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2022
Thin Wafer Processing And Dicing Equipment Market

Thin Wafer Processing and Dicing Equipment Market By Equipment Type (Thinning Equipment, Dicing Equipment), Wafer Thickness (750 micrometers, 120 micrometers, and 50 micrometers), Wafer Size (Less Than 4 Inch, 5 Inch and 6 Inch, 8 Inch), Application (Memory and Logic, MEMS Devices, Power Devices), Dicing Technology (Blade Dicing, Laser Dicing, Stealth Dicing, Plasma Dicing): Global Opportunity Analysis and Industry Forecast, 2021–2030

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Thin Wafer Processing and Dicing Equipment Market Outlook - 2030

Thin wafer processing and dicing equipment are types of equipment, which are used to process thin wafers. The integration of microelectronics into various consumer electronics and smart cards required for thinner wafers is rapidly increasing. RFID, MEMS devices, and power devices are thought to be the primary sources of demand for these thin wafers. 

This scenario is increasing demand for a better manufacturing process, particularly for processing and dicing, which are critical stages of ultra-thin wafer production. A semiconductor wafer is a thin slice of semiconductor material used in electronics. This material is used in the fabrication of integrated circuits as well as in photovoltaics for traditional wafer-based solar cells. Wafer dicing is the process of separating individual silicon chips from each other on a wafer.

The global thin wafer processing and dicing equipment market is segmented on the basis of equipment type, wafer thickness, wafer size, application, dicing technology and region. Based on equipment type, the market is divided into thinning equipment, dicing equipment. In terms of wafer thickness, the market is categorized into 750 micrometers, 120 micrometers, and 50 micrometers. On the basis of wafer size, the market is divided into less than 4 inch, 5 inch and 6 inch, 8 inch. On the basis of application the market is divided into memory and logic, MEMS Devices, Power Devices. On the basis of dicing technology the market is divided into blade dicing, laser dicing, stealth dicing, plasma dicing. Geographically, the market is analyzed across several regions such as North America, Europe, Asia-Pacific, and Latin America, Middle East & Africa (LAMEA).

Key players operating in the global thin wafer processing and dicing equipment industry include EV Group, Suzhou Delphi Laser, Lam Research Corporation, Plasma-Therm, Tokyo Seimitsu, Tokyo Electron Ltd, Advanced Dicing Technologies, SPTS Technologies, Panasonic, DISCO Corporation. These companies have adopted several strategies such as product launches, partnerships, collaborations, mergers & acquisitions, and joint ventures to strengthen their foothold in the global thin wafer processing and dicing equipment market.

Market Scope and Structure Analysis

Report Metric

Details

Market Size Available for Years

  2020–2030

  Base Year Considered

  2020

  Forecast Period

  2021–2030

  Forecast Unit

  Value ($)

  Segments Covered

Equipment Type, Wafer Thickness, Wafer Size, Application, Dicing Technology, and Region

  Companies Covered

EV Group, Suzhou Delphi Laser, Lam Research Corporation, Plasma-Therm, Tokyo Seimitsu, Tokyo Electron Ltd, Advanced Dicing Technologies, SPTS Technologies, Panasonic, DISCO Corporation

 

COVID-19 Impact Analysis

The current COVID-19 pandemic has a negative impact on the thin wafer processing and dicing equipment market, with manufacturing activities being temporarily halted across major manufacturing hubs, resulting in a significant production slowdown. People are becoming significantly more isolated as a result of increased restrictions on public meetings and travel. 

Due to supply chain delays, stock market instability, halting of airlines, business dealings in the thin wafer processing and dicing equipment business are also feeling the effects of the COVID-19 epidemic. It has directly impacted production and demand for thin wafer processing and dicing equipment causing supply chain and market disruption. 

As airports are shut down due to lockdown restrictions, the use of thin wafer processing and dicing equipment is halted, negatively impacting the thin wafer processing and dicing equipment market. Also, as government of different provinces have already announced total lockdown and temporarily shutdown of industries, the overall production process being adversely affected; thus, hinder the overall Thin Wafer Processing and Dicing Equipment market opportunity globally.

