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2022
Wafer Level Packaging Market

Wafer Level Packaging Market

by Technology (Fan in wafer level packaging, Fan out wafer level packaging), by Type (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others), by End User (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030
Update Available On-Demand

SE : Semiconductors
✷  Report Code: A01367
Apr 2022 | Pages: 315
Tables: 143
Charts: 59

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Wafer Level Packaging Market Research, 2030

The global wafer level packaging market size was valued at $4.5 billion in 2020, and is projected to reach $23.6 billion by 2030, growing at a CAGR of 18.8% from 2021 to 2030. Wafer level packaging (WLP) is a method of attaching packaging components to an integrated circuit (IC) prior to dicing the wafer. This procedure varies from a traditional method, which involve slicing the wafer into separate circuits (dice) before attaching the packaging components.

The automotive segment has been negatively impacted by the COVID-19 pandemic outbreak.

Wafer Level Packaging Market, Wafer Level Packaging Industry, Wafer Level Packaging market Size, Wafer Level Packaging market Share, Wafer Level Packaging market Growth, Wafer Level Packaging market Trends, Wafer Level Packaging market Analysis, Wafer Level Packaging market Forecast, Wafer Level Packaging market Opportunity, Wafer Level Packaging market Outlook

Growth of the global wafer level packaging industry is anticipated to be driven by factors such as rise in adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the market growth. However, complexities in manufacturing process act as major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.

Wafer Level Packaging Market

The wafer level packaging market is segmented into Technology, Type and End User. By technology, the market is classified into fan in wafer level packaging and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, the market is divided into consumer electronics, IT & telecommunication, automotive, healthcare, and others.

Wafer Level Packaging Market

By region, the wafer level packaging market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the wafer level packaging market in 2020, and is projected to register significant growth rate during the forecast period,owing to growth in the automotive segment. Furthermore, Asia-Pacific is expected to witness significant growth by the end of the forecast period, followed by LAMEA.

Wafer Level Packaging Market

Leading wafer level packaging industry manufacturers such as Applied Materials Inc, Qualcomm Technologies Inc, Amkor Technology Inc, and Jiangsu Changjiang Electronics Technology Co Ltd are focused on their investments on technologically advanced, cost-effective, and more secure products & solutions for various applications. Also, In semiconductor advance packaging sector wlcsp package, wlcsp process flow, and wafer chip scale package are in the latest trends.

TOP IMPACTING FACTORS

The prominent factors that impact the wafer level packaging market growth include rapid development in the semiconductor industry, high adoption of consumer electronics devices, and increase in demand for ultra-thin wafers. In addition,surge in Internet of Things (IoT) technologyfuels the market growth. However, high initial investment restricts the market growth. On the contrary, rise in investment in wafer fabrication equipment and materialsis expected to create lucrative opportunities for the market.

COMPETITION ANALYSIS

Competitive analysis and profiles of the major wafer level packaging market playerssuch asAmkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation have been covered in the report.

 

COVID-19 IMPACT ANALYSIS

The outbreak of COVID-19 has significantly affected the electronics and semiconductor sector. Business and manufacturing units across various countries were closed in 2021, owing to rise in number of COVID-19 cases, and are expected to remain closed in second quarter of 2022. Furthermore, partial or complete lockdown disrupted global supply chain posing challenges for manufactures to reach customers.

The COVID-19 pandemic impacted the society and overall economy across the globe. The impact of this outbreak has grown day-by-day as well as affected the overall business globally. The crisis has created uncertainty in the stock market and has resulted in falling business confidence, massive slow down of supply chain, and increased panic among customers.

Asian and European countries under lockdowns suffered major loss of business and revenue, owing to shutdown of manufacturing units. Operations of the production and manufacturing industries were heavily impacted by the outbreak of the COVID-19 disease, which further impacted growth of the wafer level packaging market outlook.

In addition, the COVID-19 pandemic has impacted the electronics sector as production facilities stalled and closed, which, in turn, boosted demand for electronics and semiconductor products in these industries. Its major impact includes a large manufacturing interruption across Europe and interruption in Chinese parts exports, which hinder the wafer level packaging market opportunity. It is expected that the demand for new and innovative products could surge once the economy begins to recover. Companies are looking forward to invest in next-generation products using new technologies, as it is expected to boost its goodwill, once customer demand surges.

