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System in Package (SiP) Technology Market by Packaging Technology (2-D IC Packaging, 2.5-D IC Packaging, and 3-D IC Packaging), Packaging Type (Flat Packages, Pin Grid Arrays, Surface Mount, Small Outline Packages, and Others), Interconnection Technology (Wire Bond, and Flip Chip) - Opportunity Analysis and Industry Forecast, 2014-2022

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SE_161827
Pages: 226
Dec 2016 | 3065 Views
 
Author's : Manish Chaurasiya & Jeshin Jayamon
Tables: 55
Charts: 80
 

System in Package (SiP) Technology Market Overview

Global System in Package (SiP) Technology Market is expected to reach $30 billion by 2022, growing at a CAGR of 9.0% during the forecast period 2016 - 2022. SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps. SiP is widely adopted in several applications such as consumer electronics, automotive, and telecommunication owing to its enhanced efficiency and durability.

Boom in the portable electronic market, increase in popularity of Internet of Things (IoT) and adoption of SiP technology in graphic cards and processors for real world gaming have increased the rate of adoption of SiP in consumer electronics, automotive, telecommunication, and other sectors. Therefore, the global SiP market is expected to witness moderate growth in the near future, owing to compact size and enhanced durability. However, high cost and less customization hamper the market growth. Increase in demand for high frequency electronic gadgets are expected to provide lucrative opportunities to the market.

Segment Overview

The global SiP technology market is segmented on the basis of packaging technology, packaging type, interconnection technology, application, and geography. Based on packaging technology, the market is classified into 2-D IC packaging, 2.5-D IC packaging, and 3-D IC packaging. In 2015, 2.5-D IC Packaging segment dominated the global market in terms of revenue contribution, and is expected to maintain this trend throughout the forecast period, owing to its compact size and enhanced efficiency.

Based on interconnection technology, the Wire Bond segment dominated the global market in terms of revenue contribution, and is expected to maintain this trend throughout the forecast period. However, the Flip Chip segment is expected to witness rapid growth due to increase in demand for integrated chips in consumer electronics sector.

Based on application, the telecommunication segment offers lucrative scope to industry players, and are expected to exhibit higher growth as compared to the other segments. Based on geography the market is segmented into North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific accounted for the largest revenue share in the global market, owing to the increase in demand for semiconductor devices and portable devices.

Global SiP Market: Segmentation

Global SiP Market Segmentation

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System in Package (SiP) Technology: Applications

System in Package Technology Applications

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Competition Analysis

Comprehensive competitive analyses and profiles of major market players, including Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics Co Ltd., Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group are provided in this report. Currently, the players in the SiP market have adopted partnership and acquisition to expand their customer base and increase their market shares.

Global SiP Market: Top Impacting Factors

Global SiP Market Top Impacting Factors
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Boom in portable electronic market and increase in popularity of Internet of Things (IoT)

Increase in demand for high speed and compact size of electronic products have fueled the requirement of SiP technology. In addition, module size reduction along with enhanced electrical and thermal performance are the key requirements of portable electronic products such as smartphones, digital camera & camcorders, laptops & tablets, wearable electronics, and household electronics. Moreover, IoT gains popularity in the industry, and is considered as the third wave of technology.

Usage in graphic cards and processors used in real world gaming

SiP are extensively used in processors and graphic cards to provide better output of videos and games. The key players in the market have heavily invested in R&D of these packaging technologies to sustain the stiff competition in the market. For instance, AMD announced to launch Zen processor, which has 40% performance improvement over its predecessor and provides a competitive edge over its rivals.

SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET KEY BENEFITS:

  • The study provides an in-depth analysis of the global SiP technology market to elucidate the prominent investment pockets.
  • Current trends and future estimations are outlined to determine the overall attractiveness, and single out profitable trends to gain a stronger foothold in the market.
  • The report provides information regarding key drivers, restraints, and opportunities along with their impact analyses.
  • The market is analyzed based on various regions, namely, North America, Europe, Asia-Pacific, and LAMEA.
  • Value chain analysis of the market enables better understanding of the roles of intermediaries in the production processes.

SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET KEY SEGMENTATION:

By Packaging Technology

  • 2-D IC Packaging
  • 2.5-D IC Packaging
  • 3-D IC Packaging

By Packaging Type

  • Flat Packages
  • Pin Grid Arrays
  • Surface Mount
  • Small Outline Packages
  • Others

By Interconnection Technology

  • Wire Bond
  • Flip Chip

By Application

  • Consumer Electronics
  • Automotive
  • Telecommunication
  • Industrial System
  • Aerospace & Defense  
  • Others (Traction & Medical)

By Geography

  • North America
    • U.S.
    • Mexico
    • Canada
  • Europe
    • UK
    • Germany
    • France
    • Rest of the Europe
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
 

Chapter: 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models

Chapter: 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

Chapter: 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top Impacting Factors
3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Bargaining power of suppliers
3.3.2. Bargaining power of buyers
3.3.3. Threat of substitutes
3.3.4. Threat of new entrants
3.3.5. Intensity of competitive rivalry

3.4. MARKET SHARE ANALYSIS, 2015
3.5. MARKET DYNAMICS

3.5.1. Drivers
3.5.2. Restraints
3.5.3. Opportunities

Chapter: 4 GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. 2-D IC PACKAGING

4.2.1. Introduction
4.2.2. Key market trends, growth factors and opportunities
4.2.3. Market size and forecast

4.3. 2.5-D IC PACKAGING

4.3.1. Introduction
4.3.2. Key market trends, growth factors and opportunities
4.3.3. Market size and forecast

4.4. 3-D IC PACKAGING

4.4.1. Introduction
4.4.2. Key market trends, growth factors and opportunities
4.4.3. Market size and forecast

Chapter: 5 GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TYPE

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. FLAT PACKAGES

5.2.1. Introduction
5.2.2. Key market trends, growth factors and opportunities
5.2.3. Market size and forecast

5.3. PIN GRID ARRAYS

5.3.1. Introduction
5.3.2. Key market trends, growth factors and opportunities
5.3.3. Market size and forecast

5.4. SURFACE MOUNT

5.4.1. Introduction
5.4.2. Key market trends, growth factors and opportunities
5.4.3. Market size and forecast

5.5. SMALL OUTLINE PACKAGES

5.5.1. Introduction
5.5.2. Key market trends, growth factors and opportunities
5.5.3. Market size and forecast

5.6. OTHERS

5.6.1. Introduction
5.6.2. Key market trends, growth factors and opportunities
5.6.3. Market size and forecast

Chapter: 6 GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY INTERCONNECTION TECHNOLOGY

6.1. OVERVIEW

6.1.1. Market size and forecast

6.2. WIRE BOND

6.2.1. Introduction
6.2.2. Key market trends, growth factors and opportunities
6.2.3. Market size and forecast

6.3. FLIP CHIP

6.3.1. Introduction
6.3.2. Key market trends, growth factors and opportunities
6.3.3. Market size and forecast

Chapter: 7 SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY APPLICATION

7.1. OVERVIEW

7.1.1. Market size and forecast

7.2. CONSUMER ELECTRONICS

7.2.1. Introduction
7.2.2. Key market trends, growth factors and opportunities
7.2.3. Market size and forecast

7.3. AUTOMOTIVE

7.3.1. Introduction
7.3.2. Key market trends, growth factors and opportunities
7.3.3. Market size and forecast

7.4. TELECOMMUNICATIONS

7.4.1. Introduction
7.4.2. Key market trends, growth factors and opportunities
7.4.3. Market size and forecast

7.5. INDUSTRIAL SYSTEM

7.5.1. Introduction
7.5.2. Key market trends, growth factors and opportunities
7.5.3. Market size and forecast

7.6. AEROSPACE & DEFENSE

7.6.1. Introduction
7.6.2. Key market trends, growth factors and opportunities
7.6.3. Market size and forecast

7.7. OTHERS

7.7.1. Introduction
7.7.2. Key market trends, growth factors and opportunities
7.7.3. Market size and forecast

Chapter: 8 SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY GEOGRAPHY

8.1. OVERVIEW

8.1.1. Market size and forecast

8.2. NORTH AMERICA

8.2.1. Introduction
8.2.2. Key market trends, growth factors and opportunities
8.2.3. Market size and forecast
8.2.4. U.S.

