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Wafer Level Packaging Market by Integration Type (Fan-in WLP, Fan-out WLP), Packaging Technology (3D IC WLP, 2.5D IC WLP, 2D IC WLP, Nano WLP), Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping), Industry (Electronics, IT & Telecommunication, Industrial, Automotive) - Global Opportunity Analysis and Industry Forecast, 2014 - 2022

SE 161694
Pages: 214
Sep 2016 | 2187 Views
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Author's : Ayushi Bajpai, Rachna Singh
Tables: 50
Charts: 151
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Wafer Level Packaging Market Overview:

The global wafer-level packaging market size is expected to reach $7.8 billion by 2022, registering a CAGR of 21.5% from 2016‐2022. Wafer-level packaging (WLP) is used for interconnecting electronic components, such as resistors, capacitors, transistors, and others onto a single chip to make an integrated circuit, while utilizing deposited solder bumps onto the chip pads. WLP allows integration of wafer fabrication, packaging, test, and burn-in at wafer level to streamline the manufacturing process undertaken by a device. Use of WLP offers numerous advantages, such as multichip capability, increased I/O density, reduced form factor, improved electrical & mechanical performance, outstanding cost/performance capability, and opportunity for advanced 3D structures, over conventional packaging technologies such as chip scale packaging and wire-bond packaging.

The increase in demand for high-speed and compact size of electronic products has expanded the need for wafer-level packaging market. In addition, Internet of Things (IoT) has been gaining popularity, and is considered as the third wave of technology. The increasing popularity of IoT and portable electronics market is expected to foster the high growth of the wafer-level packaging industry. Moreover, WLP’s technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices acts as drivers of the market growth. However, encapsulation being a challenge for fan-out wafer-level packaging, and high initial investment functions as key constraints to the market. Growing demands of electronics market for faster, lighter, smaller, yet less expensive electronic packaging solutions with high performance acts as an opportunity for WLP market.

Factors And Their Expected Impact On Wafer Level Packaging Market

The demand for wafer-level packaging is expected to surge due to heavy investments on the R&D by many key players including Jiangsu Changjiang Electronics Technology Co. Ltd., Amkor Technology Inc.; and Fujitsu Ltd., leading to the improvement in packaging quality. For instance, in April 2016, Deca Technologies announced the signing of an agreement, whereas ASE intends to invest $60 million and license Deca’s M-Series fan-out WLP technologies and processes.

Segment Review

The wafer-level market share is segmented based on wafer-level packaging integration type, packaging technology, bumping technology, industry vertical, and geography.


Packaging Technology: 2.5/3D IC Commercial Announcements!

The extensive use of 2.5D IC packaging in wafer-level packaging can be attributed to enhanced capacity, improved performance, reduced system space requirements, and low power consumption. However, 3D IC is expected to witness a substantial growth as it is an advanced version of 2.5D IC equipped with additional advantages such as shorter interconnection length, increased signal speed, reduced power consumption, and reduced power dissipation.

Global Wafer-Level Packaging Market Scenario

The fundamental properties of wafer-level packaging make it a favourable interconnection technology for several applications. The varied applications of IoT in industry verticals, such as IT & telecommunication, electronics, automotive, industrial, and healthcare, has generated interest of the wafer-level packaging. Fan-out WLP is expected to witness the highest growth in the wafer-level packaging industry as it provides ultra-high density interconnection and can integrate multiple heterogeneous dies in a cost-effective package along with superior electrical performance. However, the technology is limited to a narrow range of applications, essentially single die packages for cell phone baseband chips. Although, demand of mobile customers for miniaturization and higher integration, while keeping costs low, drives the fan-out WLP market.

Technological Superiority of Wafer Level Packaging Over Conventional Technologies

Technological advancement in electronic packaging has delivered highly efficient and reliable electrical interconnect solutions for electronic products, driving the demand for wafer-level packaging. It is extensively understood that wafer-level packaging offers a range of advantages as compared to customary chip-scale packaging and wire-bond packaging, including the superior thermal and electrical performance, substrate flexibility for varying performance requirements, proven construction, and well-established process equipment expertise. Moreover, WLP is cost-effective and an innovative process which generates interest among the electronic product customers and drives the packaging designers to maximize package performances.