KEY BENEFITS FOR STAKEHOLDERS

  • This study comprises analytical depiction of the global wafer level packaging market size along with current trends and future estimations to depict imminent investment pockets.
  • The overall wafer level packaging market analysis is determined to understand the profitable trends to gain a stronger foothold.
  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current wafer level packaging market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and the wafer level packaging market share of key vendors.
  • The report includes the market trends and the market share of key vendors.

 Wafer Level Packaging Market Report Highlights

Aspects Details
By Technology
  • Fan in wafer level packaging
  • Fan out wafer level packaging
By Type
  • 3D TSV WLP
  • 2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others
By End User
  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Others
By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (U.K., Germany, France, Rest of Europe)
  • Asia-Pacific  (China, Japan, Taiwan, India, South Korea, Rest of Asia-Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players Amkor Technology, Inc., Deca Technologies, Lam Research Corporation, ASML Holding N.V, Tokyo Electron Ltd., Applied Materials, Inc., Fujitsu, Toshiba Corporation, Qualcomm Technologies, Inc., Jiangsu Changjiang Electronics Technology Co. Ltd
 

  • CHAPTER 1:INTRODUCTION

    • 1.1.Report description

    • 1.2.Key market segments

    • 1.3.Key benefits to the stakeholders

    • 1.4.Research Methodology

      • 1.4.1.Secondary research

      • 1.4.2.Primary research

      • 1.4.3.Analyst tools and models

  • CHAPTER 2:EXECUTIVE SUMMARY

    • 2.1.Key findings of the study

    • 2.2.CXO Perspective

  • CHAPTER 3:MARKET OVERVIEW

    • 3.1.Market definition and scope

    • 3.2.Key findings

      • 3.2.1.Top investment pockets

    • 3.3.Porter’s five forces analysis

    • 3.4.Top player positioning

    • 3.5.Market dynamics

      • 3.5.1.Drivers

      • 3.5.2.Restraints

      • 3.5.3.Opportunities

    • 3.6.COVID-19 Impact Analysis on the market

  • CHAPTER 4: WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY

    • 4.1 Overview

      • 4.1.1 Market size and forecast

    • 4.2 Fan in wafer level packaging

      • 4.2.1 Key market trends, growth factors and opportunities

      • 4.2.2 Market size and forecast, by region

      • 4.2.3 Market analysis by country

    • 4.3 Fan out wafer level packaging

      • 4.3.1 Key market trends, growth factors and opportunities

      • 4.3.2 Market size and forecast, by region

      • 4.3.3 Market analysis by country

  • CHAPTER 5: WAFER LEVEL PACKAGING MARKET, BY TYPE

    • 5.1 Overview

      • 5.1.1 Market size and forecast

    • 5.2 3D TSV WLP

      • 5.2.1 Key market trends, growth factors and opportunities

      • 5.2.2 Market size and forecast, by region

      • 5.2.3 Market analysis by country

    • 5.3 2.5D TSV WLP

      • 5.3.1 Key market trends, growth factors and opportunities

      • 5.3.2 Market size and forecast, by region

      • 5.3.3 Market analysis by country

    • 5.4 WLCSP

      • 5.4.1 Key market trends, growth factors and opportunities

      • 5.4.2 Market size and forecast, by region

      • 5.4.3 Market analysis by country

    • 5.5 Nano WLP

      • 5.5.1 Key market trends, growth factors and opportunities

      • 5.5.2 Market size and forecast, by region