8.2.4.1. Market size and forecast

8.2.5. Canada

8.2.5.1. Market size and forecast

8.2.6. Mexico

8.2.6.1. Market size and forecast

8.3. EUROPE

8.3.1. Introduction
8.3.2. Key market trends, growth factors and opportunities
8.3.3. Market size and forecast
8.3.4. UK

8.3.4.1. Market size and forecast

8.3.5. Germany

8.3.5.1. Market size and forecast

8.3.6. France

8.3.6.1. Market size and forecast

8.3.7. Rest of Europe

8.3.7.1. Market size and forecast

8.4. ASIA-PACIFIC

8.4.1. Introduction
8.4.2. Key market trends, growth factors and opportunities
8.4.3. Market size and forecast
8.4.4. China

8.4.4.1. Market size and forecast

8.4.5. Japan

8.4.5.1. Market size and forecast

8.4.6. India

8.4.6.1. Market size and forecast

8.4.7. South Korea

8.4.7.1. Market size and forecast

8.4.8. Rest of Asia-Pacific

8.4.8.1. Market size and forecast

8.5. LAMEA

8.5.1. Introduction
8.5.2. Key market trends, growth factors and opportunities
8.5.3. Market size and forecast
8.5.4. Latin America

8.5.4.1. Market size and forecast

8.5.5. Middle East

8.5.5.1. Market size and forecast

8.5.6. Africa

8.5.6.1. Market size and forecast

Chapter: 9 RELATED INDUSTRY INSIGHTS

Chapter: 10 COMPANY PROFILES

10.1. AMKOR TECHNOLOGY INC.

10.1.1. Company overview
10.1.2. Operating business segments
10.1.3. Business performance
10.1.4. Key strategic moves and developments

10.2. FUJITSU LTD

10.2.1. Company overview
10.2.2. Operating business segments
10.2.3. Business performance
10.2.4. Key strategic moves and developments

10.3. TOSHIBA CORPORATION

10.3.1. Company overview
10.3.2. Operating business segments
10.3.3. Business performance
10.3.4. Key strategic moves and developments

10.4. QUALCOMM INC.
10.4.1. Company overview
10.4.2. Operating business segments
10.4.3. Business performance
10.4.4. Key strategic moves and developments

10.5. RENESAS ELECTRONICS CORPORATION

10.5.1. Company overview
10.5.2. Business performance
10.5.3. Key strategic moves and developments

10.6. SAMSUNG ELECTRONICS CO LTD

10.6.1. Company overview
10.6.2. Business performance
10.6.3. Key strategic moves and developments

10.7. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.

10.7.1. Company overview
10.7.2. Operating business segments
10.7.3. Business performance
10.7.4. Key strategic moves and developments

10.8. CHIPMOS TECHNOLOGIES INC.

10.8.1. Company overview
10.8.2. Operating business segments
10.8.3. Business performance
10.8.4. Key strategic moves and developments

10.9. POWERTECH TECHNOLOGIES INC.

10.9.1. Company overview
10.9.2. Operating business segments
10.9.3. Business performance
10.9.4. Key strategic moves and developments

10.10. ASE GROUP

10.10.1. Company overview
10.10.2. Operating business segments
10.10.3. Business performance
10.10.4. Key strategic moves and developments