Top Impacting Factors

Rising demand for three-dimensional integrated circuits, which are widely used in various miniature semiconductor devices such as memory cards, smartphones, smart cards, and various computing devices, is expected to drive the demand for thin wafer processing and dicing equipment in the coming years. Three-dimensional circuits are increasingly being used in space-constrained applications such as portable consumer electronic devices, sensors, MEMS, and industrial products as they improve overall product performance in terms of speed, durability, low power consumption, light weight, and memory. The high cost of device maintenance is a restraint for the thin wafer dicing equipment market.

Surge in Usage in Thinning Equipment

Grinding is currently the most convenient thinning process used in semiconductor applications, reducing wafer diameter thickness from 750 m to 120 m on average. However, due to the stress of high-volume manufacturing, less than 100 m silicon wafers become very flexible and difficult to reduce further using standard grinding methods. The increasing automation of wafer back grinding equipment is assisting in achieving the highest level of quality while also reducing wafer thicknesses to less than 0.050mm. 

To achieve these ultra-thin thicknesses, a diamond-grit grinding wheel is required. As a result, ultra-fine grind wheels are becoming the industry standard for all background target thicknesses. Additional technologies, such as chemical-mechanical planarization (CMP), are required to remove edge chipping and microcracking caused by the standard grinding process in applications such as memory and logic. 

TAIKO is a wafer back grinding process developed by DISCO Corporation that employs a novel grinding method. It is used to reduce the risk of thin wafer handling while also lowering warpage. TAIKO’s grinding process leaves an edge (approximately 3 mm) on the wafer’s outermost circumference and thin grinds only the inner circumference. It is a critical thinning process used in power devices, specifically in the backside metallization layer of 40V-100V MOSFETs and 650V-1200V IGBTs.

Key Benefits of the Report

  • This study presents the analytical depiction of the thin wafer processing and dicing equipment market size along with the current trends and future estimations to determine the imminent investment pockets.
  • The report presents information related to key drivers, restraints, and opportunities along with detailed analysis of the thin wafer processing and dicing equipment market share.
  • The current market is quantitatively analyzed from 2020 to 2030 to highlight thin wafer processing and dicing equipment market growth scenario.
  • Porter’s five forces analysis illustrates the potency of buyers & suppliers in the Thin Wafer Processing and Dicing Equipment industry.
  • The report provides a detailed thin wafer processing and dicing equipment market analysis based on competitive intensity and how the competition will take shape in coming years
  • The current Thin Wafer Processing and Dicing Equipment market forecast is quantitatively analyzed to benchmark the financial competency.

Questions Answered in the Thin Wafer Processing And Dicing Equipment Market Research Report

  • What are the leading market players active in the thin wafer processing and dicing equipment market?
  • What are the current trends that will influence the market in the next few years?
  • What are the driving factors, restraints, and opportunities in the market?
  • What are the projections for the future would help in taking further strategic steps?
    • Upcoming report specific FAQs examples: 
      • What is thin wafer processing and dicing equipment?
      • What does thin wafer processing and dicing equipment allow organizations to achieve?
      • Which technologies combine to make thin wafer processing and dicing equipment a critical organizational asset?
      • What are the key benefits of the thin wafer processing and dicing equipment market report?
      • Which niches should companies associated with recent improvements establish a presence in? 

Key Market Segments

Segments Sub-segments
Equipment Type
  • Thinning Equipment
  • Dicing Equipment
Wafer Thickness
  • 750 micrometers
  • 120 micrometers
  • 50 micrometers
Wafer Size
  • Less Than 4 Inch
  • 5 Inch
  • 6 Inch
  • 8 Inch
Application
  • Memory and Logic
  • MEMS Devices
  • Power Devices
  • Others
Dicing Technology
  • Blade Dicing
  • Laser Dicing
  • Stealth Dicing
  • Plasma Dicing
By Region
  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Spain
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • Australia
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
 
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