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5G Chipset Market by IC Type (ASIC, RFIC, Cellular IC, and mmWave IC), Operational Frequency (Sub 6GHz, Between 26 & 39 GHz, and Above 39 GHz), Product (Devices, Customer Premises Equipment, and Network Infrastructure Equipment), and Industry Vertical (Automotive & Transportation, Energy & Utilities, Healthcare, Retail, Consumer Electronics, Industrial Automation, and Others): Global Opportunity Analysis and Industry Forecast, 2020 - 2026

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Pages: 333
Dec 2018 | 476 Views
 
Author's : Prasad Kakade
Tables: 101
Charts: NA
 

5G Chipset Market Overview:

The global 5G Chipset market size is expected to be $2,120.0 million in 2020, and is projected to reach $22,929.0 million by 2026, registering a CAGR of 48.7% from 2020 to 2026. Asia-Pacific is expected to be the highest contributor to the global market, with $752.6 million in 2020, and is estimated to reach $8,713.0 million by 2026, registering a CAGR of 50.5% during the forecast period.

5G chipset market analysis mainly comprises of component in consumer devices, customer premise equipment, and network infrastructure equipment, which allows the end-user to form the wireless network based on 5G standards.

Proliferation of devices using the internet boosts the demand for an entirely new wireless infrastructure called 5G. Fifth generation wireless (5G) is described as the next generation of mobile networks beyond the current 4G LTE mobile network. These networks expand broadband wireless services beyond mobile internet to Internet of Things (IoT) and critical communications segments to enable a perceived fully ubiquitous connected world. 5G is expected to deliver new levels of efficiency and performance empowering new user experiences and connection of new industries. It is a kind of network or a platform for innovations that is expected to not only improve mobile broadband services but also facilitate the expansion of mobile networks to support different devices and services. It is expected to facilitate the interconnection of new industries enabling enhanced efficiency and minimizing cost. With the establishment of 5G infrastructure, 5G chipset market trends open up different opportunities and redefines broad range of industries with connected services from transportation to entertainment, education to retail and from healthcare to consumer electronics.

The significant advantages of 5G network would be its low latency and greater bandwidth. Bandwidth is defined as the width of a communication band. Higher bandwidth allows more amount of data that can flow through the network simultaneously, while lower latency enables the time taken to travel from one point to another in minimum amount of time. The latency of the 5G network is expected to be as low as 1mS. Moreover, other favorable characteristics of 5G include very high coverage, low power consumption for mobile phones as well as IoT devices, and maximum availability of the network. Increase in usage of mobile broadband is expected to drive the growth of the 5G chipset market. The demand for higher internet speed by the consumers which is met by the 5G network along with increase in demand for mobile data services is expected to remarkably boost the 5G chipset market growth.

The 5G chipset industry market is anticipated to witness a growth in demand owing to rapid development in automated devices, which depend on wireless internet such as self-driving cars, drones, home automation devices, and other smart devices. For instance, self-driving cars require very low latency to function efficiently in real time. The smart devices such as smartphones require consumption of power to access the internet. 5G network is expected to enable the smart devices to access this speed with minimum power consumption. Also, increase in the penetration of pervasive computing, which includes the rise in trend of embedding high performance microprocessor systems into everyday objects, such as smart locks or smart speakers fuel the need of ultrafast network speed, thereby driving the need of 5G chipset. 5G network is expected to operate with the following frequency rangesfrequency with less than equal to 6 Ghz and very high frequencies ranging above 6 GHz to 100 GHz. known as millimeter wave spectrum. As 5G network operates in different frequency spectrums, complexity in obtaining spectrum harmonization restrains the growth of the market. Moreover, the establishment of 5G standard requires very high infrastructure cost in deployment of multiple low-power base stations (small cells) to meet the growth in demand for higher network capacity. This is expected to restrict the market growth in the early stages but is expected to grow at a higher rate with time as services get cheaper. On the other hand, integration of 5G services with satellite communication and increase in strategic partnerships with system integrators in developing economies provide lucrative growth opportunities for the market.

The top players profiled in the market are Qualcomm Technologies, Inc., Broadcom, Intel Corporation, Nokia Corporation, Samsung Electronics Co., Ltd., Mediatek Inc., Xilinx Inc., Huawei Technologies Co., Ltd., Qorvo, and Infineon Technologies AG.

