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Wafer Fab Equipment Market by Node Size (7 nm and below, 10 nm, 14 nm, 22 nm, 32 nm, 45 nm, and 65 nm and above), by Fabrication Process (Front-end-of-line Processing and Back-end-of-line Processing), and by End-User (Foundry, Memory, and Integrated Device Manufacturer) - Global Opportunity Analysis and Industry Forecast, 2019-2026
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SE_183851
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Pages: NA
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Jul 2019 |
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Semiconductor wafer fabrication is defined as process for production of photonic and electrical circuits, which include LEDs, Radio Frequency Amplifiers (RFA), and optical computer components. Wafer fabrication helps in building components with required electrical structures. Wafer fabrication process is conducted for processing raw wafers to finished chips (discrete or integrated circuits). Traditional wafer fabrication process involves individual steps for resistors, transistors, conductors, and other electronic components processing on the semiconductor wafer. Semiconductor equipment plays a vital role in integrated circuit (IC) manufacturing, located in fab, a manufacturing facility. Thus, semiconductor wafer fabrication is used to create circuits, which are used in electronic and electrical devices.
Growth in demand from consumer electronics industry and increase in technological advancements in telecom and semiconductor sector are expected to contribute to the growth of the wafer fab equipment market. However, factors such as requirement of very specific raw materials, state-of-art machinery requirement, and huge investment restraint the growth of the market.
The market for wafer fab equipment is segmented into node size, end-user, and geography. By node size, it is classified into 7 nm and below, 10 nm, 14 nm, 22 nm, 32 nm, 45 nm, and 65 nm and above. By end user, it is divided into foundry, memory, and integrated device manufacturer (IDM). By geography, it is analyzed across North-America, Europe, Asia-Pacific, and LAMEA.
The key players mentioned in the report are Applied Materials, Inc., ASML, Dainippon Screen Manufacturing Co. Ltd., Hitachi Kokusai Electronic Inc., KLA-Tencor Corporation, Lam Research Corporation, Motorola Solutions, Inc., Nikon Corporation, Taiwan Semiconductor Manufacturing Company Limited, and Tokyo Electron Limited.
Key Benefits
- This report provides an extensive analysis of the current and emerging market trends and dynamics of the global wafer fab equipment market.
- In-depth analysis is conducted by constructing market estimations for the key market segments between 2017 and 2023.
- Exhaustive analysis of the market by node size helps understand the technologies that are currently used along with the variants that are expected to gain prominence in the future.
- Competitive intelligence helps understand the competitive scenario across the geographies as well as among the players.
Wafer Fab Equipment Market Key Segmentation:
By Node Size
- 7 nm and below
- 10 nm
- 14 nm
- 22 nm
- 32 nm
- 45 nm
- 65 nm and above
By Fabrication Process
- Front-end-of-line Processing
- Back-end-of-line Processing
By End-user
- Foundry
- Memory
- Integrated Device Manufacturer (IDM)
By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Russia
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- Australia
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Players
- Applied Materials, Inc
- ASML
- Dainippon Screen Manufacturing Co. Ltd.
- Hitachi Kokusai Electronic Inc
- KLA-Tencor Corporation
- Lam Research Corporation
- Motorola Solutions, Inc
- Nikon Corporation
- Taiwan Semiconductor Manufacturing Company Limited
- Tokyo Electron Limited
1. INTRODUCTION
1.1. Report description
1.2. Key benefits
1.3. Key market segments
1.4. Research methodology
1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tool & model
2.EXECUTIVE SUMMARY
2.1. CXO perspective
3. MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top factors impacting the market
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. Porter’s five force analysis