      • 5.5.3 Market analysis by country

    • 5.6 Others

      • 5.6.1 Key market trends, growth factors and opportunities

      • 5.6.2 Market size and forecast, by region

      • 5.6.3 Market analysis by country

  • CHAPTER 6: WAFER LEVEL PACKAGING MARKET, BY END USER

    • 6.1 Overview

      • 6.1.1 Market size and forecast

    • 6.2 Consumer Electronics

      • 6.2.1 Key market trends, growth factors and opportunities

      • 6.2.2 Market size and forecast, by region

      • 6.2.3 Market analysis by country

    • 6.3 IT and Telecommunication

      • 6.3.1 Key market trends, growth factors and opportunities

      • 6.3.2 Market size and forecast, by region

      • 6.3.3 Market analysis by country

    • 6.4 Automotive

      • 6.4.1 Key market trends, growth factors and opportunities

      • 6.4.2 Market size and forecast, by region

      • 6.4.3 Market analysis by country

    • 6.5 Healthcare

      • 6.5.1 Key market trends, growth factors and opportunities

      • 6.5.2 Market size and forecast, by region

      • 6.5.3 Market analysis by country

    • 6.6 Others

      • 6.6.1 Key market trends, growth factors and opportunities

      • 6.6.2 Market size and forecast, by region

      • 6.6.3 Market analysis by country

  • CHAPTER 7: WAFER LEVEL PACKAGING MARKET, BY REGION

    • 7.1 Overview

      • 7.1.1 Market size and forecast

    • 7.2 North America

      • 7.2.1 Key trends and opportunities

      • 7.2.2 North America Market size and forecast, by Technology

      • 7.2.3 North America Market size and forecast, by Type

      • 7.2.4 North America Market size and forecast, by End User

      • 7.2.5 North America Market size and forecast, by country

        • 7.2.5.1 U.S.
          • 7.2.5.1.1 Market size and forecast, by Technology
          • 7.2.5.1.2 Market size and forecast, by Type
          • 7.2.5.1.3 Market size and forecast, by End User
        • 7.2.5.2 Canada
          • 7.2.5.2.1 Market size and forecast, by Technology
          • 7.2.5.2.2 Market size and forecast, by Type
          • 7.2.5.2.3 Market size and forecast, by End User
        • 7.2.5.3 Mexico
          • 7.2.5.3.1 Market size and forecast, by Technology
          • 7.2.5.3.2 Market size and forecast, by Type
          • 7.2.5.3.3 Market size and forecast, by End User

    • 7.3 Europe

      • 7.3.1 Key trends and opportunities

      • 7.3.2 Europe Market size and forecast, by Technology

      • 7.3.3 Europe Market size and forecast, by Type

      • 7.3.4 Europe Market size and forecast, by End User

      • 7.3.5 Europe Market size and forecast, by country

        • 7.3.5.1 U.K.
          • 7.3.5.1.1 Market size and forecast, by Technology
          • 7.3.5.1.2 Market size and forecast, by Type
          • 7.3.5.1.3 Market size and forecast, by End User
        • 7.3.5.2 Germany
          • 7.3.5.2.1 Market size and forecast, by Technology
          • 7.3.5.2.2 Market size and forecast, by Type
          • 7.3.5.2.3 Market size and forecast, by End User
        • 7.3.5.3 France
          • 7.3.5.3.1 Market size and forecast, by Technology
          • 7.3.5.3.2 Market size and forecast, by Type
          • 7.3.5.3.3 Market size and forecast, by End User
        • 7.3.5.4 Rest of Europe
          • 7.3.5.4.1 Market size and forecast, by Technology
          • 7.3.5.4.2 Market size and forecast, by Type
          • 7.3.5.4.3 Market size and forecast, by End User