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The 5G chipset market is segmented by IC type, operational frequency, product, industry vertical, and region. Based on IC type, the market is divided into radio frequency integrated circuit (RFIC), application-specific integrated circuit (ASIC), cellular integrated circuit (Cellular IC), and millimeter wave integrated circuit (mmWave IC). Based on operational frequency, it is segmented into sub-6 GHz, between 26 & 39 GHz, and above 39 GHz. Based on product, it is classified into devices, customer premises equipment (CPE), and network infrastructure equipment. Based on industry vertical, the market is bifurcated into automotive & transportation, energy & utilities, healthcare, retail, consumer electronics, industrial automation and others. Further, the market by region is analyzed across North America, Europe, Asia-Pacific, and LAMEA.

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Top Impacting Factors

Proliferation of M2M/IoT connections

M2M connections are the technologies that typically use sensors to capture data and provide critical input to various types of machines to perform different tasks. These technologies require high bandwidth throughput and extremely low latency for higher performance. Increase in number of applications, which require M2M connections are real-time shipping, smart logistics, autonomous driving, immersive commerce, drone delivery, flexible manufacturing, immersive entertainment, disaster management, and precision agriculture. Some of the applications, such as drone delivery are at a nascent stage. Drone application is expected to be used significantly with the evolution of 5G network, which in turn is expected to offer huge 5G chipset market opportunity. For instance, major players in the 5G technology market, which include Intel and South Korean mobile carrier KT tested their projects based on 5G network at the 22nd Winter Olympics in Pyeongchang, which delivered superior viewing experience to its audience. Moreover, businesses adopt the usage of Internet of Things devices to enhance their performance and efficiency due to the development of artificial intelligence technologies and rise in global GDP. Moreover, consumers are also expected to adopt latest technologies, which require high speed internet with low latency. For instance, smart speaker is the latest technological revolution dominating the consumer electronics market. The need of smart technologies is expected to increase with the evolution of 5G. This in turn drives the growth of the 5G chipset market.

Increase in demand for mobile broadband services

According to the International Telecommunications Union, 70% of the total global youth (15-24) population are accessing the internet. Also, in the developed countries, 90% of the total young population is using the internet. Mobile broadband subscriptions grew with the annual growth rate of more than 20% in the last six years and reached 4.3 billion globally by end of 2017. The primary reason for such a huge adoption in mobile broadband services was the affordable price. The average subscription price of mobile broadband was 0.7% of the Gross National Income (GNI) per capita in the developed economies while it was 4.3% of the world GNI per capita in the under-developed economies. Thus, numerous initiatives are being made in expanding internet access through the increased availability of broadband network. For instance, 5G standard network is expected to significantly affect the growth of mobile broadband users. Further early adoption of 5G subscriptions is estimated to be affected by higher price, but the prices are expected to drop down gradually with the evolution of 5G technologies. This is expected to increase the number of 5G mobile broadband users and thereby enhance the growth of the 5G chipset market.

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High investment and Technological & Infrastructure challenges in the implementation of 5G network

5G technology is expected to be operated in different frequency ranges, which include low frequencies (f < 1Ghz), high frequencies (1GHz < f < 6 GHz), and very high frequencies (above 6GHz). The millimeter wave spectrum, also known as frequencies above 6 GHz are required to distinguish the 5G network from 4G. According to the Regulatory Authority for Electronic Communications and Posts, it is not be possible for 5G to run entirely on millimeter wave frequencies as the propagation qualities of these bands make it difficult to achieve widespread coverage, particularly in more sparsely populated areas. Moreover, these bands are not technologically advanced when it comes to delivering consumer market communication services. Also, the requirement of widespread deployment of low-power base stations (small cells) is expected to require huge capital investment. According to the Regulatory Authority for Electronic Communications and Posts, at least 10 small cells per macro base station in urban area is required to cater to the demand and enable the introduction of 5G. Therefore, these technological and infrastructure challenges in the implementation of 5G network restrict the production of 5G chipsets by some extent.

Rise in government initiatives for building smart cities in Asia-Pacific

A smart city is an urban area that incorporates information and communication technologies (ICT) to enhance the quality and performance of urban services such as energy, transportation, and utilities to reduce wastage, resource consumption, and overall costs. According to the United Nations, 68% of the world population is anticipated to shift in urban areas by 2050. In addition, the total expenditure on Internet of Things in the Asia-Pacific region is expected to increase at a high rate. For instance, the South Koreans government decided to invest $350 million in around 300 companies that it estimates globally competitive within the next four years to develop an IoT ecosystem within the country.