Technological Advancements Driving Factors of Wafer Level Packaging Market

Key Benefits

  • Comprehensive analysis of the global wafer-level packaging market trends, both current and future estimations, are provided
  • The report offers a competitive scenario of the market and elucidates on the growth trends, driving factors, scope, opportunities, and challenges
  • The report includes a comprehensive analysis of the key segments to provide insights on the market dynamics
  • Porter’s Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making
  • Value chain analysis provides key inputs on the role of stakeholders involved at various stages of the value chain

Wafer Level Packaging Market

 

Wafer Level Packaging Market Key Market Segmentation

The market is segmented based on integration type, packaging technology, bumping technology, industry vertical, and geography.

By Integration Type

  • Fan-in WLP
  • Fan-out WLP 

By Packaging Technology

  • 3D TSV WLP
  • 2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others ( 2D TSV WLP and Compliant WLP)

By Bumping Technology

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others (Aluminum & Conductive Polymer Bumping)

By Industry

  • Electronics
  • IT & Telecommunication
  • Industrial
  • Automotive
  • Aerospace & Defense
  • Healthcare
  • Others (Media & Entertainment and Non-Conventional Energy Resources)

By Geography

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • France
    • Germany 
    • Spain
    • UK
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China 
    • India
    • Japan 
    • South Korea 
    • Taiwan
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
 

Chapter: 1 INTRODUCTION

1.1 Report description
1.2 Key benefits
1.3 Key market segments
1.4 Research methodology

1.4.1 Secondary research
1.4.2 Primary research
1.4.3 Analyst tools and models

Chapter: 2 EXECUTIVE SUMMARY

2.1 CXO perspective

Chapter: 3 MARKET OVERVIEW

3.1 Market definition and scope
3.2 Key findings

3.2.1 Top factors impacting the market
3.2.2 Top investment pockets
3.2.3 Top winning strategies

3.3 Porters five force analysis

3.3.1 Adequate number of wafer level packaging suppliers leads to low bargaining power of suppliers
3.3.2 Ample number of suppliers leads to high bargaining power of buyers
3.3.3 Market being fully commercialized leads to low threats from the new entrants
3.3.4 Variations in the integration and packaging technology leads to high threats from quality manufacturing techniques by different companies
3.3.5 Profuse competitors lead to high rivalry

3.4 Value chain analysis
3.5 Primary findings
3.6 Market dynamics

3.6.1 Drivers

3.6.1.1 Trending Internet of Things (IoT): a submarket of the overall electronics market
3.6.1.2 Technological superiority over traditional packaging techniques
3.6.1.3 Impending need for circuit miniaturization in microelectronic devices