    • 7.4 Asia-Pacific

      • 7.4.1 Key trends and opportunities

      • 7.4.2 Asia-Pacific Market size and forecast, by Technology

      • 7.4.3 Asia-Pacific Market size and forecast, by Type

      • 7.4.4 Asia-Pacific Market size and forecast, by End User

      • 7.4.5 Asia-Pacific Market size and forecast, by country

        • 7.4.5.1 China
          • 7.4.5.1.1 Market size and forecast, by Technology
          • 7.4.5.1.2 Market size and forecast, by Type
          • 7.4.5.1.3 Market size and forecast, by End User
        • 7.4.5.2 Japan
          • 7.4.5.2.1 Market size and forecast, by Technology
          • 7.4.5.2.2 Market size and forecast, by Type
          • 7.4.5.2.3 Market size and forecast, by End User
        • 7.4.5.3 Taiwan
          • 7.4.5.3.1 Market size and forecast, by Technology
          • 7.4.5.3.2 Market size and forecast, by Type
          • 7.4.5.3.3 Market size and forecast, by End User
        • 7.4.5.4 India
          • 7.4.5.4.1 Market size and forecast, by Technology
          • 7.4.5.4.2 Market size and forecast, by Type
          • 7.4.5.4.3 Market size and forecast, by End User
        • 7.4.5.5 South Korea
          • 7.4.5.5.1 Market size and forecast, by Technology
          • 7.4.5.5.2 Market size and forecast, by Type
          • 7.4.5.5.3 Market size and forecast, by End User
        • 7.4.5.6 Rest of Asia-Pacific
          • 7.4.5.6.1 Market size and forecast, by Technology
          • 7.4.5.6.2 Market size and forecast, by Type
          • 7.4.5.6.3 Market size and forecast, by End User

    • 7.5 LAMEA

      • 7.5.1 Key trends and opportunities

      • 7.5.2 LAMEA Market size and forecast, by Technology

      • 7.5.3 LAMEA Market size and forecast, by Type

      • 7.5.4 LAMEA Market size and forecast, by End User

      • 7.5.5 LAMEA Market size and forecast, by country

        • 7.5.5.1 Latin America
          • 7.5.5.1.1 Market size and forecast, by Technology
          • 7.5.5.1.2 Market size and forecast, by Type
          • 7.5.5.1.3 Market size and forecast, by End User
        • 7.5.5.2 Middle East
          • 7.5.5.2.1 Market size and forecast, by Technology
          • 7.5.5.2.2 Market size and forecast, by Type
          • 7.5.5.2.3 Market size and forecast, by End User
        • 7.5.5.3 Africa
          • 7.5.5.3.1 Market size and forecast, by Technology
          • 7.5.5.3.2 Market size and forecast, by Type
          • 7.5.5.3.3 Market size and forecast, by End User

  • CHAPTER 8: COMPANY LANDSCAPE

    • 8.1. Introduction

    • 8.2. Top winning strategies

    • 8.3. Product Mapping of Top 10 Player

    • 8.4. Competitive Dashboard

    • 8.5. Competitive Heatmap

    • 8.6. Key developments

  • CHAPTER 9: COMPANY PROFILES

    • 9.1 Amkor Technology, Inc.

      • 9.1.1 Company overview

      • 9.1.2 Company snapshot

      • 9.1.3 Operating business segments

      • 9.1.4 Product portfolio

      • 9.1.5 Business performance

      • 9.1.6 Key strategic moves and developments

    • 9.2 Fujitsu

      • 9.2.1 Company overview

      • 9.2.2 Company snapshot

      • 9.2.3 Operating business segments

      • 9.2.4 Product portfolio

      • 9.2.5 Business performance

      • 9.2.6 Key strategic moves and developments

    • 9.3 Jiangsu Changjiang Electronics Technology Co. Ltd

      • 9.3.1 Company overview

      • 9.3.2 Company snapshot

      • 9.3.3 Operating business segments

      • 9.3.4 Product portfolio

      • 9.3.5 Business performance

      • 9.3.6 Key strategic moves and developments

    • 9.4 Deca Technologies

      • 9.4.1 Company overview

      • 9.4.2 Company snapshot

      • 9.4.3 Operating business segments

      • 9.4.4 Product portfolio

      • 9.4.5 Business performance

      • 9.4.6 Key strategic moves and developments

    • 9.5 Qualcomm Technologies, Inc.

      • 9.5.1 Company overview

      • 9.5.2 Company snapshot

      • 9.5.3 Operating business segments

      • 9.5.4 Product portfolio

      • 9.5.5 Business performance

      • 9.5.6 Key strategic moves and developments

    • 9.6 Toshiba Corporation

      • 9.6.1 Company overview

      • 9.6.2 Company snapshot

      • 9.6.3 Operating business segments

      • 9.6.4 Product portfolio

      • 9.6.5 Business performance

      • 9.6.6 Key strategic moves and developments

    • 9.7 Tokyo Electron Ltd.

