUM CORPORATION: COMPANY SNAPSHOT
      TABLE 103. INDIUM CORPORATION: OPERATING SEGMENTS
      TABLE 104. INDIUM CORPORATION: PRODUCT PORTFOLIO
      TABLE 105. INDIUM CORPORATION: NET SALES
      TABLE 106. INDIUM CORPORATION: KEY STRATERGIES
      TABLE 107. WAKEFIELD THERMAL, INC.: KEY EXECUTIVES
      TABLE 108. WAKEFIELD THERMAL, INC.: COMPANY SNAPSHOT
      TABLE 109. WAKEFIELD THERMAL, INC.: OPERATING SEGMENTS
      TABLE 110. WAKEFIELD THERMAL, INC.: PRODUCT PORTFOLIO
      TABLE 111. WAKEFIELD THERMAL, INC.: NET SALES
      TABLE 112. WAKEFIELD THERMAL, INC.: KEY STRATERGIES
      TABLE 113. PARKER HANNIFIN CORPORATION: KEY EXECUTIVES
      TABLE 114. PARKER HANNIFIN CORPORATION: COMPANY SNAPSHOT
      TABLE 115. PARKER HANNIFIN CORPORATION: OPERATING SEGMENTS
      TABLE 116. PARKER HANNIFIN CORPORATION: PRODUCT PORTFOLIO
      TABLE 117. PARKER HANNIFIN CORPORATION: NET SALES
      TABLE 118. PARKER HANNIFIN CORPORATION: KEY STRATERGIES
      TABLE 119. MOMENTIVE: KEY EXECUTIVES
      TABLE 120. MOMENTIVE: COMPANY SNAPSHOT
      TABLE 121. MOMENTIVE: OPERATING SEGMENTS
      TABLE 122. MOMENTIVE: PRODUCT PORTFOLIO
      TABLE 123. MOMENTIVE: NET SALES
      TABLE 124. MOMENTIVE: KEY STRATERGIES
    • LIST OF FIGURES