3.6.2 Restraints

3.6.2.1 High initial investment
3.6.2.2 Encapsulation poses a challenge for fan-out wafer level packaging

3.6.3 Opportunity

3.6.3.1 Thriving demand for small sizes, low cost, and high performance of packaging solutions

Chapter: 4 WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE

4.1 Overview
4.2 Fan-in wafer level packaging

4.2.1 Key trends
4.2.2 Key growth factors and opportunities
4.2.3 Market size and forecast

4.3 Fan-out wafer level packaging

4.3.1 Key trends
4.3.2 Key growth factors and opportunities
4.3.3 Market size and forecast

Chapter: 5 WORLD WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY

5.1 Overview
5.2 3D TSV WLP

5.2.1 Key trends
5.2.2 Key growth factors and opportunities
5.2.3 Market size and forecast

5.3 2.5D TSV WLP

5.3.1 Key trends
5.3.2 Key growth factors and opportunities
5.3.3 Market size and forecast

5.4 WLCSP

5.4.1 Key trends
5.4.2 Key growth factors and opportunities
5.4.3 Market size and forecast

5.5 Nano WLP

5.5.1 Key trends
5.5.2 Key growth factors and opportunities
5.5.3 Market size and forecast

5.6 Others

5.6.1 Key trends
5.6.2 Key growth factors and opportunities
5.6.3 Market size and forecast

Chapter: 6 WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY

6.1 Overview
6.2 Copper pillar

6.2.1 Key trends
6.2.2 Key growth factors and opportunities
6.2.3 Market size and forecast

6.3 Solder bumping

6.3.1 Key trends
6.3.2 Key growth factors and opportunities
6.3.3 Market size and forecast

6.4 Gold bumping

6.4.1 Key trends
6.4.2 Key growth factors and opportunities
6.4.3 Market size and forecast

6.5 Others

6.5.1 Key trends
6.5.2 Key growth factors and opportunities
6.5.3 Market size and forecast

Chapter: 7 WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY

7.1 Overview
7.2 Electronics

7.2.1 Key trends
7.2.2 Key growth factors and opportunities
7.2.3 Market size and forecast

7.3 IT & Telecommunication

7.3.1 Key trends
7.3.2 Key growth factors and opportunities
7.3.3 Market size and forecast

7.4 Industrial

7.4.1 Key trends
7.4.2 Key growth factors and opportunities
7.4.3 Market size and forecast

7.5 Automotive

7.5.1 Key trends
7.5.2 Key growth factors and opportunities
7.5.3 Market size and forecast

7.6 Aerospace & Defense

7.6.1 Key trends
7.6.2 Key growth factors and opportunities
7.6.3 Market size and forecast

7.7 Healthcare

7.7.1 Key trends
7.7.2 Key growth factors and opportunities
7.7.3 Market size and forecast

7.8 Others

7.8.1 Key trends
7.8.2 Key growth factors and opportunities
7.8.3 Market size and forecast

Chapter: 8 WORLD WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY

8.1 Overview
8.2 North America

8.2.1 Key trends
8.2.2 Key growth factors and opportunities
8.2.3 Market size and forecast
8.2.4 U.S.
8.2.5 Canada
8.2.6 Mexico

8.3 Europe

8.3.1 Key trends
8.3.2 Key growth factors and opportunities
8.3.3 Market size and forecast
8.3.4 Germany
8.3.5 UK
8.3.6 Netherland
8.3.7 France
8.3.8 Italy
8.3.9 Rest of Europe

8.4 Asia-Pacific

8.4.1 Key trends
8.4.2 Key growth factors and opportunities
8.4.3 Market size and forecast
8.4.4 China
8.4.5 India
8.4.6 Japan
8.4.7 South Korea
8.4.8 Taiwan
8.4.9 Rest of Asia-Pacific

8.5 LAMEA

8.5.1 Key trends
8.5.2 Key growth factors and opportunities
8.5.3 Market size and forecast
8.5.4 Latin America
8.5.5 Middle East
8.5.6 Africa

Chapter: 9 COMPANY PROFILES

9.1 Amkor Technology, Inc.

9.1.1 Company overview
9.1.2 Company snapshot
9.1.3 Operating business segments
9.1.4 Business performance
9.1.5 Key strategic moves and developments

9.2 Fujitsu

9.2.1 Company overview
9.2.2 Company snapshot
9.2.3 Operating business segments
9.2.4 Business performance
9.2.5 Key strategic moves and developments

9.3 Jiangsu Changjiang Electronics Technology Co. Ltd.

9.3.1 Company overview
9.3.2 Company snapshot
9.3.3 Operating business segments
9.3.4 Business performance
9.3.5 Key strategic moves and developments

9.4 Deca Technologies

9.4.1 Company overview
9.4.2 Company snapshot
9.4.3 Operating business segments
9.4.4 Business performance
9.4.5 Key strategic moves and developments

9.5 Qualcomm Technologies, Inc.

9.5.1 Company overview
9.5.2 Company snapshot
9.5.3 Operating business segments
9.5.4 Business performance
9.5.5 Key strategic moves and developments

9.6 Toshiba Corporation

9.6.1 Company overview
9.6.2 Company snapshot
9.6.3 Operating business segments
9.6.4 Business performance
9.6.5 Key strategic moves and developments

9.7 Tokyo Electron Ltd.

9.7.1 Company overview
9.7.2 Company snapshot
9.7.3 Operating business segments
9.7.4 Business performance
9.7.5 Key strategic moves and developments