      • 9.7.1 Company overview

      • 9.7.2 Company snapshot

      • 9.7.3 Operating business segments

      • 9.7.4 Product portfolio

      • 9.7.5 Business performance

      • 9.7.6 Key strategic moves and developments

    • 9.8 Applied Materials, Inc.

      • 9.8.1 Company overview

      • 9.8.2 Company snapshot

      • 9.8.3 Operating business segments

      • 9.8.4 Product portfolio

      • 9.8.5 Business performance

      • 9.8.6 Key strategic moves and developments

    • 9.9 ASML Holding N.V

      • 9.9.1 Company overview

      • 9.9.2 Company snapshot

      • 9.9.3 Operating business segments

      • 9.9.4 Product portfolio

      • 9.9.5 Business performance

      • 9.9.6 Key strategic moves and developments

    • 9.10 Lam Research Corporation

      • 9.10.1 Company overview

      • 9.10.2 Company snapshot

      • 9.10.3 Operating business segments

      • 9.10.4 Product portfolio

      • 9.10.5 Business performance

      • 9.10.6 Key strategic moves and developments

  • LIST OF TABLES

  • TABLE 1. GLOBAL WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
    TABLE 2. WAFER LEVEL PACKAGING MARKET REVENUE, FOR FAN IN WAFER LEVEL PACKAGING, BY REGION , 2020-2030,($MILLION)
    TABLE 3. WAFER LEVEL PACKAGING MARKET FAN IN WAFER LEVEL PACKAGING BY COUNTRY, 2020-2030,($MILLION)
    TABLE 4. WAFER LEVEL PACKAGING MARKET REVENUE, FOR FAN OUT WAFER LEVEL PACKAGING, BY REGION , 2020-2030,($MILLION)
    TABLE 5. WAFER LEVEL PACKAGING MARKET FAN OUT WAFER LEVEL PACKAGING BY COUNTRY, 2020-2030,($MILLION)
    TABLE 6. GLOBAL WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
    TABLE 7. WAFER LEVEL PACKAGING MARKET REVENUE, FOR 3D TSV WLP, BY REGION , 2020-2030,($MILLION)
    TABLE 8. WAFER LEVEL PACKAGING MARKET 3D TSV WLP BY COUNTRY, 2020-2030,($MILLION)
    TABLE 9. WAFER LEVEL PACKAGING MARKET REVENUE, FOR 2.5D TSV WLP, BY REGION , 2020-2030,($MILLION)
    TABLE 10. WAFER LEVEL PACKAGING MARKET 2.5D TSV WLP BY COUNTRY, 2020-2030,($MILLION)
    TABLE 11. WAFER LEVEL PACKAGING MARKET REVENUE, FOR WLCSP, BY REGION , 2020-2030,($MILLION)
    TABLE 12. WAFER LEVEL PACKAGING MARKET WLCSP BY COUNTRY, 2020-2030,($MILLION)
    TABLE 13. WAFER LEVEL PACKAGING MARKET REVENUE, FOR NANO WLP, BY REGION , 2020-2030,($MILLION)
    TABLE 14. WAFER LEVEL PACKAGING MARKET NANO WLP BY COUNTRY, 2020-2030,($MILLION)
    TABLE 15. WAFER LEVEL PACKAGING MARKET REVENUE, FOR OTHERS, BY REGION , 2020-2030,($MILLION)
    TABLE 16. WAFER LEVEL PACKAGING MARKET OTHERS BY COUNTRY, 2020-2030,($MILLION)
    TABLE 17. GLOBAL WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
    TABLE 18. WAFER LEVEL PACKAGING MARKET REVENUE, FOR CONSUMER ELECTRONICS, BY REGION , 2020-2030,($MILLION)
    TABLE 19. WAFER LEVEL PACKAGING MARKET CONSUMER ELECTRONICS BY COUNTRY, 2020-2030,($MILLION)
    TABLE 20. WAFER LEVEL PACKAGING MARKET REVENUE, FOR IT AND TELECOMMUNICATION, BY REGION , 2020-2030,($MILLION)
    TABLE 21. WAFER LEVEL PACKAGING MARKET IT AND TELECOMMUNICATION BY COUNTRY, 2020-2030,($MILLION)
    TABLE 22. WAFER LEVEL PACKAGING MARKET REVENUE, FOR AUTOMOTIVE, BY REGION , 2020-2030,($MILLION)
    TABLE 23. WAFER LEVEL PACKAGING MARKET AUTOMOTIVE BY COUNTRY, 2020-2030,($MILLION)
    TABLE 24. WAFER LEVEL PACKAGING MARKET REVENUE, FOR HEALTHCARE, BY REGION , 2020-2030,($MILLION)
    TABLE 25. WAFER LEVEL PACKAGING MARKET HEALTHCARE BY COUNTRY, 2020-2030,($MILLION)
    TABLE 26. WAFER LEVEL PACKAGING MARKET REVENUE, FOR OTHERS, BY REGION , 2020-2030,($MILLION)