Moreover, other Asian governments also integrate IoT in their long-term development projects. Chinas central government has also selected over 200 cities, which include Beijing, Shanghai, Guangzhou, Hangzhou, and others to pilot smart city projects. It is estimated that over 90% of Chinas provinces and municipalities have listed IoT as a pillar industry in their development plans. 5G wireless network is expected to be the backbone of the smart cities. Hence, it provides lucrative opportunity for the manufacturers of the 5G chipset.

Key Benefits for 5G Chipset Market:

  • This study comprises an analytical depiction of the global 5G chipset market forecast along with the current trends and future estimations to depict the imminent investment pockets.

  • The overall market potential is determined to understand the profitable trends to gain a stronger foothold.

  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.

  • The current market is quantitatively analyzed from 2020 to 2026 to benchmark the financial competency.

  • Porters five forces analysis illustrates the potency of the buyers and suppliers in the industry.

5G Chipset Key Market Segments:

By IC Type

  • ASIC

  • RFIC

  • Cellular IC

  • mmWave IC

By Operational Frequency

  • Sub 6GHz

  • Between 26 & 39 Ghz

  • Above 39 Ghz

By Product

  • Devices

  • Customer Premises Equipment

  • Network Infrastructure Equipment

By Industry Vertical

  • Automotive & Transportation

  • Energy & Utilities

  • Healthcare

  • Retail

  • Consumer Electronics

  • Industrial Automation

  • Others

By Region

  • North America

    • U.S.

    • Canada

    • Mexico

  • Europe

    • UK

    • Germany

    • France

    • Russia

    • Rest of Europe

  • Asia-Pacific

    • China

    • Japan

    • India

    • South Korea

    • Rest of Asia-Pacific

  • LAMEA

    • Latin America

    • Middle East

    • Africa

Key Market Players Profiled

  • Qualcomm Technologies, Inc.

  • Broadcom

  • Intel Corporation

  • Nokia Corporation

  • Samsung Electronics Co., Ltd.

  • Mediatek Inc.

  • Xilinx Inc.

  • Huawei Technologies Co., Ltd.

  • Qorvo

  • Infineon Technologies AG

 

Chapter: 1:    INTRODUCTION

1.1.    REPORT DESCRIPTION
1.2.    KEY BENEFITS FOR STAKEHOLDERS
1.3.    KEY MARKET SEGMENTS
1.4.    RESEARCH METHODOLOGY

1.4.1.    Primary research
1.4.2.    Secondary research
1.4.3.    Analyst tools and models

Chapter: 2:    EXECUTIVE SUMMARY

2.1.    CXO PERSPECTIVE

Chapter: 3:    MARKET OVERVIEW

3.1.    MARKET DEFINITION AND SCOPE
3.2.    KEY FINDINGS

3.2.1.    Top impacting factors
3.2.2.    Top investment pockets
3.2.3.    Top winning strategies

3.3.    PORTER’S FIVE FORCES ANALYSIS
3.4.    MARKET SHARE ANALYSIS (2020)
3.5.    MARKET DYNAMICS

3.5.1.    Drivers

3.5.1.1.    Proliferation of M2M/IoT connections
3.5.1.2.    Increase in demand for mobile broadband services

3.5.2.    Restraint

3.5.2.1.    High investment and Technological & Infrastructure challenges in the implementation of 5G network
3.5.2.2.    Privacy and Security Concern

3.5.3.    Opportunities

3.5.3.1.    Rise in government initiatives for building smart cities in Asia-Pacific

Chapter: 4:    5G CHIPSET MARKET, BY IC TYPE

4.1.    OVERVIEW
4.2.    ASIC

4.2.1.    Key market trends, growth factors and opportunities
4.2.2.    Market size and forecast, by region
4.2.3.    Market analysis by country

4.3.    RFIC

4.3.1.    Key market trends, growth factors, and opportunities
4.3.2.    Market size and forecast, by region
4.3.3.    Market analysis by country

4.4.    CELLULAR IC

4.4.1.    Key market trends, growth factors, and opportunities
4.4.2.    Market size and forecast, by region
4.4.3.    Market analysis by country