9.8 Applied Materials, Inc.

9.8.1 Company overview
9.8.2 Company snapshot
9.8.3 Operating business segments
9.8.4 Business performance
9.8.5 Key strategic moves and developments

9.9 ASML Holding N.V

9.9.1 Company overview
9.9.2 Company snapshot
9.9.3 Operating business segments
9.9.4 Business performance
9.9.5 Key strategic moves and developments

9.10 Lam Research Corporation

9.10.1 Company overview
9.10.2 Company snapshot
9.10.3 Operating business segments
9.10.4 Business performance
9.10.5 Key strategic moves and developments

LIST OF FIGURES

FIG. 1 ROADMAP FOR ADVANCEMENTS IN PACKAGING TECHNOLOGY
FIG. 2 WORLD WAFER LEVEL PACKAGING MARKET, RESEARCH METHODOLOGY
FIG. 3 WORLD WAFER LEVEL PACKAGING MARKET SEGMENTS, REVENUE & CAGR, 20162022
FIG. 4 WORLD WAFER LEVEL PACKAGING MARKET, COMPARATIVE ANALYSIS, 2015 VS 2022
FIG. 5 FACTORS AND THEIR EXPECTED IMPACT ON WAFER LEVEL PACKAGING MARKET
FIG. 6 TOP IMPACTING FACTORS
FIG. 7 TOP INVESTMENT POCKETS, BY INDUSTRY VERTICAL
FIG. 8 TOP WINNING STRATEGIES
FIG. 9 PORTERS FIVE FORCE ANALYSIS
FIG. 10 VALUE CHAIN ANALYSIS
FIG. 11 DRIVING FACTOR OF WAFER LEVEL PACKAGING MARKET
FIG. 12 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE (% SHARE), 2015 & 2022
FIG. 13 OPPORTUNITIES FOR FIWLP IN MOBILE PHONES
FIG. 14 WORLD FAN IN WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 15 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FAN-IN WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 16 WORLD FAN-IN WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 17 WORLD FAN-IN WAFER LEVEL PACKAGING MARKET SHARE (%), 20152022
FIG. 18 OPPORTUNITIES FOR FOWLP IN MOBILE PHONES
FIG. 19 WORLD FAN OUT WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 20 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 21 WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 22 WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 23 2.5D/3D COMMERCIAL ANNOUNCEMENTS
FIG. 24 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY (% SHARE), 2015 & 2022
FIG. 25 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 26 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD 3D TSV WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 27 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 28 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 29 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 30 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 31 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 32 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 33 WLCSP UNIT FORECAST BY END EQUIPMENT TYPE 2010-16
FIG. 34 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 35 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 36 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 37 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET SHARE (%), 20142022
FIG. 38 WAFER LEVEL PACKAGING: CURRENT VS PROPOSED
FIG. 39 WORLD NANO WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 40 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD NANO WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 41 WORLD NANO WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 42 WORLD NANO WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 43 WORLD OTHERS WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 44 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD OTHERS WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 45 WORLD OTHERS WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 46 WORLD OTHERS WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 47 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY (% SHARE), 2015 & 2022
FIG. 48 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET ANALYSIS ($MILLION), 2015
FIG. 49 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET (% SHARE), 2015 & 2022
FIG. 50 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET REVENUE ($MILLION), 20142022
FIG. 51 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET SHARE (%), 20142022
FIG. 52 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET ANALYSIS ($MILLION), 2015
FIG. 53 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET (% SHARE), 2015 & 2022
FIG. 54 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET REVENUE ($MILLION), 20142022
FIG. 55 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET SHARE (%), 20142022
FIG. 56 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET ANALYSIS ($MILLION), 2015
FIG. 57 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET (% SHARE), 2015 & 2022
FIG. 58 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET REVENUE ($MILLION), 20142022
FIG. 59 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET SHARE (%), 20142022
FIG. 60 WORLD WAFER LEVEL PACKAGING OTHERS MARKET ANALYSIS ($MILLION), 2015
FIG. 61 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING OTHERS MARKET (% SHARE), 2015 & 2022
FIG. 62 WORLD WAFER LEVEL PACKAGING OTHERS MARKET REVENUE ($MILLION), 20142022
FIG. 63 WORLD WAFER LEVEL PACKAGING OTHERS MARKET SHARE (%), 20142022
FIG. 64 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY, 2015 & 2022 (% SHARE)
FIG. 65 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET ANALYSIS, 2015 ($MILLION)
FIG. 66 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET, 2015 & 2022 (% SHARE)
FIG. 67 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET REVENUE, 20142022 ($MILLION)
FIG. 68 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET SHARE, 20142022 (%)
FIG. 69 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET, 2015 & 2022 (% SHARE)
FIG. 70 WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET REVENUE, 20142022 ($MILLION)