LIST OF TABLES

TABLE 1. GLOBAL SIP MARKET, BY PACKAGING TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 2. 2-D IC PACKAGING IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 3. 2.5-D IC PACKAGING IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 4. 3-D IC PACKAGING IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 5. GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY PACKAGING TYPE, 2014-2022 ($MILLION)
TABLE 6. FLAT PACKAGES IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 7. PIN GRID ARRAYS IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 8. SURFACE MOUNT IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 9. SMALL OUTLINE PACKAGES IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 10. OTHERS MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 11. GLOBAL SIP MARKET, BY INTERCONNECTION TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 12. WIRE BOND IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 13. FLIP CHIP IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 14. SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY APPLICATION, 2014-2022 ($MILLION)
TABLE 15. CONSUMER ELECTRONICS IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 16. AUTOMOTIVE IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 17. TELECOMMUNICATIONS IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 18. INDUSTRIAL SYSTEM IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 19. AEROSPACE & DEFENSE IN SIP MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 20. OTHERS MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 21. SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 22. NORTH AMERICAN SIP MARKET, BY PACKAGING TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 23. NORTH AMERICAN SIP MARKET, BY PACKAGING TYPE, 2014-2022 ($MILLION)
TABLE 24. NORTH AMERICAN SIP MARKET, BY APPLICATION, 2014-2022 ($MILLION)
TABLE 25. NORTH AMERICAN SIP MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 26. EUROPEAN SIP MARKET, BY PACKAGING TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 27. EUROPEAN SIP MARKET, BY PACKAGING TYPE, 2014-2022 ($MILLION)
TABLE 28. EUROPEAN SIP MARKET, BY APPLICATION, 2014-2022 ($MILLION)
TABLE 29. EUROPEAN SIP MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 30. ASIA-PACIFIC SIP MARKET, BY PACKAGING TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 31. ASIA-PACIFIC SIP MARKET, BY PACKAGING TYPE, 2014-2022 ($MILLION)
TABLE 32. ASIA-PACIFIC SIP MARKET, BY APPLICATION, 2014-2022 ($MILLION)
TABLE 33. ASIA-PACIFIC SIP MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 34. LAMEA SIP MARKET, BY PACKAGING TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 35. LAMEA SIP MARKET, BY PACKAGING TYPE, 2014-2022 ($MILLION)
TABLE 36. LAMEA SIP MARKET, BY APPLICATION, 2014-2022 ($MILLION)
TABLE 37. LAMEA SIP MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 38. AMKOR TECHNOLOGY INC.: COMPANY SNAPSHOT
TABLE 39. AMKOR TECHNOLOGY INC.: OPERATING SEGMENTS
TABLE 40. FUJITSU LTD: COMPANY SNAPSHOT
TABLE 41. FUJITSU LTD: OPERATING SEGMENTS
TABLE 42. TOSHIBA CORPORATION: COMPANY SNAPSHOT
TABLE 43. TOSHIBA CORPORATION: OPERATING SEGMENTS
TABLE 44. QUALCOMM INC.: COMPANY SNAPSHOT
TABLE 45. QUALCOMM INC.: OPERATING SEGMENTS
TABLE 46. RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT
TABLE 47. SAMSUNG ELECTRONICS CO LTD: COMPANY SNAPSHOT
TABLE 48. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT
TABLE 49. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.: OPERATING SEGMENTS
TABLE 50. CHIPMOS TECHNOLOGIES INC.: COMPANY SNAPSHOT
TABLE 51. CHIPMOS TECHNOLOGIES INC.: OPERATING SEGMENTS
TABLE 52. POWERTECH TECHNOLOGIES INC.: COMPANY SNAPSHOT
TABLE 53. POWERTECH TECHNOLOGIES INC.: OPERATING SEGMENTS
TABLE 54. ASE GROUP: COMPANY SNAPSHOT
TABLE 55. ASE GROUP: OPERATING SEGMENTS