    • FIGURE 1. SEGMENTATION OF THERMAL INTERFACE MATERIAL MARKET,2021-2031
      FIGURE 2. THERMAL INTERFACE MATERIAL MARKET,2021-2031
      FIGURE 3. TOP INVESTMENT POCKETS, BY REGION
      FIGURE 4. PORTER FIVE-1
      FIGURE 5. PORTER FIVE-2
      FIGURE 6. PORTER FIVE-3
      FIGURE 7. PORTER FIVE-4
      FIGURE 8. PORTER FIVE-5
      FIGURE 9. THERMAL INTERFACE MATERIAL MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
      FIGURE 10. VALUE CHAIN ANALYSIS
      FIGURE 11. KEY REGULATION ANALYSIS
      FIGURE 12. PATENT ANALYSIS BY COMPANY
      FIGURE 13. PATENT ANALYSIS BY COUNTRY
      FIGURE 14. REGULATORY GUIDELINES
      FIGURE 15. THERMAL INTERFACE MATERIAL MARKET,BY TYPE,2021(%)
      FIGURE 16. COMPARATIVE SHARE ANALYSIS OF GREASES AND ADHESIVES THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 17. COMPARATIVE SHARE ANALYSIS OF TAPES AND FILMS THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 18. COMPARATIVE SHARE ANALYSIS OF GAP FILLERS METALLIC TIMS THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 19. COMPARATIVE SHARE ANALYSIS OF PHASE CHANGE MATERIALS THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 20. COMPARATIVE SHARE ANALYSIS OF OTHERS THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 21. THERMAL INTERFACE MATERIAL MARKET,BY APPLICATION,2021(%)
      FIGURE 22. COMPARATIVE SHARE ANALYSIS OF COMPUTERS THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 23. COMPARATIVE SHARE ANALYSIS OF TELECOM THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 24. COMPARATIVE SHARE ANALYSIS OF MEDICAL DEVICES THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 25. COMPARATIVE SHARE ANALYSIS OF INDUSTRIAL MACHINERY THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 26. COMPARATIVE SHARE ANALYSIS OF CONSUMER DURABLES THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 27. COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE ELECTRONICS THERMAL INTERFACE MATERIAL MARKET, 2021 AND 2031(%)
      FIGURE 28. THERMAL INTERFACE MATERIAL MARKET BY REGION,2021
      FIGURE 29. U.S. THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 30. CANADA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 31. MEXICO THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 32. GERMANY THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 33. UK THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 34. FRANCE THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 35. SPAIN THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 36. ITALY THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 37. REST OF EUROPE THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 38. CHINA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 39. INDIA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 40. JAPAN THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 41. SOUTH KOREA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 42. AUSTRALIA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 43. REST OF ASIA-PACIFIC THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 44. BRAZIL THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 45. SAUDI ARABIA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 46. SOUTH AFRICA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 47. REST OF LAMEA THERMAL INTERFACE MATERIAL MARKET,2021-2031($MILLION)
      FIGURE 48. TOP WINNING STRATEGIES, BY YEAR
      FIGURE 49. TOP WINNING STRATEGIES, BY DEVELOPMENT
      FIGURE 50. TOP WINNING STRATEGIES, BY COMPANY
      FIGURE 51. PRODUCT MAPPING OF TOP 10 PLAYERS
      FIGURE 52. COMPETITIVE DASHBOARD
      FIGURE 53. COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
      FIGURE 54. TOP PLAYER POSITIONING, 2021
      FIGURE 55. LAIRD TECHNOLOGIES INC..: NET SALES ($MILLION)
      FIGURE 56. DUPONT.: NET SALES ($MILLION)
      FIGURE 57. HONEYWELL INTERNATIONAL INC..: NET SALES ($MILLION)
      FIGURE 58. HENKEL CORPORATION.: NET SALES ($MILLION)
      FIGURE 59. ZALMAN.: NET SALES ($MILLION)
      FIGURE 60. 3M.: NET SALES ($MILLION)
      FIGURE 61. INDIUM CORPORATION.: NET SALES ($MILLION)
      FIGURE 62. WAKEFIELD THERMAL, INC..: NET SALES ($MILLION)
      FIGURE 63. PARKER HANNIFIN CORPORATION.: NET SALES ($MILLION)
      FIGURE 64. MOMENTIVE.: NET SALES ($MILLION)

     
     

    The thermal interface material market is expected to exhibit high growth potential. Electronic device packaging is challenging owing to growing power level consumption in miniature electronic devices. Furthermore, in order to comply with technological advancement, electronic device manufacturers are inclined toward reducing device size. However, reducing the electronic device size further requires use of proper thermal interface material for allowing effective heat transfer. Thermal interface materials are proven to offer reliable heat transfer between electronic integrated circuits and heat spreaders.

    Thermal interface materials are generally used between heat generating devices or components such as microprocessors, photonic ICs, and others. Removal or transfer of heat from miniature semiconductors used in electronic devices is utmost important for ensuring reliable operation of the device and improve longevity of the electronic components. Microscopic surface imprecision and non-planarity of integrated circuits or heat spreaders used in electronic devices hamper heat dissipation capacity. In addition, formation of proper thermal contact between surfaces is hampered owing to surface imprecision. All these factors will hamper thermal conductivity thereby demanding the use of thermal interface materials.

    Thermal management is a sizeable factor considered during automotive electronics production. Some of the electronic components are located near the internal combustion engines. Thus, the heat generated by IC engine and ambient temperature tends to put forward heat dissipation problems on the electronic components. Thermal interface materials such as thermal pads and phase change materials are widely used in automotive electronics. Advanced automotive cars are equipped with technologically developed electronics such advanced driver assistance systems (ADAS) and other climate control electronics.

    Modern cars, buses, and passenger vehicles include high functionality and development of hybrid cars have pushed the need for thermal management. Hybrid cars have electric batteries that are packed into the car. However, it further increases power density consumption. Power density consumption is directly related to generation of high heat. Thus, thermal interface materials are being used and implemented in automotive electronics and batteries for thermal management.

