System in Package (SiP) Technology Market Overview
Global System in Package (SiP) Technology Market is expected to reach $30 billion by 2022, growing at a CAGR of 9.0% during the forecast period 2016 - 2022. SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps. SiP is widely adopted in several applications such as consumer electronics, automotive, and telecommunication owing to its enhanced efficiency and durability.
Boom in the portable electronic market, increase in popularity of Internet of Things (IoT) and adoption of SiP technology in graphic cards and processors for real world gaming have increased the rate of adoption of SiP in consumer electronics, automotive, telecommunication, and other sectors. Therefore, the global SiP market is expected to witness moderate growth in the near future, owing to compact size and enhanced durability. However, high cost and less customization hamper the market growth. Increase in demand for high frequency electronic gadgets are expected to provide lucrative opportunities to the market.
The global SiP technology market is segmented on the basis of packaging technology, packaging type, interconnection technology, application, and geography. Based on packaging technology, the market is classified into 2-D IC packaging, 2.5-D IC packaging, and 3-D IC packaging. In 2015, 2.5-D IC Packaging segment dominated the global market in terms of revenue contribution, and is expected to maintain this trend throughout the forecast period, owing to its compact size and enhanced efficiency.
Based on interconnection technology, the Wire Bond segment dominated the global market in terms of revenue contribution, and is expected to maintain this trend throughout the forecast period. However, the Flip Chip segment is expected to witness rapid growth due to increase in demand for integrated chips in consumer electronics sector.
Based on application, the telecommunication segment offers lucrative scope to industry players, and are expected to exhibit higher growth as compared to the other segments. Based on geography the market is segmented into North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific accounted for the largest revenue share in the global market, owing to the increase in demand for semiconductor devices and portable devices.
Global SiP Market: Segmentation
System in Package (SiP) Technology: Applications
Comprehensive competitive analyses and profiles of major market players, including Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group are provided in this report. Currently, the players in the SiP market have adopted partnership and acquisition to expand their customer base and increase their market shares.
Global SiP Market: Top Impacting Factors
Boom in portable electronic market and increase in popularity of Internet of Things (IoT)
Increase in demand for high speed and compact size of electronic products have fueled the requirement of SiP technology. In addition, module size reduction along with enhanced electrical and thermal performance are the key requirements of portable electronic products such as smartphones, digital camera & camcorders, laptops & tablets, wearable electronics, and household electronics. Moreover, IoT gains popularity in the industry, and is considered as the third wave of technology.
Usage in graphic cards and processors used in real world gaming
SiP are extensively used in processors and graphic cards to provide better output of videos and games. The key players in the market have heavily invested in R&D of these packaging technologies to sustain the stiff competition in the market. For instance, AMD announced to launch Zen processor, which has 40% performance improvement over its predecessor and provides a competitive edge over its rivals.
SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET KEY BENEFITS:
- The study provides an in-depth analysis of the global SiP technology market to elucidate the prominent investment pockets.
- Current trends and future estimations are outlined to determine the overall attractiveness, and single out profitable trends to gain a stronger foothold in the market.
- The report provides information regarding key drivers, restraints, and opportunities along with their impact analyses.
- The market is analyzed based on various regions, namely, North America, Europe, Asia-Pacific, and LAMEA.
- Value chain analysis of the market enables better understanding of the roles of intermediaries in the production processes.
SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET KEY SEGMENTATION:
By Packaging Technology
- 2-D IC Packaging
- 2.5-D IC Packaging
- 3-D IC Packaging
By Packaging Type
- Flat Packages
- Pin Grid Arrays
- Surface Mount
- Small Outline Packages
By Interconnection Technology
- Wire Bond
- Flip Chip
- Consumer Electronics
- Industrial System
- Aerospace & Defense
- Others (Traction & Medical)
- North America
- Rest of the Europe
- South Korea
- Rest of Asia-Pacific
- Latin America
- Middle East