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2022
System In Package (sip) Technology Market

System in Package (SiP) Technology Market

by Packaging Technology (2D IC Packaging, 2.5D IC Packaging, 3D IC Packaging), by Packaging Method (Wire Bond, Flip Chip), by End User (Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace and Defense, Others): Global Opportunity Analysis and Industry Forecast, 2020-2030

✷  Report Code: A01498
Pages: 310
Apr 2022 | 15075 Views
Author(s) : N n Kundan , Vineet Kumar
Tables: 141
Charts: 58
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System In Package (SiP) Technology Market Research, 2030

The global system in package (sip) technology market size was valued at $14.8 billion in 2020, and is projected to reach $34.2 billion by 2030, growing at a CAGR of 9.7% from 2021 to 2030. A system in package (SiP) is a single module that contains a number of integrated circuits that perform all functions of an electronic system. Generally, all external passive components are incorporated into one small chip in a SiP, which lowers the development and assembling cost of a printed circuit board (PCB). The SiP can be operated in harsh system environments and is less corrosive in nature, compact in size, and cost efficient. It is widely used in a variety of industries, including consumer electronics, automotive, and telecommunications.

The automotive segment has been negatively impacted by the COVID-19 pandemic outbreak.

System-in-Package-(SiP)-Technology-Market.jpg

Growth of the global system in package (SiP) technology industry is anticipated to be driven by factors, such as advent of 5G network connected devices, high demand for compact electronics gadgets with internet connectivity, and rise in the number of the Internet of Things (IoT) devices. In addition, growing adoption of smartphones and smart wearables boosts the market growth. However, higher level of integration leads to thermal issues, which acts as a major restraint for the market. On the contrary, high demand from Asia-Pacific is expected to fuel the market growth during the forecast period.

System in Package (SiP) Technology Market
By Packaging Technology

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3D IC Packaging segment is expected to secure leading position during forecast period.

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The system in package (sip) technology market is segmented into Packaging Technology, Packaging Method and End User. By packaging technology, the market is classified into 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. Depending on packaging method, it is categorized into wire bond and flip chip. On the basis of end user, the market is divided into consumer electronics, automotive, telecommunication, industrial system, aerospace & defense, and others.

System in Package (SiP) Technology Market
By End User

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Consumer electronics segment is projected as one of the most lucrative segments.

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Region-wise, the system in package (SiP) technology market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the system in package (SiP) technology market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the consumer electronics segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. 

System in Package (SiP) Technology Market
By Region

2030
Asia-pacific 
North America
Europe
Lamea

Asia-Pacific would exhibit the highest CAGR of 11.0% during 2021-2030

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Leading system in package (SiP) technology industry manufacturers such as Amkor Technology Inc., ASE Group, Jiangsu Changjiang Electronics Technology Co., Ltd., and Fujitsu Ltd. are focusing on investments on technologically advanced, cost-effective, and more secure products and solutions for various applications. Also, system in package design is in the latest trend

TOP IMPACTING FACTORS

The prominent factors that impact the system in package (SiP) technology market growth include, expansion in the portable electronic market, rise in popularity of IoT, and need for circuit miniaturization in microelectronic devices. In addition, upsurge in usage for graphic cards and processors in real-world gaming fuel the market growth. However, higher initial investment restricts the market growth. On the contrary, increase in demand for high-frequency electronic gadgets is expected to create lucrative opportunities for the market.

COMPETITION ANALYSIS

Competitive analysis and profiles of the major system in package (SiP) technology market players such as Amkor Technology Inc, ASE Group, Chipmos Technologies Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., Powertech Technologies Inc., Qualcomm Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., and Toshiba Corporation have been covered in the report.

 

COVID-19 IMPACT ANALYSIS

The outbreak of COVID-19 has significantly affected the electronics and semiconductor sector. Business and manufacturing units across various countries were closed in 2021, owing to increase in number of COVID-19 cases, and are expected to remain closed in the second quarter of 2022. Furthermore, partial or complete lockdown has disrupted the global supply chain posing challenges for manufactures to reach customers.