    TABLE 27. WAFER LEVEL PACKAGING MARKET OTHERS BY COUNTRY, 2020-2030,($MILLION)
    TABLE 28. WAFER LEVEL PACKAGING MARKET, BY REGION, 2020-2030,($MILLION)
    TABLE 29. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
    TABLE 30. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
    TABLE 31. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
    TABLE 32. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
    TABLE 33. U.S. WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 34. U.S. WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 35. U.S. WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 36. CANADA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 37. CANADA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 38. CANADA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 39. MEXICO WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 40. MEXICO WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 41. MEXICO WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 42. EUROPE WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
    TABLE 43. EUROPE WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
    TABLE 44. EUROPE WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
    TABLE 45. EUROPE WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
    TABLE 46. U.K. WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 47. U.K. WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 48. U.K. WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 49. GERMANY WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 50. GERMANY WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 51. GERMANY WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 52. FRANCE WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 53. FRANCE WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 54. FRANCE WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 55. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 56. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 57. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 58. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
    TABLE 59. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
    TABLE 60. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
    TABLE 61. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
    TABLE 62. CHINA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 63. CHINA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 64. CHINA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 65. JAPAN WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 66. JAPAN WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 67. JAPAN WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 68. TAIWAN WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 69. TAIWAN WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 70. TAIWAN WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 71. INDIA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 72. INDIA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 73. INDIA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 74. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 75. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 76. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 77. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 78. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 79. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 80. LAMEA WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