4.5.    MMWAVE IC

4.5.1.    Key market trends, growth factors, and opportunities
4.5.2.    Market size and forecast, by region
4.5.3.    Market analysis by country

Chapter: 5:    5G CHIPSET MARKET, BY OPERATIONAL FREQUENCY

5.1.    OVERVIEW
5.2.    SUB 6GHZ

5.2.1.    Key market trends, growth factors and opportunities
5.2.2.    Market size and forecast, by region
5.2.3.    Market analysis by country

5.3.    BETWEEN 26 & 39 GHZ

5.3.1.    Key market trends, growth factors, and opportunities
5.3.2.    Market size and forecast, by region
5.3.3.    Market analysis by country

5.4.    ABOVE 39 GHZ

5.4.1.    Key market trends, growth factors, and opportunities
5.4.2.    Market size and forecast, by region
5.4.3.    Market analysis by country

Chapter: 6:    5G CHIPSET MARKET, BY PRODUCT

6.1.    OVERVIEW
6.2.    DEVICES

6.2.1.    Key market trends, growth factors and opportunities
6.2.2.    Market size and forecast, by region
6.2.3.    Market analysis by country

6.3.    CUSTOMER PREMISES EQUIPMENT

6.3.1.    Key market trends, growth factors, and opportunities
6.3.2.    Market size and forecast, by region
6.3.3.    Market analysis by country

6.4.    NETWORK INFRASTRUCTURE EQUIPMENT

6.4.1.    Key market trends, growth factors, and opportunities
6.4.2.    Market size and forecast, by region
6.4.3.    Market analysis by country

Chapter: 7:    5G CHIPSET MARKET, BY INDUSTRY VERTICAL

7.1.    OVERVIEW
7.2.    AUTOMOTIVE & TRANSPORTATION

7.2.1.    Key market trends, growth factors and opportunities
7.2.2.    Market size and forecast, by region
7.2.3.    Market analysis by country

7.3.    ENERGY & UTILITIES

7.3.1.    Key market trends, growth factors and opportunities
7.3.2.    Market size and forecast, by region
7.3.3.    Market analysis by country

7.4.    HEALTHCARE

7.4.1.    Key market trends, growth factors and opportunities
7.4.2.    Market size and forecast, by region
7.4.3.    Market analysis by country

7.5.    RETAIL

7.5.1.    Key market trends, growth factors and opportunities
7.5.2.    Market size and forecast, by region
7.5.3.    Market analysis by country

7.6.    CONSUMER ELECTRONICS

7.6.1.    Key market trends, growth factors and opportunities
7.6.2.    Market size and forecast, by region
7.6.3.    Market analysis by country

7.7.    INDUSTRIAL AUTOMATION

7.7.1.    Key market trends, growth factors and opportunities
7.7.2.    Market size and forecast, by region
7.7.3.    Market analysis by country

7.8.    OTHERS

7.8.1.    Key market trends, growth factors and opportunities
7.8.2.    Market size and forecast, by region
7.8.3.    Market analysis by country

Chapter: 8:    5G CHIPSET MARKET, BY REGION

8.1.    OVERVIEW
8.2.    NORTH AMERICA

8.2.1.    Key market trends, growth factors, and opportunities
8.2.2.    Market size and forecast, by IC Type
8.2.3.    Market size and forecast, by Operational Frequency
8.2.4.    Market size and forecast, by product
8.2.5.    Market size and forecast, by industry vertical
8.2.6.    Market analysis by country

8.2.6.1.    U.S.

8.2.6.1.1.    Market size and forecast, by IC Type
8.2.6.1.2.    Market size and forecast, by Operational Frequency
8.2.6.1.3.    Market size and forecast, by product
8.2.6.1.4.    Market size and forecast, by industry vertical

8.2.6.2.    Canada

8.2.6.2.1.    Market size and forecast, by IC Type
8.2.6.2.2.    Market size and forecast, by Operational Frequency
8.2.6.2.3.    Market size and forecast, by product
8.2.6.2.4.    Market size and forecast, by industry vertical

8.2.6.3.    Mexico

8.2.6.3.1.    Market size and forecast, by IC Type
8.2.6.3.2.    Market size and forecast, by Operational Frequency
8.2.6.3.3.    Market size and forecast, by product
8.2.6.3.4.    Market size and forecast, by industry vertical