3.4. Market share analysis, 2016
3.5. Market dynamics
3.5.1. Drivers
3.5.2. Restraints
3.5.3. Opportunities
4. GLOBAL WAFER FAB EQUIPMENT MARKET, BY NODE SIZE, 2017-2023 ($MILLION)
4.1. Market overview
4.2. 7nm and below
4.2.1. Key market trends
4.2.2. Key growth factors and opportunities
4.2.3. Market size and forecast
4.3. 10-14 nm
4.3.1. Key market trends
4.3.2. Key growth factors and opportunities
4.3.3. Market size and forecast
4.4. 15-21 nm
4.4.1. Key market trends
4.4.2. Key growth factors and opportunities
4.4.3. Market size and forecast
4.5. 22-32 nm
4.5.1. Key market trends
4.5.2. Key growth factors and opportunities
4.5.3. Market size and forecast
4.6. 45nm and above
4.6.1. Key market trends
4.6.2. Key growth factors and opportunities
4.6.3. Market size and forecast
5. GLOBAL WAFER FAB EQUIPMENT MARKET, BY END-USER, 2017-2023 ($MILLION)
5.1. Market overview
5.2. Foundry
5.2.1. Key market trends
5.2.2. Key growth factors and opportunities
5.2.3. Market size and forecast
5.2.4. Acoustic
5.2.5. Optical
5.2.6. Other sensors
5.3. Memory
5.3.1. Key market trends
5.3.2. Key growth factors and opportunities
5.3.3. Market size and forecast
5.4. Integrated device manufacturer (IDM)
5.4.1. Key market trends
5.4.2. Key growth factors and opportunities
5.4.3. Market size and forecast
6. GLOBAL WAFER FAB EQUIPMENT MARKET, BY REGION, 2017-2023 ($MILLION)
6.1. Market overview
6.2. North America
6.2.1. Key market trends
6.2.2. Key growth factors and opportunities
6.2.3. Market size and forecast by
6.2.3.1. Node size
6.2.3.2. End-user
6.2.3.3. Country
6.2.3.3.1. U.S.
6.2.3.3.1.1. Market size and forecast, by node size
6.2.3.3.1.2. Market size and forecast, by end-user
6.2.3.3.2. Canada
6.2.3.3.2.1. Market size and forecast, by node size
6.2.3.3.2.2. Market size and forecast, by end-user
6.2.3.3.3. Mexico
6.2.3.3.3.1. Market size and forecast, by node size
6.2.3.3.3.2. Market size and forecast, by end-user
6.3. Europe
6.3.1. Key market trends
6.3.2. Key growth factors and opportunities
6.3.3. Market size and forecast by
6.3.3.1. Node size
6.3.3.2. End-user
6.3.3.3. Country
6.3.3.3.1. UK
6.3.3.3.1.1. Market size and forecast, by node size
6.3.3.3.1.2. Market size and forecast, by end-user
6.3.3.3.2. Germany
6.3.3.3.2.1. Market size and forecast, by node size
6.3.3.3.2.2. Market size and forecast, by end-user
6.3.3.3.3. France
6.3.3.3.3.1. Market size and forecast, by node size
6.3.3.3.3.2. Market size and forecast, by end-user
6.3.3.3.4. Russia
6.3.3.3.4.1. Market size and forecast, by node size
6.3.3.3.4.2. Market size and forecast, by end-user
6.3.3.3.5. Rest of Europe
6.3.3.3.5.1. Market size and forecast, by node size
6.3.3.3.5.2. Market size and forecast, by end-user
6.4. Asia-Pacific
6.4.1. Key market trends
6.4.2. Key growth factors and opportunities
6.4.3. Market size and forecast by
6.4.3.1. Node size
6.4.3.2. End-user
6.4.3.3. Country
6.4.3.3.1. China
6.4.3.3.1.1. Market size and forecast, by node size
6.4.3.3.1.2. Market size and forecast, by end-user
6.4.3.3.2. India
6.4.3.3.2.1. Market size and forecast, by node size
6.4.3.3.2.2. Market size and forecast, by end-user
6.4.3.3.3. Japan
6.4.3.3.3.1. Market size and forecast, by node size
6.4.3.3.3.2. Market size and forecast, by end-user
6.4.3.3.4. South Korea
6.4.3.3.4.1. Market size and forecast, by node size
6.4.3.3.4.2. Market size and forecast, by end-user
6.4.3.3.5. Rest of Asia-Pacific
6.4.3.3.5.1. Market size and forecast, by node size
6.4.3.3.5.2. Market size and forecast, by end-user
6.5. LAMEA
6.5.1. Key market trends
6.5.2. Key growth factors and opportunities
6.5.3. Market size and forecast by
6.5.3.1. Node size
6.5.3.2. End-user
6.5.3.3. Country
6.5.3.3.1. Latin America
6.5.3.3.1.1. Market size and forecast, by node size
6.5.3.3.1.2. Market size and forecast, by end-user
6.5.3.3.2. Middle East
6.5.3.3.2.1. Market size and forecast, by node size
6.5.3.3.2.2. Market size and forecast, by end-user
6.5.3.3.3. Africa
6.5.3.3.3.1. Market size and forecast, by node size
6.5.3.3.3.2. Market size and forecast, by end-user
7. COMPANY PROFILES
7.1. Applied Materials, Inc
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Business performance
7.1.4. Operating business segments 7.1.5. Key strategies and developments
7.2. Dainippon Screen Manufacturing Co. Ltd.
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Business performance
7.2.4. Operating business segments
7.2.5. Key strategies and developments
7.3. Hitachi Kokusai Electronic Inc
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Business performance
7.3.4. Operating business segments
7.3.5. Key strategies and developments
7.4. ASML
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Business performance
7.4.4. Operating business segments
7.4.5. Key strategies and developments
7.5. KLA-Tencor Corporation
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Business performance
7.5.4. Operating business segments
7.5.5. Key strategies and developments
7.6. Lam Research Corporation
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Business performance
7.6.4. Operating business segments
7.6.5. Key strategies and developments
7.7. Nikon Corporation
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Business performance
7.7.4. Operating business segments
7.7.5. Key strategies and developments
7.8. Motorola Solutions, Inc
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Business performance
7.8.4. Operating business segments
7.8.5. Key strategies and developments
7.9. Taiwan Semiconductor Manufacturing Company Limited
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Business performance
7.9.4. Operating business segments
7.9.5. Key strategies and developments
7.10. Tokyo Electron Limited
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Business performance
7.10.4. Operating business segments
7.10.5. Key strategies and developments
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