    TABLE 81. LAMEA WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
    TABLE 82. LAMEA WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
    TABLE 83. LAMEA WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
    TABLE 84. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 85. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 86. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 87. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 88. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 89. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 90. AFRICA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
    TABLE 91. AFRICA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
    TABLE 92. AFRICA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
    TABLE 93.AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
    TABLE 94.AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
    TABLE 95.AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO
    TABLE 96.AMKOR TECHNOLOGY, INC.: NET SALES,
    TABLE 97.AMKOR TECHNOLOGY, INC.: KEY STRATERGIES
    TABLE 98.FUJITSU: COMPANY SNAPSHOT
    TABLE 99.FUJITSU: OPERATING SEGMENTS
    TABLE 100.FUJITSU: PRODUCT PORTFOLIO
    TABLE 101.FUJITSU: NET SALES,
    TABLE 102.FUJITSU: KEY STRATERGIES
    TABLE 103.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: COMPANY SNAPSHOT
    TABLE 104.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: OPERATING SEGMENTS
    TABLE 105.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: PRODUCT PORTFOLIO
    TABLE 106.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: NET SALES,
    TABLE 107.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: KEY STRATERGIES
    TABLE 108.DECA TECHNOLOGIES: COMPANY SNAPSHOT
    TABLE 109.DECA TECHNOLOGIES: OPERATING SEGMENTS
    TABLE 110.DECA TECHNOLOGIES: PRODUCT PORTFOLIO
    TABLE 111.DECA TECHNOLOGIES: NET SALES,
    TABLE 112.DECA TECHNOLOGIES: KEY STRATERGIES
    TABLE 113.QUALCOMM TECHNOLOGIES, INC.: COMPANY SNAPSHOT
    TABLE 114.QUALCOMM TECHNOLOGIES, INC.: OPERATING SEGMENTS
    TABLE 115.QUALCOMM TECHNOLOGIES, INC.: PRODUCT PORTFOLIO
    TABLE 116.QUALCOMM TECHNOLOGIES, INC.: NET SALES,
    TABLE 117.QUALCOMM TECHNOLOGIES, INC.: KEY STRATERGIES
    TABLE 118.TOSHIBA CORPORATION: COMPANY SNAPSHOT
    TABLE 119.TOSHIBA CORPORATION: OPERATING SEGMENTS
    TABLE 120.TOSHIBA CORPORATION: PRODUCT PORTFOLIO
    TABLE 121.TOSHIBA CORPORATION: NET SALES,
    TABLE 122.TOSHIBA CORPORATION: KEY STRATERGIES
    TABLE 123.TOKYO ELECTRON LTD.: COMPANY SNAPSHOT
    TABLE 124.TOKYO ELECTRON LTD.: OPERATING SEGMENTS
    TABLE 125.TOKYO ELECTRON LTD.: PRODUCT PORTFOLIO
    TABLE 126.TOKYO ELECTRON LTD.: NET SALES,
    TABLE 127.TOKYO ELECTRON LTD.: KEY STRATERGIES
    TABLE 128.APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
    TABLE 129.APPLIED MATERIALS, INC.: OPERATING SEGMENTS
    TABLE 130.APPLIED MATERIALS, INC.: PRODUCT PORTFOLIO
    TABLE 131.APPLIED MATERIALS, INC.: NET SALES,
    TABLE 132.APPLIED MATERIALS, INC.: KEY STRATERGIES
    TABLE 133.ASML HOLDING N.V: COMPANY SNAPSHOT
    TABLE 134.ASML HOLDING N.V: OPERATING SEGMENTS
    TABLE 135.ASML HOLDING N.V: PRODUCT PORTFOLIO
    TABLE 136.ASML HOLDING N.V: NET SALES,
    TABLE 137.ASML HOLDING N.V: KEY STRATERGIES
    TABLE 138.LAM RESEARCH CORPORATION: COMPANY SNAPSHOT
    TABLE 139.LAM RESEARCH CORPORATION: OPERATING SEGMENTS
    TABLE 140.LAM RESEARCH CORPORATION: PRODUCT PORTFOLIO
    TABLE 141.LAM RESEARCH CORPORATION: NET SALES,
    TABLE 142.LAM RESEARCH CORPORATION: KEY STRATERGIES