The COVID-19 pandemic impacts the society and overall economy across the globe. The impact of this outbreak is growing day-by-day and affects the overall business globally. The crisis is creating uncertainty in the stock market, resulting in falling business confidence, massive slowing of supply chain, and increase in panic among customers.

Asian and European countries under lockdowns have suffered major loss of business and revenue, owing to shutdown of manufacturing units. Operations of production and manufacturing industries have been heavily impacted by the outbreak of the COVID-19 disease, which further impacted growth of the system in package (SiP) technology market outlook.

In addition, the COVID-19 pandemic has impacted the electronics sector as production facilities have stalled, which, in turn, boosts demand for electronics and semiconductor products in these industries. Its major impact includes a large manufacturing interruption across Europe and interruption in Chinese parts exports, which hinder the system in package (SiP) technology market opportunity. It is expected that the demand for new and innovative products could surge once the economy begins to recover. Companies are looking forward to invest in next-generation products using new technologies, as it is expected to boost its goodwill, once customer demand surges.

KEY BENEFITS FOR STAKEHOLDERS

  • This study comprises analytical depiction of the global system in package (SiP) technology market size along with current trends and future estimations to depict imminent investment pockets.
  • The overall system in package (SiP) technology market analysis is determined to understand the profitable trends to gain a stronger foothold.
  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current system in package (SiP) technology market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
  • Porter’s five forces analysis illustrates the potency of the buyers and the system in package (SiP) technology market share of key vendors.
  • The report includes the market trends and the market share of key vendors.

System in Package (SiP) Technology Market Report Highlights

Aspects Details
By Packaging Technology
  • 2D IC Packaging
  • 2.5D IC Packaging
  • 3D IC Packaging
By Packaging Method
  • Wire Bond
  • Flip Chip
By End User
  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace and Defense
  • Others
By Region
  • North America  (U.S., Canada, Mexico)
  • Europe  (U.K., Germany, France, Rest of Europe)
  • Asia-Pacific  (China, Japan, Taiwan, India, South Korea, Rest of Asia-Pacific)
  • LAMEA  (Latin America, Middle East, Africa)
Key Market Players JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD., CHIPMOS TECHNOLOGIES INC., POWERTECH TECHNOLOGIES INC., ASE GROUP, AMKOR TECHNOLOGY INC., FUJITSU LTD, TOSHIBA CORPORATION, RENESAS ELECTRONICS CORPORATION, SAMSUNG ELECTRONICS CO LTD, Qualcomm Inc
 

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The global system in package (SiP) technology market is flourishing at a rapid pace. However, high initial investment is still a concern for new entrants. Market players are generously investing in R&D activities to develop improved solutions to reduce the overall cost of system in package (SiP) technology-based products. In addition, according to industry experts, it is essential to optimize affordable prices for system in package (SiP) technology products for long-term growth.  

In November 2021, Amkor Technology Inc. announced the business expansion of advanced packaging technology capacity with a new factory setup in Bac Ninh, Vietnam. This is expected to provide a long-term investment in geographical diversification and factory capacity expansion, supporting Amkor’s commitment to reliable supply chain solutions for its customers.

Key players of the market focus on introducing technologically advanced products to remain competitive in the market. Partnership, acquisition, and product launches are expected to be the prominent strategies adopted by market players. Asia-Pacific accounted for a major share of the market in 2020, owing to the presence of major players in the region; Also, Asia-Pacific is expected to grow at the highest CAGR, owing to rise in adoption of system in package (SiP) technology market in a variety of fields.  

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FREQUENTLY ASKED QUESTIONS?

A. The global system in package (SiP) technology market size was valued at $14.77 billion in 2020

A. Asia-Pacific dominated the system in package (SiP) technology market in 2020

A. Amkor Technology Inc., ASE Group, Jiangsu Changjiang Electronics Technology Co., Ltd., and Fujitsu Ltd.

A. Use of SiP in 5G network connected devices is in the latest trend.

A. It is widely used in a variety of industries, including consumer electronics, automotive, and telecommunications.

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