FIG. 71 WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET SHARE, 20142022 (%)
FIG. 72 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET, 2015 & 2022 (% SHARE)
FIG. 73 WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET REVENUE, 20142022 ($MILLION)
FIG. 74 WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET SHARE, 20142022 (%)
FIG. 75 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET, 2014 & 2022 (% SHARE)
FIG. 76 WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET REVENUE, 20142022 ($MILLION)
FIG. 77 WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET SHARE, 20142022 (%)
FIG. 78 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENCE MARKET, 2015 & 2022 (% SHARE)
FIG. 79 WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENSE MARKET REVENUE, 20142022 ($MILLION)
FIG. 80 WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENSE MARKET SHARE, 20142022 (%)
FIG. 81 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET, 2015 & 2022 (% SHARE)
FIG. 82 WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET REVENUE, 20142022 ($MILLION)
FIG. 83 WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET SHARE, 20142022 (%)
FIG. 84 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING OTHERS MARKET, 2015 & 2022 (% SHARE)
FIG. 85 WORLD WAFER LEVEL PACKAGING OTHERS MARKET REVENUE, 20142022 ($MILLION)
FIG. 86 WORLD WAFER LEVEL PACKAGING OTHERS MARKET SHARE, 20142022 (%)
FIG. 87 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS, BY GEOGRAPHY (%), 2015 & 2022
FIG. 88 NORTH AMERICA: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 89 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF NORTH AMERICAN MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 90 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 91 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 92 U.S.: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 93 CANADA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 94 MEXICO: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 95 EUROPE: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 96 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF EUROPE MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 97 EUROPE: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 98 EUROPE: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 99 GERMANY: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 100 UK: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 101 NETHERLAND: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 102 FRANCE: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 103 ITALY: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 104 REST OF EUROPE: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 105 ASIA-PACIFIC: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 106 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF ASIA-PACIFIC MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 107 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 108 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 109 CHINA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 110 INDIA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 111 JAPAN: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 112 SOUTH KOREA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 113 TAIWAN: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 114 REST OF ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 115 LAMEA: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 116 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF LAMEA MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 117 LAMEA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 118 LAMEA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 119 LATIN AMERICA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 120 MIDDLE EAST: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 121 AFRICA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 122 AMKOR TECHNOLOGY: REVENUE, 20132015 ($MILLION)
FIG. 123 AMKOR TECHNOLOGY: REVENUE BY SEGMENT, 2015 (%)
FIG. 124 AMKOR TECHNOLOGY: REVENUE BY REGION, 2015 (%)
FIG. 125 FUJITSU, REVENUE, 20132015 ($MILLION)
FIG. 126 FUJITSU, REVENUE, BY SEGMENT (%), 2015
FIG. 127 FUJITSU, REVENUE, BY REGION (%), 2015
FIG. 128 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE, 20132015 ($MILLION)
FIG. 129 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE BY SEGMENT, 2015 (%)
FIG. 130 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE BY REGION, 2015 (%)
FIG. 131 DECA TECHNOLOGIES: REVENUE, 20132015 ($MILLION)
FIG. 132 DECA TECHNOLOGIES: REVENUE BY SEGMENT, 2015 (%)
FIG. 133 DECA TECHNOLOGIES: REVENUE BY REGION, 2015 (%)
FIG. 134 QUALCOMM TECHNOLOGIES: REVENUE, 20132015 ($MILLION)
FIG. 135 QUALCOMM TECHNOLOGIES: REVENUE BY SEGMENT, 2015 (%)
FIG. 136 QUALCOMM TECHNOLOGIES: REVENUE BY REGION, 2015 (%)
FIG. 137 TOSHIBA CORPORATION: NET SALES, 20132015 ($MILLION)
FIG. 138 TOSHIBA CORPORATION: REVENUE BY SEGMENT, 2015 (%)
FIG. 139 TOSHIBA CORPORATION: REVENUE BY REGION, 2015 (%)
FIG. 140 TOKYO ELECTRON: REVENUE, 20142016 ($MILLION)
FIG. 141 TOKYO ELECTRON: REVENUE BY SEGMENT, 2016 (%)
FIG. 142 TOKYO ELECTRON: REVENUE BY REGION, 2016 (%)
FIG. 143 APPLIED MATERIALS: REVENUE, 20132015 ($MILLION)
FIG. 144 APPLIED MATERIALS: REVENUE BY SEGMENT, 2015 (%)
FIG. 145 APPLIED MATERIALS: REVENUE BY REGION, 2015 (%)
FIG. 146 ASML: REVENUE, 20132015 ($MILLION)
FIG. 147 ASML: REVENUE BY SEGMENT, 2015 (%)
FIG. 148 ASML: REVENUE BY REGION, 2015 (%)
FIG. 149 LAM RESEARCH: REVENUE, 20142016 ($MILLION)
FIG. 150 LAM RESEARCH: REVENUE BY SEGMENT, 2015 (%)
FIG. 151 LAM RESEARCH: REVENUE BY REGION, 2015 (%)