  • LIST OF FIGURES

  • FIGURE 1.WAFER LEVEL PACKAGING MARKET SEGMENTATION
    FIGURE 2.WAFER LEVEL PACKAGING MARKET,2020-2030
    FIGURE 3.WAFER LEVEL PACKAGING MARKET,2020-2030
    FIGURE 4. TOP INVESTMENT POCKETS, BY REGION
    FIGURE 5.PORTER FIVE-1
    FIGURE 6.PORTER FIVE-2
    FIGURE 7.PORTER FIVE-3
    FIGURE 8.PORTER FIVE-4
    FIGURE 9.PORTER FIVE-5
    FIGURE 10.TOP PLAYER POSITIONING
    FIGURE 11.WAFER LEVEL PACKAGING MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
    FIGURE 12.WAFER LEVEL PACKAGING MARKET,BY TECHNOLOGY,2020(%)
    FIGURE 13.COMPARATIVE SHARE ANALYSIS OF FAN IN WAFER LEVEL PACKAGING WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 14.COMPARATIVE SHARE ANALYSIS OF FAN OUT WAFER LEVEL PACKAGING WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 15.WAFER LEVEL PACKAGING MARKET,BY TYPE,2020(%)
    FIGURE 16.COMPARATIVE SHARE ANALYSIS OF 3D TSV WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 17.COMPARATIVE SHARE ANALYSIS OF 2.5D TSV WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 18.COMPARATIVE SHARE ANALYSIS OF WLCSP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 19.COMPARATIVE SHARE ANALYSIS OF NANO WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 20.COMPARATIVE SHARE ANALYSIS OF OTHERS WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 21.WAFER LEVEL PACKAGING MARKET,BY END USER,2020(%)
    FIGURE 22.COMPARATIVE SHARE ANALYSIS OF CONSUMER ELECTRONICS WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 23.COMPARATIVE SHARE ANALYSIS OF IT AND TELECOMMUNICATION WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 24.COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 25.COMPARATIVE SHARE ANALYSIS OF HEALTHCARE WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 26.COMPARATIVE SHARE ANALYSIS OF OTHERS WAFER LEVEL PACKAGING MARKET,2020-2030(%)
    FIGURE 27.WAFER LEVEL PACKAGING MARKET BY REGION,2020
    FIGURE 28.U.S. WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 29.CANADA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 30.MEXICO WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 31.U.K. WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 32.GERMANY WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 33.FRANCE WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 34.REST OF EUROPE WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 35.CHINA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 36.JAPAN WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 37.TAIWAN WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 38.INDIA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 39.SOUTH KOREA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 40.REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 41.LATIN AMERICA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 42.MIDDLE EAST WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 43.AFRICA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
    FIGURE 44. TOP WINNING STRATEGIES, BY YEAR
    FIGURE 45. TOP WINNING STRATEGIES, BY DEVELOPMENT
    FIGURE 46. TOP WINNING STRATEGIES, BY COMPANY
    FIGURE 47.PRODUCT MAPPING OF TOP 10 PLAYERS
    FIGURE 48.COMPETITIVE DASHBOARD
    FIGURE 49.COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
    FIGURE 50.AMKOR TECHNOLOGY, INC..: NET SALES ,($MILLION)
    FIGURE 51.FUJITSU.: NET SALES ,($MILLION)
    FIGURE 52.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD.: NET SALES ,($MILLION)
    FIGURE 53.DECA TECHNOLOGIES.: NET SALES ,($MILLION)
    FIGURE 54.QUALCOMM TECHNOLOGIES, INC..: NET SALES ,($MILLION)
    FIGURE 55.TOSHIBA CORPORATION.: NET SALES ,($MILLION)
    FIGURE 56.TOKYO ELECTRON LTD..: NET SALES ,($MILLION)
    FIGURE 57.APPLIED MATERIALS, INC..: NET SALES ,($MILLION)
    FIGURE 58.ASML HOLDING N.V.: NET SALES ,($MILLION)
    FIGURE 59.LAM RESEARCH CORPORATION.: NET SALES ,($MILLION)

 
 

The global wafer level packaging market is flourishing at a rapid pace. However, high initial investment is still a concern for new entrants. Market players are generously investing in R&D activities to develop improved solutions to reduce the overall cost of wafer level packaging products. In addition, according to industry experts, it is essential to optimize affordable prices for wafer level packaging products for long-term growth.  

In November 2021, Amkor Technology Inc. announced the business expansion of advanced packaging technology capacity with a new factory setup in Bac Ninh, Vietnam. This is expected to provide a long-term investment in geographical diversification and factory capacity expansion, supporting Amkor’s commitment to reliable supply chain solutions for its customers.

Key players of the market focus on introducing technologically advanced products to remain competitive in the market. Partnership, acquisition, and product launches are expected to be the prominent strategies adopted by the market players. Asia-Pacific accounted for a major share of the market in 2020, owing to the presence of major players in the region; Also, Asia-Pacific is expected to grow at the highest CAGR, owing to rise in adoption of wafer level packaging market in a variety of fields.  

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FREQUENTLY ASKED QUESTIONS?

A. Asia-Pacific dominated the wafer level packaging market in 2020

A. The global wafer level packaging market size was valued at $4.54billion in 2020

A. asApplied Materials Inc, Qualcomm Technologies Inc, Amkor Technology Inc, and Jiangsu Changjiang Electronics Technology Co Ltd

A. It is widely used in PCB Design

A. Integration technology such as fan-in and fan-out are in the latest trend.

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