    PURCHASE OPTIONS

    Call or Email us

    U.S.-Canada Toll-free: +1-800-792-5285
    Int'l : +1-503-894-6022
    Europe : +44-845-528-1300
    Email : help@alliedmarketresearch.com
     
    FREQUENTLY ASKED QUESTIONS?

    A. Growing demand for thermal interface materials for miniature device packaging and automotive regulations such as implementation of Euro 6 standard, has further augmented the demand for high power density automotive electronics and ECU. This technological advancement has created new challenges for thermal management. Generation of heat across these ECU and other electronic components coupled with presence of ambient temperature of the automotive engine components degrades system reliability and thus make the electronic component susceptible to thermal degradation. Several studies have been conducted and demonstrated that use of thermal interface materials in electronic components help to achieve high heat conduction under harsh environmental and working conditions are the upcoming trends of thermal interface material market in the world

    A. Computer is the leading application of thermal interface material

    A. Asia-Pacific is the largest regional market for thermal interface material

    A. The global thermal interface material market was valued at $4.7 billion in 2021, and is projected to reach $10.8 billion by 2031, growing at a CAGR of 8.8% from 2022 to 2031.

    A. Parker Hannifin Corporation, DuPont, and Henkel Corporation are the top companies to hold the market share in thermal interface material

    Looking for Customization?

     Customization Request

    Have a Question?

     Speak with Analyst

    Any Confusion?

     Inquire Before Buying

    Have a glance of the Report

      Request Sample
    RELATED TAGS

    Purchase Full Report of
    Thermal Interface Material Market

    Start reading instantly.
    This Report and over 66,944+ more Reports, Available with Avenue Library. T&C*.

    • Online Only
    • $3,570
    • Online cloud access only
    • Restricted print, copy, paste & download
    • Read only
    • Free industry update
      (Within 180 days)
    • Free report update in next update cycle
      (Dec 2023 - Dec 2024)
    • Data Pack
    • $3,840
    • Restricted to one authorized user
    • One print only
    • Available in
      Excel
    • Free industry update
      (Within 180 days)
    •   Free report update in next update cycle
      (Dec 2023 - Dec 2024)
    • Single User
    • $5,730
    • Restricted to one authorized user
    • One print only
    • Available in
      PDF
    • Free industry update
      (Within 180 days)
    •   Free report update in next update cycle
      (Dec 2023 - Dec 2024)
    • Five Users
    • $6,450
    • Limited to five authorized users
    • Print upto five copies
    • Available in
      PDF
    • Free industry update
      (Within 180 days)
    •   Free report update in next update cycle
      (Dec 2023 - Dec 2024)
    • Enterprise
      License/PDF

    • $9,600
    • Unlimited
      within
      company/enterprise
    • Available in Excel & PDF
    • Free industry update
      (Within 180 days)
    •   Free report update in next update cycle
      (Dec 2023 - Dec 2024)
    • Library
      Membership

    • $999 $ 1,175
      Per User/ Per month/ Billed annually
    • Published Content
      E-access
    • Company Profiles
      E-access
    • Newly Added Content Access
    • 10 PDF
      Downloads
    • 5 Excel Data
      Pack Downloads
    • 250 Company Profiles PDF Downloads
    • Buy Now

    *Taxes/Fees, if applicable will be added during checkout. All prices in USD

    RELATED REPORTS
     

    Why Allied Market Research?

     

    Infallible Methodology

    To ensure high-level data integrity, accurate analysis, and impeccable forecasts

    Analyst Support

    For complete satisfaction

    Customization

    On-demand customization of scope of the report to exactly meet your needs

    TARGETED MARKET VIEW

    Targeted market view to provide pertinent information and save time of readers

    Get fresh content delivered

    Get insights on topics that are crucial for your business. Stay abreast of your interest areas.

    Get Industry Data Alerts

    Why Allied Market Research?

    Infallible Methodology

    To ensure high-level data integrity, accurate analysis, and impeccable forecasts

    Analyst Support

    For complete satisfaction

    Customization

    On-demand customization of scope of the report to exactly meet your needs

    TARGETED MARKET VIEW

    Targeted market view to provide pertinent information and save time of readers