8.3.    EUROPE

8.3.1.    Key market trends, growth factors, and opportunities
8.3.2.    Market size and forecast, by IC Type
8.3.3.    Market size and forecast, by Operational Frequency
8.3.4.    Market size and forecast, by product
8.3.5.    Market size and forecast, by industry vertical
8.3.6.    Market analysis by country

8.3.6.1.    U.K.

8.3.6.1.1.    Market size and forecast, by IC Type
8.3.6.1.2.    Market size and forecast, by Operational Frequency
8.3.6.1.3.    Market size and forecast, by product
8.3.6.1.4.    Market size and forecast, by industry vertical

8.3.6.2.    Germany

8.3.6.2.1.    Market size and forecast, by IC Type
8.3.6.2.2.    Market size and forecast, by Operational Frequency
8.3.6.2.3.    Market size and forecast, by product
8.3.6.2.4.    Market size and forecast, by industry vertical

8.3.6.3.    France

8.3.6.3.1.    Market size and forecast, by IC Type
8.3.6.3.2.    Market size and forecast, by Operational Frequency
8.3.6.3.3.    Market size and forecast, by product
8.3.6.3.4.    Market size and forecast, by industry vertical

8.3.6.4.    Russia

8.3.6.4.1.    Market size and forecast, by IC Type
8.3.6.4.2.    Market size and forecast, by Operational Frequency
8.3.6.4.3.    Market size and forecast, by product
8.3.6.4.4.    Market size and forecast, by industry vertical

8.3.6.5.    Rest of Europe

8.3.6.5.1.    Market size and forecast, by IC Type
8.3.6.5.2.    Market size and forecast, by Operational Frequency
8.3.6.5.3.    Market size and forecast, by product
8.3.6.5.4.    Market size and forecast, by industry vertical

8.4.    ASIA-PACIFIC

8.4.1.    Key market trends, growth factors, and opportunities
8.4.2.    Market size and forecast, by IC Type
8.4.3.    Market size and forecast, by Operational Frequency
8.4.4.    Market size and forecast, by product
8.4.5.    Market size and forecast, by industry vertical
8.4.6.    Market analysis by country

8.4.6.1.    China

8.4.6.1.1.    Market size and forecast, by IC Type
8.4.6.1.2.    Market size and forecast, by Operational Frequency
8.4.6.1.3.    Market size and forecast, by product
8.4.6.1.4.    Market size and forecast, by industry vertical

8.4.6.2.    Japan

8.4.6.2.1.    Market size and forecast, by IC Type
8.4.6.2.2.    Market size and forecast, by Operational Frequency
8.4.6.2.3.    Market size and forecast, by product
8.4.6.2.4.    Market size and forecast, by industry vertical

8.4.6.3.    India

8.4.6.3.1.    Market size and forecast, by IC Type
8.4.6.3.2.    Market size and forecast, by Operational Frequency
8.4.6.3.3.    Market size and forecast, by product
8.4.6.3.4.    Market size and forecast, by industry vertical

8.4.6.4.    South Korea

8.4.6.4.1.    Market size and forecast, by IC Type
8.4.6.4.2.    Market size and forecast, by Operational Frequency
8.4.6.4.3.    Market size and forecast, by product
8.4.6.4.4.    Market size and forecast, by industry vertical

8.4.6.5.    Rest of Asia-Pacific

8.4.6.5.1.    Market size and forecast, by IC Type
8.4.6.5.2.    Market size and forecast, by Operational Frequency
8.4.6.5.3.    Market size and forecast, by product
8.4.6.5.4.    Market size and forecast, by industry vertical

8.5.    LAMEA

8.5.1.    Key market trends, growth factors, and opportunities
8.5.2.    Market size and forecast, by IC Type
8.5.3.    Market size and forecast, by Operational Frequency
8.5.4.    Market size and forecast, by product
8.5.5.    Market size and forecast, by industry vertical
8.5.6.    Market analysis by country

8.5.6.1.    Latin America

8.5.6.1.1.    Market size and forecast, by IC Type
8.5.6.1.2.    Market size and forecast, by Operational Frequency
8.5.6.1.3.    Market size and forecast, by product
8.5.6.1.4.    Market size and forecast, by industry vertical

8.5.6.2.    Middle East

8.5.6.2.1.    Market size and forecast, by IC Type
8.5.6.2.2.    Market size and forecast, by Operational Frequency
8.5.6.2.3.    Market size and forecast, by product
8.5.6.2.4.    Market size and forecast, by industry vertical