LIST OF FIGURES

FIGURE 1. SEGMENTATIONS
FIGURE 2. TOP IMPACTING FACTORS
FIGURE 3. TOP WINNING STRATEGIES: PERCENTAGE DISTRIBUTION (2013 - 2016)
FIGURE 4. TOP WINNING STRATEGIES: NATURE AND TYPE
FIGURE 5. TOP INVESTMENT POCKETS IN GLOBAL SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET, BY APPLICATION
FIGURE 6. PORTERS FIVE FORCES ANALYSIS
FIGURE 7. MARKET SHARE ANALYSIS, 2015
FIGURE 8. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 2-D IC PACKAGING IN SIP MARKET, 2015 & 2022 (%)
FIGURE 9. MARKET REVENUE & FORECAST OF GLOBAL 2-D IC PACKAGING IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 10. GLOBAL 2-D IC PACKAGING IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 11. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 2.5-D IC PACKAGING IN SIP MARKET, 2015 & 2022 (%)
FIGURE 12. MARKET REVENUE & FORECAST OF GLOBAL 2.5-D IC PACKAGING IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 13. GLOBAL 2.5-D IC PACKAGING IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 14. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3-D IC PACKAGING IN SIP MARKET, 2015 & 2022 (%)
FIGURE 15. MARKET REVENUE & FORECAST OF GLOBAL 3-D IC PACKAGING IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 16. GLOBAL 3-D IC PACKAGING IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 17. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL FLAT PACKAGES IN SIP MARKET, 2015 & 2022 (%)
FIGURE 18. MARKET REVENUE & FORECAST OF GLOBAL FLAT PACKAGES IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 19. GLOBAL FLAT PACKAGES IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 20. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL PIN GRID ARRAYS IN SIP MARKET, 2015 & 2022 (%)
FIGURE 21. MARKET REVENUE & FORECAST OF GLOBAL PIN GRID ARRAYS IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 22. GLOBAL PIN GRID ARRAYS IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 23. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL SURFACE MOUNT IN SIP MARKET, 2015 & 2022 (%)
FIGURE 24. MARKET REVENUE & FORECAST OF GLOBAL SURFACE MOUNT IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 25. GLOBAL SURFACE MOUNT IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 26. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL SMALL OUTLINE PACKAGES IN SIP MARKET, 2015 & 2022 (%)
FIGURE 27. MARKET REVENUE & FORECAST OF GLOBAL SMALL OUTLINE PACKAGES IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 28. GLOBAL SMALL OUTLINE PACKAGES IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 29. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS MARKET, 2015 & 2022 (%)
FIGURE 30. MARKET REVENUE & FORECAST OF GLOBAL OTHERS MARKET, 2014-2022 ($MILLION)
FIGURE 31. GLOBAL OTHERS MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 32. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL WIRE BOND IN SIP MARKET, 2015 & 2022 (%)
FIGURE 33. MARKET REVENUE & FORECAST OF GLOBAL WIRE BOND IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 34. GLOBAL WIRE BOND IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 35. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL FLIP CHIP IN SIP MARKET, 2015 & 2022 (%)
FIGURE 36. MARKET REVENUE & FORECAST OF GLOBAL FLIP CHIP IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 37. GLOBAL FLIP CHIP IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 38. COMPARATIVE REGIONAL SHARE ANALYSIS OF GLOBAL CONSUMER ELECTRONICS IN SIP MARKET, 2015 & 2022 (%)
FIGURE 39. GLOBAL CONSUMER ELECTRONICS IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 40. GLOBAL CONSUMER ELECTRONICS IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 41. COMPARATIVE REGIONAL ANALYSIS OF GLOBAL AUTOMOTIVE IN SIP MARKET, 2015 & 2022 (%)
FIGURE 42. GLOBAL AUTOMOTIVE IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 43. GLOBAL AUTOMOTIVE IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 44. COMPARATIVE REGIONAL SHARE ANALYSIS OF GLOBAL TELECOMMUNICATIONS IN SIP MARKET, 2015 & 2022 (%)
FIGURE 45. GLOBAL TELECOMMUNICATIONS IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 46. GLOBAL TELECOMMUNICATIONS IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 47. COMPARATIVE REGIONAL SHARE ANALYSIS OF GLOBAL INDUSTRIAL SYSTEM IN SIP MARKET, 2015 & 2022 (%)
FIGURE 48. GLOBAL INDUSTRIAL SYSTEM IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 49. GLOBAL INDUSTRIAL SYSTEM IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 50. COMPARATIVE REGIONAL SHARE ANALYSIS OF GLOBAL AEROSPACE & DEFENSE IN SIP MARKET, 2015 & 2022 (%)
FIGURE 51. GLOBAL AEROSPACE & DEFENSE IN SIP MARKET, 2014-2022 ($MILLION)
FIGURE 52. AEROSPACE & DEFENSE IN SIP MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 53. COMPARATIVE REGIONAL SHARE ANALYSIS OF GLOBAL OTHERS MARKET, 2015 & 2022 (%)
FIGURE 54. GLOBAL OTHERS MARKET, 2014-2022 ($MILLION)
FIGURE 55. GLOBAL OTHERS MARKET ANALYSIS, 2015 & 2022 ($MILLION)
FIGURE 56. U.S. SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 57. CANADA SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 58. MEXICO SYSTEM IN PACKAGE (SIP) TECHNOLOGY MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 59. UK SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 60. GERMANY SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 61. FRANCE SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 62. REST OF EUROPE SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 63. CHINA: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 64. JAPAN: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 65. INDIA: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 66. SOUTH KOREA: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 67. REST OF ASIA-PACIFIC: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 68. LATIN AMERICA: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 69. MIDDLE EAST: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 70. AFRICA: SIP MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 71. AMKOR TECHNOLOGY INC.: COMPANY SNAPSHOT
FIGURE 72. FUJITSU LTD: COMPANY SNAPSHOT
FIGURE 73. TOSHIBA CORPORATION: COMPANY SNAPSHOT
FIGURE 74. QUALCOMM INC.: COMPANY SNAPSHOT
FIGURE 75. RENESAS ELECTRONICS: COMPANY SNAPSHOT
FIGURE 76. SAMSUNG ELECTRONICS CO. LTD.: COMPANY SNAPSHOT
FIGURE 77. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD.: COMPANY SNAPSHOT
FIGURE 78. CHIPMOS TECHNOLOGIES INC.: COMPANY SNAPSHOT
FIGURE 79. POWERTECH TECHNOLOGIES INC.: COMPANY SNAPSHOT
FIGURE 80. ASE GROUP: COMPANY SNAPSHOT

