Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a type of chemical vapour deposition process using two chemicals called precursors or ...
Report Code : A08102 | Category : Semiconductor and Electronics
Molded interconnect devices (MID) are injection-molded thermoplastic part with integrated electronic circuit. These 3-dimensional electromechanical components are molded with circuits using high temperature thermoplastics and the structured metallization, which opens new dimension of carrier circuit design to electronics industry.
Report Code : A08632 | Category : Semiconductor and Electronics