LIST OF TABLES

TABLE 1 WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE ($MILLION), 20142022
TABLE 2 WORLD FAN-IN WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 3 WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY ($MILLION), 20142022
TABLE 5 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 6 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 7 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 8 WORLD NANO WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 9 WORLD OTHERS WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 10 WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY ($MILLION), 20142022
TABLE 11 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 12 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 13 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 14 WORLD WAFER LEVEL PACKAGING OTHERS MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 15 WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY, 20142022 ($MILLION)
TABLE 16 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 17 WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 18 WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 19 WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 20 WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENCE MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 21 WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 22 WORLD WAFER LEVEL PACKAGING OTHERS MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 23 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 24 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 25 EUROPE: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 26 EUROPE: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 27 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 28 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 29 LAMEA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 30 LAMEA: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 31 AMKOR TECHNOLOGY - COMPANY SNAPSHOT
TABLE 32 AMKOR TECHNOLOGY COMPANY OPERATING BUSINESS SEGMENTS
TABLE 33 FUJITSU: COMPANY SNAPSHOT
TABLE 34 FUJITSU - OPERATING SEGMENTS
TABLE 35 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY - COMPANY SNAPSHOT
TABLE 36 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY COMPANY OPERATING BUSINESS SEGMENTS
TABLE 37 DECA TECHNOLOGIES - COMPANY SNAPSHOT
TABLE 38 DECA TECHNOLOGIES COMPANY OPERATING BUSINESS SEGMENTS
TABLE 39 QUALCOMM TECHNOLOGIES - COMPANY SNAPSHOT
TABLE 40 QUALCOMM TECHNOLOGIES COMPANY OPERATING BUSINESS SEGMENTS
TABLE 41 TOSHIBA CORPORATION - COMPANY SNAPSHOT
TABLE 42 TOSHIBA CORPORATION COMPANY OPERATING BUSINESS SEGMENTS
TABLE 43 TOKYO ELECTRON - COMPANY SNAPSHOT
TABLE 44 TOKYO ELECTRON COMPANY OPERATING BUSINESS SEGMENTS
TABLE 45 APPLIED MATERIALS - COMPANY SNAPSHOT
TABLE 46 APPLIED MATERIALS COMPANY OPERATING BUSINESS SEGMENTS
TABLE 47 ASML - COMPANY SNAPSHOT
TABLE 48 ASML COMPANY OPERATING BUSINESS SEGMENTS
TABLE 49 LAM RESEARCH - COMPANY SNAPSHOT
TABLE 50 LAM RESEARCH COMPANY OPERATING BUSINESS SEGMENTS

 
 

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