 

The global system in package (SiP) technology market is expected to witness massive growth in the near future due to boom in portable electronic market and increase in popularity of Internet of Things (IoT). Earlier, printed circuit board (PCB) based IC were used in industrial systems for data transmission. However, other industries, such as consumer electronics, energy & power, inverter & UPS, and automotive, have adopted SiP to efficiently manage the data transfer, owing to the advent of advanced technology and increase in awareness about the benefits of SiP technology. Market players have focused on developing innovative products for applications in telecommunication and electronic appliances to enhance their efficiency. It enables high frequency data transfer to improve efficiency and prevent power loss. Low power consumption and intense competition in the market have enforced industries to adopt 2.5D IC packaging technology, which has stimulated the growth of the SiP market.

SiP can be operated at high insensitive data transmission. However, higher cost and less customization, which adversely affects their performance. Nevertheless, the implementation of a reliable and 3D packaging technology can reduce complexity. However, prominent players have developed low-cost, compact, affordable, and energy-efficient packaging techniques to increase the efficiency of the applications. Increase in demand for high frequency electronic gadgets provide growth opportunities to market players. Public and private organizations have substantially invested in R&D activities to develop technologies and applications for SiP technology. Asia-Pacific is the major revenue contributor to the global market, followed by North America. It is projected that the growth of the SiP market in North America and LAMEA would significantly increase during the forecast period.

 

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