8.5.6.3.    Africa

8.5.6.3.1.    Market size and forecast, by IC Type
8.5.6.3.2.    Market size and forecast, by Operational Frequency
8.5.6.3.3.    Market size and forecast, by product
8.5.6.3.4.    Market size and forecast, by industry vertical

Chapter: 9:    COMPANY PROFILES

9.1.    BROADCOM

9.1.1.    Company overview
9.1.2.    Company snapshot
9.1.3.    Operating business segments
9.1.4.    Product portfolio
9.1.5.    Business performance
9.1.6.    Key strategic moves and developments

9.2.    HUAWEI TECHNOLOGIES CO., LTD.

9.2.1.    Company overview
9.2.2.    Company snapshot
9.2.3.    Operating business segments
9.2.4.    Product portfolio
9.2.5.    Business performance
9.2.6.    Key strategic moves and developments

9.3.    INFINEON TECHNOLOGIES AG

9.3.1.    Company overview
9.3.2.    Company snapshot
9.3.3.    Operating business segments
9.3.4.    Product portfolio
9.3.5.    Business performance
9.3.6.    Key strategic moves and developments

9.4.    INTEL CORPORATION

9.4.1.    Company overview
9.4.2.    Company snapshot
9.4.3.    Operating business segments
9.4.4.    Product portfolio
9.4.5.    Business performance
9.4.6.    Key strategic moves and developments

9.5.    MEDIATEK INC

9.5.1.    Company overview
9.5.2.    Company snapshot
9.5.3.    Product portfolio
9.5.4.    Business performance
9.5.5.    Key strategic moves and developments

9.6.    NOKIA CORPORATION

9.6.1.    Company overview
9.6.2.    Company snapshot
9.6.3.    Operating business segments
9.6.4.    Product portfolio
9.6.5.    Business performance
9.6.6.    Key strategic moves and developments

9.7.    QUALCOMM TECHNOLOGIES, INC.

9.7.1.    Company overview
9.7.2.    Company snapshot
9.7.3.    Operating business segments
9.7.4.    Product portfolio
9.7.5.    Business performance
9.7.6.    Key strategic moves and developments

9.8.    QORVO

9.8.1.    Company overview
9.8.2.    Company snapshot
9.8.3.    Operating business segments
9.8.4.    Product portfolio
9.8.5.    Business performance
9.8.6.    Key strategic moves and developments

9.9.    SAMSUNG ELECTRONICS CO. LTD.

9.9.1.    Company overview
9.9.2.    Company snapshot
9.9.3.    Operating business segments
9.9.4.    Product portfolio
9.9.5.    Business performance
9.9.6.    Key strategic moves and developments

9.10.    XILINX INC.

9.10.1.    Company overview
9.10.2.    Company snapshot
9.10.3.    Operating business segments
9.10.4.    Product portfolio
9.10.5.    Business performance
9.10.6.    Key strategic moves and developments

 

The 5G chipset market is expected to grow at an exponential growth rate. Improved accuracy, efficiency, and speed of operations in the 5G embedded devices are expected to drive the market growth during the forecast period. The automotive & transportation segment in the industry vertical is expected to grow at the fastest CAGR during the forecast period.

Proliferation of M2M/IoT connections and increase in demand for mobile broadband services drive the growth of the market. However, high investment and technological & infrastructure challenges in the implementation of 5G network and privacy & security concern impede this growth. In the near future, rise in government initiatives for building smart cities in Asia-Pacific is expected to create lucrative opportunities for the key players operating in this market.   

The global 5G Chipset market is expected to be $2,120.0 million in 2020, and is projected to reach $22,929.0 million by 2026, registering a CAGR of 48.7% from 2020 to 2026. Asia-Pacific is expected to account for the highest revenue in the global market throughout the forecast period (2020–2026). The market participants continue to introduce the technologically advanced products to remain competitive in the market. Product launch, product development, and collaboration are the prominent strategies adopted by the market players.

The key market players analyzed in this report include Qualcomm Technologies, Inc., Broadcom, Intel Corporation, Nokia Corporation, Samsung Electronics Co., Ltd., Mediatek Inc., Xilinx Inc., Huawei Technologies Co., Ltd., Qorvo, and Infineon Technologies AG.

 

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